MPC5200CBV400 - PowerPC G2_LE MPU, 400MHz, 272-PBGA | NXP
Teilenummer: MPC5200CBV400 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $65.24 | $65,24 |
| 10 | $58.72 | $587,20 |
| 100 | $51.84 | $5.184,00 |
| 500 | $45.91 | $22.955,00 |
| 1.000 | $40.67 | $40.670,00 |
MPC5200CBV400 Übersicht
A PowerPC embedded MPU is a microprocessor that implements the IBM/Freescale PowerPC instruction set, providing RISC performance, deterministic interrupt behaviour, and on-chip peripherals. It belongs to the broader hierarchy: embedded microprocessor -> 32-bit RISC MPU -> PowerPC family -> PowerPC G2_LE (e300) core. The MPC5200CBV400 specifically targets designs that need PowerPC software compatibility but on a smaller thermal budget than the MPC8245/MPC8260 PowerQUICC line, trading some peripheral sophistication for cost efficiency.
Key features include a hardware double-precision Floating Point Unit (FPU), 16 KB instruction cache plus 16 KB data cache, a hardware Memory Management Unit (MMU) for full virtual-memory operating systems such as Linux and VxWorks, and BestComm DMA for high-throughput peripheral transfers. The on-chip peripheral set covers PCI 2.1, USB 1.1, ATA/IDE, I2C, SPI, CAN 2.0, Fast Ethernet MAC, and dedicated audio interfaces, dramatically reducing the external chip count in a typical media or gateway design.
Typical applications include networking gateways, set-top boxes, industrial automation controllers, automotive telematics, image-capture/processing boards, and point-of-sale terminals. The BestComm DMA engine can move blocks between ATA, PCI, and memory without CPU intervention, which suits streaming-media applications where deterministic throughput is mandatory.
When designing with this device, pay close attention to the 1.42 V to 1.58 V core supply rail - the decoupling network should be located within 5 mm of the VDD pins. Thermal management is straightforward at the rated junction temperatures but the 27x27 mm PBGA still requires a 6-layer minimum PCB with thermal vias under the central pad. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MPC5200CBV400 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC5200CBV400 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Mounting Type, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC5200CVR400B
✅ Drop-In✓ Auf Lager
$24.8 / Stück
Datenblatt ansehen →MPC5200VR400B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC5200CBV400B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC5200CBV266
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC5200CVR400B
✅ Drop-In✓ Auf Lager
$24.8 / Stück
Datenblatt ansehen →MPC5200CBV400 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Series | MPC5200 |
| Core Architecture | PowerPC G2_LE (e300), 32-bit RISC, superscalar |
| Core Count | 1 |
| Core Frequency | 400 MHz |
| Performance | 760 MIPS at 400 MHz |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| FPU | Yes (hardware, double precision) |
| MMU | Yes (hardware) |
| Core Supply Voltage | 1.42 V to 1.58 V (typ. 1.5 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| SDRAM I/O Supply | 2.8 V (SDR_VDD) |
| Gehäuse | 272-PBGA (27x27 mm) |
| Betriebstemperatur | -40C to +85C (industrial, see device suffix) |
| Montageart | Surface Mount (PBGA) |
MPC5200CBV400 272-pbga (27x27 mm) Pinbelegungsleitfaden
Pinbelegung für MPC5200CBV400 (272-pbga (27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC5200CBV400.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC5200CBV400 ist geeignet für 6 Anwendungs: Network Media Gateway, Set-Top Box and Media Player, Industrial Automation Controller, Automotive Infotainment / Telematics, Image Capture and Analysis Board, Point-of-Sale Terminal.
Network Media Gateway
The MPC5200CBV400 is well suited as the main processor in residential and SMB gateway designs, where its 400 MHz e300 core delivers 760 MIPS while the integrated PCI 2.1 controller and Fast Ethernet MAC eliminate external bridge chips. The BestComm DMA engine offloads packet movement from the CPU, sustaining throughput for NAT/firewall rules at line rate, while the MMU supports embedded Linux with full QoS queuing. The 1.5 V core rail plus 2.5 V / 3.3 V I/O rails fit standard cable-modem and DSL-CPE power trees, and the 272-PBGA package reflows onto a 6-layer board with thermal vias under the central pad. Compared with a discrete ARM9 + companion-chip approach, the MPC5200CBV400 reduces BOM by typically 3-4 ICs.
