FPGA与CPLD
产品（6666)
EP3SE260H780C4LG - Stratix III E FPGA, 488 I/O, 780-HBGA | Altera
The Altera (now Intel) EP3SE260H780C4LG is a high-density, high-performance Stratix III Enhanced family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package. It integrates 254,400 logic elements (LEs) with 18.36 Mbits of embedded memory, delivering ASIC-grade performance for compute-intensive and signal-processing workloads. The "C4" speed grade denotes a commercial temperature grade (0C to +85C) at the mid-speed tier. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital circuits after PCB assembly. FPGAs occupy the highest tier of programmable logic, above CPLDs in density and below custom ASICs in per-unit cost, making them ideal for low-volume designs, rapid prototyping, and applications whose algorithms continue to evolve after deployment. Key features include 950 MHz DSP block performance, dedicated 9-bit x 9-bit multiplier blocks, up to 800 Mbps external memory interface support (DDR3, QDR II+, RLDRAM II), 488 user I/O pins, and 8 full-duplex transceivers supporting rates up to 6.375 Gbps. The 780-HBGA package provides the highest user I/O density in the Stratix III E lineup, suited for data-path-heavy designs. The Stratix III Enhanced family uses a 65 nm low-power process and introduces programmable power technology that dynamically scales voltage on logic blocks. Combined with hard IP for PCI Express Gen2, 10 Gigabit Ethernet MACs, and multi-gigabit transceivers, it accelerates protocol bridging, baseband processing, and high-speed serial links. Typical applications include ASIC prototyping, high-performance DSP (radar, medical imaging, video processing), high-speed serial protocol bridging, broadcast equipment, military/aerospace signal processing, and test & measurement instrumentation. The 780-HBGA package supports high pin-count designs where board area and trace-length control are critical. When designing with this device, allocate FPGA fabric utilization below 70% to leave timing margin for place-and-route closure, plan power sequencing across VCC, VCCA_PLL, and VCCPT rails, and validate transceiver reference-clock jitter against protocol masks. This page synthesizes distributor pricing, same-package drop-in alternatives (speed/temperature/revision grade variants), and practical design considerations for the EP3SE260H780C4LG that are not consolidated in the manufacturer datasheet.
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
The Intel (Altera) EP3SE260H780C4LN is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. The device integrates 10,200 Logic Array Blocks (LABs) and 384 embedded 18x18 multipliers, supporting DSP-intensive workloads at core speeds up to 600 MHz. This C4LN speed grade variant is specified for commercial temperature operation (0C to +85C) and uses 1.0V core VCC with auxiliary VCCPD and VCCPT rails for I/O and phase-locked loop (PLL) blocks. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a configurable logic fabric of programmable Look-Up Tables (LUTs), flip-flops, routing, and hardened IP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and ASICs: microcontrollers run software, FPGAs implement custom hardware at wire-speed, and ASICs are fixed-silicon implementations of a single design. The Stratix III E family adds dedicated transceivers, DSP blocks, and TriMatrix on-chip memory to the general-purpose FPGA fabric, making it suitable for high-throughput parallel processing. Key features of the EP3SE260H780C4LN include 16 global clock networks, 8 PLLs per device, 4 configuration schemes (Fast Passive Parallel, Active Serial, Passive Serial, JTAG), and support for up to 12.5 Gbps operation when paired with Stratix III GX/LX transceivers on adjacent package variants. The device also exposes the partial reconfiguration controller and CRC error-detection circuitry that are hallmarks of the Stratix III generation. The EP3SE260H780C4LN is fabricated in TSMC's 40 nm process node and uses a 1.0V core supply. The 780-FCBGA package exposes 488 general-purpose I/O arranged across 24 I/O banks with support for LVDS, LVCMOS, SSTL, and HSTL I/O standards. On-chip termination (OCT) eliminates external series/parallel resistors on critical nets. Typical applications include high-performance digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, 10 Gigabit Ethernet MAC), broadcast video processing, and high-frequency trading accelerators. The 16.67 Mbit embedded memory enables wide data-path implementations without external SRAM. When designing with this part, attention to PCB layout is critical: the 780-FCBGA requires microvia or via-in-pad PCB technology, matched-length routing on LVDS pairs, and decoupling capacitors within 100 mil of every VCC pin. Designers should also budget power using the Altera PowerPlay Early Power Estimator (EPE) tool before PCB commitment. This page synthesizes distributor pricing, same-family Stratix III E drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
EP3SE260H780C4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE260H780C4N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 10,200 Logic Array Blocks (LABs), and 16,672,768 bits of embedded RAM, housed in a 780-ball FineLine Ball-Grid Array (FCBGA) package. The device operates across a 0.86 V to 1.15 V core voltage range using TSMC's 65 nm process node, with a maximum core clock frequency of 450 MHz. The 488 user I/O pins support a broad mix of single-ended and differential I/O standards for high-bandwidth system connectivity. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory blocks, DSP slices, PLLs) on a single silicon die. FPGAs sit in the wider taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors, and they enable parallel hardware implementation of algorithms that would otherwise require custom ASICs or multi-chip DSP solutions. Key features of the EP3SE260H780C4N include 768 18x18 multipliers for DSP, 12 phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR3, DDR2, and QDRII+ up to 800 MHz, and integrated transceiver capability depending on die variant. The device is hardened for signal integrity with on-chip termination and adaptive equalization, and is rated for industrial-grade operating temperature. Architecturally, the Stratix III E family uses an adaptive logic module (ALM) fabric that is roughly 25 percent more area-efficient than prior Stratix II Adaptive Look-Up Tables, while the partial reconfiguration and dedicated configuration logic enable secure in-field updates. The 65 nm process and 1.1 V core deliver a favorable performance-per-watt envelope for high-end DSP and packet-processing workloads. Typical applications include high-performance digital signal processing for radar and software-defined radio, ASIC prototyping and emulation, high-speed packet processing in network infrastructure, video broadcasting and medical imaging pipelines, and high-throughput data-acquisition systems. The combination of logic density and dedicated multiplier resources is well suited to multi-channel DSP and FEC implementations. Designers should plan for 0.86 V to 1.15 V core supply sequencing and use the Altera/Intel Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure. Thermal management at high toggle rates requires a multi-layer PCB with sufficient ground and power planes; reference the Stratix III handbook for thermal design guidelines. This page synthesizes distributor stock and pricing, the Stratix III family pin-compatible variants, and practical design notes that complement the manufacturer datasheet and Quartus II device documentation.
