PIC32MZ2025DAA169T-I/HF - 200MHz 32-bit MCU, 2MB Flash, 169-LFBGA | Microchip
MPN： PIC32MZ2025DAA169T-I/HF ✓ 啟用中PIC32MZ2025DAA169T-I/HF 概覽
A 32-bit microcontroller (MCU) is a programmable processor integrating CPU core, memory (Flash for code, SRAM for variables), and peripherals (ADC, timers, communication interfaces) on a single silicon die. The PIC32MZ family uses a 32-bit MIPS architecture (hypernym: MCU -> 32-bit MCU -> RISC microcontroller -> embedded processor), delivering MPU-like computational performance while preserving MCU simplicity. The DA subfamily extends this with an integrated 2D graphics controller, DDR2 memory controller, and Hi-Speed USB for Human-Machine Interface (HMI) applications.
Key features of the PIC32MZ2025DAA169 include a 12-bit 18 MSPS ADC module with up to 45 analog inputs, CAN 2.0B and Hi-Speed USB 2.0 OTG interfaces, an integrated Graphics Processor with TFT/LCD controller supporting WVGA-class displays, and XLP (eXtreme Low Power) Technology for battery-friendly idle behavior. The 169-LFBGA package supports high-pin-count applications including external DDR2 DRAM (32 MB or 128 MB externally addressable).
Technically, the device is built on a 65 nm low-power CMOS process with a 5-stage pipeline MIPS core. The Graphics Processor offloads rendering tasks from the CPU, freeing MIPS budget for application logic. The 2 MB Flash supports Live Update firmware partitioning for fail-safe in-field upgrades. The DDR2 controller supports 32 MB or 128 MB external DRAM, which is unusual for an MCU class device.
Typical applications include industrial control HMIs with TFT/LCD displays, medical instrument touch panels, automotive infotainment, point-of-sale terminals, and IoT edge gateways with GUI. The integrated graphics controller eliminates an external GPU, reducing BOM cost for graphical products.
When designing, ensure the 11x11 mm LFBGA land pattern can be fabricated with your PCB process (typically 0.5 mm or 0.8 mm pitch); BGA assembly requires X-ray inspection or AOI. Decouple VDD with 100 nF + 10 uF per rail near the IC.
This page synthesizes distributor pricing, drop-in compatible LFBGA-169 alternatives, and practical design notes that complement the manufacturer datasheet.
直接替換替代品，適用於 PIC32MZ2025DAA169T-I/HF — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ2025DAA169T-I/HF （相同外形與佔位） — 差異在於 Operating Temperature, Core Architecture, Graphics Controller, USB, CAN.
PIC32MZ2025DAA169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2025DAB169T-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1064DAA169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1025DAA169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1025DAB169T-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2025DAA169T-I/HF 最大額定值與電氣特性
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DA (Graphics Applications) |
| CPU Core | 32-bit RISC |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data Memory (SRAM) | 640 KB |
| External DRAM Interface | 32 MB or 128 MB DDR2 (externally addressable) |
| Graphics Controller | Integrated (TFT/LCD, integrated GPU) |
| Operating Voltage Range | 1.7 V to 3.6 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | CAN 2.0B |
| 工作溫度 | -40C to +85C (industrial, "I" grade) |
| 封裝 | 169-LFBGA (11x11 mm) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant (per third-party distributors) |
| Supply Voltage Nominal | 3.3 V |
PIC32MZ2025DAA169T-I/HF 169-lfbga (11x11 mm) 腳位配置指南
PIC32MZ2025DAA169T-I/HF（169-lfbga (11x11 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MZ2025DAA169T-I/HF.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MZ2025DAA169T-I/HF 適用於 6 應用s: Industrial HMI with TFT LCD, Medical Instrument Touch Panel, Automotive Infotainment and Cluster Display, Point-of-Sale (POS) Terminal, IoT Edge Gateway with GUI, Industrial Control Panel / SCADA Remote Terminal.
Industrial HMI with TFT LCD
The PIC32MZ2025DAA169T-I/HF is purpose-built for industrial HMI panels driving TFT LCDs. Its integrated Graphics Controller and 200 MHz MIPS32 microAptiv core offload 2D rendering tasks from the CPU, while the external DDR2 interface supports 32 MB or 128 MB of frame-buffer memory for rich WVGA-class graphical user interfaces. With 2 MB Flash and 640 KB SRAM, it can host full LVGL or Microchip Graphics Suite projects, and Hi-Speed USB OTG plus CAN 2.0B integrate the fieldbus connectivity typical of factory automation HMIs. Industrial -40C to +85C temperature rating ensures operation on the shop floor.
推薦
Medical Instrument Touch Panel
Medical touch panels demand deterministic response, clean graphics, and reliability over years of operation. The PIC32MZ2025DAA169T-I/HF's 200 MHz MIPS32 core with 2 MB Flash and 640 KB SRAM is sufficient to drive a QVGA/WVGA TFT LCD with capacitive touch overlays while running the application logic for patient monitoring or diagnostic readouts. The 12-bit 18 MSPS ADC with up to 45 analog inputs can directly digitize sensor front-ends, reducing analog signal sources. XLP low-power idle modes reduce quiescent current in battery-powered portable instruments.
