M2GL060-1FG484 - 56.5K LE IGLOO2 FPGA | Microchip
料号： M2GL060-1FG484 ✓ 量产中M2GL060-1FG484 概述
An FPGA is a reprogrammable semiconductor whose programmable logic fabric and configurable I/O blocks can be programmed after manufacture. Within the device hierarchy, the M2GL060 belongs to the IGLOO2 low-density FPGA family, combining a programmable logic fabric with embedded flash configuration memory. This makes the device suitable for designs that need deterministic parallel processing, flexible interface support, or field-updatable control logic without developing a custom ASIC.
Key device characteristics include 56,520 logic elements, 267 I/Os, a 1.2 V supply voltage, and a commercial temperature range from 0°C to +85°C. The -1 ordering suffix identifies the device speed grade within the M2GL060 family, while the FG484 designation identifies the 484-ball BGA package. Surface-mount assembly supports compact industrial, communications, and embedded-control equipment.
The IGLOO2 architecture is designed for low static power in flash-based FPGAs. Because configuration data is held in on-chip flash, the M2GL060 can retain its programmed logic while the system is unpowered. Its 267 I/Os provide substantial connectivity for external memory, control interfaces, data acquisition, and general peripheral bridging. Exact I/O standards, supported interfaces, timing classes, and internal resource counts must be selected from the complete Microchip device tables before final schematic sign-off.
Typical applications include industrial protocol bridging, I/O expansion, system management, communications infrastructure, embedded control, and secure connectivity. The large I/O count is particularly useful when a design must consolidate several discrete interface blocks onto one programmable device. The 484-ball package also requires careful escape-routing, via-in-pad awareness, and thermal planning on multilayer PCB layouts.
When planning a design, reserve all configuration, programming, and power pins according to the Microchip pin-description table, and follow the manufacturer power-up and decoupling recommendations. Differential and high-speed interface assignments must remain inside the selected speed grade and package-specific timing constraints. Use the manufacturer device and pinout documentation as the authority for board-level implementation.
This page combines device specifications, package details, drop-in replacement options, and design guidance that help engineers evaluate the M2GL060-1FG484 for low-density programmable-logic designs more efficiently than a distributor listing alone.
直接替换替代料： M2GL060-1FG484 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M2GL060-1FG484 （相同外形与封装尺寸） ——差异在于 Configuration Memory, Logic Elements, Maximum Operating Temperature, Minimum Operating Temperature, Package Type.
M2GL060-FG484I
✅ 直接替换联系询价
查看数据手册 →M2GL060T-1FG484M
✅ 直接替换📋 参考替代料（不在目录中）
M2GL060-1FG484I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
M2GL060T-FG484I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
M2GL060-FG484
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →M2GL060-1FG484 最大额定值与电气特性
| Manufacturer | Microchip Technology |
| Product Type | FPGA - Field Programmable Gate Array |
| FPGA Series | IGLOO2 |
| Device Designator | M2GL060 |
| Logic Elements | 56,520 LE |
| Number of I/O | 267 I/O |
| 工作电源电压 | 1.2 V |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | +85 °C |
| 安装方式 | SMD/SMT |
| Package Type | FPBGA-484 |
| Ball Count | 484 balls |
| Packaging | Tray |
| Configuration Memory | Flash-based |
| Production Status | In Production |
M2GL060-1FG484 fpbga-484 引脚配置指南
M2GL060-1FG484（fpbga-484 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M2GL060-1FG484.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M2GL060-1FG484 适用于 6 应用s: Industrial Protocol Bridging, I/O Expansion and System Management, Communications and Network Interface Support, Embedded Data Acquisition and Control, Secure Connectivity and Encryption, General-Purpose Embedded Logic.
Industrial Protocol Bridging
The M2GL060-1FG484 is well suited to protocol-bridging duties because 56,520 logic elements can support parallel conversion, buffering, and protocol translation while 267 I/Os provide extensive board-level connectivity. The flash-based configuration allows the bridge logic to remain programmable and field-updatable. Place the device between host and peripheral interfaces, constrain timing for the -1 speed grade, and reserve configuration pins according to the Microchip pin tables.
推荐
I/O Expansion and System Management
With 267 I/Os, the M2GL060-1FG484 can consolidate several discrete expansion and supervisory functions into one programmable device. Its 56,520 LE fabric is appropriate for control logic, status aggregation, interrupt handling, and peripheral emulation without the expense of a custom ASIC. The 484-ball BGA requires careful escape routing and a multilayer board, but it provides high connectivity where board area is constrained.
