MPC8245TVV266D - PowerPC 603e 266MHz Host Processor | NXP
MPN： MPC8245TVV266D ✗ 停產MPC8245TVV266D 概覽
An integrated host processor (IHP) is a system-on-chip that merges an application CPU, a peripheral bridge, and a memory controller to reduce board area and component count. In the MPC82xx family hierarchy, the MPC8245 sits between entry-level embedded PowerPC devices and higher-performance MPC8240/MPC8250 parts, targeting cost-sensitive applications where PCI connectivity, performance, and low power must coexist.
Key features include a 266 MHz core speed, a 64-bit system bus (32-bit data path on external memory), 32 KB L1 cache, integrated PCI bus controller supporting PCI 2.2, SDRAM/DDR memory controller, and a power-management unit. The device operates at 3.3 V core with 5 V-tolerant I/O and uses a 0.25 micrometer CMOS process. Operating temperature range spans -40 C to +105 C for industrial environments.
The chip combines the proven PowerPC 603e core (superscalar, out-of-order execution) with an Application-Specific Integrated Logic block to handle I/O and memory. The integrated PCI bridge provides master/target capability and arbitration, eliminating an external bridge chip. The memory controller supports SDRAM, Flash, and ROM with ECC for fault-tolerant operation, while dedicated DMA engines accelerate I/O without CPU intervention.
Typical applications include networking line cards, RAID controllers, industrial control systems, printing and imaging equipment, and PCI-based peripheral cards. The combination of low power and integrated I/O also suits SOHO routers, storage controllers, and telematics platforms.
When designing with this part, careful attention must be paid to the 352-pin TBGA routing - the 35x35 mm footprint requires a multilayer PCB with microvia technology to escape the dense BGA pin field. Decoupling capacitor placement within 100 mils of power pins is essential to maintain signal integrity for the parallel memory bus, especially at full 66 MHz PCI operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from the NXP datasheet and reference designs, offering engineering context beyond a bare data summary.
直接替換替代品，適用於 MPC8245TVV266D — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8245TVV266D （相同外形與佔位） — 差異在於 Operating Temperature, PCI Interface, Package, Memory Controller, Mounting Type.
MPC8245TVV300D
✅ 直接替換聯絡詢價
查看資料表 →MPC8245LZU266D
✅ 直接替換聯絡詢價
查看資料表 →MPC8245LZU300D
✅ 直接替換聯絡詢價
查看資料表 →MPC8245TVV266D 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) |
| Part Number | MPC8245TVV266D |
| Core Architecture | PowerPC 603e (32-bit Power Architecture) |
| Core Frequency | 266 MHz |
| Number of Cores | 1 |
| Bus Width | 32-bit (64-bit internal) |
| L1 Cache | 32 KB (unified) |
| Integrated Functions | PCI bridge, memory controller, DMA |
| PCI Interface | PCI 2.2 compliant, 32-bit/64-bit, 33/66 MHz |
| Memory Controller | SDRAM/DDR support with ECC |
| Process Technology | 0.25 um CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Voltage | 3.3 V (5 V tolerant) |
| 工作溫度 | -40 C to +105 C (industrial) |
| 封裝 | 352-pin TBGA (35 mm x 35 mm) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Non-Compliant (legacy Sn/Pb) |
| Status | Obsolete / End of Life |
MPC8245TVV266D 352-pin tbga (35 mm x 35 mm) 腳位配置指南
MPC8245TVV266D（352-pin tbga (35 mm x 35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8245TVV266D.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8245TVV266D 適用於 7 應用s: PCI-Based Networking Line Cards, RAID Storage Controllers, Industrial Control Systems, Printing and Imaging Equipment, Telematics and In-Vehicle Computing, SOHO Router and Gateway Designs, Medical Imaging Peripherals.
PCI-Based Networking Line Cards
The integrated PCI 2.2 bridge makes the MPC8245TVV266D ideal for networking line cards that need a host CPU plus PCI connectivity for framer or MAC ASICs. Its 266 MHz PowerPC 603e core delivers enough performance for control-plane forwarding and management, while the integrated bridge eliminates an external PCI chip. Designers route the PCI bus directly to the edge connector and use the memory controller to attach DDR/SDRAM for packet buffers. The 5 V-tolerant I/O simplifies legacy backplane interfacing.
推薦
RAID Storage Controllers
The combination of a 266 MHz PowerPC 603e core, ECC-capable memory controller, and integrated DMA channels suits RAID controller designs. The CPU handles command queuing, parity calculation, and host-side protocols, while DMA engines offload bulk data movement between SATA/SCSI PHYs and system memory. The 5 V-tolerant PCI interface supports legacy RAID HBAs, and ECC on the SDRAM interface protects metadata integrity during rebuild operations.
推薦
Industrial Control Systems
With -40 C to +105 C industrial temperature range and 266 MHz processing headroom, the MPC8245TVV266D is suited for PLC controllers, motion-control boards, and SCADA gateway designs. The PowerPC 603e core runs deterministic VxWorks or Linux real-time firmware, while the PCI bridge provides expansion for motion cards or fieldbus ASICs (Profibus, CAN, EtherCAT). ECC memory improves reliability in factory-floor environments exposed to EMI.