EP3SE260H780I3 - Stratix III E 255K LE FPGA, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE260H780I3 is a high-density Stratix III E FPGA built on a 65 nm process, delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FC-HFBGA) package. The device integrates 10,200 LABs and 384 embedded 18x18 multipliers, providing up to 192 GMACs of DSP throughput for high-performance signal processing. An internal clock network supports operation up to 800 MHz fabric and 500 MHz logic-array frequency, with transceiver-rich variants typically reaching 717 MHz on high-speed interfaces. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices, sitting alongside CPLDs in the digital logic hierarchy and bridging the gap between fixed-function ASICs and software-driven processors. Stratix III E devices specifically target high-performance, logic-rich applications with embedded DSP and memory, paralleling Xilinx Virtex-6 in market positioning. The EP3SE260H780I3 is part of the Stratix III E family engineered for low static and dynamic power through programmable power technology, with each LAB able to operate in high-speed or low-power mode. The 780-ball FCBGA package supports industrial temperature grades, making the part suitable for harsh-environment deployments. On-chip features include partial reconfiguration, dedicated PLL and DLL clock management, and hard memory controllers for DDR2/DDR3. Typical applications span high-end wireline and wireless baseband processing, military radar and electronic warfare, ASIC prototyping, and high-definition video broadcast infrastructure. The device also serves medical imaging accelerator cards, high-frequency trading acceleration platforms, and test-and-measurement instrumentation where parallel DSP throughput and large on-chip memory dominate the design trade. A key design trade-off: the 780-ball FCBGA package requires a multi-layer PCB (typically 8-12 layers) with controlled-impedance routing, microvia or via-in-pad stackups, and matched-length traces for high-speed differential pairs. Engineers should plan for thermal management (junction-to-ambient resistance typically in single-digit C/W with proper heatsinking) and consider migration paths to Stratix IV/V or Cyclone families as the Stratix III line is no longer recommended for new designs. This page synthesizes distributor pricing, drop-in Stratix III family alternatives, and practical FPGA design notes not collected in a single place in the manufacturer datasheet.
EP3SE260H780I3N - Stratix III E FPGA 255K LE 780-FCBGA | Intel
The Intel EP3SE260H780I3N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os in a 780-pin FCBGA (HBGA) package. According to the distributor listing, it operates at up to 500 MHz core frequency on a 65 nm CMOS process with a 1.1 V core supply, and is rated for the industrial temperature range. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, embedded memory (BRAM/M9K/M144K), high-speed transceivers, and I/O cells, all configured via an SRAM-based bitstream after PCB assembly. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > PLD > digital logic IC > semiconductor), bridging software-defined hardware and ASIC-class performance for prototyping, low-volume production, and applications where time-to-market dominates unit-cost sensitivity. The Stratix III generation specifically targets high-performance signal processing, telecom baseband, and ASIC-prototyping workloads. Key features include 10,200 Logic Array Blocks (LABs), 488 user I/Os supporting multiple I/O standards (LVDS, LVTTL, SSTL, HSTL), embedded multipliers and DSP blocks for high-throughput arithmetic, and 16,672,768 bits of on-chip RAM configurable as true dual-port, simple dual-port, or single-port memory. The device also provides up to 12 transceivers (per Stratix III E family) for multi-gigabit serial links, PLL-based clock management, and dynamic on-chip termination (OCT) for signal integrity. Architecturally, the Stratix III E family uses a 65 nm TSMC process with adaptive logic modules (ALMs) - each ALM packs eight 6-input LUTs into a single structure, yielding roughly twice the logic density of the prior Stratix II generation at equivalent performance. The 'I' suffix in the part number indicates industrial temperature grade (-40 °C to +100 °C ambient operation), while the '3' speed grade positions this device in the mid-performance tier (Stratix III speed grades: 2 = fast, 3 = mid, 4 = slow). Typical applications include ASIC prototyping, high-end DSP and image processing, telecom baseband and channel cards, military/aerospace signal processing, high-speed serial protocol bridging (PCIe, Serial RapidIO, Aurora, CEI-6G), and test & measurement instrumentation. The 488 I/O count makes it well-suited for bus-heavy designs requiring wide parallel interfaces to DDR/QDR memories and external ASICs. When designing with this device, allocate adequate PCB layers (typically 12+ for a 780-pin FCBGA), use a multi-via-per-pad escape pattern for the BGA fan-out, and follow Intel/Altera's Stratix III Handbook power-rail sequencing recommendations (VCCINT, VCCAUX, VCCPD rails must sequence within 100 ms to prevent latch-up). Decoupling requires a mix of 0402/0201 ceramic capacitors placed as close to every power pin as possible. This page synthesizes distributor pricing, same-family Stratix III alternatives, application guidance, and PCB layout considerations drawn from the manufacturer datasheet family and current distributor inventory - information that a raw datasheet PDF alone does not provide.
EP3SE260H780I4 - 255K LE Stratix III FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP3SE260H780I4 is a high-density Stratix III Enhanced (Stratix III E) family FPGA housed in a 780-ball FC-HFBGA (HBGA) package. According to manufacturer data, the device integrates approximately 255,000 logic elements (LEs) fabricated on a 65 nm process node, with a core voltage of 1.1 V and 488 user I/Os. The part is specified for industrial-grade temperature operation (the trailing 'I' designator in the ordering code). An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture is built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs occupy the top of the digital hardware hierarchy between ASICs (which are fixed-function) and microcontrollers (which are software-programmed but sequential). Stratix III E parts are positioned for high-performance signal processing, high-bandwidth connectivity, and ASIC prototyping where deterministic parallelism and large embedded memory are required. Key features include up to 14.4 Mbit of embedded RAM (M9K/M144K blocks), dedicated DSP blocks supporting 9x9, 18x18, and 36x36 multipliers, up to 8 embedded transceivers operating up to 6.5 Gbps (per Stratix III family capability), and hard PCI Express Gen1 endpoints. The device supports configuration via JTAG, Passive Serial, Fast Passive Parallel, and Active Serial schemes using Altera/Intel EPCS or EPCQ flash memories. The 65 nm process and 1.1 V core enable lower static power than the prior Stratix II generation. The HBGA-780 substrate uses flip-chip interconnects that shorten the die-to-package inductance path, supporting clean multi-Gbps signaling. The 'I4' suffix indicates industrial temperature grade (-40C to +100C ambient) and speed grade 4. Typical applications include high-end test and measurement instrumentation, ASIC prototyping, broadcast video processing, defense signal processing, and wireless baseband preprocessing. The combination of 255K LEs and ~14 Mbit RAM targets pipelines that previously required multiple smaller FPGAs. A primary design consideration is power delivery: the 1.1 V core rail can draw substantial current under high toggle rates - designers must budget for a multi-phase VRM with bulk decoupling close to the BGA balls. Signal integrity on the flip-chip BGA requires matched-length routing and reference-plane continuity under the escape region. This page synthesizes distributor pricing, drop-in same-package variants, and engineering guidance not found in the manufacturer datasheet alone.
