PIC18LF23K22T-I/MV - 8KB Flash, 25MHz 8-bit MCU | Microchip
MPN： PIC18LF23K22T-I/MV ✓ 啟用中PIC18LF23K22T-I/MV 概覽
An 8-bit microcontroller (MCU) is a programmable computing engine built around an 8-bit data path, on-chip Flash program memory, RAM, and a rich set of digital and analog peripherals, occupying a position in the hierarchy between simple fixed-function logic and full 32-bit microprocessors. Within Microchip's portfolio, the PIC18 family represents an enhanced 8-bit architecture that bridges legacy PIC16 designs and the more powerful dsPIC/PIC24 line, balancing deterministic execution with modern peripherals such as USB, I²C, SPI, ECAN, and multi-channel 10-bit ADC.
Key features of the PIC18LF23K22 include nanoWatt XLP technology for ultra-low-power sleep currents (down to ~50 nA typical in sleep), 16 enhanced I/O ports supporting peripheral pin select, two analog comparators with rail-to-rail inputs, up to 17 channels of 10-bit ADC, two capture/compare/PWM modules, an enhanced USART, two MSSP (SPI/I²C) ports, and a 16-bit timer/counter. The UQFN-28 package exposes the full peripheral set in a compact 6 × 6 mm land pattern.
Architecturally, the PIC18LF23K22T-I/MV uses an enhanced Harvard architecture with separate program and data buses, a hardware multiplier for 8 × 8 single-cycle operations, and prioritized interrupt handling. The 'LF' prefix indicates the low-voltage / wide VDD range variant; the 'T' suffix denotes Tape and Reel packaging. The 'I' industrial temperature rating and 'MV' package designator round out the part code. Its XLP nanoWatt features include ultra-low-power wake, deep sleep with RAM retention, and multiple idle modes — critical for battery-powered edge devices.
Typical applications include portable industrial sensor nodes, low-power IoT edge devices, USB/CDC human-interface peripherals, battery-backed instrumentation, automotive body controllers (sub-systems, not AEC-Q100 powertrain), and small home appliances. The wide 2.0–5.5 V VDD range lets it interface to both 3.3 V and 5 V analog front-ends without level shifting.
A key design consideration is decoupling: place one 100 nF ceramic bypass capacitor directly across VDD/VSS as close to the package as possible, plus a bulk 1 µF–10 µF tantalum or ceramic near the regulator. For low-power designs, use the deep-sleep mode with the RTCC running for timekeeping, waking only on interrupt edges. The 28-pin UQFN footprint also requires thermal pad soldering for reliable mass-production assembly.
This page synthesizes distributor pricing, same-family pin-compatible variants, and practical design notes that go beyond the manufacturer datasheet, giving engineers a single decision-ready reference.
直接替換替代品，適用於 PIC18LF23K22T-I/MV — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18LF23K22T-I/MV （相同外形與佔位） — 差異在於 Package, Operating Temperature, Core Architecture, ADC, Program Memory (Flash).
PIC18LF23K22-I/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18F23K22-I/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18F24K22-I/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18F25K22-I/MV
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18LF23K22T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF23K22-E/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF23K22T-I/MV 最大額定值與電氣特性
| Architecture | PIC18 8-bit enhanced Harvard |
| Family | PIC18 K22 (nanoWatt XLP) |
| Program Memory (Flash) | 8 KB |
| Data RAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Clock | 25 MHz (62.5 ns instruction cycle) |
| Throughput | 8 MIPS |
| Supply Voltage (VDD) | 2.0 V to 5.5 V |
| I/O Pins | 16 (with Peripheral Pin Select) |
| ADC | 10-bit, up to 17 channels |
| Analog Comparators | 2 (rail-to-rail input) |
| Timers | 1 × 8-bit, 3 × 16-bit |
| CCP/ECCP Modules | 2 |
| Enhanced USART | 1 (LIN-capable) |
| MSSP (SPI / I²C) | 2 |
| 工作溫度 | −40 °C to +85 °C (Industrial) |
| 封裝 | UQFN-28 (MV), 6 × 6 mm |
| 安裝類型 | Surface Mount |
| MSL 等級 | 1 |
