PIC32MZ2064DAK169-V/HF - 200MHz 32-bit Graphics MCU | Microchip
MPN： PIC32MZ2064DAK169-V/HF ✓ 啟用中PIC32MZ2064DAK169-V/HF 概覽
What is a PIC32MZ Graphics MCU? A PIC32MZ microcontroller is a 32-bit MIPS-based MCU family from Microchip Technology (semiconductor manufacturer) that combines MPU-class computational throughput with the deterministic peripherals and ease of use of an MCU. PIC32MZ Graphics (DAK/DAL/DAR/DAS) family parts add an integrated 2D Graphics Controller and Graphics Processing Unit (GPU), enabling rich HMI rendering on TFT LCD panels without an external graphics coprocessor. The hierarchy is: PIC32MZ -> MIPS32 microAptiv core -> 32-bit MCU -> embedded microcontroller -> integrated circuit.
Key features include a 12-bit 18 MSPS ADC with up to 45 analog inputs, High-Speed USB 2.0 (HS USB) with on-chip transceiver, CAN 2.0b, plus the integrated GPU and Graphics LCD Controller. The 2 MB Flash and 640 KB SRAM satisfy the storage and framebuffer needs of advanced GUIs with assets, fonts, and animations. The 200 MHz MIPS32 microAptiv core delivers MPU-class throughput.
On the architecture, the microAptiv core is single-core (no SMP), with integrated FPU, MMU, and prefetch cache. DDR2 DRAM is driven by an external memory controller, while on-die SRAM is split between general-purpose and dedicated graphics/USB buffers. The 169-LFBGA (11x11) package provides ample I/O for parallel RGB display output and quadrature encoder input.
Typical applications include automotive infotainment HMIs, industrial machine control panels with color TFT, medical patient monitors, point-of-sale terminals, and home appliance HMI. The graphics acceleration and large framebuffer simplify development of icon, slider, and animation UIs without an external GPU.
When designing with the PIC32MZ2064DAK169-V/HF, ensure DDR2 DRAM traces are length-matched and impedance-controlled per the Microchip schematic checklist. Provide a low-jitter 24 MHz crystal reference for USB and DDR2, and follow the package's PCB land pattern and thermal dissipation guidance.
This page synthesizes distributor pricing, drop-in alternatives from the same 169-LFBGA Graphics family, and practical design notes that go beyond the manufacturer datasheet summary.
直接替換替代品，適用於 PIC32MZ2064DAK169-V/HF — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ2064DAK169-V/HF （相同外形與佔位） — 差異在於 Graphics Controller, USB, CAN, Core Architecture, External Memory Interface.
PIC32MZ2064DAK169T-V/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2064DAK169T-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2064DAK169-I/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ1064DAK169-I/HF
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ1064DAB169-I/HF
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MZ2064DAK169-V/HF
✅ 直接替換聯絡詢價
查看資料表 →PIC32MZ2064DAK169-V/HF 最大額定值與電氣特性
| Core Architecture | MIPS32 microAptiv |
| Core Count | Single-core |
| Maximum CPU Frequency | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Support | DDR2 DRAM (32 MB or 128 MB, family option) |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| ADC Resolution | 12-bit |
| ADC Sampling Rate | 18 MSPS |
| Analog Input Channels | Up to 45 |
| USB | High-Speed USB 2.0 (HS USB) with on-chip transceiver |
| CAN | CAN 2.0b |
| 封裝 | 169-pin LFBGA (11x11 mm) |
| 工作溫度 | -40C to +105C |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 |
| RoHS 狀態 | Compliant |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Series | PIC32MZ DA |
| Lead-Free | Yes |
PIC32MZ2064DAK169-V/HF 169-pin lfbga (11x11 mm) 腳位配置指南
PIC32MZ2064DAK169-V/HF（169-pin lfbga (11x11 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MZ2064DAK169-V/HF.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MZ2064DAK169-V/HF 適用於 6 應用s: Automotive Infotainment HMI, Industrial Machine Control Panel, Medical Patient Monitor Display, Point-of-Sale Terminal, Home Appliance HMI with TFT, Building Automation Touch Panel.
Automotive Infotainment HMI
The PIC32MZ2064DAK169-V/HF is engineered for automotive infotainment HMIs where the integrated 2D Graphics Controller and GPU drive TFT panels without external coprocessors. With 2 MB Flash and 640 KB SRAM it can store GUI assets, multiple font sets, and animation frames on-engine, while the 200 MHz microAptiv core handles HMI logic, CAN 2.0b messaging, and High-Speed USB 2.0 media interfaces. The 169-LFBGA (11x11) package fits behind small 4-7 inch displays, and the -40C to +105C operating range supports cabin and engine-bay-adjacent modules.
推薦
Industrial Machine Control Panel
Industrial control panels benefit from the PIC32MZ2064DAK169-V/HF's integrated GPU, large framebuffer, and up to 45 analog inputs at 12-bit 18 MSPS. The 2 MB Flash and 640 KB SRAM accommodate multi-language UI assets and runtime logging, while CAN 2.0b and HS USB 2.0 deliver fieldbus and programming ports. Industrial 4-10 inch TFT panels connect directly through the integrated Graphics LCD Controller, eliminating external GPU cost. Estimated BOM reduction versus discrete MCU + external GPU: 30-40%.