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
The Intel (formerly Altera) EP3SE260H780I4L is a high-density Stratix III E FPGA with 255,000 logic elements, 16,672,640 bits of embedded memory, and 488 user I/O pins, housed in a 780-pin FC-HFBGA (flip-chip fine-pitch BGA) package. It operates from a 0.9 V core supply, is built on a 65 nm process, and supports DDR3 memory interfaces at up to 533 MHz (1067 Mbps data rate), with 24 transceivers up to 6.375 Gbps per the Stratix III E family specification. The device is part of the Stratix III Enhanced (E) variant that delivers higher logic density and richer DSP/memory resources than the base Stratix III L variant. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs in density, and below ASICs in per-unit cost but above them in design flexibility. FPGAs typically integrate programmable logic blocks, embedded multipliers, BRAM, clock networks, high-speed transceivers, and hard IP cores (memory controllers, PCIe, SERDES), making them suitable for high-throughput compute, signal processing, and prototyping tasks. Key features of the EP3SE260H780I4L include 488 user I/Os, 1,536 18x18-bit multipliers (per Stratix III E family maximum), 19.4 Mbits of total BRAM per device-level maximum, and support for soft-core processors such as Nios II. The FC-HFBGA package provides a fine-pitch BGA with flip-chip attach and a high pin-count for high-bandwidth signal routing. Industrial temperature grade and JTAG IEEE 1149.1 boundary-scan support enable in-system programming and test. Typical applications for the EP3SE260H780I4L include high-performance DSP and baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, SRIO, XAUI), test and measurement instrumentation front-ends, military and aerospace signal processing, and high-port-count line-card controllers. The 780-pin FC-HFBGA package and industrial-grade qualification make it well-suited to demanding environments that require large logic capacity with deterministic timing closure. When designing with the EP3SE260H780I4L, pay close attention to multi-rail power sequencing (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and auxiliary supplies), thermal management on the FC-HFBGA substrate, and PCB stack-up to control impedance on the high-speed transceiver channels. Configuration can be loaded via JTAG, passive serial, or via a quad flash EPCQ device for fast multi-MB bitstreams.
EP3SE260H780I4LG - Stratix III E FPGA 255K LE HBGA-780 | Intel
The Intel (formerly Altera) EP3SE260H780I4LG is a high-density, low-power Stratix III Enhanced FPGA delivering 255,000 logic elements, 102,000 adaptive logic modules (ALMs), and 15.90 Mbit of embedded memory in a 780-ball FineLine BGA (HBGA) package. It belongs to the EP3SE260 speed-grade -4 / industrial temperature family and integrates 488 user I/O pins, eight phase-locked loops, and dedicated DSP blocks optimized for high-throughput signal processing. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), routing channels, and hardened IP such as memory, multipliers, transceivers, and PLLs. FPGAs sit hierarchically below Application-Specific Integrated Circuits (ASICs) but above general-purpose microcontrollers in the programmable-logic taxonomy, allowing hardware-level parallelism and post-manufacture functional changes. The Stratix III Enhanced family targets applications that require very high logic density combined with low static and dynamic power, achieved through Altera's programmable power technology and adaptive logic modules. Key features include 840 18x18 multipliers, 304 DSP blocks, 4 fractional PLLs plus 4 general-purpose PLLs, support for external memory interfaces including DDR3 up to 800 MHz, and an industrial temperature range of -40C to +100C. The HBGA-780 package supports high pin count with manageable board real estate for telecom, broadcast, and high-performance computing backplanes. Configuration is supported via JTAG, Passive Serial, Fast Passive Parallel, and Active Serial schemes through dedicated configuration pins. The architecture combines the Quartus II design-flow benefits with TSMC's 65 nm low-power process, providing deterministic timing closure for multi-gigabit serial and parallel interfaces. Hardware designers typically pair the device with high-speed external SRAM/DDR3, multi-gigabit transceivers (via the Stratix III Enhanced variant), and protocol IP cores for PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and Interlaken. Typical applications include wireless baseband processing, high-end medical imaging, ASIC prototyping, broadcast video processing, and high-frequency trading acceleration. Designers working on signal intelligence (SIGINT) platforms and defense radar also rely on the EP3SE260 density for channelization and beamforming workloads. When designing with this FPGA, use Intel Quartus II software v13.1 or later for synthesis, place-and-route, and PowerPlay power estimation. Verify thermal envelopes via junction-to-ambient and junction-to-case thermal resistance figures from the package datasheet, as BGA-780 at full utilization commonly exceeds 10 W. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-package alternatives drawn from the Site MPN list, and practical design notes - synthesis unavailable on the manufacturer product page alone.
EP3SE260H780I4LN - 255k LE Stratix III E FPGA | Altera | 780-BGA
The Altera (Intel) EP3SE260H780I4LN is a high-density Stratix® III E Field Programmable Gate Array (FPGA) with 255,000 logic elements, housed in a 780-ball FineLine Ball-Grid Array (FCBGA/HBGA) package. The device integrates 16,672,640 memory bits and 488 user I/O pins, fabricated on a TSMC 65 nm process node and offered in the -4 speed grade with industrial temperature rating. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit hierarchically between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs) (which are fixed in silicon), offering hardware-level parallelism, in-system reprogrammability, and custom datapath design without NRE cost. The Stratix III E family specifically targets high-performance signal processing, ASIC prototyping, and high-bandwidth data-path applications. Key features of the EP3SE260H780I4LN include 10,200 Logic Array Blocks (LABs), integrated DSP blocks for high-throughput arithmetic, embedded memory for buffering and queuing, and dedicated high-speed serial transceiver resources supporting multi-gigabit data rates. The device operates from a 0.9 V core supply and supports industrial temperature range operation. Its high logic-to-I/O ratio makes it suitable for pin-intensive designs and dense parallel processing. Stratix III E devices use a 65 nm low-k dielectric CMOS process with Altera's adaptive logic module (ALM) architecture, delivering roughly 1.4× the logic capacity and 2× the transceiver performance of the preceding Stratix II generation. Embedded transceivers operate up to 6.375 Gbps, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, and CPRI. The architecture is optimized for ASIC prototyping, high-performance DSP pipelines, and communications infrastructure where deterministic parallel throughput is required. Typical applications include ASIC prototyping and emulation, high-speed digital signal processing for wireless baseband and radar, software-defined radio platforms, high-end test and measurement instrumentation, video broadcast and image processing pipelines, and high-bandwidth networking line cards. Designers choose Stratix III E parts when they require very high logic density combined with multi-gigabit transceivers and substantial on-chip memory in a single device. When designing with this FPGA, ensure robust power-delivery network design for the multi-rail core and transceiver supplies, and follow Altera's PCB layout guidelines for HBGA packages including via-in-pad and microvia construction for signal-integrity at high transceiver rates. Programming uses the Quartus II design suite. This page synthesizes distributor pricing, drop-in Stratix family alternatives, and PCB/thermal design notes for the EP3SE260H780I4LN not aggregated on the manufacturer product page.
