PIC32MZ1024EFH100-E/GJX - 200MHz 1MB Flash MCU | Microchip
MPN： PIC32MZ1024EFH100-E/GJX ✓ 啟用中PIC32MZ1024EFH100-E/GJX 概覽
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO into one IC. Within the broader semiconductor taxonomy, MCUs sit under microprocessors -> processing units -> logic ICs -> integrated circuits. The PIC32MZ EF family specifically targets high-performance embedded connectivity applications requiring FPU-accelerated DSP and real-time deterministic behavior.
Key features include a hardware Floating Point Unit (IEEE 754-compliant) for fast single/double-precision math, four 64-bit accumulators with single-cycle MAC, saturating and fractional arithmetic, dual-panel Flash for live field updates without downtime, and a 12-bit 18 MSPS ADC. The device integrates dedicated peripherals for connectivity: USB 2.0 high-speed with PHY, dual CAN 2.0b controllers, Ethernet MAC with RMII/MII, multiple UART/SPI/I2C, and a parallel master port for external memory or graphics TFTs.
Technically, the PIC32MZ EF core is built on the MIPS Warrior M-class architecture, providing 5-stage pipeline execution with DSP extensions. The dual-panel Flash architecture allows simultaneous read-while-write operations and over-the-air firmware upgrades - a critical feature for deployed IoT and industrial nodes. The integrated FPU eliminates software emulation overhead, enabling high-speed sensor fusion and audio processing.
Typical applications include industrial automation controllers, automotive body and infotainment modules, IoT edge gateways with Ethernet/USB connectivity, graphics HMI touch panels, and motor control drives. The wide operating temperature range and dual-panel Flash make it well-suited for industrial sensor hubs and connected machinery.
When designing with this MCU, allocate decoupling capacitors close to each VDD/VSS pair, use the trace impedance guidelines from the PIC32MZ EF family datasheet, and validate the JTAG/ICSP programming interface layout. For Ethernet applications, the integrated RMII PHY interface requires careful length-matched routing.
This page synthesizes distributor pricing across six channels, drop-in alternatives, and design notes that complement the manufacturer datasheet - including parametric proximity scoring unavailable elsewhere.
直接替換替代品，適用於 PIC32MZ1024EFH100-E/GJX — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ1024EFH100-E/GJX （相同外形與佔位） — 差異在於 Operating Temperature, Package, Core Architecture, ADC, Operating Voltage.
PIC32MZ1024EFH100-I/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFH100T-E/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2048EFH100-E/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFF100-E/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFG100-I/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFE100-E/GJX
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1024EFH100-E/GJX 最大額定值與電氣特性
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Speed | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB |
| FPU | IEEE 754-compliant single/double precision |
| DSP | Four 64-bit accumulators, single-cycle MAC |
| ADC | 12-bit, up to 18 MSPS |
| Operating Voltage | 2.1 V to 3.6 V |
| 工作溫度 | -40C to +125C (extended, -E suffix) |
| 封裝 | 100-pin TFBGA (7x7 mm) |
| 安裝類型 | Surface Mount |
| USB | USB 2.0 High-Speed with on-chip PHY |
| CAN | 2 x CAN 2.0b |
| Ethernet | 10/100 Mbps MAC with RMII/MII |
| AEC-Q100 | Automotive-grade qualified |
| RoHS 狀態 | Compliant |
PIC32MZ1024EFH100-E/GJX 100-pin tfbga (7x7 mm) 腳位配置指南
PIC32MZ1024EFH100-E/GJX（100-pin tfbga (7x7 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MZ1024EFH100-E/GJX.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MZ1024EFH100-E/GJX 適用於 7 應用s: Industrial Automation Controllers, Automotive Body and Infotainment Modules, IoT Edge Gateways, Graphics HMI Touch Panels, Motor Control Drives, Medical Patient Monitoring, Audio Processing and Effects.
Industrial Automation Controllers
The PIC32MZ1024EFH100-E/GJX fits industrial PLC and distributed controller applications because its 200 MHz MIPS core with FPU executes complex control loops within tight real-time budgets. The dual CAN 2.0b controllers allow native fieldbus communication with industrial sensors and motor drives, while the 10/100 Ethernet MAC supports EtherCAT/PROFINET gateway implementations. The -40C to +125C extended temperature grade enables cabinet-free deployment near motors and process equipment.
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Automotive Body and Infotainment Modules
The PIC32MZ1024EFH100-E/GJX is AEC-Q100 qualified with -40C to +125C operation, making it suitable for automotive body control modules and infotainment peripherals. The USB 2.0 high-speed PHY with on-chip transceiver enables direct connection to infotainment head units, while dual CAN interfaces connect to vehicle body networks. The 1 MB Flash supports layered AUTOSAR-style firmware architectures with bootloaders and application images using dual-panel Flash.
