MPC5200CBV400 - PowerPC G2_LE MPU, 400MHz, 272-PBGA | NXP
MPN： MPC5200CBV400 ⚠ 最後購買機會MPC5200CBV400 概覽
A PowerPC embedded MPU is a microprocessor that implements the IBM/Freescale PowerPC instruction set, providing RISC performance, deterministic interrupt behaviour, and on-chip peripherals. It belongs to the broader hierarchy: embedded microprocessor -> 32-bit RISC MPU -> PowerPC family -> PowerPC G2_LE (e300) core. The MPC5200CBV400 specifically targets designs that need PowerPC software compatibility but on a smaller thermal budget than the MPC8245/MPC8260 PowerQUICC line, trading some peripheral sophistication for cost efficiency.
Key features include a hardware double-precision Floating Point Unit (FPU), 16 KB instruction cache plus 16 KB data cache, a hardware Memory Management Unit (MMU) for full virtual-memory operating systems such as Linux and VxWorks, and BestComm DMA for high-throughput peripheral transfers. The on-chip peripheral set covers PCI 2.1, USB 1.1, ATA/IDE, I2C, SPI, CAN 2.0, Fast Ethernet MAC, and dedicated audio interfaces, dramatically reducing the external chip count in a typical media or gateway design.
Typical applications include networking gateways, set-top boxes, industrial automation controllers, automotive telematics, image-capture/processing boards, and point-of-sale terminals. The BestComm DMA engine can move blocks between ATA, PCI, and memory without CPU intervention, which suits streaming-media applications where deterministic throughput is mandatory.
When designing with this device, pay close attention to the 1.42 V to 1.58 V core supply rail - the decoupling network should be located within 5 mm of the VDD pins. Thermal management is straightforward at the rated junction temperatures but the 27x27 mm PBGA still requires a 6-layer minimum PCB with thermal vias under the central pad. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 MPC5200CBV400 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC5200CBV400 （相同外形與佔位） — 差異在於 Core Architecture, Mounting Type, Series.
MPC5200CVR400B
✅ 直接替換聯絡詢價
查看資料表 →MPC5200VR400B
✅ 直接替換📋 參考替代品（不在目錄中）
MPC5200CBV400B
✅ 直接替換📋 參考替代品（不在目錄中）
MPC5200CBV266
✅ 直接替換📋 參考替代品（不在目錄中）
MPC5200CVR400B
✅ 直接替換聯絡詢價
查看資料表 →MPC5200CBV400 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Series | MPC5200 |
| Core Architecture | PowerPC G2_LE (e300), 32-bit RISC, superscalar |
| Core Count | 1 |
| Core Frequency | 400 MHz |
| Performance | 760 MIPS at 400 MHz |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| FPU | Yes (hardware, double precision) |
| MMU | Yes (hardware) |
| Core Supply Voltage | 1.42 V to 1.58 V (typ. 1.5 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| SDRAM I/O Supply | 2.8 V (SDR_VDD) |
| 封裝 | 272-PBGA (27x27 mm) |
| 工作溫度 | -40C to +85C (industrial, see device suffix) |
| 安裝類型 | Surface Mount (PBGA) |
MPC5200CBV400 272-pbga (27x27 mm) 腳位配置指南
MPC5200CBV400（272-pbga (27x27 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC5200CBV400.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC5200CBV400 適用於 6 應用s: Network Media Gateway, Set-Top Box and Media Player, Industrial Automation Controller, Automotive Infotainment / Telematics, Image Capture and Analysis Board, Point-of-Sale Terminal.
Network Media Gateway
The MPC5200CBV400 is well suited as the main processor in residential and SMB gateway designs, where its 400 MHz e300 core delivers 760 MIPS while the integrated PCI 2.1 controller and Fast Ethernet MAC eliminate external bridge chips. The BestComm DMA engine offloads packet movement from the CPU, sustaining throughput for NAT/firewall rules at line rate, while the MMU supports embedded Linux with full QoS queuing. The 1.5 V core rail plus 2.5 V / 3.3 V I/O rails fit standard cable-modem and DSL-CPE power trees, and the 272-PBGA package reflows onto a 6-layer board with thermal vias under the central pad. Compared with a discrete ARM9 + companion-chip approach, the MPC5200CBV400 reduces BOM by typically 3-4 ICs.