Empfohlen
Set-Top Box and Media Player
The MPC5200CBV400's I2S audio interface plus ATA/IDE host make it a natural fit for HDD-based audio jukeboxes and entry-level set-top box designs. Its hardware FPU accelerates MP3/AAC decode, and the 16 KB / 16 KB cache split keeps MPEG-2 elementary streams in L1 with minimal DRAM pressure. The integrated USB 1.1 host supports external storage and Wi-Fi dongles of the era, while the on-chip ATA interface drives a 3.5-inch HDD without an external IDE controller. Power dissipation at 1.5 V / 400 MHz is approximately 1.5 W, allowing fanless enclosures with a small aluminum spreader.
Empfohlen
Industrial Automation Controller
In industrial automation, the MPC5200CBV400 serves as a PLC-class or motion controller where deterministic CAN 2.0B communication and PCI expansion matter most. The two integrated CAN ports run at 1 Mbit/s with hardware acceptance filtering, ideal for CANopen and DeviceNet masters, while the PCI 2.1 bus adds expansion slots for field-bus cards (Profibus, EtherCAT slave). The hardware MMU supports QNX and VxWorks for safety-critical firmware, and the wide -40C to +85C temperature range covers most factory-floor enclosures. The 27x27 mm PBGA footprint is robust against vibration when paired with underfill.
Empfohlen
Automotive Infotainment / Telematics
Although the MPC5200CBV400 itself is not AEC-Q100 qualified, it has been widely deployed in pre-AEC-Q100 telematics units and aftermarket head units where its 400 MHz PowerPC core runs automotive-grade Linux stacks. The CAN 2.0B ports handle body-network diagnostics, while the I2S interface feeds class-D amplifiers, and the integrated ATA host supports HDD-based navigation map data. Engineers designing new automotive platforms should evaluate the SPC5200 family for AEC-Q100; the MPC5200CBV400 remains useful for legacy maintenance, fleet-management retrofits, and non-safety-critical modules.
Empfohlen
Image Capture and Analysis Board
The MPC5200CBV400 finds use in machine-vision and image-analysis appliances where its BestComm DMA and PCI bandwidth move Bayer-pattern camera data into DDR memory without CPU bottlenecks. The hardware FPU accelerates convolution kernels at 30 fps for VGA-class inspection, and the PCI bus accommodates off-the-shelf frame-grabber cards. The 1.5 V / 2.5 V / 3.3 V rail combination lets vision integrators re-use existing Camera-Link power supplies, and the 27x27 mm PBGA on a 6-layer board fits standard PC/104-Plus form factors with minor adaptation. Software stacks typically use VxWorks or Linux with custom DMA descriptors.