推薦
Medical Patient Monitor Display
The PIC32MZ2064DAK169-V/HF fits medical patient monitors that need a crisp color TFT UI and reliable data plumbing. The 12-bit 18 MSPS ADC with up to 45 inputs handles multiple sensor channels (SpO2, ECG, temperature), the 200 MHz microAptiv core drives the HMI render loop, and the integrated GPU accelerates waveform overlays. The 640 KB SRAM supports waveform history buffers; 2 MB Flash accommodates multilingual assets and bootloader for IEC 60730/10993 compliance code.
推薦
Point-of-Sale Terminal
Point-of-sale terminals need a responsive color HMI, USB peripherals, and secure boot. The PIC32MZ2064DAK169-V/HF provides High-Speed USB 2.0 with on-chip transceiver for barcode scanners and printers, CAN 2.0b for cash-drawer interfaces, and the integrated 2D Graphics Controller + GPU for animated touch menus on 5-7 inch TFT panels. The 2 MB Flash stores payment UX, fonts, and cryptographic libraries, while 640 KB SRAM supports transaction caching and rendering.
推薦
Home Appliance HMI with TFT
Premium home appliances (ovens, washers, refrigerators) increasingly ship with color TFT touch UIs. The PIC32MZ2064DAK169-V/HF's integrated GPU accelerates and TFT panels at 60 fps, while the 12-bit ADC with up to 45 inputs reads thermistors, motor currents, and water level sensors. The 200 MHz core handles scheduling and connectivity, the HS USB 2.0 enables firmware updates via mass storage, and the -40C to +105C range tolerates oven-adjacent enclosures.
推薦
Building Automation Touch Panel
Building automation panels - HVAC controls, lighting controllers, access keypads - leverage the PIC32MZ2064DAK169-V/HF for graphical scheduling UIs on quad, cantilevered touch panels. The 200 MHz core manages BACnet/Modbus stacks and HMI logic simultaneously, the integrated GPU draws floor-plan backgrounds with smooth animations, and the 640 KB SRAM holds schedule data. The 169-LFBGA (11x11) package suits wall-mount depth constraints.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MZ2064DAK169-V/HF — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ2064DAK169T-V/HF | PIC32MZ2064DAK169T-I/HF | PIC32MZ2064DAK169-I/HF | PIC32MZ1064DAK169-I/HF | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Graphics Controller | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| USB | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 |
| ADC | 12-bit, 18 MSPS, up to 45 ch | 12-bit, 18 MSPS, up to 45 ch | 12-bit, 18 MSPS, up to 45 ch | 12-bit, 18 MSPS, up to 45 ch | 12-bit, 18 MSPS, up to 45 ch | 12-bit, 18 MSPS, up to 45 ch |
主要差異化特點
- Higher operating temperature ceiling for automotive modules (對比PIC32MZ2064DAK169-I/HF)
- Twice the Flash for GUI asset libraries (對比PIC32MZ1064DAK169-I/HF)
- Tape-and-reel factory form factor (對比PIC32MZ2064DAK169-I/HF)
- Up to 45 analog inputs in compact 169-ball package (對比PIC32MZ2064DAH176)
設計說明
The 169-LFBGA (11x11) package requires a 4 or 6-layer PCB with a continuous ground plane and a dedicated power plane for the microAptiv core. Use Microchip's recommended land pattern with NSMD (non-solder mask defined) pads and 0.4 mm pitch BGA escape routing. Stagger vias and use blind/buried vias or microvia stackups if available, since through-via escape will not fit between 0.4 mm pitch balls.
DDR2 DRAM traces to the external memory controller must be length-matched within +/- 25 mil across the byte lanes, with 50 ohm single-ended impedance. Reference the Microchip PIC32MZ Graphics family schematic checklist for the recommended DDR2 topology, decoupling (75 nC bulk + 0.1 uF per pin pair), and VTT termination. The HS USB 2.0 D+/D- traces must be 90 ohm differential with no stubs, and the 24 MHz crystal must be within 5 mm of the XIN/XOUT pins.
Estimated: at 200 MHz with DDR2 active and USB transmitting, core current draw on the PIC32MZ2064 DAK graphics MCU family reaches ~250-300 mA at 1.2V core. Power dissipation is approximately 0.3-0.36 W; the 169-LFBGA (11x11) with 4-layer PCB and thermal via array under the die pad keeps junction temperature rise under 25C above ambient. Place thermal vias in the BGA land pattern center to spread heat into the inner ground plane.
Do not omit the external 24 MHz crystal - internal RC is insufficient for HS USB 2.0 and DDR2 DRAM timing. Always populate the ICSP/ICD pins (PGECx/PGEDx pair) on a debug header, since the PIC32MZ2064DAK169 exposes multiple PGECx/PGEDx pairs and any pair can be used but both must be routed. Configure unused I/O pins as outputs to minimize quiescent IoT.
The parallel RGB TFT bus runs at up to 50 MHz pixel clock - keep trace lengths matched across R/G/B and HSYNC/VSYNC/DE within 50 mil. Use series termination (22-33 ohm) on clock lines if the panel connector is more than 50 mm from the BGA. Separate analog and digital grounds with a single bridge under the ADC; the 12-bit 18 MSPS ADC with up to 45 channels is sensitive to digital switching noise.
合規資訊
RoHS and lead-free status confirmed by Microchip product page and DigiKey listing. AEC-Q100 status requires confirmation from Microchip qualification pack - extended -40C to +105C temperature grade supports but does not automatically imply AEC-Q100 qualification.