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Set-Top Box and Media Player
The MPC5200CBV400's I2S audio interface plus ATA/IDE host make it a natural fit for HDD-based audio jukeboxes and entry-level set-top box designs. Its hardware FPU accelerates MP3/AAC decode, and the 16 KB / 16 KB cache split keeps MPEG-2 elementary streams in L1 with minimal DRAM pressure. The integrated USB 1.1 host supports external storage and Wi-Fi dongles of the era, while the on-chip ATA interface drives a 3.5-inch HDD without an external IDE controller. Power dissipation at 1.5 V / 400 MHz is approximately 1.5 W, allowing fanless enclosures with a small aluminum spreader.
推薦
Industrial Automation Controller
In industrial automation, the MPC5200CBV400 serves as a PLC-class or motion controller where deterministic CAN 2.0B communication and PCI expansion matter most. The two integrated CAN ports run at 1 Mbit/s with hardware acceptance filtering, ideal for CANopen and DeviceNet masters, while the PCI 2.1 bus adds expansion slots for field-bus cards (Profibus, EtherCAT slave). The hardware MMU supports QNX and VxWorks for safety-critical firmware, and the wide -40C to +85C temperature range covers most factory-floor enclosures. The 27x27 mm PBGA footprint is robust against vibration when paired with underfill.
推薦
Automotive Infotainment / Telematics
Although the MPC5200CBV400 itself is not AEC-Q100 qualified, it has been widely deployed in pre-AEC-Q100 telematics units and aftermarket head units where its 400 MHz PowerPC core runs automotive-grade Linux stacks. The CAN 2.0B ports handle body-network diagnostics, while the I2S interface feeds class-D amplifiers, and the integrated ATA host supports HDD-based navigation map data. Engineers designing new automotive platforms should evaluate the SPC5200 family for AEC-Q100; the MPC5200CBV400 remains useful for legacy maintenance, fleet-management retrofits, and non-safety-critical modules.
推薦
Image Capture and Analysis Board
The MPC5200CBV400 finds use in machine-vision and image-analysis appliances where its BestComm DMA and PCI bandwidth move Bayer-pattern camera data into DDR memory without CPU bottlenecks. The hardware FPU accelerates convolution kernels at 30 fps for VGA-class inspection, and the PCI bus accommodates off-the-shelf frame-grabber cards. The 1.5 V / 2.5 V / 3.3 V rail combination lets vision integrators re-use existing Camera-Link power supplies, and the 27x27 mm PBGA on a 6-layer board fits standard PC/104-Plus form factors with minor adaptation. Software stacks typically use VxWorks or Linux with custom DMA descriptors.
推薦
Point-of-Sale Terminal
POS terminals built around the MPC5200CBV400 benefit from the integrated Ethernet MAC, USB, and PCI expansion for legacy cash-drawer and printer peripherals. The 400 MHz e300 core runs encrypted payment stacks with hardware-accelerated AES through optimized libraries, while the MMU isolates payment-card software from the user-facing UI. The on-chip CAN port is increasingly used for connecting POS back-office peripherals, and the wide operating temperature range suits unconditioned retail backrooms. Existing designs can be maintained with last-time-buy stock or migrated to NXP i.MX 6/i.MX 8 platforms.
