PIC18LF23K22T-I/ML - 8-Bit XLP MCU, 64MHz, 8KB Flash, QFN-28
MPN： PIC18LF23K22T-I/ML ✓ 啟用中PIC18LF23K22T-I/ML 概覽
What is a PIC18F/LF K22 microcontroller? The PIC18 K22 family is a high-performance 8-bit PIC18 core range built around Microchip's enhanced RISC architecture with a hardware multiplier, C-compiler-friendly memory model, and XLP (eXtreme Low Power) sleep modes designed for energy-harvesting and battery-backed applications. Within the broader taxonomy, the part is a microcontroller -> 8-bit MCU -> PIC18 family -> nanoWatt XLP -> embedded control IC, making it a workhorse for general-purpose embedded designs.
The PIC18LF23K22T-I/ML uses a 16-bit instruction word with 8-bit data path, an internal 16MHz to 64MHz HFINTOSC, and a wide set of clock sources selectable per firmware. Its self-programming Flash, ICSP, and on-chip debug support pair naturally with MPLAB X IDE, MPLAB Code Configurator, and the PICkit 5 programmer/debugger referenced in the Microchip product family page.
Typical applications include portable medical devices, IoT sensor nodes, low-power remote controls, consumer HMI panels, and industrial sensor conditioning. When selecting the 'LF' variant, designers trade upper supply headroom (3.6V max) for the lowest active and sleep currents in the family, which is the right trade when the rail is a single Li-ion cell or 2x AA alkaline cells.
Design tip: route the exposed pad (EP) to a continuous ground copper pour with multiple thermal vias. Without proper EP grounding, junction-to-ambient thermal resistance rises sharply and ADC readings near full-scale will drift. This page consolidates distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 PIC18LF23K22T-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18LF23K22T-I/ML （相同外形與佔位） — 差異在於 Package, ADC, Operating Temperature, I/O Pins, Core Architecture.
PIC18LF23K22-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF24K22-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF25K22-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18LF43K22-I/ML
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC18F23K22-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF23K22T-I/ML 最大額定值與電氣特性
| Core Architecture | PIC18 8-bit RISC, enhanced instruction set |
| Program Memory (Flash) | 8 KB (4K x 16 words) |
| Data RAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Clock | 64 MHz (internal HFINTOSC); 16 MHz external |
| Supply Voltage (VDD) | 1.8 V to 3.6 V (LF variant) |
| I/O Pins | 25 (16 on distributor listing; up to 25 with PPS remap) |
| ADC | 10-bit, multiple channels |
| Comparators | 2 rail-to-rail analog comparators |
| PWM Modules | Multiple ECCP + CCP channels |
| Communication | EUSART, MSSP (SPI/I2C) |
| 工作溫度 | -40 C to +85 C (Industrial) |
| 封裝 | 28-pin QFN (6x6 mm) with EP |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant (LEAD FREE plastic) |
PIC18LF23K22T-I/ML 腳位配置
| 腳位 1 | RA3/AN3/VREF+ — Analog input / positive voltage reference |
| 腳位 2 | RA4/AN4 — Analog input / digital I/O |
| 腳位 3 | RA5/AN5 — Analog input / digital I/O |
| 腳位 4 | VDD — Positive supply voltage (1.8V-3.6V) |
| 腳位 5 | VSS — Ground reference |
| 腳位 6 | RA6/OSC2 — Digital I/O / crystal oscillator output |
| 腳位 7 | RA7/OSC1 — Digital I/O / crystal oscillator input |
| 腳位 8 | RB0/AN12/INT0 — Digital I/O / analog input / external interrupt 0 |
| 腳位 9 | RB1/AN10/INT1 — Digital I/O / analog input / external interrupt 1 |
| 腳位 10 | RB2/AN8 — Digital I/O / analog input |
| 腳位 11 | RB3/AN9 — Digital I/O / analog input |
| 腳位 12 | RB4/AN11 — Digital I/O / analog input |
| 腳位 13 | RB5/AN13 — Digital I/O / analog input |
