PIC32MZ2025DAA169-I/HF - 32-bit 200MHz 2MB Flash Graphics MCU | Microchip
MPN： PIC32MZ2025DAA169-I/HF ✓ 啟用中PIC32MZ2025DAA169-I/HF 概覽
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. PIC32MMC256-bit microcontrollers belong to the broader 32-bit MCU taxonomy (32-bit MCU -> MCU -> microcontroller -> embedded processor -> semiconductor). The PIC32MZ DA family bridges MCU and MPU use-cases by integrating a parallel DDR2 DRAM interface and graphics accelerator on-die, eliminating the need for an external MPU plus external memory controller in cost-sensitive graphical HMI designs.
Key features include a 12-bit 18 MSPS ADC with up to 45 analog inputs, two CAN modules, Hi-Speed USB 2.0, and a complete graphics subsystem (GPU + LCD controller). The -I/HF suffix denotes industrial temperature range (-40C to +85C), HF-grade packaging (RoHS Pb-free halogen-free LFBGA) delivered in Tray packaging. The 200 MHz microAptiv core delivers 330 DMIPS / 3.28 CoreMark/MHz, enabling responsive touch-screen GUIs.
Architecturally, the device combines a Harvard bus architecture with tightly-coupled 2 MB Flash and 640 KB SRAM, dual DMA controllers, and a separate graphics plane running in parallel. The integrated DDR2 controller supports up to 128 MB external memory, removing the bandwidth bottleneck typical of MCU-internal-SRAM designs when driving large QVGA/WQVGA color TFT panels.
Typical applications include industrial HMI touch panels, medical patient monitors, smart home control hubs, automotive dashboard clusters, point-of-sale (POS) terminals, and portable instrumentation with graphical displays. The integrated graphics engine and large memory budget make the part particularly attractive for GUI-driven designs where an external MPU + external DDR would inflate BOM cost.
When designing with the PIC32MZ2025DAA169, route the DDR2 memory interface as a 50 ohm-controlled-impedance matched-length group, and assign the dedicated 12-bit ADC inputs to analog-only PCB regions to avoid digital noise coupling. The 169-LFBGA package requires 0.5 mm-pitch PCB land pattern; ensure manufacturing partners can support 0.5 mm pitch LFBGA assembly.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical LFBGA design notes that complement the manufacturer datasheet, providing information gain not available from a single datasheet PDF.
直接替換替代品，適用於 PIC32MZ2025DAA169-I/HF — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ2025DAA169-I/HF （相同外形與佔位） — 差異在於 Graphics Controller, CAN, USB, Core Architecture, Operating Temperature.
PIC32MZ1064DAA169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1064DAB169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1025DAB169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2025DAB169-I/HF
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ1064DAB169T-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1025DAK169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2025DAA169-I/HF 最大額定值與電氣特性
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit RISC |
| Maximum CPU Frequency | 200 MHz |
| Performance | 330 DMIPS / 3.28 CoreMark/MHz |
| Flash Program Memory | 2 MB |
| SRAM Data Memory | 640 KB |
| External Memory Support | Up to 128 MB DDR2 DRAM (externally addressable) |
| Graphics Controller | Integrated (LCD controller + GPU) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| User I/O Count | 120 |
| USB | Hi-Speed USB 2.0 |
| CAN | 2x CAN modules |
| 工作溫度 | -40C to +85C (Industrial, -I grade) |
| 封裝 | 169-pin LFBGA (11x11 mm) |
| 安裝類型 | Surface Mount |
| Operating Voltage | 3.3 V (typical) |
| RoHS / Halogen-Free | RoHS compliant, Pb-free / Halogen-free (HF suffix) |
| Packaging Type | Tray |
PIC32MZ2025DAA169-I/HF 169-pin lfbga (11x11 mm) 腳位配置指南
PIC32MZ2025DAA169-I/HF（169-pin lfbga (11x11 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MZ2025DAA169-I/HF.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MZ2025DAA169-I/HF 適用於 6 應用s: Industrial HMI Touch Panels, Medical Patient Monitors, Smart Home Control Hubs, Automotive Dashboard Clusters, Point-of-Sale (POS) Terminals, Portable Test & Measurement Instruments.
Industrial HMI Touch Panels
The PIC32MZ2025DAA169-I/HF is well matched to industrial HMI touch panels because the integrated GPU plus LCD controller offload pixel rendering from the 200 MHz microAptiv core. Its 2 MB Flash holds full GUI frameworks such as MPLAB Harmony and 640 KB SRAM provides framebuffer headroom for QVGA/WQVGA color TFT panels. The 12-bit 18 MSPS ADC reads backlight sense, temperature, and analog front-end channels in parallel with GUI updates. With 2x CAN and Hi-Speed USB, the device also bridges the touch panel to factory fieldbuses and to programming/maintenance hosts.
推薦
Medical Patient Monitors
For multi-parameter patient monitors, the PIC32MZ2025DAA169-I/HF combines a 12-bit 18 MSPS ADC with up to 45 analog inputs to digitize ECG, SpO2, respiration, and temperature channels simultaneously. The 200 MHz MIPS32 core runs real-time DSP filter chains while the GPU drives the color TFT waveform display. Industrial -40C to +85C temperature rating covers the warm-up profile of bedside cart enclosures. Hi-Speed USB provides isolated clinical-network uplink, and 2x CAN connect to anesthesia delivery and ventilator peripherals.