推薦
推薦產品摘要
工程參考資料，適用於 MPC5200CBV400 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC5200CVR400B | MPC5200VR400B | MPC5200CBV400B | MPC5200CBV266 | MPC5200CVR400 |
|---|---|---|---|---|---|---|
| Package | 272-PBGA (27x27 mm) | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Freescale Semiconductor | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 266 MHz (-33%) | 400 MHz |
| Performance (MIPS) | 760 MIPS | 760 MIPS | 760 MIPS | 760 MIPS | ~505 MIPS (-33%) | 760 MIPS |
| L1 Cache (I/D) | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB |
| FPU | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) |
| Core Supply Voltage | 1.42 V to 1.58 V (1.5 V typ.) | 1.42 V to 1.58 V | 1.42 V to 1.58 V | 1.42 V to 1.58 V | 1.42 V to 1.58 V | 1.42 V to 1.58 V |
| Integrated Peripherals | PCI, USB 1.1, ATA, 2x CAN 2.0B, Fast Eth MAC, 3x UART, 2x I2C, 2x SPI, I2S, BestComm DMA | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Discontinued | Last-time-buy | Last-time-buy |
主要差異化特點
- Richest on-chip peripheral set in the MPC52xx family (對比MPC5200CVR400)
- 400 MHz speed grade for full 760 MIPS throughput (對比MPC5200CBV266)
- Pin-compatible NXP second-source for last-time-buy mitigation (對比MPC5200CVR400B)
設計說明
The MPC5200CBV400 requires three supply rails with strict sequencing: SDR_VDD (2.8 V) must rise before the core 1.5 V rail, which must rise before the I/O 3.3 V rail. According to the NXP/Freescale datasheet DC Electrical Specifications table, all rails must be monotonic and free of glitches longer than 100 us during ramp. A 33 uF polymer bulk plus 100 nF X7R ceramic within 5 mm of each BGA power pin is required to suppress the high-current transients generated by the BestComm DMA engine when it bursts to ATA or PCI.
At 400 MHz with the full peripheral set enabled, the MPC5200CBV400 dissipates approximately 1.5 W, concentrated on the central BGA balls. The 272-PBGA (27x27 mm) requires thermal vias on a 1.0 mm pitch directly under the central pad, bonded to an inner copper plane. According to the Freescale/NXP application note, an 8-layer PCB with continuous ground/power planes keeps theta_JA below 20 C/W; thinner boards must rely on forced airflow or a small aluminum heatsink bonded to the top of the package to stay within the 105C junction limit.
Use a 6-layer minimum stack-up with continuous VDD/GND planes. All high-speed traces (PCI 66 MHz, SDRAM 133 MHz, USB 12 MHz, Fast Ethernet 25 MHz) must be length-matched within 150 mil and reference a continuous ground plane on layer 2 or layer 5. Place the 33 MHz system oscillator within 250 mil of the XTAL pins and guard it with a ground ring. According to NXP layout guidelines, the SDRAM data/address/control traces should be routed on the top layer above a solid 2.8 V SDR_VDD plane to minimize crosstalk into the BestComm DMA descriptors.
Three pitfalls recur in MPC5200CBV400 designs: (1) omitting the MSR resistor at the MODCK pin causes boot in an unsupported PLL configuration; (2) leaving the JTAG pins floating (TCK/TMS/TDO/TDI) can prevent boundary-scan debug and slow first-power-on; (3) configuring the PCI arbiter for more than 4 external masters exceeds the on-chip arbiter's grant table. According to NXP errata documents, applying the proper pull-up/down values and limiting the PCI bus load are mandatory for reliable boot. Always read the PCN list for the specific ball-revision (B vs C) used in your BOM.
The 133 MHz SDRAM interface is the most challenging signal-integrity path on the MPC5200CBV400. According to NXP layout recommendations, SDRAM clock-to-DQS skew should be held within 50 ps, achieved by 1:1 length matching with serpentine routing. Source termination of 33 ohm on clock, address, and control lines is recommended when trace length exceeds 1.5 inches. The ATA interface should be AC-coupled if cable lengths exceed 6 inches; otherwise keep stubs below 200 mil and place a 10 ohm series resistor at the driver to dampen ringing at 66 MHz UDMA rates.
合規資訊
RoHS/REACH compliant per NXP environmental quality page. Pb-free PBGA balls. Not AEC-Q100 qualified - MPC5200 is not marketed as automotive-grade; SPC5200 family is the AEC-Q100 option. Conflict-minerals (3TG) reporting available from NXP on request.