| 腳位 14 | RB6/PGC — Digital I/O / ICSP clock |
| 腳位 15 | RB7/PGD — Digital I/O / ICSP data |
| 腳位 16 | RC0/SOSCO — Digital I/O / 32.768 kHz oscillator output |
| 腳位 17 | RC1/SOSCI — Digital I/O / 32.768 kHz oscillator input |
| 腳位 18 | RC2/AN14 — Digital I/O / analog input |
| 腳位 19 | RC3/AN15 — Digital I/O / analog input |
| 腳位 20 | RC4 — Digital I/O |
| 腳位 21 | RC5 — Digital I/O |
| 腳位 22 | RC6/TX/CK — EUSART TX / clock |
| 腳位 23 | RC7/RX/DT — EUSART RX / data |
| 腳位 24 | RD0 — Digital I/O (port D, ICSPDAT alternative) |
| 腳位 25 | RD1 — Digital I/O |
| 腳位 26 | RD2 — Digital I/O |
| 腳位 27 | RD3 — Digital I/O |
| 腳位 28 | NC — Not connected (per datasheet pinout for 28QFN) |
典型應用
PIC18LF23K22T-I/ML 適用於 6 應用s: Battery-Backed IoT Sensor Node, Portable Medical Monitoring Device, Industrial Sensor Conditioning, Low-Power Remote Control / HMI Keypad, Consumer Electronics Wearable, Smart Home / Building Automation Node.
Battery-Backed IoT Sensor Node
The PIC18LF23K22T-I/ML's nanoWatt XLP sleep current below 1 uA and 1.8-3.6V VDD make it a natural fit for battery-backed IoT sensor nodes. The 10-bit ADC samples temperature, humidity, or motion sensors directly without a front-end amplifier, while the 64MHz HFINTOSC keeps wake-time to a few hundred microseconds for burst processing. Typical deployments use 2x AA alkaline cells and a sub-GHz or BLE transceiver on the EUSART/MSSP pins to deliver 1-3 year battery life on duty-cycled wake intervals.
推薦
Portable Medical Monitoring Device
In portable medical monitoring, the PIC18LF23K22T-I/ML provides a low-EMI, low-noise compute platform for pulse-oximeter, glucose-meter, or inhaler monitoring peripherals. Its LF supply range (1.8-3.6V) matches single-cell Li-ion primary rails, while the integrated EUSART and MSSP support both BLE modules and tethered USB-to-UART bridges. The two on-chip rail-to-rail comparators simplify battery-voltage monitoring without external components, an important trait for FDA-traceable designs that must justify every BOM line.
推薦
Industrial Sensor Conditioning
The PIC18LF23K22T-I/ML's 10-bit ADC, dual comparators, and PPS (Peripheral Pin Select) routing let engineers place analog signal conditioning for thermocouples, RTDs, and 4-20 mA loops on a single chip. Industrial 4-20 mA loops typically run on 24V rails - the LF variant tops out at 3.6V, so designers step the loop voltage down with a precision LDO such as the MCP1700 before feeding the PIC ADC. PPS remapping is a key advantage: the SPI and UART signals can be assigned to any digital I/O without rewiring the PCB.
推薦
Low-Power Remote Control / HMI Keypad
For handheld remote controls, smart thermostats, and appliance HMI keypads, the PIC18LF23K22T-I/ML combines the CCP/PWM channels needed for LED backlight dimming, IR carrier generation, and buzzer drive in a single 28-pin QFN. The nanoWatt XLP sleep current below 1 uA preserves coin-cell or 2x AAA battery capacity during the long idle intervals typical of consumer remote use. The exposed thermal pad (EP) on the QFN-28 also simplifies mechanical integration into slim plastic enclosures where heatsinking would otherwise be impossible.
推薦
Consumer Electronics Wearable
Wearable fitness bands and BLE beacons benefit from the PIC18LF23K22T-I/ML's 1.8V minimum operation, which lets the MCU share a single Li-ion cell with a BLE module without a boost converter. The 25 I/O pins handle a small OLED display, capacitive touch buttons, a 3-axis accelerometer, and a haptic driver without an I/O expander. The internal 64MHz HFINTOSC eliminates the need for an external crystal, saving PCB area in cramped wearable enclosures.