推薦
Smart Home Control Hubs
The PIC32MZ2025DAA169-I/HF anchors smart-home hubs that integrate Zigbee/Thread/Z-Wave via serial peripherals, Wi-Fi/BLE via Hi-Speed USB, and a color TFT for status dashboards. The 2 MB Flash accommodates device-driver tables for hundreds of smart-home products, while 640 KB SRAM and external DDR2 support packet queuing and TLS handshake buffers. The integrated GPU renders animated thermostat and security-camera UIs without taxing the CPU. CAN buses can carry HVAC or EV-charger traffic in residential energy-management builds.
推薦
Automotive Dashboard Clusters
In two-wheeler and entry-level automotive instrument clusters, the PIC32MZ2025DAA169-I/HF drives a color TFT speedometer/tachometer display with anti-aliased graphics while running CAN-FD vehicle network stacks. The 200 MHz microAptiv core provides the throughput needed for real-time gauge animations, and the 12-bit ADC reads fuel-level and temperature sensors directly. Two independent CAN modules separate powertrain CAN from body CAN. Industrial -40C to +85C operation matches under-dash thermal envelopes for ICE vehicles.
推薦
Point-of-Sale (POS) Terminals
POS terminals leverage the PIC32MZ2025DAA169-I/HF to drive a touchscreen GUI for cashiers, run encrypted payment protocols, and manage peripherals (barcode scanner, receipt printer, cash drawer) over USB and serial. The 2 MB Flash holds payment SDK plus GUI assets, and 640 KB SRAM supports transaction buffers. The integrated GPU accelerates touch-response animations while the host MCU continues transaction processing. Hi-Speed USB handles the encrypted PIN-pad uplink.
推薦
Portable Test & Measurement Instruments
Handheld oscilloscopes, signal analyzers, and field-instrumentation tools use the PIC32MZ2025DAA169-I/HF for its 12-bit 18 MSPS ADC, large memory budget, and graphical waveform display capability. The 200 MHz MIPS32 core runs FFT and signal-processing routines, while the on-die GPU plots time-domain and spectrum traces on a color TFT at 30+ fps. 2 MB Flash stores calibration constants and instrument firmware, and the 120 user I/O count accommodates multi-channel front-end switching matrices. Industrial temperature grade ensures operation in field-service environments.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MZ2025DAA169-I/HF — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ1064DAA169-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1025DAB169-I/HF | PIC32MZ2025DAB169-I/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1025DAK169-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Architecture | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 1280 KB (+100%) | 1280 KB (+100%) | 640 KB (matched) | 640 KB (matched) | 1280 KB (+100%) | 640 KB (matched) |
| Hardware Crypto Engine | No | Yes | Yes | No | No | Yes | No |
| Integrated GPU / LCD Controller | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
主要差異化特點
- Doubled SRAM (1280 KB vs 640 KB) without PCB rework (對比PIC32MZ1064DAA169-I/HF)
- Hardware crypto engine absent in this variant (對比PIC32MZ1064DAB169T-I/HF)
- No external MPU required for color TFT GUI (對比PIC32MX795F512L-80I/BG)
設計說明
The 169-LFBGA uses 0.5 mm ball pitch; ensure the PCB fabrication partner supports 0.4 mm-pitch solder mask openings (NSMD land pattern preferred). Route the DDR2 interface as a 50-ohm controlled-impedance group with matched lengths (DQ within +/-25 mil of the strobe, CLK within +/-50 mil of DQS). Use the maximum recommended number of ground vias in the BGA shadow to provide a low-inductance return path for the high-speed DDR2 switching currents.
Estimated: At 200 MHz full-load with DDR2 active and GPU rendering, the 169-LFBGA package dissipates approximately 0.8-1.0 W. The 11x11 mm LFBGA thermal pad must be soldered to a continuous ground plane with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) to keep junction temperature below the 125C maximum. For enclosed handhelds, derate CPU frequency to 180 MHz if internal ambient can exceed 70C.
Do not omit the external DDR2 reference voltage (DDR_VREF) decoupling - a 1 uF X7R + 0.1 uF capacitor pair within 5 mm of the pin is mandatory for stable DDR2 operation. Configure unused ADC inputs as digital outputs (not analog) to prevent supply-current leakage. When migrating from PIC32MX to PIC32MZ, ensure the toolchain uses MPLAB XC32 v2.40+ and Harmony v3+; older toolchains lack the microAptiv errata workarounds.
The Hi-Speed USB D+/D- traces require 90-ohm differential impedance, and the total length from PHY to connector must be kept under 50 mm. Place the USB common-mode choke within 5 mm of the connector side. Keep the USB signals away from the DDR2 CLK/DQS nets by at least 4x the trace-to-trace spacing to avoid 480 Mbps jitter degradation. Series 27-ohm source-termination resistors at the MCU side are typically required for compliance.
合規資訊
HF suffix denotes halogen-free and Pb-free construction. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified (use AEC-Q100 PIC32 variants for automotive).