Empfohlen
Point-of-Sale Terminal
POS terminals built around the MPC5200CBV400 benefit from the integrated Ethernet MAC, USB, and PCI expansion for legacy cash-drawer and printer peripherals. The 400 MHz e300 core runs encrypted payment stacks with hardware-accelerated AES through optimized libraries, while the MMU isolates payment-card software from the user-facing UI. The on-chip CAN port is increasingly used for connecting POS back-office peripherals, and the wide operating temperature range suits unconditioned retail backrooms. Existing designs can be maintained with last-time-buy stock or migrated to NXP i.MX 6/i.MX 8 platforms.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC5200CBV400 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC5200CVR400B | MPC5200VR400B | MPC5200CBV400B | MPC5200CBV266 | MPC5200CVR400 |
|---|---|---|---|---|---|---|
| Package | 272-PBGA (27x27 mm) | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Freescale Semiconductor | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit | PowerPC G2_LE (e300), 32-bit |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 266 MHz (-33%) | 400 MHz |
| Performance (MIPS) | 760 MIPS | 760 MIPS | 760 MIPS | 760 MIPS | ~505 MIPS (-33%) | 760 MIPS |
| L1 Cache (I/D) | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB |
| FPU | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) | Yes (hardware, double precision) |
| Core Supply Voltage | 1.42 V to 1.58 V (1.5 V typ.) | 1.42 V to 1.58 V | 1.42 V to 1.58 V | 1.42 V to 1.58 V | 1.42 V to 1.58 V | 1.42 V to 1.58 V |
| Integrated Peripherals | PCI, USB 1.1, ATA, 2x CAN 2.0B, Fast Eth MAC, 3x UART, 2x I2C, 2x SPI, I2S, BestComm DMA | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Discontinued | Last-time-buy | Last-time-buy |
Wichtigste Unterscheidungsmerkmale
- Richest on-chip peripheral set in the MPC52xx family (vs. MPC5200CVR400)
- 400 MHz speed grade for full 760 MIPS throughput (vs. MPC5200CBV266)
- Pin-compatible NXP second-source for last-time-buy mitigation (vs. MPC5200CVR400B)
Designhinweise
The MPC5200CBV400 requires three supply rails with strict sequencing: SDR_VDD (2.8 V) must rise before the core 1.5 V rail, which must rise before the I/O 3.3 V rail. According to the NXP/Freescale datasheet DC Electrical Specifications table, all rails must be monotonic and free of glitches longer than 100 us during ramp. A 33 uF polymer bulk plus 100 nF X7R ceramic within 5 mm of each BGA power pin is required to suppress the high-current transients generated by the BestComm DMA engine when it bursts to ATA or PCI.
At 400 MHz with the full peripheral set enabled, the MPC5200CBV400 dissipates approximately 1.5 W, concentrated on the central BGA balls. The 272-PBGA (27x27 mm) requires thermal vias on a 1.0 mm pitch directly under the central pad, bonded to an inner copper plane. According to the Freescale/NXP application note, an 8-layer PCB with continuous ground/power planes keeps theta_JA below 20 C/W; thinner boards must rely on forced airflow or a small aluminum heatsink bonded to the top of the package to stay within the 105C junction limit.
Use a 6-layer minimum stack-up with continuous VDD/GND planes. All high-speed traces (PCI 66 MHz, SDRAM 133 MHz, USB 12 MHz, Fast Ethernet 25 MHz) must be length-matched within 150 mil and reference a continuous ground plane on layer 2 or layer 5. Place the 33 MHz system oscillator within 250 mil of the XTAL pins and guard it with a ground ring. According to NXP layout guidelines, the SDRAM data/address/control traces should be routed on the top layer above a solid 2.8 V SDR_VDD plane to minimize crosstalk into the BestComm DMA descriptors.
Three pitfalls recur in MPC5200CBV400 designs: (1) omitting the MSR resistor at the MODCK pin causes boot in an unsupported PLL configuration; (2) leaving the JTAG pins floating (TCK/TMS/TDO/TDI) can prevent boundary-scan debug and slow first-power-on; (3) configuring the PCI arbiter for more than 4 external masters exceeds the on-chip arbiter's grant table. According to NXP errata documents, applying the proper pull-up/down values and limiting the PCI bus load are mandatory for reliable boot. Always read the PCN list for the specific ball-revision (B vs C) used in your BOM.
The 133 MHz SDRAM interface is the most challenging signal-integrity path on the MPC5200CBV400. According to NXP layout recommendations, SDRAM clock-to-DQS skew should be held within 50 ps, achieved by 1:1 length matching with serpentine routing. Source termination of 33 ohm on clock, address, and control lines is recommended when trace length exceeds 1.5 inches. The ATA interface should be AC-coupled if cable lengths exceed 6 inches; otherwise keep stubs below 200 mil and place a 10 ohm series resistor at the driver to dampen ringing at 66 MHz UDMA rates.
Compliance-Informationen
RoHS/REACH compliant per NXP environmental quality page. Pb-free PBGA balls. Not AEC-Q100 qualified - MPC5200 is not marketed as automotive-grade; SPC5200 family is the AEC-Q100 option. Conflict-minerals (3TG) reporting available from NXP on request.