PIC18F55K42-I/MV - 8-Bit 64MHz MCU, 32KB Flash, 48-UQFN | Microchip
MPN： PIC18F55K42-I/MV ✓ 啟用中PIC18F55K42-I/MV 概覽
An 8-bit PIC microcontroller is a Harvard-architecture RISC CPU with separate program and data buses, optimized for deterministic real-time control. Within Microchip's taxonomy the part belongs to PIC18 (high-performance 8-bit) -> PIC microcontroller -> microcontroller -> embedded controller -> semiconductor. The XLP (eXtreme Low Power) family extends this lineage with nanoWatt sleep modes that allow battery-powered nodes to remain active for years on a single cell.
Key differentiating features include DMA-capable peripherals that move data without CPU intervention, a vectored interrupt controller with two programmable priority levels, two-level hardware context saving, and CIPs such as CLC, NCO, PWM and the configurable logic cell that let designers build state machines in hardware. The 12-bit ADC2 includes automated averaging, threshold comparison, and zero-crossing detection that offload typical signal-chaining math from the core.
The architecture uses a 16-bit instruction word with 8-bit data path and an internal 64 MHz oscillator; instruction execution is four clock cycles. The MV package suffix denotes the 48-pin UQFN (MV) industrial-grade (-40 C to +85 C) variant, distinguished from the low-power PIC18LF55K42 sibling only by its operating voltage range (2.3-5.5 V vs 1.8-3.6 V). Hardware CTE (code-protection) and ICD/ICSP debug pins are present.
Typical applications include consumer appliance control, IoT sensor hubs, low-power wireless gateways (paired with RN2483 or MRF24XA), USB-CDC human-interface devices, industrial LED drivers, and small motor-control BLDC fans. The high pin count makes the device well-suited to systems that previously required 40-pin parts but now need more I/O for capacitive touch or segmented displays.
A practical design tip: place a 100 nF decoupling capacitor on every VDD/AVDD pair and a bulk 10 uF near the package exposed pad; the EP must be soldered to the ground plane for thermal dissipation and signal integrity. Use the MAP feature to lock the bootloader region from accidental erase.
This page consolidates current distributor pricing, drop-in alternatives, and practical design notes not gathered in the manufacturer datasheet alone, allowing engineers to evaluate the PIC18F55K42-I/MV against modern 8-bit and 32-bit alternatives before committing to a BOM line.
直接替換替代品，適用於 PIC18F55K42-I/MV — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18F55K42-I/MV （相同外形與佔位） — 差異在於 Package, ADC, Program Memory (Flash), DAC, Comparators.
PIC18F55K42T-I/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18F55K42-E/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18F56K42-I/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18F57K42-I/MV
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18F46K22-E/MV
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC18F55K42-I/MV 最大額定值與電氣特性
| Family | PIC18 XLP 18K |
| CPU Core | PIC18 8-bit RISC |
| Maximum CPU Frequency | 64 MHz |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data SRAM | 2 KB |
| Data EEPROM | 256 bytes |
| 封裝 | 48-UQFN (6x6 mm) with exposed pad |
| 腳位數 | 48 |
| Operating Voltage (VDD) | 2.3 V to 5.5 V |
| 工作溫度 | -40 C to +85 C (Industrial) |
| ADC | 12-bit ADC2 with Computation, up to 43 channels |
| DAC | 5-bit DAC |
| Comparators | On-chip |
| PWM Channels | Multiple 16-bit PWM |
| DMA | Yes (Core Independent) |
| Vector Interrupts | Yes, programmable priority |
| Core Independent Peripherals (CIP) | CLC, NCO, CWG, DSM |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
PIC18F55K42-I/MV 腳位配置
| 腳位 1 | RA0/IOVDD — PORTA0 / I/O supply |
| 腳位 2 | RA1 — PORTA1 |
| 腳位 3 | RA2 — PORTA2 |