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE260H780I4N is a high-density Stratix III Enhanced (Stratix III E) Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements, 488 user I/Os, and 16,672,768 bits of embedded memory in a 780-pin FC-HFBGA (FCBGA) package. Fabricated on a 65 nm low-power CMOS process with a 1.1 V core supply, the device integrates 10,200 LABs and is rated for industrial temperature operation, supporting system clock rates up to 450 MHz. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device consisting of an array of programmable logic blocks, embedded memory blocks, DSP blocks, and high-speed transceiver slices, all interconnected by a programmable routing fabric. FPGAs occupy the top of the programmable logic hierarchy (FPGA -> programmable logic -> ASIC-class integration -> semiconductor), bridging the gap between fixed-function ASICs and software-driven processors. The Stratix III family was Intel/Altera's mid-2000s high-performance node, with the Enhanced ('E') sub-family adding more transceivers and DSP bandwidth versus the standard Stratix III. Key features include 488 user I/O pins, 16,672,768 embedded memory bits, 10,200 LABs (Logic Array Blocks), embedded DSP blocks, and support for high-speed external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device supports the JTAG IEEE Std. 1149.1 boundary-scan specification, allowing pin-level interconnect testing without physical probes, and supports in-system programming via the Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) configuration modes. Typical applications include high-speed digital signal processing, software-defined radio (SDR), video broadcast infrastructure, ASIC prototyping, high-end test and measurement, and military/aerospace signal processing. The combination of high logic density, abundant embedded multipliers, and 488 GPIO pins makes it well suited for parallel multi-channel processing where DSP throughput per dollar per watt is the primary constraint. When designing with the EP3SE260H780I4N, plan for a multi-rail power solution (typically 1.1 V core, 2.5 V/3.3 V I/O, and 1.2 V PLL analog) and follow Intel's PCB layout guidelines for flip-chip BGA packages, including via-in-pad and microvia stackups to escape the 1.0 mm BGA pitch. Configuration memory requires an external EPCS or EPCQ flash device, and JTAG chain integrity must be verified before live system bring-up.
EP3SE50F484C2 - 47.5K LE Stratix III E FPGA | Intel | 484-FCBGA
The Intel (formerly Altera) EP3SE50F484C2 is a Stratix III Enhanced family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 296 user I/Os, and 5,760,000 bits of embedded memory, housed in a 484-ball FineLine BGA (FC-FBGA) package. It is fabricated on a 65 nm process node, operates from a 1.1 V core supply, and targets high-performance DSP, communications, and signal-processing designs. What is a Stratix III Enhanced FPGA? The Stratix III E family is the high-performance variant of Altera's third-generation 65 nm FPGA line, tuned for DSP-rich designs that require abundant embedded multipliers, MLAB/M9K memory blocks, and rich transceivers or external memory interfaces. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs and ASSPs as reconfigurable digital silicon; they are widely used when design iteration, parallelism, or hardware-level DSP throughput is required. Key features include 1,900 Logic Array Blocks (LABs), 296 user I/O pins, embedded memory of 5,760,000 bits distributed in M9K blocks, dedicated 18x18 multipliers for DSP, and support for external memory interfaces including DDR3/DDR2/QDRII+/RLDRAM2. The device is offered in a commercial (C2) speed grade with the C2 indicating the specific performance tier, and the industrial-grade versions are also available within the family. Architecturally, Stratix III E uses Altera's adaptive logic module (ALM) structure that doubles register density per 6-input LUT compared to the previous generation. The 65 nm process and 1.1 V core voltage balance performance with dynamic power, while optional -2/-3/-4 speed grades allow designers to trade timing margin for power. The FC-FBGA-484 package provides a high-density, low-parasitic interconnect suitable for designs with high I/O utilization. Typical applications include high-speed serial backplane interfaces, software-defined radio, video processing pipelines, military/aerospace signal intelligence, ASIC prototyping, and high-performance DSP co-processing. The combination of 18x18 multipliers, MLAB/M9K memory, and abundant user I/O suits parallel compute, image processing, and protocol-bridging designs. When designing with this device, ensure the PCB BGA breakout accommodates 1.0 mm pitch routing, supply decoupling follows Altera's PowerPlay guidance, and configuration is via JTAG or AS configuration schemes. Stratix III E is now in last-time-buy status in many channels; verify lifecycle before committing to new designs.
EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel
The Intel (Altera) EP3SE50F484C2G is a Stratix III E family Field-Programmable Gate Array (FPGA) integrating 47,500 logic elements, 1,900 LABs/CLBs, and 5,760,000 bits of embedded RAM in a 484-ball FineLine BGA (FCBGA) package. It supports 296 user I/O pins and operates from a 0.86 V to 1.15 V core supply, making it suitable for high-density digital signal processing, high-speed serial connectivity, and embedded processor subsystems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacture by a customer-supplied bitstream. Stratix III E sits in the hierarchy of programmable logic: FPGA -> programmable logic device -> programmable logic IC -> semiconductor. Compared to CPLDs, FPGAs offer far higher logic density, embedded memory blocks, dedicated DSP blocks, and high-speed transceivers; the Stratix III E family is Intel/Altera's high-performance transceiver-equipped node targeting ASIC-prototype and high-throughput wired-communications designs. Key features include 47,500 logic elements (~equivalent to ~95K ASIC gates per industry convention), 5,760 Kbit embedded RAM (~720 KB), 296 user I/O, support for DDR/DDR2/DDR3 memory interfaces with dedicated PHY blocks, and integrated multi-gigabit transceivers on selected package pins. The FCBGA-484 package exposes 16 transceiver channels in this variant, enabling protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet. Architecturally, Stratix III E uses a 40 nm low-power process and an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, providing higher effective logic density than 4-input LUT architectures. The device includes a hard memory controller, embedded DSP blocks (variable-precision multipliers), and partial reconfiguration support, allowing designers to time-multiplex logic regions for power and area savings. Typical applications include ASIC prototyping, high-speed data acquisition cards, software-defined radio baseband, video broadcast infrastructure, and military/aerospace signal processing. The 484-FBGA package is preferred for board designs where line-card real estate is limited but high I/O count and transceiver density are required. When designing, verify transceiver channel availability against the FCBGA-484 ballout (this variant exposes 16 transceivers), confirm core decoupling per the Intel Stratix III pin connection guidelines, and use the Quartus II (or current Quartus Prime) tool chain for synthesis, place-and-route, and timing closure. This page synthesizes current distributor pricing, drop-in alternative FPGAs from the same Stratix III family, and practical design notes that complement the official Intel Stratix III device handbook.
EP3SE50F484C2N - Stratix III E FPGA 47.5K LE | 484-FCBGA | Intel
The Intel (Altera) EP3SE50F484C2N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 2,304 Kbits of embedded memory, and 296 user I/Os in a 484-ball FineLine BGA (FCBGA) package. Manufactured on a 65 nm low-k process, it operates from a 0.9 V/1.1 V core supply with an internal frequency up to 600 MHz. What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit above microcontrollers and ASICs in the design hierarchy: microcontrollers execute firmware sequentially, ASICs commit a design to silicon for volume, while FPGAs offer hardware-reconfigurable parallelism for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is part of Intel's high-performance FPGA portfolio targeting signal processing, high-speed serial connectivity, and embedded processing. Key features include 47,500 logic elements, 264 DSP blocks (18x18 multipliers) for high-throughput arithmetic, 2,304 Kbits of embedded RAM (M9K/M144K blocks), and up to 8 embedded transceivers at 3.125 Gbps depending on package. The device also integrates hard memory controllers for DDR/DDR2/DDR3 and supports up to 304 user I/Os in the F484 package variant. Power is managed through programmable power technology that dynamically scales voltage and frequency per logic block. Architecturally, the Stratix III E uses ALM (Adaptive Logic Module) logic elements, a MultiTrack interconnect for predictable routing delays, and dedicated PLL blocks for clock synthesis. The 65 nm process and on-die decoupling deliver low core voltage operation, making the device suitable for power-sensitive high-performance designs. Typical applications include high-speed digital signal processing in radar and baseband, telecom line cards with CPRI/OBSAI fronthaul, ASIC prototyping for ASIC emulation, video broadcast processing, and test & measurement instrumentation. The 484-ball FCBGA provides the high pin density needed for wide memory interfaces and multiple transceiver channels on a single board. Design consideration: Stratix III E devices require Intel Quartus II software for design entry, synthesis, place-and-route, and timing closure. Plan for a multi-rail power supply with proper sequencing and sufficient decoupling to meet the device's low-voltage core requirements.
