MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking
MPN： MPC8245LVV266D ✗ 停產MPC8245LVV266D 概覽
What is a PowerQUICC II processor? A PowerQUICC II is a family of integrated communications processors from NXP that combines a PowerPC processor core with a peripheral and memory controller subsystem. The product hierarchy is: PowerQUICC II -> integrated processor (MPU + system logic) -> microprocessor (MPU) -> integrated circuit (IC) -> semiconductor. Unlike a standalone MPU, PowerQUICC II integrates the memory controller, PCI bridge, DMA engines, and communication peripherals onto one chip, eliminating a separate northbridge and reducing BOM cost.
Key features include 266 MHz core clock delivering 505.4 MIPS, a 32-bit PowerPC 603e core with 32 KB Level-1 instruction cache and 32 KB Level-1 data cache, an integrated 32-bit/66 MHz PCI bridge, dual 10/100 Ethernet MACs (when the peripheral logic is configured accordingly), a DDR memory controller, and hardware cryptography acceleration. The 1.8 V core supply (Vcc) with separate 3.3 V I/O rails (per the LV designator) keeps power dissipation manageable in fanless or sealed enclosures.
The architecture uses a 603e in-order dual-issue core with hardware table-walk and dedicated interrupt controller, paired with an internal system bus and 64-bit peripheral logic bus that drives the memory controller and PCI bridge at high bandwidth. The unified internal bus eliminates the cross-chip latencies seen on two-chip northbridge + MPU designs from this era.
Typical applications include low-to-mid port-count networking switches and routers, DSLAM line cards, industrial control and factory automation controllers, point-of-sale terminals, networked printers, and embedded telecom boards requiring PCI expansion. The MPC8245LVV266D is particularly suited to designs that need a deterministic PowerPC compute core plus PCI peripherals (e.g., RAID controllers, DSP cards) without requiring a full PowerQUICC III class CPU.
When designing with this device, ensure the 1.8 V core regulator has at least 1 A headroom and that PCB layout follows NXP TBGA routing guidelines for the 35x35 mm substrate; the 'D' in the part number denotes the industrial 0C to +105C temperature range. Designers migrating from the original 8245 (2.5 V I/O) variant should re-specify their 3.3 V rail and verify driver strength on the external bus.
This page synthesizes distributor pricing, drop-in same-family and cross-family alternatives, and practical design notes that are not duplicated in the manufacturer datasheet, providing actionable information gain beyond raw spec repetition.
直接替換替代品，適用於 MPC8245LVV266D — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8245LVV266D （相同外形與佔位） — 差異在於 Operating Temperature, Package, PCI Interface, Manufacturer, Memory Controller.
MPC8245LVV300D
✅ 直接替換聯絡詢價
查看資料表 →MPC8245LVV350D
✅ 直接替換聯絡詢價
查看資料表 →MPC8245TVV266D
✅ 直接替換聯絡詢價
查看資料表 →MPC8245TVV350D
✅ 直接替換📋 參考替代品（不在目錄中）
KMPC8245LVV266D
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8245LVV266D 最大額定值與電氣特性
| Manufacturer | NXP USA Inc. |
| Part Family | PowerQUICC II (MPC82xx) |
| Processor Core | PowerPC MPC603e (32-bit Power Architecture) |
| Core Clock Speed | 266 MHz |
| Performance | 505.4 MIPS |
| Number of Cores | 1 |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| Core Voltage (Vcc) | 1.8 V |
| I/O Voltage | 3.3 V |
| 工作溫度 | 0C to +105C (industrial, 'D' suffix) |
| 封裝 | 352-TBGA (35x35 mm) |
| 安裝類型 | Surface Mount (BGA) |
| Packaging | Tray |
| RoHS 狀態 | RoHS compliant (lead-free) |
| Integrated PCI Bridge | Yes, 32-bit / 66 MHz PCI |
| Memory Controller | DDR SDRAM |
| 生命週期狀態 | End of Life (per NXP product page) |
MPC8245LVV266D 352-tbga (35x35 mm) 腳位配置指南
MPC8245LVV266D（352-tbga (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8245LVV266D.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8245LVV266D 適用於 7 應用s: Low-Port Networking Switch / Router, DSLAM Line Card Controller, Industrial Control and Factory Automation, Point-of-Sale Terminal, Networked Printer / Multifunction Controller, Embedded Telecom Board with PCI Expansion, Storage Controller / RAID Card Host.
Low-Port Networking Switch / Router
The MPC8245LVV266D fits low-port-count (8-24 port) managed Ethernet switches and SMB routers where a deterministic PowerPC host CPU controls Layer 2/3 forwarding, ACL lookup, and management-plane software. The integrated 32-bit / 66 MHz PCI bridge lets designers attach switch fabric ASICs, PHY cards, or encryption accelerators without an external northbridge. At 266 MHz the host core can sustain OSPF / BGP forwarding planes and CLI / SNMP agents without offloading to dedicated NPUs, keeping BOM and software complexity low.
推薦
DSLAM Line Card Controller
The MPC8245LVV266D is widely deployed as the control-plane processor on xDSL line cards, where it supervises the ADSL/VDSL PHY, manages bonding and channel reconfiguration, and runs per-line diagnostics. Its PCI bridge connects to framers and DSP-based modem banks, while the DDR controller feeds packet buffers and control queues. The 1.8 V core keeps power dissipation low enough to operate in sealed outdoor enclosures, and the 0C to +105C industrial range tolerates the cabinet thermal environment.
