XC6SLX150-3FG676C - Spartan-6 LX FPGA | AMD Xilinx
MPN： XC6SLX150-3FG676C ✓ 啟用中XC6SLX150-3FG676C 概覽
A field-programmable gate array is a programmable-logic semiconductor in which digital circuits are configured through configurable logic blocks, programmable interconnect, and I/O resources. Within the device hierarchy, an FPGA is a programmable-logic IC and a semiconductor. Spartan-6 devices integrate programmable logic, dedicated block RAM, programmable input/output resources, and digital clock-management capabilities to support parallel processing, control, interface, and embedded-system designs.
The XC6SLX150-3FG676C provides 498 I/O in its 676-ball package and operates at an indicated internal frequency of 667 MHz. Its -3 speed grade is described as having the highest performance among the standard Spartan-6 LX grades -3, -2, and -1L. The commercial temperature range shown for this ordering code is 0°C to 85°C, making the device appropriate for equipment operating within that range.
The 676-ball FCBGA package uses a 19 x 19 mm body and 0.80 mm ball pitch. This dense land pattern supports high I/O availability on a compact board area, but it also demands careful PCB layout, escape routing, via strategy, assembly-process planning, and pin-assignment review. AMD provides package pinout files in ASCII format for engineers who require the exact package-level assignment.
Typical design roles include digital control systems, high-channel-count parallel I/O, industrial automation equipment, communications infrastructure, test and measurement platforms, and embedded signal-processing systems. The combination of 498 I/O, the -3 speed grade, and the 667 MHz indicated operating frequency is particularly useful when a design benefits from substantial parallel connectivity and configurable logic rather than a fixed application-specific ASIC.
PCB implementation should begin with the package pinout and board constraints rather than assumption. Confirm ball assignments, differential-pair rules, power-plane connectivity, decoupling locations, and assembly requirements against the AMD package documentation. When replacing another Spartan-6 device, also verify speed grade, temperature grade, package suffix, device variant, and configuration compatibility.
This page organizes the key ordering-code, package, performance, sourcing, and engineering details into a compact reference. It also identifies same-family drop-in candidates and highlights the migration checks that matter most when preserving a 676-ball Spartan-6 board.
直接替換替代品，適用於 XC6SLX150-3FG676C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX150-3FG676C （相同外形與佔位） — 差異在於 Device Type, Package, Temperature Grade, Speed Grade, Lead-Free Status.
XC6SLX150-2FG676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-1FG676C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC6SLX150-3FG676I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC6SLX150-3FG676C 最大額定值與電氣特性
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Device Designation | XC6SLX150 |
| Speed Grade | -3 |
| Temperature Grade | Commercial |
| Maximum Internal Frequency | 667 MHz |
| I/O Count | 498 I/O |
| 封裝 | 676-ball FCBGA |
| Package Body Size | 19 x 19 mm |
| Ball Pitch | 0.80 mm |
| Package Construction | Lead-free |
| 工作溫度 | 0°C to 85°C |
| 安裝類型 | Surface Mount |
| Logic Type | Configurable digital logic |
| Clock and Timing | Digital clock-management resources |
| Memory Support | Dedicated block RAM |
| Programming Interface | Spartan-6 FPGA configuration interface |
XC6SLX150-3FG676C lead-free 腳位配置指南
XC6SLX150-3FG676C（lead-free 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX150-3FG676C.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX150-3FG676C 適用於 6 應用s: Industrial Automation Controllers, Parallel Data Acquisition Systems, Communications and Network Interfaces, Test and Measurement Equipment, Embedded Signal Processing, Video and Imaging Control.
Industrial Automation Controllers
XC6SLX150-3FG676C fits industrial automation controllers that need extensive parallel connectivity and programmable digital logic. Its 498 I/O can support machine interfaces, sensors, actuators, status indicators, and inter-board communication, while the 667 MHz indicated internal frequency provides a strong starting point for control and supervisory logic. The -3 speed grade offers the highest performance among the standard Spartan-6 LX grades. In a controller design, the device can consolidate discrete control, sequencing, and communication-interface functions without relying on several fixed-function controllers. Use AMD's exact package pinout file during board layout and place the device within the commercial 0°C to 85°C operating envelope unless the design requires a different temperature grade.
推薦
Parallel Data Acquisition Systems
The 498 I/O available on XC6SLX150-3FG676C make it suitable for parallel data-acquisition and signal-conditioning systems requiring numerous external connections. A single Spartan-6 LX device can organize control logic, interface timing, channel multiplexing, and data movement while the -3 grade supports the highest standard LX performance. Its 676-ball FCBGA package is compact at 19 x 19 mm, but the 0.80 mm pitch requires careful escape routing and assembly planning. Engineers should assign pins using AMD's package file, keep sensitive and high-speed routes away from unrelated switching activity, and verify timing for each acquisition channel. The commercial 0°C to 85°C grade must also be checked against the enclosure temperature.
推薦
Communications and Network Interfaces
XC6SLX150-3FG676C is well suited to communications equipment that needs configurable parallel logic, moderate protocol handling, and a large I/O count. The device can implement interface adaptation, packet control, buffering, and system interconnect functions around external processors or converters, while its 498 I/O provide substantial board-level connectivity. The -3 speed grade is preferable when design timing is critical because it is identified as the highest-performance standard Spartan-6 LX option. Board planners should use the official 676-ball pinout, preserve matched routing for differential interfaces where applicable, and provide the power and ground connectivity specified by AMD. The same physical platform can also support a lower-speed replacement, but timing closure must be repeated after any migration.