EP3SE50F484C3 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera
The Intel / Altera EP3SE50F484C3 is a high-density Stratix III E FPGA with 47,500 logic elements, 296 user I/Os, and 5,760 Kbits of embedded memory, housed in a 484-ball FineLine BGA package. It is built on TSMC's 40 nm process and is positioned as a low-power, high-performance mid-range member of the Stratix III Enhanced family, suitable for ASIC prototyping, high-speed DSP pipelines, and high-bandwidth interface bridging. The C3 speed grade with a 0C to 85C commercial temperature range targets cost-sensitive applications that do not require industrial-grade screening. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic through a programmable fabric of logic elements (LEs), embedded memory blocks, DSP blocks, and a programmable interconnect network. FPGAs occupy a unique position between general-purpose processors (CPUs/MCUs) and fixed-function ASICs - more flexible than an ASIC but with deterministic latency and much higher parallel throughput than a microcontroller. The Stratix III E family specifically emphasizes high logic density and DSP performance at lower static power than the prior Stratix II generation, making it well-suited for compute-intensive applications in wireless, video processing, and test equipment. Key features of the EP3SE50F484C3 include up to 800 MHz internal operation, 19 of the 24 available high-speed transceivers supported by the die (package-dependent), dedicated hardware multipliers and DSP blocks, and TriMatrix embedded memory supporting true dual-port RAM, simple dual-port RAM, and shift-register configurations. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. The architecture uses an 8-input adaptive logic module (ALM) that combines the flexibility of LUT-based logic with arithmetic carry chains, allowing designers to map legacy 4-input LUT designs efficiently while gaining extra logic capacity for wide datapath functions. MultiTrack interconnect and routing switches are tuned to minimize congestion at high utilization. Typical applications include ASIC prototyping for verification of multi-million-gate designs, high-speed image processing pipelines, wireless baseband processing, and bridging between high-speed serial protocols. The 296 user I/Os and abundant LVDS pairs make the device especially strong for parallel data acquisition cards and high-resolution video frame grabbers. When designing with this device, consider a proper power-sequencing strategy for core and I/O supplies, sufficient decoupling near each power pin, and use of Altera's Quartus II design software (or compatible third-party tools) for synthesis, place-and-route, and timing closure. Thermal management must account for the worst-case junction temperature under maximum toggle rate. This page synthesizes distributor pricing, identical-footprint alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams make a faster, more informed decision on this legacy Stratix III E part.
EP3SE50F484C3G - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel
The Intel (Altera) EP3SE50F484C3G is a high-density Stratix III E Field-Programmable Gate Array with 47,500 logic elements, 5,760,000 bits of embedded memory, and 296 user I/O pins, housed in a 484-ball FineLine BGA (FCBGA) package. The "C3G" speed grade denotes a commercial-temperature 3rd-speed-bin device optimized for moderate timing closure with low power consumption. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacturing to implement custom digital functions. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs (lower NRE cost, higher unit cost) and microcontroller/DSP cores (lower flexibility). The Stratix III family belongs to the high-performance tier, adding dedicated DSP blocks, high-speed transceivers, and large on-chip RAM to the basic FPGA fabric. Key features of the EP3SE50F484C3G include 47.5K adaptive logic modules (ALMs), 2,304 Kbits of M9K memory and 1,888 Kbits of M144K block memory, up to 296 user I/O pins, 384 18x18 multipliers, and 4 PLLs supporting multiple clock domains. Programmable Power Technology allows unused logic to be disabled, reducing static power by up to 50% versus previous generations. The Stratix III E family uses TSMC's 65 nm low-power process with a 1.1V core, achieving clock rates above 500 MHz in pipelined DSP designs. The 484-ball FCBGA package is wire-bond, supports 1.0 mm ball pitch, and provides multiple high-speed serial transceiver lanes (model-dependent). Configuration is supported through JTAG, passive serial, fast passive parallel, and dedicated configuration pins. Typical applications include high-performance DSP for wireless baseband, radar and beamforming, ASIC prototyping and emulation, high-speed packet processing in networking line cards, video broadcast and image processing pipelines, and military/aerospace signal processing. The wide parallel I/O count makes the EP3SE50 suitable for memory-rich data-acquisition systems where the 5.76 Mbit embedded RAM can buffer multiple video frames. When designing with the EP3SE50F484C3G, allocate at least eight layers for PCB routing to escape the 1.0 mm-pitch BGA cleanly. Use Altera's Quartus II design suite (version 13.0 or earlier for full Stratix III support) for synthesis, place-and-route, and power analysis. Engineers migrating to newer Stratix V/10 families should plan a re-validation cycle, as the Stratix III is in its final lifecycle phase. This page consolidates distributor pricing, packaging details, drop-in same-package alternatives, and reference designs that complement, but do not replace, the official Intel Stratix III Device Handbook and per-pin datasheets.
