PIC16LF15376-I/MV - 28KB Flash 8-bit MCU | Microchip
MPN： PIC16LF15376-I/MV ✓ 啟用中PIC16LF15376-I/MV 概覽
An 8-bit PIC microcontroller (MCU) is a compact, low-cost processor built on Microchip's RISC-based PIC architecture. It executes one instruction per cycle and is widely used in embedded applications where predictable behavior, low power, and integrated peripherals outweigh raw computational speed. PIC16 MCUs occupy the mid-tier of Microchip's 8-bit portfolio, balancing peripherals and code density with low cost.
Key features include 2 KB RAM, four 10-bit PWM outputs, a 10-bit ADC, a 5-bit/8-bit DAC, configurable logic cells (CLC), complementary waveform generator (CWG), and up to 36 I/O pins. Two EUSART plus SPI and I2C serial engines enable simultaneous sensor bus and host communication, while on-chip peripherals reduce external component count.
The device uses an internal 32 MHz high-speed oscillator with PLL, supports up to 32 MHz system clock, and provides selectable clock sources including 31 kHz LFINTOSC for low-power modes. XLP delivers nanoWatt sleep currents, allowing years of operation from a single coin cell in duty-cycled sensing applications.
Typical applications include IoT sensor nodes, battery-powered medical wearables, low-power wireless sensor hubs, industrial HVAC controls, and consumer appliance control panels. Designers leverage the integrated analog peripherals to digitize sensor signals without external ADC ICs.
When designing, reserve a 100 nF decoupling capacitor near each VDD pin and a 10 uF bulk capacitor at the supply entry point. Use Microchip's MPLAB X IDE with the XC8 compiler for code development and the PICkit 4 or MPLAB Snap debugger for in-circuit programming and debugging.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping procurement and engineering teams make faster sourcing and design decisions.
直接替換替代品，適用於 PIC16LF15376-I/MV — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC16LF15376-I/MV （相同外形與佔位） — 差異在於 DAC, Package, ADC, I/O Pins, Program Memory (Flash).
此產品無可直接替換的替代品。
申請替代品PIC16LF15376-I/MV 最大額定值與電氣特性
| Core Architecture | PIC16 (8-bit RISC) |
| Family | PIC16F15376 (XLP) |
| CPU Speed | 32 MHz (max) |
| Program Memory (Flash) | 28 KB (16K x 14) |
| Data RAM | 2 KB |
| Operating Voltage Range | 1.8 V to 3.6 V |
| 封裝 | 40-pin UQFN (5x5 mm) with exposed pad |
| I/O Pins | Up to 36 |
| ADC | 10-bit, multi-channel |
| DAC | 5-bit and 8-bit |
| PWM Channels | 4 x 10-bit |
| Comparators | Yes |
| CLC (Configurable Logic Cells) | 4 |
| CWG (Complementary Waveform Generator) | Yes |
| EUSART | 2 |
| SPI | Yes |
| I2C | Yes |
| Internal Oscillator | 32 MHz with PLL, 31 kHz LFINTOSC |
| XLP (eXtreme Low Power) | Yes |
| 工作溫度 | -40 C to +85 C (Industrial) |
| RoHS 狀態 | Compliant |
PIC16LF15376-I/MV 40-pin uqfn (5x5 mm) with exposed pad 腳位配置指南
PIC16LF15376-I/MV（40-pin uqfn (5x5 mm) with exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC16LF15376-I/MV.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC16LF15376-I/MV 適用於 6 應用s: Battery-Powered IoT Sensor Nodes, Wearable Health Monitoring Devices, Industrial HVAC Control Panels, Consumer Appliance Control Boards, Remote Wireless Sensor Hubs, Educational and Maker Platforms.
Battery-Powered IoT Sensor Nodes
The PIC16LF15376-I/MV suits IoT sensor nodes because its 1.8-3.6 V supply range accepts single-cell LiCoin or 2x AA alkaline chemistries directly without boost regulators. XLP nanoWatt technology holds sleep current under 1 uA while a 31 kHz LFINTOSC maintains a real-time wake source. Integrated 10-bit ADC, four CLCs, and 2 KB RAM sample thermistor, PIR, or photodiode signals and run small protocol stacks without external logic.