推薦
Test and Measurement Equipment
The programmable-logic resources and 498 I/O of XC6SLX150-3FG676C support test and measurement equipment that combines sequencing, pattern generation, interface control, and acquisition logic. The 667 MHz indicated internal frequency and -3 grade support performance-sensitive timing, while the large package I/O count reduces the need for separate routing devices in densely connected instruments. A practical implementation can place the FPGA beside converters and interface ICs, then use tightly controlled clocking and terminated routes for sensitive signals. Because the 676-ball FCBGA has a 0.80 mm pitch, assembly yield, via-in-pad policy, thermal performance, and escape-routing density should be reviewed early. The commercial temperature range is suitable only when the complete instrument remains within 0°C to 85°C.
推薦
Embedded Signal Processing
XC6SLX150-3FG676C can serve as the programmable core in embedded signal-processing systems where parallel logic, digital filtering, control sequencing, and external I/O must operate together. Its 498 I/O allow parallel data paths and control connections to remain within one FPGA domain, while the -3 speed grade is the strongest of the standard Spartan-6 LX options. The device is especially relevant when an application benefits from configurable pipeline depth, timing changes, or hardware adaptation without changing a fixed ASIC. Designers should evaluate block-RAM usage, clock domains, and I/O standards against the AMD family documentation, then validate the 676-ball layout with the package pinout file. The internal frequency of 667 MHz is a device indication, not a guaranteed end-to-end signal rate.
推薦
Video and Imaging Control
XC6SLX150-3FG676C is applicable to imaging systems that require extensive digital control, parallel sensor interfaces, timing generation, and programmable post-processing. The 498 I/O provide substantial connectivity for image sensors, memory interfaces, converters, and synchronization signals, while the -3 grade supports the highest standard performance in the Spartan-6 LX family. In a camera or display-control architecture, the FPGA can combine sensor timing, data-path control, and interface conversion around companion components. Layout work must account for the 0.80 mm ball pitch, careful length matching on sensitive interfaces, and power delivery across the 19 x 19 mm package. Use the exact AMD package file to confirm every ball and verify the commercial temperature range against the imaging equipment's internal environment.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX150-3FG676C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX150-2FG676C | XC6SLX150-1FG676C | XC6SLX150-3FG676I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3, highest standard Spartan-6 LX performance | -2 | -1 | -3, highest standard Spartan-6 LX performance |
| I/O Count | 498 I/O | 498 I/O | 498 I/O | 498 I/O |
| Package Body Size | 19 x 19 mm | 19 x 19 mm | 19 x 19 mm | 19 x 19 mm |
| Ball Pitch | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm |
| Temperature Grade | Commercial, 0°C to 85°C | Commercial | Commercial | Extended temperature |
主要差異化特點
- Highest standard Spartan-6 LX speed grade (對比XC6SLX150-2FG676C)
- Commercial temperature grade for standard commercial equipment (對比XC6SLX150-3FG676I)
- High I/O density in a compact package (對比XC6SLX150-1FG676C)
設計說明
Begin the layout with AMD's exact Spartan-6 package pinout file rather than a generic 676-ball symbol. The XC6SLX150-3FG676C uses a 19 x 19 mm FCBGA with 0.80 mm pitch, so escape routing, via placement, pad-stack design, and assembly clearance must be coordinated early. Verify every power, ground, configuration, and user I/O ball against the selected device and package. If a lower-speed drop-in candidate is introduced, retain the same footprint and reassess timing rather than assuming the layout itself changes.
Plan power and ground connectivity for the 676-ball FCBGA with the package and board requirements from AMD. Place decoupling and return-path structures where they can serve the device without introducing long current loops or additional signal discontinuity. Separate clocks, high-speed interfaces, and sensitive control paths from unrelated digital activity, and preserve the intended return path beneath each routed signal. Exact capacitance values, via dimensions, and layer-count requirements must be taken from the manufacturer documentation rather than inferred from the package size.
Do not treat the 667 MHz device indication as a guaranteed 667 MHz signal rate at every I/O. Timing performance depends on the selected clocking approach, routing, logic architecture, I/O standard, and external circuitry. For clocked interfaces, budget skew and jitter, evaluate the actual source and receiver loading, and validate the design with simulation and hardware measurement. When changing from the -3 grade to a -2 or -1 alternative, rerun timing analysis because the physical substitution does not preserve the target's timing margin.
Do not approve a substitution based only on the XC6SLX150 family name. Confirm the logic variant, speed grade, temperature suffix, package suffix, ball count, body dimensions, pitch, configuration method, and required operating range. In particular, an XC6SLX150T part is a different Spartan-6 LXT device, while FGG484 and FGG676 references represent different package options from FG676. Compare complete ordering codes and use the AMD ordering information and package pinout files for final qualification.
合規資訊
The published package listing identifies XC6SLX150-3FG676C as lead-free. RoHS, REACH, halogen-free, and conflict-minerals declarations were not identified in the available manufacturer or distributor records. The commercial-temperature FPGA is not an automotive-qualified device based on the ordering information.