EP3SE50F484C3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
The Intel EP3SE50F484C3N is a Stratix III E family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 2,304 Kbits of embedded memory, and 296 user I/Os, housed in a 484-ball FineLine Ball-Grid Array (FBGA) package. It is built on a TSMC 40 nm low-power process and operates with internal logic frequencies up to 717 MHz (per distributor listings) or 800 MHz (per DigChip), with transceiver rates that historically extend to 6.375 Gbps on Stratix III GT variants. An FPGA is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. The Stratix III E family is positioned in the high-performance tier of Intel's (formerly Altera) mid-2000s/early-2010s programmable logic portfolio, targeting ASIC-prototype, signal-processing, and high-bandwidth telecom applications. Within the broader taxonomy, this part sits at: FPGA -> programmable logic device -> ASIC alternative -> semiconductor IC. Key features include 1,900 Logic Array Blocks (LABs), Adaptive Logic Modules (ALMs) with a register-rich architecture, MultiTrack interconnect for predictable timing closure, and dedicated DSP blocks and TriMatrix memory blocks. The device also includes high-speed serial transceivers for chip-to-chip and backplane serial links, along with embedded hard IP controllers such as PCIe, DDR, and Ethernet MACs. The 484-ball FBGA package supports the high pin-count needed for 296 user I/Os plus dedicated configuration, clock, and transceiver pins. Architecturally, Stratix III E uses a programmable-power technology with logic regions that can be set to high-performance or low-power modes, allowing designers to trade timing margin for dynamic power consumption. The ALM structure (eight inputs per ALM, two outputs) provides higher logic utilization than the older 4-input LUT architecture, while the MultiTrack interconnect offers rows, columns, and direct-link paths for deterministic routing delays. Configuration is via the standard passive-serial, fast passive-parallel, fast active-serial, or JTAG modes using Altera/Intel Quartus II design software. Typical applications include high-performance ASIC prototyping, DSP pipelines (radar, medical imaging, software-defined radio), high-throughput data acquisition, broadcast video processing, and 10G/40G telecom backplanes. The combination of DSP blocks, transceivers, and on-chip memory makes it well-suited for real-time baseband processing in wireless base stations. When designing with this device, use the latest Quartus II software version that supports Stratix III (typically Quartus II v13.1 or the Intel Cyclone/Stratix support add-on) and validate timing closure with the TimeQuest timing analyzer. PCB layout for a 484-ball 1.0 mm-pitch FBGA demands microvia stack-up and 50 ohm controlled-impedance routing on high-speed transceiver traces. This page synthesizes distributor pricing, cross-brand drop-in equivalents from within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel
Intel EP3SE50F484C4 is a Stratix III E family field-programmable gate array (FPGA) delivering 47,500 logic elements, 5,760 Kbits of embedded memory, and 296 user I/Os in a 484-ball fine-pitch BGA (FBGA-484, FCBGA) package. The device combines high logic density with 8.5 Gbps transceiver capability and dedicated DSP blocks, targeting performance-critical digital signal processing, telecommunications, and ASIC-prototyping applications. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device containing configurable logic blocks (XIbs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured after manufacturing, enabling rapid prototyping, in-field upgrades, and low-volume production runs. Key features of the EP3SE50F484C4 include 47,500 logic elements, 5,760 Kbits embedded memory (M9K/M144K TriMatrix blocks), 384 18x18 multipliers, eight 8.5 Gbps transceivers, and 296 user I/Os. The device supports DDR3 memory interfaces up to 800 MHz memory clock and integrates eight fractional PLLs for precise clock synthesis. Operating from 0.85V core supply with 0.9V VCC, the Stratix III E process minimizes dynamic power. Architecturally, Stratix III E FPGAs use a logic-element structure with 8-input adaptive logic modules (ALMs), allowing up to 1.7x the logic capacity of prior generations. Each ALM contains two adaptive LUTs, two dedicated adders, and shared arithmetic chains, ideal for DSP pipelines. The MultiTrack interconnect fabric provides deterministic timing with low skew across long routing distances. Typical applications include 40G/100G Ethernet line cards, wireless baseband processing, high-speed digital signal processing (software-defined radio, radar, medical imaging), ASIC prototyping, and high-performance computing accelerators. The combination of high logic density and 8.5 Gbps transceivers makes the EP3SE50F484C4 especially suited to wireline communication infrastructure and high-bandwidth signal acquisition. When designing with this FPGA, ensure proper power-rail sequencing (3.3V then 1.0V/0.85V core), use Intel's Quartus II design suite (Stratix III device support), and respect thermal design power (TDP) budgets. The FBGA-484 package requires careful PCB layout with controlled-impedance traces for transceiver channels and adequate decoupling to manage simultaneous switching noise (SSN) on the 296 user I/Os.
EP3SE50F484C4G - 47,500 LE FPGA | Intel | Digital Systems
Intel EP3SE50F484C4G is a Stratix III E field-programmable gate array with 47,500 logic elements, 19,000 adaptive logic modules, 5.49 Mbit embedded memory, and 296 I/O in a 484-ball FCBGA package. The verified operating supply voltage is 1.1 V, while its commercial temperature range spans 0 °C to +85 °C. This combination places the device in Intel's high-density FPGA hierarchy, between programmable logic and system-level digital integration. Engineers can use it for datapaths, control logic, protocol processing, and other designs requiring configurable hardware and substantial parallel I/O. A field-programmable gate array, or FPGA, is a semiconductor device containing configurable logic blocks, programmable interconnects, memory resources, and I/O elements. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The hierarchy is FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Stratix III E devices combine programmable fabric with embedded resources, allowing engineers to implement parallel processing and changing interfaces without requiring a custom mask set. Their configuration flexibility is especially useful when algorithms, protocols, or system requirements are still evolving. The EP3SE50F484C4G provides 47,500 logic elements, 19,000 adaptive logic modules, 5.49 Mbit embedded memory, and 296 I/O. It operates from a 1.1 V supply and is specified from 0 °C to +85 °C. The high logic capacity supports complex control and data-processing functions, while 296 I/O provide many connections for external memories, converters, processors, and high-speed interfaces. The package is identified as 484-BBGA, FCBGA and is suitable for surface-mount assembly. Its architecture is built around programmable adaptive logic modules connected by configurable routing. Embedded memory supports data buffering, register files, lookup tables, packet storage, and other localized state functions. The FPGA fabric can implement parallel datapaths and deterministic control logic, but power, timing, I/O banking, configuration, signal integrity, and pin assignment must be evaluated in the target design. The 1.1 V operating supply also requires compatible voltage regulation and power sequencing. Typical applications include industrial automation controllers, communications equipment, digital signal processing, test and measurement systems, networking equipment, and medical monitoring hardware. In these systems, the 47,500 logic elements can implement multiple control and processing blocks, while 296 I/O can connect field buses, memory, converters, and management interfaces. The commercial +85 °C maximum is suitable for controlled commercial and industrial environments, but it does not establish an extended-temperature or automotive qualification. The principal design trade-off is that an FPGA adds configuration complexity and requires a supported design flow, power analysis, timing closure, and careful PCB implementation. A 484-ball FCBGA also demands advanced assembly and controlled routing. Designers should verify unused-pin behavior, configuration circuitry, I/O standards, memory implementation constraints, and thermal performance against the manufacturer documentation before release. This page combines verified distributor specifications, sourcing context, package-aware comparisons, and practical engineering notes. Only exact EP3SE50F484C4G values are presented as confirmed; unprovided electrical, timing, compliance, and alternative-part details are not inferred.