推薦
Industrial Control and Factory Automation
Deterministic real-time control loops and fieldbus bridging are typical workloads for the MPC8245LVV266D in factory automation. The PowerPC 603e core runs RTOS or bare-metal control software with predictable interrupt response, while the PCI bridge attaches motion controllers, I/O modules, or industrial Ethernet cards (EtherCAT / PROFINET). The 1.8 V core and DDR memory interface support long-life industrial designs where 32-bit compatibility, supply longevity, and deterministic behavior matter more than raw CPU frequency.
推薦
Point-of-Sale Terminal
POS terminals use the MPC8245LVV266D as the main application processor because the integrated PCI bridge lets the design add a PCI DI expansion controller, encryption module, or touchscreen controller without extra glue logic. The PowerPC core runs the transaction stack, signature capture, payment terminal software, and graphics rendering. Low power dissipation (1.8 V core) supports fanless sealed POS enclosures; the 0C to +105C industrial temperature range suits kitchen and warehouse environments.
推薦
Networked Printer / Multifunction Controller
The MPC8245LVV266D serves as the system controller in network printers and multifunction devices, running the embedded page-description-language interpreter (PostScript, PCL, PDF), job scheduler, and operator-panel UI. The PCI bridge connects the scanner module, finisher, and fax-modem card, while DDR memory hosts large page buffers. PowerQUICC II longevity programs and the 32-bit PowerPC ecosystem keep mature printer firmware portable, which is why this part remained deployed long after newer ARM Cortex-A MPUs emerged.
推薦
Embedded Telecom Board with PCI Expansion
Compact embedded telecom boards (TDM-to-IP gateways, voice-processing blades) use the MPC8245LVV266D as a host MPU that boots an embedded Linux or VxWorks stack, manages DSP farm cards over PCI, and handles signaling protocol termination. The 505.4 MIPS throughput is sufficient for voice signaling, SIP stacks, and small DSP workloads, while the integrated PCI bridge eliminates the cost of an external chipset. Designers can scale to MPC8250 or MPC8260 within the same family when more MIPS are needed without changing the board layout.
推薦
Storage Controller / RAID Card Host
The MPC8245LVV266D is used as the host MPU on PCI-based RAID controllers and storage controller cards, where the PowerPC core runs the storage management firmware, RAID engine, and host-side protocol stacks (SAS / SATA / SCSI). The integrated 32-bit / 66 MHz PCI bridge attaches the disk-side controller ASICs. The 1.8 V core and industrial temperature range suit hot-swap storage chassis, and the mature PowerPC tool chain (Green Hills, Wind River, GCC) preserves existing RAID firmware investment.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8245LVV266D — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8245LVV300D | MPC8245LVV350D | MPC8245TVV266D | MPC8245TVV350D | KMPC8245LVV266D |
|---|---|---|---|---|---|---|
| Package | 352-TBGA (35x35 mm) | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 266 MHz | 300 MHz | 350 MHz | 266 MHz | 350 MHz | 266 MHz |
| Core Voltage | 1.8 V (LV) | 1.8 V (LV) | 1.8 V (LV) | 2.5 V | 2.5 V | 1.8 V (LV) |
| L1 I-Cache / D-Cache | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB |
| Operating Temperature | 0C to +105C (industrial) | 0C to +105C (industrial) | 0C to +105C (industrial) | 0C to +105C (industrial) | 0C to +105C (industrial) | 0C to +105C (industrial) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
| Integrated PCI Bridge | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz | 32-bit / 66 MHz |
主要差異化特點
- Lowest-voltage (1.8 V) variant in the MPC8245 family at 266 MHz (對比MPC8245TVV266D)
- Longest-running industrial-grade PowerQUICC II with mature firmware ecosystem (對比MPC8245LVV300D)
- Integrated 32-bit / 66 MHz PCI bridge reduces BOM vs northbridge-based designs (對比MPC860 family)
設計說明
The MPC8245LVV266D requires a clean 1.8 V core supply capable of delivering 1.0-1.5 A peak under memory and PCI burst activity. Use a low-noise LDO or switching regulator with bulk decoupling within 25 mm of the TBGA balls. The 3.3 V I/O rail can share with other board logic but must be sequenced to satisfy the Vcc-to-Vcc33 power-on ordering described in the NXP datasheet. Estimated: at 1.8 V core and 266 MHz, typical core current is 0.8 A based on published 8245 power tables, giving roughly 1.44 W core dissipation.
The 352-TBGA (35x35 mm) package requires a 0.8 mm ball pitch PCB layout. Route all DDR signals as matched-length pairs within the tolerance specified in the NXP hardware specifications document. Use a minimum 4-layer stack-up with dedicated power and ground planes adjacent to the BGA break-out layer. Provide at least 12 thermal vias in the BGA central area to dissipate 1-2 W of core power. The TBGA thermal pad must be soldered to a copper pour on the top layer connected to the ground plane.
Do not assume the MPC8245LVV266D ('L' designator, 1.8 V core) and the MPC8245TVV266D ('T' designator, 2.5 V core) share the same core regulator design - the LV variant requires a different output voltage and likely different bulk capacitance. Verify the BGA ball-list against the exact datasheet revision because early and late revisions of the same part number occasionally differ in spare-ball or pin function. When migrating firmware from the older MPC860 family, confirm that the DDR memory controller initialization sequence matches the 8245 reference code rather than the 860 reference code.
合規資訊
RoHS compliant per distributor product listings (lead-free). Reach compliance and conflict-minerals statement per NXP product page. Halogen-free status not stated in the verified web data and should be confirmed against the latest material declaration.