| RoHS 狀態 | Compliant (lead-free) |
| Packaging | Tape & Reel (T suffix) |
PIC18LF23K22T-I/MV 腳位配置
| 腳位 1 | RA2/AN2/C1IN+/C2IN+/VREF-/CVREF- — Digital I/O / analog input / comparator input / DAC negative reference |
| 腳位 2 | RA3/AN3/C1IN0-/C2IN0- — Digital I/O / analog input / comparator input |
| 腳位 3 | RA4/T0CKI/C1OUT — Digital I/O / Timer0 clock input / Comparator 1 output |
| 腳位 4 | RA5/AN4/C2OUT — Digital I/O / analog input / Comparator 2 output |
| 腳位 5 | RA6/OSC2/CLKO — Digital I/O / crystal oscillator output / clock output |
| 腳位 6 | RA7/OSC1/CLKI — Digital I/O / crystal oscillator input / clock input |
| 腳位 7 | VDD — Positive supply voltage (2.0 V to 5.5 V) |
| 腳位 8 | VSS — Ground reference |
| 腳位 9 | RB0/INT0/FLT0 — Digital I/O / external interrupt 0 / PWM fault input |
| 腳位 10 | RB1/INT1 — Digital I/O / external interrupt 1 |
| 腳位 11 | RB2/INT2 — Digital I/O / external interrupt 2 |
| 腳位 12 | RB3/INT3/CCP2 — Digital I/O / external interrupt 3 / Capture/Compare/PWM 2 |
| 腳位 13 | RB4/KBI0 — Digital I/O / keyboard interrupt 0 |
| 腳位 14 | RB5/KBI1 — Digital I/O / keyboard interrupt 1 |
| 腳位 15 | RB6/KBI2/PGC — Digital I/O / keyboard interrupt 2 / ICSP clock |
| 腳位 16 | RB7/KBI3/PGD — Digital I/O / keyboard interrupt 3 / ICSP data |
| 腳位 17 | RC0/SOSCO — Digital I/O / secondary oscillator output (RTCC) |
| 腳位 18 | RC1/SOSCI — Digital I/O / secondary oscillator input (RTCC) |
| 腳位 19 | RC2/CCP1 — Digital I/O / Capture/Compare/PWM 1 |
| 腳位 20 | RC3/SCL1/SCK1 — Digital I/O / I²C clock / SPI clock (MSSP1) |
| 腳位 21 | RC4/SDA1/SDI1 — Digital I/O / I²C data / SPI data in (MSSP1) |
| 腳位 22 | RC5/SDO1 — Digital I/O / SPI data out (MSSP1) |
| 腳位 23 | RC6/TX1/CK1 — Digital I/O / EUSART TX / EUSART clock |
| 腳位 24 | RC7/RX1/DT1 — Digital I/O / EUSART RX / EUSART data |
| 腳位 25 | RE3/MCLR/VPP — Digital input / Master Clear reset (active-low) / programming voltage |
| 腳位 26 | RA0/AN0/C1IN+/ULPWU — Digital I/O / analog input / comparator / ultra-low-power wake-up |
| 腳位 27 | RA1/AN1/C2IN+/ULPWU — Digital I/O / analog input / comparator / ultra-low-power wake-up |
| 腳位 28 | VSS (thermal pad) — Ground (exposed thermal pad — must be soldered to PCB ground) |
典型應用
PIC18LF23K22T-I/MV 適用於 7 應用s: Battery-Powered IoT Sensor Node, Industrial Control / Human-Machine Interface, USB/CDC Peripheral Interface (no native USB), Low-Power Data Acquisition Module, Smart Home Sensor Hub, Automotive Body Sub-System (non-safety), Small Appliance Control Board.
Battery-Powered IoT Sensor Node
The PIC18LF23K22T-I/MV is well matched to battery-powered IoT sensor nodes thanks to its nanoWatt XLP deep-sleep current under 100 nA typical and 2.0–5.5 V VDD that accepts single-cell Li-ion (3.0–4.2 V) or 2×AA (3.0 V) chemistries directly. The 17-channel 10-bit ADC reads multiple thermocouple, photodiode, or strain-gauge signals without external converters, while peripheral pin select routes I²C/SPI sensors to any of the 16 I/O pins — easing PCB layout. A typical application wakes the MCU every 60 seconds, samples one or two analog sensors, transmits over a connected radio module (e.g., RN2483), and returns to deep sleep, drawing an average current below 20 µA — enabling 5+ years on a single 2.4 Ah Li-coin cell.
推薦
Industrial Control / Human-Machine Interface
The PIC18LF23K22T-I/MV serves as the central controller in industrial HMIs (keypads, status indicators, simple operator panels) thanks to its 25 MHz throughput, 2 CCP modules for PWM backlight or buzzer drive, and enhanced USART for RS-232/RS-485 communication to a host PLC. Its 2.0–5.5 V VDD tolerates noisy 24 V-to-5 V industrial rails post-regulation. Two analog comparators handle fast over-current or zero-cross detection without CPU intervention, while 16 digital I/O drive LED matrices, keypads, and optocouplers. Industrial temperature grade (−40 to +85 °C) and 8 KB Flash comfortably host the keypad scanner, debouncing logic, and MODBUS-RTU slave firmware with room for field-update over UART bootloader.