EP3SE50F484C4L - 47.5K LE Stratix III E FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3SE50F484C4L is a high-density Stratix III E FPGA with 47,500 logic elements, 1,900 LABs (Logic Array Blocks), and 296 user I/Os in a 484-ball FC-FBGA package. The -4 speed grade targets performance-oriented designs, the 'C' prefix indicates a commercial temperature grade of 0°C to +85°C, and the 'L' suffix denotes a lead-free finish. Per the Stratix III Device Handbook, the device is built on TSMC's 65nm process and supports up to 5,760 Kbits of embedded memory and 384 (18x18) hardware multipliers. What is a Stratix III FPGA? Stratix III is Intel's third-generation 40nm/65nm high-performance FPGA family targeted at ASIC prototyping, high-speed DSP, and high-bandwidth I/O applications. Stratix III E devices specifically emphasize logic density, memory, and DSP resources, while Stratix III GX variants add transceivers. Within the Stratix family hierarchy, Stratix III sits between Stratix II and Stratix IV/V, representing a programmable-logic platform rather than a fixed-function ASIC. Key features of the EP3SE50F484C4L include 47,500 logic elements, 1,900 LABs, 384 embedded 18x18 multipliers, 4.4 Mbits of MLAB memory plus dedicated M9K/M144K block memory, 12 PLLs, and 296 maximum user I/Os. The device supports high-performance external memory interfaces (DDR3, DDR2, QDRII+, RLDRAM2) via soft memory controllers, with a typical core voltage of 0.9V and supported I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. Architecturally, the EP3SE50F484C4L uses the adaptive logic module (ALM) introduced in Stratix III, providing 8-input fracturable look-up tables that improve effective logic utilization versus older 4-LUT architectures. Programmable Power Technology allows unused logic, memory, and DSP blocks to be disabled at runtime, reducing static power by up to 50% compared with Stratix II in equivalent designs. Typical applications include ASIC prototyping and emulation platforms, high-performance DSP (radar, medical imaging, software-defined radio), high-speed serial protocol bridging, video broadcast processing, and industrial test/measurement instrumentation. Designers often pair the part with external DDR3 memory and a high-speed ADC/DAC front end. When designing with this device, validate the Quartus II / Quartus Prime fitter results carefully because the -4 speed grade with 484-ball FC-FBGA cooling envelope can drive junction temperatures to the upper limit of the 0°C to +85°C commercial grade. Plan thermal copper pours and use Altera's PowerPlay early power estimator before layout finalization. This page synthesizes distributor pricing, drop-in alternative MPNs (same 484-ball FC-FBGA package), and practical Quartus design notes not consolidated in the manufacturer datasheet.
EP3SE50F484C4LG - Stratix III E FPGA 47.5K LE | Intel | 484-FCBGA
The Intel (formerly Altera) EP3SE50F484C4LG is a Stratix® III E family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 2,886 Kbits of embedded memory (M9K + M144K blocks), and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package at 23x23 mm. It is built on a 40 nm TSMC process and targets high-performance digital signal processing, parallel processing, and high-bandwidth data-path applications where the Stratix III transceiver-rich (E) variant delivers superior DSP throughput compared with the logic-only Stratix III GX variants. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/ALMs) connected by a programmable interconnect fabric, allowing hardware designers to program arbitrary digital logic, memory, and DSP functions after manufacture. FPGAs sit within the broader taxonomy: programmable logic device (PLD) → FPGA → high-end SRAM-based FPGA → DSP-optimized FPGA. Stratix III E parts are positioned above the Cyclone family for cost-optimized designs and below the Stratix V family for newer 28 nm designs, making them the workhorse mid-range DSP FPGA of the late-2000s generation. Key specifications include 19,000 ALMs, 47,500 LEs, 5.49 Mbits total embedded memory, 384 18x18-bit hardware multipliers, 4 PLLs, and a maximum user I/O count of 296. The device operates from a 1.1 V core supply, supports I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and offers a -4 speed grade with the C4 commercial temperature grade (0°C to +85°C). The L suffix indicates a lead-free, RoHS-compliant package finish. Architecturally, the Stratix III E family leverages a programmable-power technology that allows unused logic and interconnect to enter a low-power state, dramatically reducing static power compared with prior Stratix II designs. The combination of high memory-to-logic ratio and abundant dedicated multipliers makes it well-suited to video processing, software-defined radio, and high-speed instrumentation where parallel DSP pipelines are required. Typical applications include wireline telecom baseband processing, software-defined radio (SDR) baseband, video broadcast encoding/decoding, high-speed serial protocol bridging, ASIC prototyping, and high-performance computing accelerators. Designers targeting Stratix III typically pair the device with external DDR2/DDR3 memory controllers and high-speed LVDS links for data acquisition. When designing with the EP3SE50F484C4LG, plan for an Altera/Intel Quartus II design-flow license (version 11.0 or later), use the FCBGA-484 land pattern from the package specification document, and provide a minimum of 8-layer PCB stackup with continuous ground planes under the BGA to manage simultaneous-switching-noise (SSN) on the 296 I/O pins. This page synthesizes distributor pricing, same-brand drop-in speed/temperature/package alternatives, and practical PCB-thermal-design notes not found on a single manufacturer datasheet page.
EP3SE50F484C4LN - Stratix III E FPGA, 47.5K LEs, 484-FBGA | Intel
The Intel EP3SE50F484C4LN is a Stratix III E field-programmable gate array (FPGA) fabricated in a 40 nm low-power CMOS process, delivering 47,500 logic elements, 2,304 Kbits of embedded memory, and 296 user I/Os in a 484-ball FineLine BGA (FCBGA) package. The device integrates 1900 LABs/CLBs, 384 18x18 multipliers, and high-speed transceivers supporting up to 6.375 Gbps, making it suitable for high-bandwidth signal-processing applications. Operating from a 0.85 V to 1.1 V core supply with industrial temperature grade, it targets performance-critical systems where power efficiency and density matter. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O serializers can be programmed by the end user to implement custom digital functions. FPGAs sit between fixed-function ASICs (highest performance, highest NRE) and microcontrollers (programmable software, lower throughput), occupying the high-throughput parallel-processing niche. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device within the digital IC category, and the Stratix III family specifically targets high-end signal processing and protocol bridging. The 'E' suffix denotes the enhanced-logic variant with lower static power than the base Stratix III family, and the 'L' suffix indicates a lead-free, RoHS-compliant package. Key features include 47,500 logic elements arranged in 1900 LABs, 2,304 Kbits of embedded RAM organized as M9K/M144K blocks, 384 hard 18x18 multipliers for DSP, and up to 12 transceivers at 6.375 Gbps per channel. The device supports DDR3 interfaces up to 800 MHz memory clock via dedicated PHY blocks, and offers 8 PLLs for clock management. Configuration is supported through fast passive parallel (FPP), active serial (AS), or JTAG modes using industry-standard configuration devices. The EP3SE50F484C4LN's architecture combines the Quartus II design-software toolchain, adaptive logic modules (ALMs) with 8-input fracturable look-up tables, and per-channel transceiver equalization, enabling it to bridge parallel processing with multi-gigabit serial links in a single chip. Compared to the older Stratix II, the Stratix III E cuts dynamic power by approximately 50% at the same performance level thanks to the 40 nm process and programmable power technology. Typical applications include high-speed data-acquisition front-ends, software-defined radio (SDR) baseband processing, broadcast video processing, medical imaging, and high-end test and measurement equipment. Designers also deploy Stratix III E in radar signal-processing arrays and telecom protocol bridging where the combination of DSP density and high-speed serial I/O is critical. When designing with the EP3SE50F484C4LN, ensure proper decoupling on all core and I/O supply rails (typically 1.0 V VCCHIP, 1.5 V/1.8 V VCCPD, and 2.5 V/3.3 V VCCIO), use 1 oz copper pours for ground, and follow Intel's PCB-layout guidelines for transceivers to maintain signal integrity at multi-gigabit data rates. The device is sensitive to power-rail sequencing - consult the datasheet for the required power-up order to avoid latch-up. This page synthesizes distributor pricing, Stratix III E family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, enabling engineers to compare options and make sourcing decisions in a single view.