推薦
Printing and Imaging Equipment
The integrated host processor architecture is well-matched to mid-range multifunction printers and imaging controllers, where the PowerPC 603e drives the raster image processor and the PCI bridge connects to scanner ASICs or network interfaces. The low power consumption of the 0.25 um core reduces the printer's thermal envelope, allowing compact enclosures. ECC SDRAM keeps image data integrity intact during high-volume printing jobs.
推薦
Telematics and In-Vehicle Computing
The industrial -40 to +105 C temperature range lets the MPC8245TVV266D operate inside telematics control units where automotive thermal swings are common. The integrated PCI bus supports GPS receivers, cellular modems, and CAN bridge ASICs. ECC memory protects against soft errors in vehicle electrical environments, while the PowerPC 603e core handles routing stacks and diagnostics without needing a separate microcontroller. Lead-free variants may be required for in-vehicle designs.
推薦
SOHO Router and Gateway Designs
The MPC8245TVV266D pairs a 266 MHz CPU with integrated PCI and memory control in a single chip, suiting entry-level SOHO routers and broadband gateways. The PowerPC 603e core runs the routing stack, while the PCI bridge attaches to Wi-Fi mini-PCI cards or DSL modem ASICs. ECC memory keeps routing tables safe from bit flips in always-on deployments, and the low 0.25 um process power draw keeps the SOHO power budget manageable.
推薦
Medical Imaging Peripherals
The PowerPC 603e core with ECC memory and integrated PCI bridge fits ultrasound carts and patient-monitoring peripherals that require deterministic real-time response. The 266 MHz clock handles modest data-acquisition rates, while DMA engines bulk-transfer pixel data to system memory. The industrial temperature range and ECC make the part suitable for clinical environments that demand data-integrity guarantees, although medical designs may require lead-free packaging variants.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8245TVV266D — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8245TVV300D | MPC8245LZU266D | MPC8245LZU300D | MPC8245TZU266D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-pin TBGA (35x35) | 352-pin TBGA (35x35) - same | 352-pin TBGA (35x35) - same footprint family | 352-pin TBGA (35x35) - same | 456-pin TBGA - different |
| Core Frequency | 266 MHz | 300 MHz | 266 MHz | 300 MHz | 266 MHz |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Integrated PCI Bridge | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) |
| Memory Controller | SDRAM with ECC | SDRAM with ECC | SDRAM with ECC | SDRAM with ECC | SDRAM with ECC |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 1, USD) | $48.50 | $52.00-$58.00 | $45.00-$50.00 | $55.00 | $60.00+ |
主要差異化特點
- Highest-speed 352-pin TBGA variant in the 266 MHz grade (對比MPC8245LZU266D)
- Lower-cost entry into the MPC8245 family at 266 MHz (對比MPC8245TVV300D)
- 352-ball TBGA footprint matches speed-grade family (對比MPC8245TZU266D)
- Integrated PCI 2.2 with master/target and arbitration (對比MPC8248CVRTIEA)
設計說明
The 352-pin TBGA package at 35x35 mm requires multilayer PCB with via-in-pad or microvia escape to break out the dense 1.27 mm ball pitch. Use a 6-layer stackup minimum (signal-ground-power-signal-power-signal) and place 0.1 uF decoupling capacitors within 100 mils of every power/ground ball pair. Estimated based on the MPC8245 datasheet package dimension: routing density exceeds 600 escape traces, so blind/buried vias are recommended for first-two layers.
The 0.25 um CMOS process dissipates approximately 1.5-2.0 W at 266 MHz with typical workloads. With a TBGA theta_JA near 18 C/W (estimated for 35x35 mm package on a 4-layer JEDEC board), junction temperature rises 27-36 C above ambient, well within the 105 C industrial limit. For sealed enclosures, however, mount thermal vias directly under the package die shadow and consider a copper spreader for 90 percent loading margins.
The external memory bus runs at half the CPU clock (133 MHz at 266 MHz core) with 64-bit data, producing significant simultaneous switching noise on the address/control bus. Series-terminate all address and control lines to 50 ohms, keep trace lengths matched within +/- 250 mils, and use a continuous ground reference plane beneath the bus. The PCI bus at 66 MHz demands the same termination discipline plus stub-length control below 1.5 inches.
The MPC8245 requires a 3.3 V core rail capable of at least 1.5 A peak during cache-miss bursts. Use a low-dropout regulator with +/- 3 percent tolerance and 50 mV peak-to-peak ripple. The I/O rail can share the core supply if 5 V tolerance is not needed; otherwise, derive the I/O rail separately. Hold the system reset for at least 100 us after all rails reach 90 percent of nominal to allow internal PLL lock.
Because this part is obsolete, do not rely on NXP EOL coupons or RMA paths. Source only from authorized stocking distributors (Rochester Electronics, DigiKey-Franchise) and reject any supplier without a traceable Certificate of Conformance. Verify the lead-finish code against the datasheet; lead-free variants exist for some MPC8245 suffix codes. Confirm 5 V tolerance on PCI pins before driving them from a 5 V slot.
合規資訊
RoHS non-compliant due to legacy leaded Sn/Pb BGA balls; lead-free variants exist for other suffix codes. Not AEC-Q100 qualified. Reach compliant per NXP environmental documentation. Conflict-minerals compliant per NXP policy.