推薦
Wearable Health Monitoring Devices
For wearable health devices, the PIC16LF15376-I/MV combines low active current with 32 MHz compute headroom to drive on-body sensors like heart-rate, SpO2, and motion trackers. The 5-bit/8-bit DAC plus 10-bit ADC digitizes biopotential signals directly, while the 40-pin UQFN (5x5 mm) keeps the PCB footprint small enough for wrist or patch enclosures. XLP sleep modes extend battery life across multi-day wear cycles.
推薦
Industrial HVAC Control Panels
The PIC16LF15376-I/MV fits HVAC control panels needing multiple sensor inputs (temperature, humidity, pressure) and switched outputs (fans, valves, relays). Four 10-bit PWM channels drive fan speed or damper servos without extra timers, while the CWG provides complementary drive for three-phase BLDC motor support. Two EUSART ports bridge to a master controller display and a wired Modbus fieldbus simultaneously.
推薦
Consumer Appliance Control Boards
The PIC16LF15376-I/MV integrates almost every peripheral a small appliance needs: PWMs for motor drive, ADC for temperature sensing, CLC for safety logic, and EUSART/SPI/I2C for HMI bridges. The 28 KB Flash fits the largest of UI state machines and fault diagnostics. Designers can retire external EEPROMs by leveraging the PIC16's data EEPROM, lowering the BOM cost for high-volume white-goods production.
推薦
Remote Wireless Sensor Hubs
Wireless sensor hubs benefit from the PIC16LF15376-I/MV because two EUSART blocks can simultaneously host a sub-GHz radio module (LoRa, FSK) and a wired debug or RS-485 backhaul. Four CLCs implement custom packet framing and timing, while 28 KB Flash holds LoRaWAN or proprietary MAC code. XLP keeps idle current low enough that battery-powered hubs last multiple years on duty-cycled transmissions.
推薦
Educational and Maker Platforms
The PIC16LF15376-I/MV is well suited to learning platforms because the free MPLAB X IDE, XC8 compiler, and MPLAB Code Configurator let students initialize peripherals graphically. The PICkit 4 or Curiosity Nano board provides low-cost programming and debugging. The chip's combination of PWMs, ADC, DAC, CLCs, and dual EUSART gives learners exposure to nearly every common MCU peripheral within a single $2 device.
推薦
推薦產品摘要
工程參考資料，適用於 PIC16LF15376-I/MV — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC16LF15376-E/MV | PIC16F15376-I/MV | PIC16LF15376-I/ML | PIC16LF15376-I/MVVAO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-pin UQFN (5x5 mm) | 40-pin UQFN (5x5 mm) - same | 40-pin UQFN (5x5 mm) - same | 44-pin QFN (8x8 mm) - different | 40-pin UQFN (5x5 mm) - same |
| Flash Memory | 28 KB (16K x 14) | 28 KB | 28 KB | 28 KB | 28 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit |
主要差異化特點
- Lowest voltage operation in PIC16F15376 family (對比PIC16F15376-I/MV)
- Extended temperature variant available in same footprint (對比PIC16LF15376-E/MV)
- Larger QFN variant offers more I/O pins (對比PIC16LF15376-I/ML)
設計說明
Place a 100 nF decoupling capacitor adjacent to every VDD pin and a 10 uF bulk capacitor at the supply entry to the PIC16LF15376-I/MV. The exposed thermal pad (EP) on the UQFN-40 must be soldered to a copper pour tied to ground to dissipate heat and provide a low-impedance return path. Use a ferrite bead on VDD if the board shares a noisy digital supply.
Always configure the Configuration Words (CONFIG1, CONFIG2, CONFIG3) before exiting reset, especially the watchdog timer (WDTE) and brown-out reset (BOR) settings. Forgetting to enable the PLL prevents the 32 MHz operation. For low-power designs, switch the system clock to LFINTOSC before entering Sleep to keep active current in the microamp range.
Route the ICSPDAT/ICSPCLK traces (typically RB7/RB6) away from switching power nodes to prevent programming glitches. Keep analog signals (ADC, DAC) short and away from PWM outputs to minimize coupling. The UQFN-40 EP should occupy at least 50% copper area with thermal vias for reliable operation above 32 MHz.
The PIC16LF15376-I/MV dissipates well under 100 mW even at full 32 MHz operation, so no external heatsink is required. However, exposed-pad soldering improves thermal conductivity to the PCB, keeping the junction below the 150 C maximum at industrial temperatures. Ensure the EP is soldered to a continuous ground pour, not a trace, for heat spreading.
合規資訊
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; the automotive-grade PIC16F15376-E/MVAO is the alternative. Lead-free reflow profile per JEDEC J-STD-020.