EP3SE50F484C4N - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera
The Altera (Intel) EP3SE50F484C4N is a high-performance Stratix III E family Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 296 user I/Os, and 5,760 Kbits of embedded memory, housed in a 484-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm process technology with a 1.1 V core voltage, the device delivers up to 450 MHz maximum operating frequency with 1,900 Logic Array Blocks (LABs). An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which also include SPLDs and CPLDs. Compared to ASICs, FPGAs offer rapid prototyping and in-field reconfigurability, while modern high-end FPGAs like the Stratix III E integrate hard IP cores (transceivers, memory controllers, DSP blocks) that compete with mid-range DSP and ASSP devices in performance-per-watt. The Stratix III E family specifically targets high-speed parallel processing, telecom backplanes, and signal-processing applications. Key features of the EP3SE50F484C4N include 47,500 logic elements, 5,760 Kbits embedded RAM, 1,900 LABs, 296 user I/O pins, and 4 PLLs for clock management. The device integrates dedicated DSP blocks optimized for high-speed arithmetic operations and supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL for flexible board-level integration. Programmable via JTAG and supported by the Quartus II design suite, the device offers robust configuration options. Architecturally, the Stratix III E FPGA uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables (LUTs), enabling efficient implementation of arbitrary logic functions. The 65 nm low-k dielectric process reduces power consumption by up to 50% compared to the previous Stratix II generation while maintaining timing margin. The device supports partial reconfiguration and dynamic phase alignment for clock domains. Typical applications include high-performance digital signal processing (DSP), telecom baseband processing, high-speed serial protocol bridges, military radar and signal intelligence systems, ASIC prototyping, and high-throughput data acquisition. The 484-ball FC-FBGA package supports board densities required for industrial and aerospace signal-processing cards. Designers should note the 484-ball BGA package requires careful PCB layout with microvia or via-in-pad technology, controlled-impedance routing, and matched-length differential pairs for LVDS interfaces. Power-rail decoupling must follow the Stratix III E PowerPlay early-power estimator guidelines to manage inrush current during configuration. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the Stratix III E FPGA, providing engineering context not consolidated in the manufacturer datasheet.
EP3SE50F484I3 - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SE50F484I3 is a Stratix III E family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 296 user I/Os, and 5,760 Kbits of embedded memory in a 484-ball FineLine BGA (FCBGA) package. Built on TSMC's 65 nm low-power process, this FPGA operates at a core voltage of 1.1 V and supports transceiver-rich designs targeting high-speed serial I/O and DSP-intensive applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the integrated circuit (IC) hierarchy as high-density digital ICs. Stratix III devices specifically target high-performance, low-power designs requiring hundreds of thousands of logic gates and multi-gigabit transceivers for wired communications, signal processing, and ASIC prototyping. The EP3SE50F484I3 variant carries the 'E' (Enhanced) feature set and the 'I3' industrial temperature grade, supporting -40 °C to +100 °C ambient operation. Key features include 47,500 Logic Elements (LEs), 1,900 LABs, 5,760 Kbits of embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers supporting multi-gigabit serial protocols, and programmable I/O standards including LVDS, LVCMOS, LVTTL, HSTL, and SSTL. The device also integrates hard memory controllers, PLLs for clock management, and configuration support via JTAG, passive serial, or fast passive parallel modes. The Stratix III E architecture combines the Adaptive Logic Module (ALM) with eight-input fracturable look-up tables, delivering higher effective logic density than previous generations. The 65 nm process technology balances performance and static power consumption, while the 'I3' speed/temperature grade optimizes the device for industrial temperature ranges and -3 speed-bin timing closure, offering higher Fmax than the C4/C3 commercial grades. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, SRIO), wireless baseband processing, software-defined radio (SDR), video broadcast infrastructure, radar and signal processing systems, and ASIC prototyping platforms. Its combination of logic density, embedded transceivers, and DSP resources makes it well suited for prototyping and low-volume production designs. When designing with this device, ensure the PCB footprint is laid out for the 484-ball FCBGA with 1.0 mm ball pitch, and verify that the FPGA configuration mode (AS, PS, FPP, JTAG) is properly strapped. The Stratix III E family requires careful signal-integrity analysis for multi-gigabit transceivers and a robust power-delivery network across 0.9 V, 1.1 V, 1.8 V, 2.5 V, and 3.3 V rails. This page synthesizes distributor pricing, Stratix III E drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
EP3SE50F484I3G - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
The Intel EP3SE50F484I3G is a high-density, high-performance Stratix III E family Field Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Chip-Scale BGA (FCBGA) package. It integrates 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 5.49 Mbits of embedded memory, with 296 user I/O pins and an operating supply voltage of 1.1 V. The device is specified over the industrial -40C to +100C temperature range and is targeted at high-end digital signal processing, ASIC prototyping, and communications infrastructure designs. A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose interconnect, logic fabric, and I/O behaviour are configured by a customer-supplied configuration bitstream after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic devices -> integrated circuits -> semiconductors, and the Stratix III E family is Intel's (formerly Altera's) high-performance 65 nm node targeting DSP, memory-rich, and high-speed transceiver applications. Key features include 47,500 logic elements / 19,000 ALMs, 5.49 Mbits of embedded block RAM (e.g., M9K blocks), support for up to 296 user I/Os, and a 1.1 V core supply. The Stratix III E device integrates dedicated DSP blocks, embedded memory, and high-speed serial transceiver support (via separate GX variants), making it well suited to signal-processing pipelines. The FCBGA-484 package offers a fine-pitch, low-inductance interconnect for high-speed parallel interfaces. Architecturally, the device is built on a 65 nm low-power CMOS process and uses logic-array-block (LAB) tiling with adaptive logic modules that combine fracturable LUTs, dedicated carry chains, and register files. Configuration is stored in SRAM cells, allowing unlimited re-programmability in the field. The Stratix III E family also adds enhanced SEU mitigation features (CRC, parity, scrubbing IP), which is critical for telecom and aerospace applications. Typical applications include high-throughput DSP (radar, software-defined radio, video broadcast processing), ASIC prototyping and emulation, high-speed networking line cards, test and measurement back-end processing, and military/aerospace signal processing. The Stratix III E family is also frequently used in medical imaging front-ends and high-end industrial imaging systems where low-latency parallel processing is required. When designing with this device, verify power-rail sequencing, decoupling, and thermal dissipation early. The 484-ball FCBGA package has specific via-in-pad and thermal via requirements, and the Quartus II / Quartus Prime toolchain must be used for synthesis, place-and-route, and timing closure. PCB stack-up should be tuned for the LVDS and DDR memory interface rates used. This page synthesizes distributor pricing across DigiKey, Mouser, and authorized brokers, drop-in same-package alternatives drawn from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.