推荐
Communications and Network Interface Support
The M2GL060-1FG484 can implement interface adapters, data routers, and protocol engines in communications equipment where parallel data paths benefit from programmable logic. Its 267 I/Os support connections to multiple transceivers, memories, and control channels, while the 1.2 V core supply fits low-voltage digital systems. Validate every high-speed interface against the selected speed grade and keep the configurable I/O within its rated standards.
推荐
Embedded Data Acquisition and Control
The 56,520 logic elements and 267 I/Os of the M2GL060-1FG484 allow parallel data acquisition, filtering, and control sequencing to be integrated into one programmable component. This is useful for industrial controllers that combine sensors, counters, timing logic, and external data buses. Use the I/O resources according to the manufacturer voltage and timing specifications, and verify thermal performance because dense logic activity can raise junction temperature.
推荐
Secure Connectivity and Encryption
The M2GL060-1FG484 can host communication security, key-handling interface, or hardware acceleration logic close to the data source, reducing dependence on a general-purpose microcontroller for repeatable bit-level operations. Its 267 I/Os allow the accelerator to connect directly to external memory and network-facing circuits. The IGLOO2 flash configuration supports field updates, although cryptographic certification and system security requirements apply to the complete design.
推荐
General-Purpose Embedded Logic
The M2GL060-1FG484 is appropriate for miscellaneous embedded logic, timers, state machines, legacy interface adapters, and control functions that benefit from field programmability. It provides 56,520 LE in a 1.2 V device while retaining flash configuration across power cycles. Because the 484-ball package is designed for dense surface-mount assembly, early planning is essential for via-in-pad options, ball escape, thermal vias, and manufacturing inspection.
推荐
推荐产品汇总
工程参考数据： M2GL060-1FG484 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M2GL060-FG484I | M2GL060T-1FG484M | M2GL060-1FG484I | M2GL060T-FG484I | M2GL060-FG484 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-BGA (FBGA-484) | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same |
| FPGA Series | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
| Logic Elements | 56,520 LE | 56,520 LE | 56,520 LE | 56,520 LE | 56,520 LE | 56,520 LE |
| Number of I/O | 267 I/O | 267 I/O | 267 I/O | 267 I/O | 267 I/O | 267 I/O |
| Operating Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Designation | -1 | Standard speed designation | -1 | -1 | Standard speed designation | Standard speed designation |
| Mounting Style | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT |
关键差异点
- Maintains the -1 speed grade while providing an industrial-temperature ordering option （对比 M2GL060-FG484I)
- Same M2GL060 resource level without changing the 484-ball footprint （对比 M2GL060T-1FG484M)
- Commercial temperature range is explicitly defined （对比 M2GL060T-FG484I)
- Uses a production-listed low-density IGLOO2 configuration （对比 M2GL060-FG484)
设计说明
The 484-ball BGA requires deliberate escape routing and a multilayer PCB. Follow the Microchip package drawing for ball locations, recommended via-in-pad or via geometry, and solder-mask or paste-land patterns. Keep high-speed nets short, route configuration signals away from noisy power stages, and provide unobstructed thermal-via paths beneath the device when the package drawing allows them.
Design the 1.2 V core rail and any required configuration or I/O supply domains as a complete power tree. Place bypass capacitors at the associated power and ground balls using the manufacturer guidance, and verify voltage sequencing, steady-state droop, and startup current. Estimated rail-current values must come from the actual design utilization and selected I/O states rather than from a single nominal device figure.
Estimate junction temperature from worst-case FPGA utilization, I/O activity, supply voltage, ambient temperature, and the package thermal model. Estimated: use the manufacturer thermal characterization data together with the board-specific thermal resistance rather than treating the 484-ball package as an unlimited heat sink. Separate hot I/O paths from sensitive configuration and clock networks to reduce localized heating.
Do not substitute an M2GL060 ordering code solely by matching the 484-ball package. Confirm speed grade, temperature grade, configuration method, supported I/O standards, and qualification requirements. After any substitution, rerun synthesis timing and static timing analysis, review power-domain constraints, and compare the new pin-description tables against the PCB footprint before releasing production files.
合规信息
Microchip lists the M2GL060 family as in production. Compliance declarations must be confirmed for the exact orderable MPN using the manufacturer product documentation and current material-compliance statements.