推薦
Automotive Infotainment and Cluster Display
While the 'I' grade PIC32MZ2025DAA169T-I/HF is industrial (-40C to +85C), the integrated graphics, Hi-Speed USB, and CAN 2.0B make it a strong fit for non-safety automotive infotainment and instrument cluster prototypes. The 200 MHz MIPS32 core with Graphics Processor accelerates 2D rendering of speedometers, tachometers, and menu UIs. The DDR2 interface supplies frame-buffer memory for higher-resolution WVGA cluster displays. Designers targeting AEC-Q100 qualification should evaluate the AEC-Q100-qualified variants within the PIC32MZ family separately.
推薦
Point-of-Sale (POS) Terminal
POS terminals combine a graphical user interface, multiple connectivity options, and secure transaction processing. The PIC32MZ2025DAA169T-I/HF's 2 MB Flash supports the GUI stack plus payment application code, while the integrated Graphics Controller and DDR2 frame-buffer drive a 7-10 inch WVGA TFT touch display. Hi-Speed USB 2.0 OTG can interface with PIN pads, magnetic-stripe readers, or printers. The MIPS32 core's deterministic interrupt latency supports time-critical card read/write operations.
推薦
IoT Edge Gateway with GUI
IoT edge gateways increasingly include local visualization (touchscreen dashboards) for configuration and field diagnostics. The PIC32MZ2025DAA169T-I/HF combines Hi-Speed USB, CAN, and the integrated TFT/LCD controller with enough Flash and SRAM for a real-time OS or bare-metal GUI library. The 200 MHz MIPS32 core can also run MQTT/CoAP stacks or perform local edge analytics before forwarding to the cloud. Industrial -40C to +85C operation ensures deployment in outdoor enclosures.
推薦
Industrial Control Panel / SCADA Remote Terminal
SCADA remote terminals (RTUs) and machine control panels require a high-reliability MCU that can run a graphical HMI, communicate over industrial fieldbus (CAN 2.0B), and digitize analog sensors. The PIC32MZ2025DAA169T-I/HF integrates all three in one package: the 200 MHz MIPS32 core runs the GUI and control logic, the 12-bit 18 MSPS ADC handles up to 45 analog inputs, and the integrated TFT/LCD controller drives the panel display. The 169-LFBGA (11x11 mm) package is suitable for compact panel-mount enclosures.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MZ2025DAA169T-I/HF — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ2025DAA169-I/HF | PIC32MZ2025DAB169T-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ1025DAA169-I/HF | PIC32MZ1025DAB169T-I/HF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core Architecture | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Program Flash | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 256 KB | 256 KB |
| External DRAM Interface | DDR2 (32 MB or 128 MB) | DDR2 (32 MB or 128 MB) | DDR2 (32 MB or 128 MB) | DDR2 (32 MB or 128 MB) | DDR2 (32 MB or 128 MB) | DDR2 (32 MB or 128 MB) |
| USB | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Tray vs Tape and Reel | Tape and Reel (T) | Tray | Tape and Reel | Tray | Tray | Tape and Reel |
主要差異化特點
- Highest Flash density in 169-LFBGA DA family (對比PIC32MZ1064DAA169-I/HF)
- Tape and Reel packaging for SMT production (對比PIC32MZ2025DAA169-I/HF)
- DAA variant with full 640 KB (對比PIC32MZ1025DAA169-I/HF)
設計說明
The 169-LFBGA (11x11 mm) package typically uses 0.8 mm ball pitch. Ensure your PCB fab supports the via-in-pad or dog-bone fan-out required for BGA breakout. Per the Microchip PIC32MZ DA family datasheet layout recommendations, route DDR2 signals first with matched-length traces and a continuous reference ground plane beneath the DDR2 routing region. Use 100 nF + 10 uF ceramic decoupling per power pin pair, placed within 3 mm of the respective balls.
At 200 MHz with the integrated Graphics Controller active, the PIC32MZ2025DAA169T-I/HF can dissipate 0.5-1 W of power depending on peripheral usage. The LFBGA package relies primarily on PCB copper for cooling. Per Microchip thermal guidance, design at least 1 sq inch of unbroken copper pour under the exposed die area, with thermal vias connecting to inner copper layers. In enclosed enclosures with limited airflow, derate peripheral clock speeds or use sleep modes to manage junction temperature within the industrial -40C to +85C range.
Common pitfalls when designing with the PIC32MZ2025DAA169T-I/HF include: (1) forgetting the DDR2 reference voltage (VDD_DDR2) decoupling, which can corrupt display memory; (2) failing to enable the internal PLL correctly, leading to USB enumeration failures; (3) assuming all LFBGA balls are interchangeable - the power/ground balls are not user-routable; and (4) neglecting the Live Update firmware layout which requires a fixed boot partition in Flash. Refer to the Microchip PIC32MZ DA family datasheet section 'Layout and Routing' and the BSP init code for the correct clock and DDR2 initialization sequence.
合規資訊
RoHS compliant per third-party distributor Lisleapex product page. Not AEC-Q100 qualified (industrial -40C to +85C 'I' grade); AEC-Q100 automotive variants exist within the PIC32MZ family but are separate part numbers. Conflict-minerals declaration per Microchip public policy.