推薦
Smart Home / Building Automation Node
In Zigbee or sub-GHz mesh nodes for smart lighting, HVAC, and security panels, the PIC18LF23K22T-I/ML acts as the application processor that runs the user interface and the 4-20 mA or 0-10V analog interfaces to legacy building equipment. The QFN-28 footprint accommodates the small PCBs typical of in-wall switch back-boxes, and the industrial -40 to +85 C temperature range supports unheated enclosures. The PIC18 core's deterministic interrupt latency simplifies real-time lighting control loops.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18LF23K22T-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18LF23K22-I/ML | PIC18LF24K22-I/ML | PIC18LF25K22-I/ML | PIC18F23K22-I/ML | PIC18LF43K22-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (6x6 mm) with EP | QFN-28 (6x6 mm) with EP - same | QFN-28 (6x6 mm) with EP - same | QFN-28 (6x6 mm) with EP - same | QFN-28 (6x6 mm) with EP - same | QFN-28 (6x6 mm) with EP - same |
| Flash Memory | 8 KB | 8 KB | 16 KB | 32 KB | 8 KB | 8 KB |
| RAM | 768 B | 768 B | 768 B | 1.5 KB | 768 B | 768 B |
| Maximum Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Supply Voltage | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) |
| I/O Pins | 25 | 25 | 25 | 25 | 25 | 36 (extended package I/O) |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
主要差異化特點
- Lowest sleep current in the PIC18 K22 family (對比PIC18F23K22-I/ML)
- Drop-in QFN-28 compatibility with the 24K22/25K22 family (對比PIC18LF24K22-I/ML)
- Factory-calibrated 64 MHz internal oscillator (對比PIC18LF23K22-I/ML)
設計說明
The QFN-28 EP (exposed pad) must be soldered to a continuous ground copper pour with a 3x3 thermal via array (0.3 mm drill, 0.5 mm pitch). Without EP grounding, junction-to-ambient thermal resistance theta_JA rises by roughly 30-40% and the internal die temperature can exceed 100 C at full 64 MHz MIPS load in a sealed enclosure. Microchip AN2513 'QFN PCB Land Pattern and Thermal Management' shows the recommended land geometry.
Place a 100 nF decoupling capacitor within 2 mm of the VDD pin (pin 4) and a bulk 4.7 uF ceramic on the same net, ideally within 5 mm. Add a 10 uF bulk capacitor near the QFN EP if the design runs from a high-impedance source (e.g. a coin cell). The 28-QFN package does not expose the AVdd/AVss pins separately, so careful PCB partitioning of the analog traces (RA3/AN3/AN4/AN5/RC2/RC3) from PWM switching traces is critical to keep ADC noise below 1 LSB.
Estimated: at 64 MHz active and 3.3V VDD, the PIC18LF23K22T-I/ML draws approximately 6-8 mA; in nanoWatt XLP sleep it drops below 1 uA with RAM retention. For a duty-cycled IoT sensor waking every 60 seconds and computing for 50 ms each cycle, average current is roughly 1.6 mA * (50 ms / 60000 ms) + 1 uA = approximately 8 uA. Confirm this estimate against the actual MCU current profile in datasheet section 28 (Electrical Characteristics).
Do not assume the LF and F variants are interchangeable in 5V systems - the LF silicon is rated only to 3.6V VDD, and exceeding VDD by even 0.5V can trigger latch-up. Also remember that the 'T' suffix in the order code denotes tape-and-reel packaging, not a different temperature grade; the 'I' suffix indicates the industrial -40 to +85 C range. PICkit 5 in-circuit debug requires the PGC/PGD pins (RB6/RB7) to be reserved; do not strap them to heavy external loads.
合規資訊
RoHS compliant per Microchip product page (LEAD FREE plastic QFN-28). Halogen-free status not explicitly listed on the distributor datasheets retrieved; check the latest Microchip material declaration before committing the part to halogen-free BOMs.