| 腳位 4 | RA3 — PORTA3 |
| 腳位 5 | RA4 — PORTA4 |
| 腳位 6 | RA5 — PORTA5 |
| 腳位 7 | RA6 — PORTA6 |
| 腳位 8 | RA7 — PORTA7 |
| 腳位 9 | VSS — Ground |
| 腳位 10 | VDD — Core supply |
| 腳位 11 | RB0 — PORTB0 |
| 腳位 12 | RB1 — PORTB1 |
| 腳位 13 | RB2 — PORTB2 |
| 腳位 14 | RB3 — PORTB3 |
| 腳位 15 | RB4 — PORTB4 |
| 腳位 16 | RB5 — PORTB5 |
| 腳位 17 | RB6/ICSPCLK — PORTB6 / ICD clock |
| 腳位 18 | RB7/ICSPDAT — PORTB7 / ICD data |
| 腳位 19 | AVSS — Analog ground |
| 腳位 20 | AVDD — Analog supply |
| 腳位 21 | RC0 — PORTC0 |
| 腳位 22 | RC1 — PORTC1 |
| 腳位 23 | RC2 — PORTC2 |
| 腳位 24 | RC3 — PORTC3 |
| 腳位 25 | RC4 — PORTC4 |
| 腳位 26 | RC5 — PORTC5 |
| 腳位 27 | RC6 — PORTC6 |
| 腳位 28 | RC7 — PORTC7 |
| 腳位 29 | VSS — Ground |
| 腳位 30 | VDD — Core supply |
| 腳位 31 | RD0 — PORTD0 |
| 腳位 32 | RD1 — PORTD1 |
| 腳位 33 | RD2 — PORTD2 |
| 腳位 34 | RD3 — PORTD3 |
| 腳位 35 | RD4 — PORTD4 |
| 腳位 36 | RD5 — PORTD5 |
| 腳位 37 | RD6 — PORTD6 |
| 腳位 38 | RD7 — PORTD7 |
| 腳位 39 | RE0 — PORTE0 |
| 腳位 40 | RE1 — PORTE1 |
| 腳位 41 | RE2 — PORTE2 |
| 腳位 42 | RE3 — PORTE3 |
| 腳位 43 | RE4 — PORTE4 |
| 腳位 44 | RE5 — PORTE5 |
| 腳位 45 | RE6 — PORTE6 |
| 腳位 46 | RE7 — PORTE7 |
| 腳位 47 | OSC1/CLKI — External oscillator input |
| 腳位 48 | OSC2/CLKO — External oscillator output |
典型應用
PIC18F55K42-I/MV 適用於 6 應用s: Battery-Powered IoT Sensor Hub, Consumer Appliance Control (HMI), Industrial LED Lighting Driver, Small BLDC Motor Control Fan, USB-CDC Human Interface Device, Smart Home Edge Node.
Battery-Powered IoT Sensor Hub
The PIC18F55K42-I/MV is well suited to battery-powered IoT sensor hubs because its XLP architecture achieves 50 nA typical sleep current with full RAM retention, allowing multi-year operation on a single CR2032 cell. The 32 KB Flash is sufficient for application code plus a ZigBee or LoRa driver, and the 12-bit ADC2 with Computation provides on-chip averaging and threshold detection that offload routine signal conditioning from the CPU. Its DMA controller moves ADC results to RAM without waking the core, further reducing average current. Pair the part with an MRF24XA or RN2483 sub-GHz transceiver to build a complete sensor node.
推薦
Consumer Appliance Control (HMI)
The PIC18F55K42-I/MV's 48-UQFN pin count provides enough I/O to drive segmented LCDs, capacitive touch buttons, multiple LEDs, and a control triac on a single chip in a washing-machine or dishwasher front panel. Its 64 MHz CPU handles mTouch capacitive-touch libraries and a real-time state machine for safety interlocks, while the PWM outputs drive motor-control signals with up to 16-bit resolution. The on-chip comparators and 5-bit DAC support closed-loop motor current sensing without external analog ICs.
推薦
Industrial LED Lighting Driver
The PIC18F55K42-I/MV delivers 16-bit PWM resolution and Core Independent Peripherals such as CLC and NCO that allow designers to implement constant-current LED drivers and DMX-style dimming protocols without CPU overhead. Its 2.3-5.5 V operating range is compatible with both 3.3 V logic and 5 V analog driver stages. The CWG (Complementary Waveform Generator) and DSM (Data Signal Modulator) peripherals generate dead-band-controlled complementary PWM signals needed for high-brightness LED half-bridge drivers up to several hundred kHz.
推薦
Small BLDC Motor Control Fan
The PIC18F55K42-I/MV can drive small sensorless BLDC fans using its on-chip comparators for back-EMF zero-cross detection, the DSM peripheral for noise-robust commutation timing, and the DMA controller to stream ADC samples into memory for sensorless startup algorithms. The 64 MHz CPU executes field-oriented-control math at sufficient rate for fans up to a few hundred watts. Industrial-grade -40 C to +85 C operation makes the part suitable for fan trays in telecom equipment or server racks.
