M2GL060-1FG484 - 56.5K LE IGLOO2 FPGA | Microchip
MPN： M2GL060-1FG484 ✓ 啟用中M2GL060-1FG484 概覽
An FPGA is a reprogrammable semiconductor whose programmable logic fabric and configurable I/O blocks can be programmed after manufacture. Within the device hierarchy, the M2GL060 belongs to the IGLOO2 low-density FPGA family, combining a programmable logic fabric with embedded flash configuration memory. This makes the device suitable for designs that need deterministic parallel processing, flexible interface support, or field-updatable control logic without developing a custom ASIC.
Key device characteristics include 56,520 logic elements, 267 I/Os, a 1.2 V supply voltage, and a commercial temperature range from 0°C to +85°C. The -1 ordering suffix identifies the device speed grade within the M2GL060 family, while the FG484 designation identifies the 484-ball BGA package. Surface-mount assembly supports compact industrial, communications, and embedded-control equipment.
The IGLOO2 architecture is designed for low static power in flash-based FPGAs. Because configuration data is held in on-chip flash, the M2GL060 can retain its programmed logic while the system is unpowered. Its 267 I/Os provide substantial connectivity for external memory, control interfaces, data acquisition, and general peripheral bridging. Exact I/O standards, supported interfaces, timing classes, and internal resource counts must be selected from the complete Microchip device tables before final schematic sign-off.
Typical applications include industrial protocol bridging, I/O expansion, system management, communications infrastructure, embedded control, and secure connectivity. The large I/O count is particularly useful when a design must consolidate several discrete interface blocks onto one programmable device. The 484-ball package also requires careful escape-routing, via-in-pad awareness, and thermal planning on multilayer PCB layouts.
When planning a design, reserve all configuration, programming, and power pins according to the Microchip pin-description table, and follow the manufacturer power-up and decoupling recommendations. Differential and high-speed interface assignments must remain inside the selected speed grade and package-specific timing constraints. Use the manufacturer device and pinout documentation as the authority for board-level implementation.
This page combines device specifications, package details, drop-in replacement options, and design guidance that help engineers evaluate the M2GL060-1FG484 for low-density programmable-logic designs more efficiently than a distributor listing alone.
直接替換替代品，適用於 M2GL060-1FG484 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： M2GL060-1FG484 （相同外形與佔位） — 差異在於 Configuration Memory, Logic Elements, Maximum Operating Temperature, Minimum Operating Temperature, Package Type.
M2GL060-FG484I
✅ 直接替換聯絡詢價
查看資料表 →M2GL060T-1FG484M
✅ 直接替換📋 參考替代品（不在目錄中）
M2GL060-1FG484I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
M2GL060T-FG484I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
M2GL060-FG484
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →M2GL060-1FG484 最大額定值與電氣特性
| Manufacturer | Microchip Technology |
| Product Type | FPGA - Field Programmable Gate Array |
| FPGA Series | IGLOO2 |
| Device Designator | M2GL060 |
| Logic Elements | 56,520 LE |
| Number of I/O | 267 I/O |
| 工作電源電壓 | 1.2 V |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | +85 °C |
| 安裝方式 | SMD/SMT |
| Package Type | FPBGA-484 |
| Ball Count | 484 balls |
| Packaging | Tray |
| Configuration Memory | Flash-based |
| Production Status | In Production |
M2GL060-1FG484 fpbga-484 腳位配置指南
M2GL060-1FG484（fpbga-484 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： M2GL060-1FG484.
請參閱 資料表 以查看完整腳位配置。
典型應用
M2GL060-1FG484 適用於 6 應用s: Industrial Protocol Bridging, I/O Expansion and System Management, Communications and Network Interface Support, Embedded Data Acquisition and Control, Secure Connectivity and Encryption, General-Purpose Embedded Logic.
Industrial Protocol Bridging
The M2GL060-1FG484 is well suited to protocol-bridging duties because 56,520 logic elements can support parallel conversion, buffering, and protocol translation while 267 I/Os provide extensive board-level connectivity. The flash-based configuration allows the bridge logic to remain programmable and field-updatable. Place the device between host and peripheral interfaces, constrain timing for the -1 speed grade, and reserve configuration pins according to the Microchip pin tables.
推薦
I/O Expansion and System Management
With 267 I/Os, the M2GL060-1FG484 can consolidate several discrete expansion and supervisory functions into one programmable device. Its 56,520 LE fabric is appropriate for control logic, status aggregation, interrupt handling, and peripheral emulation without the expense of a custom ASIC. The 484-ball BGA requires careful escape routing and a multilayer board, but it provides high connectivity where board area is constrained.