推薦
USB/CDC Peripheral Interface (no native USB)
Although the PIC18LF23K22T-I/MV does not include a native USB peripheral, it can still drive a USB-CDC bridge design via an external UART-to-USB converter such as the MCP2200 or MCP2221A, exposing a virtual COM port over USB to a host PC. The MCU's enhanced USART runs up to 5 Mbps and easily handles 12 Mbps USB-CDC throughput via the bridge. This topology is common in low-cost laboratory instruments, sensor dongles, and firmware-load adapters where the application only needs UART-LE USB, not full-speed USB protocol stack. The 8 KB Flash hosts the command parser and protocol logic; 16 I/O drive status LEDs and user buttons on the device.
推薦
Low-Power Data Acquisition Module
The PIC18LF23K22T-I/MV's 10-bit ADC with up to 17 channels plus internal 1.024 V FVR reference provides a compact front-end for multi-channel data acquisition modules (vibration, pressure, temperature logging). The 256-byte EEPROM stores calibration coefficients directly in-circuit, while the 8 KB Flash runs a circular-logging firmware with UART telemetry output. nanoWatt XLP deep sleep between samples cuts average current below 1 µA in 1-Hz logging mode, ideal for remote, solar-powered environmental monitors. The 25 MHz CPU handles 17-channel sequential ADC scans at >100 kS/s aggregate, and the enhanced USART streams logs at 115200 baud to a host radio or SD-card logger.
推薦
Smart Home Sensor Hub
The PIC18LF23K22T-I/MV is a strong fit for compact smart-home sensor hubs that aggregate occupancy, light, and temperature readings and forward them over a Wi-Fi/BLE co-processor via SPI or UART. The 16 I/O drive multiple sensors directly, while two MSSP ports simultaneously run SPI to a wireless co-processor and I²C to a sensor IC — both without bus contention. The 2.0–5.5 V VDD accepts a 3.3 V regulator output cleanly, while nanoWatt XLP idle modes keep standby power below 50 µA between BLE/Zigbee advertisements, ideal for battery or energy-harvested wireless sensor designs.
推薦
Automotive Body Sub-System (non-safety)
For non-safety automotive body sub-systems — seat controllers, HVAC keypads, lighting trim, accessory drivers — the PIC18LF23K22T-I/MV serves as a low-cost peripheral node. Its wide 2.0–5.5 V VDD tolerates 12 V battery transients post-regulation, and the enhanced USART supports LIN 1.3 bus masters commonly used for body-electronics communication. Two CCP modules drive PWM-controlled lighting and motor loads, while 16 I/O scan keypads or LED matrices. Note this is the Industrial-grade (−40 to +85 °C) variant; for AEC-Q100 qualification choose the PIC18F25K22-I/MV extension family or step up to the PIC18F46K22 AEC-Q100 part for safety-relevant applications.