推薦
USB-CDC Human Interface Device
The PIC18F55K42-I/MV can be paired with an external USB-UART bridge (MCP2200 or MCP2221A) to implement a USB CDC-class HID such as a custom keyboard, mouse, or configuration tool. The MCU's 32 KB Flash holds USB descriptor tables plus application code, and its 48 I/O pins are sufficient for scan-matrix keypads or rotary encoder inputs. Hardware vector interrupts with programmable priority guarantee sub-microsecond response time to user inputs without jitter.
推薦
Smart Home Edge Node
The PIC18F55K42-I/MV's XLP nanoWatt sleep modes make it ideal for battery-powered or energy-harvested smart-home edge nodes such as window sensors, leak detectors, and occupancy sensors. Its 12-bit ADC2 with Computation can sample a PIR sensor, light sensor, and thermistor at kHz rates while the core stays asleep. The DMA controller buffers samples to RAM and only wakes the CPU when an event exceeds threshold. Embedded in a 48-UQFN 6x6 mm footprint the entire MCU + a few passives fits on a coin-cell PCB less than 12 mm wide.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18F55K42-I/MV — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18F55K42T-I/MV | PIC18F55K42-E/MV | PIC18F56K42-I/MV | PIC18F57K42-I/MV | PIC18F46K22-E/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (6x6 mm) with EP | 48-UQFN (6x6 mm) with EP | 48-UQFN (6x6 mm) with EP | 48-UQFN (6x6 mm) with EP | 48-UQFN (6x6 mm) with EP | 40-UQFN (6x6 mm) with EP |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 128 KB | 64 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 4 KB | 8 KB | 3.8 KB |
| EEPROM | 256 B | 256 B | 256 B | 1024 B | 1024 B | 1024 B |
| Maximum CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V |
| Temperature Grade | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
| DMA Controller | Yes | Yes | Yes | Yes | Yes | No |
主要差異化特點
- Highest pin count in the PIC18F55/56/57K42 XLP family (對比PIC18F46K22-E/MV)
- Core Independent Peripherals (CIPs) reduce CPU overhead (對比PIC18F46K22-E/MV)
- Vectored interrupts with two priority levels (對比PIC18F55K42T-I/MV)
- Scalable Flash options within the same footprint (對比PIC18F56K42-I/MV)
設計說明
Estimated: at 64 MHz full active CPU and 5.0 V VDD, the PIC18F55K42-I/MV typically draws 8-10 mA. Place a 100 nF decoupling capacitor on every VDD/AVDD pair within 3 mm of the package, plus a single 10 uF bulk ceramic near the exposed pad. The exposed pad must be soldered to a continuous ground plane to meet thermal and EMC targets. For sleep applications, use Sleep mode (50 nA typical) plus Retention mode for RAM persistence; document both wake-up latency (5 us Sleep, 6 us Retention) in firmware design.
Estimated: the 48-UQFN 6x6 mm package has a thermal pad that doubles as the primary ground return. Use a via array (0.3 mm vias on 1 mm pitch) below the EP tied to the ground plane; missing the EP connection increases junction temperature by 20-30 C at full CPU load and degrades ADC2 SNR by several dB. For trace routing, allocate the inner layer to a single uninterrupted ground plane and route signals on outer layers to maintain 50 ohm impedance on SPI/I2C lines.
Estimated: when routing the 12-bit ADC2 analog inputs, dedicate a separate AVDD pin pair and place an LC (10 uH ferrite + 10 uF + 100 nF) pi-filter to isolate the analog rail from digital noise. The DAC and reference inputs should bypass to AVSS (not digital VSS) for lowest noise. Use adjacent-pin ground returns instead of shared return paths. The K42 family ADC2 with Computation provides on-chip averaging; enable Accumulate-and-Average mode to reduce software overhead and effectively increase resolution by 1-2 bits.
Common pitfalls with the PIC18F55K42-I/MV: (1) Forgetting to write the WDTCPS configuration bit to disable the default watchdog timer; (2) Using the wrong Voltage Regulator mode configuration - selecting 'Low Voltage' on the F variant causes VREG lockup above 3.6 V; (3) Failing to solder the exposed pad, leading to ESD damage on adjacent I/O; (4) Not enabling the Program Memory Read Protection bit when shipping production firmware; (5) Selecting the internal HFINTOSC without writing the PLL multiplier bit, halving performance; (6) Omitting the 4.7 uF tantalum + 100 nF bulk on VDD/AVDD when driving PWM at >100 kHz, causing voltage droop and CPU resets.
合規資訊
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; automotive customers should consider PIC18F55K42-E/MV (extended temp) and review Microchip's automotive-grade MCU portfolio separately. Lead-free and halogen-free per Microchip material declarations.