推薦
IoT Edge Gateways
The PIC32MZ1024EFH100-E/GJX serves as an IoT edge gateway controller, leveraging its integrated Ethernet MAC, USB 2.0 high-speed PHY, and multiple UART/SPI/I2C interfaces to aggregate diverse sensor and fieldbus data. The 200 MHz core with FPU runs TLS 1.3 handshake and MQTT payload processing locally, while the 512 KB SRAM accommodates TLS buffers and packet queues. Dual-panel Flash enables secure OTA firmware updates in deployed gateway units.
推薦
Graphics HMI Touch Panels
While the EFH variant prioritizes connectivity, the PIC32MZ1024EFH100-E/GJX can drive smaller HMI panels through its parallel master port and integrated TFT timing controllers. The 200 MHz MIPS core with FPU accelerates vector rendering and touch gesture processing, and the 12-bit ADC supports touch-sensing front-end measurements. For full graphics workloads the pin-compatible PIC32MZ1024EFG100-I/GJX with dedicated graphics controller is recommended.
推薦
Motor Control Drives
The PIC32MZ1024EFH100-E/GJX handles sensorless and encoder-based motor control through its 200 MHz MIPS core, DSP extensions with single-cycle MAC, and high-resolution PWM peripherals. The FPU accelerates Park/Clarke transforms in field-oriented control algorithms, while the 12-bit 18 MSPS ADC samples motor phase currents with minimal latency. The extended -40C to +125C temperature grade supports deployment on integrated motor drive PCBs.
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Medical Patient Monitoring
The PIC32MZ1024EFH100-E/GJX is used in medical patient monitoring peripherals where deterministic USB 2.0 high-speed data streaming delivers waveform data to host processors. The 200 MHz core with DSP extensions enables on-device QRS detection and SpO2 signal processing, reducing host CPU load. Note that medical safety certification requires IEC 62304/ISO 14971 compliance beyond the MCU itself - the device supports but does not certify the end-product.
推薦
Audio Processing and Effects
The PIC32MZ1024EFH100-E/GJX accelerates audio DSP workloads through its MIPS Warrior M-class core with IEEE 754 FPU and four 64-bit accumulators supporting single-cycle MAC operations. The 200 MHz core sustains real-time audio sample rates at 48 kHz with headroom for reverb, EQ, and dynamics processing algorithms. The I2S peripheral interfaces directly to audio codecs, while DMA channels offload sample transfer from the CPU.
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推薦產品摘要
工程參考資料，適用於 PIC32MZ1024EFH100-E/GJX — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ1024EFH100-I/GJX | PIC32MZ1024EFH100T-E/GJX | PIC32MZ2048EFH100-E/GJX | PIC32MZ1024EFF100-E/GJX |
|---|---|---|---|---|---|
| Package | TFBGA-100 (GJX) | TFBGA-100 (GJX) - same | TFBGA-100 (GJX) - same | TFBGA-100 (GJX) - same | TFBGA-100 (GJX) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| USB 2.0 HS PHY | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII | 10/100 Mbps RMII/MII (reduced peripheral set) |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Extended industrial temperature grade with AEC-Q100 automotive qualification (對比PIC32MZ1024EFH100-I/GJX)
- Higher memory density for complex firmware stacks (對比PIC32MZ1024EFF100-E/GJX)
- Cost-efficient path to 2 MB Flash in same footprint (對比PIC32MZ2048EFH100-E/GJX)
設計說明
The PIC32MZ EF core draws peak currents exceeding 80 mA at 200 MHz with FPU active. Place one 0.1uF X7R ceramic bypass capacitor within 2 mm of every VDD/VSS pair, and add a bulk 10uF tantalum or polymer capacitor near the package. Route separate analog (AVDD) and digital supply planes with ferrite-bead isolation if the 12-bit ADC accuracy matters in your design. The voltage regulator core (VCAP) requires an external 4.7uF capacitor - do not omit.
TFBGA-100 (7x7 mm) requires 0.5 mm pitch fanout using microvia-in-pad or dog-bone via fanout to maintain manufacturability. Use 4-layer PCB minimum with continuous ground plane beneath the BGA for both reference return and thermal dissipation. Maintain length-matched differential routing (<5 mil tolerance) for USB 2.0 high-speed pairs (D+/D-) and RMII Ethernet signals per Microchip hardware layout guidelines.
Common pitfalls with the PIC32MZ EF family: (1) forgetting to configure the secondary oscillator for RTC operation when using deep sleep modes, (2) overlooking that dual-panel Flash live update requires firmware-managed partition swapping, (3) failing to enable the JTAG/ICSP pull-ups during programming, (4) using the wrong VCAP value which causes core regulator instability - check the family datasheet DS60001320 for the exact capacitor specification. Always validate oscillator start-up time across the full -40C to +125C range.
合規資訊
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive applications. Lead-free and halogen-free per Microchip material declarations.