推薦
Communications and Network Interface Support
The M2GL060-1FG484 can implement interface adapters, data routers, and protocol engines in communications equipment where parallel data paths benefit from programmable logic. Its 267 I/Os support connections to multiple transceivers, memories, and control channels, while the 1.2 V core supply fits low-voltage digital systems. Validate every high-speed interface against the selected speed grade and keep the configurable I/O within its rated standards.
推薦
Embedded Data Acquisition and Control
The 56,520 logic elements and 267 I/Os of the M2GL060-1FG484 allow parallel data acquisition, filtering, and control sequencing to be integrated into one programmable component. This is useful for industrial controllers that combine sensors, counters, timing logic, and external data buses. Use the I/O resources according to the manufacturer voltage and timing specifications, and verify thermal performance because dense logic activity can raise junction temperature.
推薦
Secure Connectivity and Encryption
The M2GL060-1FG484 can host communication security, key-handling interface, or hardware acceleration logic close to the data source, reducing dependence on a general-purpose microcontroller for repeatable bit-level operations. Its 267 I/Os allow the accelerator to connect directly to external memory and network-facing circuits. The IGLOO2 flash configuration supports field updates, although cryptographic certification and system security requirements apply to the complete design.
推薦
General-Purpose Embedded Logic
The M2GL060-1FG484 is appropriate for miscellaneous embedded logic, timers, state machines, legacy interface adapters, and control functions that benefit from field programmability. It provides 56,520 LE in a 1.2 V device while retaining flash configuration across power cycles. Because the 484-ball package is designed for dense surface-mount assembly, early planning is essential for via-in-pad options, ball escape, thermal vias, and manufacturing inspection.
推薦
推薦產品摘要
工程參考資料，適用於 M2GL060-1FG484 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | M2GL060-FG484I | M2GL060T-1FG484M | M2GL060-1FG484I | M2GL060T-FG484I | M2GL060-FG484 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-BGA (FBGA-484) | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same |
| FPGA Series | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
| Logic Elements | 56,520 LE | 56,520 LE | 56,520 LE | 56,520 LE | 56,520 LE | 56,520 LE |
| Number of I/O | 267 I/O | 267 I/O | 267 I/O | 267 I/O | 267 I/O | 267 I/O |
| Operating Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Designation | -1 | Standard speed designation | -1 | -1 | Standard speed designation | Standard speed designation |
| Mounting Style | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT |
主要差異化特點
- Maintains the -1 speed grade while providing an industrial-temperature ordering option (對比M2GL060-FG484I)
- Same M2GL060 resource level without changing the 484-ball footprint (對比M2GL060T-1FG484M)
- Commercial temperature range is explicitly defined (對比M2GL060T-FG484I)
- Uses a production-listed low-density IGLOO2 configuration (對比M2GL060-FG484)
設計說明
The 484-ball BGA requires deliberate escape routing and a multilayer PCB. Follow the Microchip package drawing for ball locations, recommended via-in-pad or via geometry, and solder-mask or paste-land patterns. Keep high-speed nets short, route configuration signals away from noisy power stages, and provide unobstructed thermal-via paths beneath the device when the package drawing allows them.
Design the 1.2 V core rail and any required configuration or I/O supply domains as a complete power tree. Place bypass capacitors at the associated power and ground balls using the manufacturer guidance, and verify voltage sequencing, steady-state droop, and startup current. Estimated rail-current values must come from the actual design utilization and selected I/O states rather than from a single nominal device figure.
Estimate junction temperature from worst-case FPGA utilization, I/O activity, supply voltage, ambient temperature, and the package thermal model. Estimated: use the manufacturer thermal characterization data together with the board-specific thermal resistance rather than treating the 484-ball package as an unlimited heat sink. Separate hot I/O paths from sensitive configuration and clock networks to reduce localized heating.
Do not substitute an M2GL060 ordering code solely by matching the 484-ball package. Confirm speed grade, temperature grade, configuration method, supported I/O standards, and qualification requirements. After any substitution, rerun synthesis timing and static timing analysis, review power-domain constraints, and compare the new pin-description tables against the PCB footprint before releasing production files.
合規資訊
Microchip lists the M2GL060 family as in production. Compliance declarations must be confirmed for the exact orderable MPN using the manufacturer product documentation and current material-compliance statements.