推薦
Small Appliance Control Board
The PIC18LF23K22T-I/MV provides a compact, low-cost control core for small appliances such as coffee machines, blenders, washing-machine sub-boards, and air-purifier controllers. Its 25 MHz throughput runs PID loops at >1 kHz for temperature or motor-speed regulation, while two analog comparators perform zero-cross detection on AC mains signals post-isolator. Two CCP modules generate precise PWM for triac/SCR phase-angle dimming or brushed-DC motor drives. The 2.0–5.5 V VDD accepts a 5 V regulated rail directly, and the industrial temperature grade handles the warm operating envelope of appliance enclosures. The 8 KB Flash stores the menu logic, sensor calibration, and fault-detection firmware with room for in-field firmware updates.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18LF23K22T-I/MV — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18LF23K22-I/MV | PIC18F23K22-I/MV | PIC18F24K22-I/MV | PIC18F25K22-I/MV | PIC18LF23K22T-I/ML | PIC18LF23K22-E/MV |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-28 (MV) 6×6 mm | UQFN-28 (MV) 6×6 mm - same | UQFN-28 (MV) 6×6 mm - same | UQFN-28 (MV) 6×6 mm - same | UQFN-28 (MV) 6×6 mm - same | QFN-28 (ML) 6×6 mm - same footprint, taller body | UQFN-28 (MV) 6×6 mm - same |
| Program Flash | 8 KB | 8 KB | 8 KB | 16 KB (+100%) | 32 KB (+300%) | 8 KB | 8 KB |
| Data RAM | 768 bytes | 768 bytes | 768 bytes | 768 bytes | 1536 bytes (+100%) | 768 bytes | 768 bytes |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max Clock Speed | 25 MHz (8 MIPS) | 25 MHz (8 MIPS) | 25 MHz (8 MIPS) | 25 MHz (8 MIPS) | 25 MHz (8 MIPS) | 25 MHz (8 MIPS) | 25 MHz (8 MIPS) |
| Supply Voltage (VDD) | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Operating Temperature | −40 °C to +85 °C (Industrial) | −40 °C to +85 °C (Industrial) | −40 °C to +85 °C (Industrial) | −40 °C to +85 °C (Industrial) | −40 °C to +85 °C (Industrial) | −40 °C to +85 °C (Industrial) | −40 °C to +125 °C (Extended) |
| I/O Pins | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| ADC Channels (10-bit) | 17 channels | 17 channels | 17 channels | 17 channels | 17 channels | 17 channels | 17 channels |
主要差異化特點
- Lowest-voltage K22 family variant (2.0 V min) (對比PIC18F23K22-I/MV)
- Ultra-low deep-sleep current for battery designs (對比PIC18F25K22-I/MV)
- Compact UQFN-28 footprint (0.6 mm body thickness) (對比PIC18LF23K22T-I/ML)
- Industrial −40 to +85 °C temperature grade standard (對比PIC18LF23K22-E/MV)
設計說明
Decoupling: Place one 100 nF low-ESR ceramic capacitor as close as possible between each VDD/VSS pair (pin 7/8), plus a bulk 1 µF to 10 µF tantalum or ceramic near the regulator output. For nanoWatt XLP designs, this network is critical — switching spikes on VDD directly modulate the internal bandgap reference and increase deep-sleep current. Place the bulk capacitor within 5 mm of the IC; the 100 nF cap must be within 2 mm with wide traces to VSS thermal pad (pin 28). Estimated: at 25 MHz operation with 8 KB Flash active, peak supply current is ~10 mA — the bulk cap must source this transient without significant droop.
The UQFN-28 thermal pad (pin 28) MUST be soldered to a PCB ground pour for both electrical and thermal performance. Use at least 8 thermal vias in the exposed pad (0.3 mm drill, 0.5 mm pitch) connecting the top copper pour to a full ground plane on the next inner layer. Failure to solder the thermal pad results in poor electrical grounding and elevated junction temperature at moderate loads. Keep all signal traces at least 0.2 mm from the package edges to avoid solder-bridging during reflow.
Crystal placement (RA6/RA7, pins 5–6) requires short traces to the crystal and load capacitors — keep total trace length under 5 mm each side to minimize parasitic capacitance. Place the load capacitors (typically 15–22 pF for an 8–25 MHz crystal) within 2 mm of the crystal pads with a ground guard ring. For low-EMI applications, route the ICSP clock (RB6/RCV6 = PGC, pin 15) and ICSP data (RB7 = PGD, pin 16) away from analog-sensitive traces such as AN0/AN1 (pins 26–27) and away from the comparator inputs.
Configuration word settings: leaving the LVP (Low-Voltage Programming) bit enabled when using a 5 V supply with PGECX/PGEDX in-circuit programming can cause inadvertent entry into programming mode if the ICSP pins float. Either disable LVP for cleaner operation, or pull the PGC pin to VDD through a 10 kΩ resistor to prevent false triggering. Also: the MCLR pin (pin 25) is a digital input only when not used for reset — do NOT connect it directly to VDD without a series resistor for in-circuit debug.
For noise-sensitive analog measurements, place a small RC low-pass filter (typically 100 Ω + 100 nF, fc ~16 kHz) on each ANx input to the ADC. This prevents digital switching noise on adjacent I/O pins from coupling into the ADC sample. The 17-channel ADC uses a sample-and-hold capacitor of ~10 pF — source impedance should be below 5 kΩ for full 10-bit accuracy at high conversion rates. The internal 1.024 V FVR reference can be routed to the ADC positive reference for ratiometric measurements without external reference parts.
合規資訊
RoHS compliant per Microchip product page. Lead-free (Pb-free) UQFN-28 MV package, MSL-1 rating. Not AEC-Q100 qualified — for automotive safety-relevant applications, consider the PIC18F46K22 AEC-Q100 part instead. Halogen-free per Microchip declaration.
