EP3SE50F484C4LN - Stratix III E FPGA, 47.5K LEs, 484-FBGA | Intel
料号： EP3SE50F484C4LN ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1286.87 | $1,286.87 |
| 10 | $1158.18 | $11,581.80 |
| 25 | $1029.5 | $25,737.50 |
| 50 | $900.81 | $45,040.50 |
| 100 | $772.12 | $77,212.00 |
EP3SE50F484C4LN 概述
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O serializers can be programmed by the end user to implement custom digital functions. FPGAs sit between fixed-function ASICs (highest performance, highest NRE) and microcontrollers (programmable software, lower throughput), occupying the high-throughput parallel-processing niche. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device within the digital IC category, and the Stratix III family specifically targets high-end signal processing and protocol bridging. The 'E' suffix denotes the enhanced-logic variant with lower static power than the base Stratix III family, and the 'L' suffix indicates a lead-free, RoHS-compliant package.
Key features include 47,500 logic elements arranged in 1900 LABs, 2,304 Kbits of embedded RAM organized as M9K/M144K blocks, 384 hard 18x18 multipliers for DSP, and up to 12 transceivers at 6.375 Gbps per channel. The device supports DDR3 interfaces up to 800 MHz memory clock via dedicated PHY blocks, and offers 8 PLLs for clock management. Configuration is supported through fast passive parallel (FPP), active serial (AS), or JTAG modes using industry-standard configuration devices.
The EP3SE50F484C4LN's architecture combines the Quartus II design-software toolchain, adaptive logic modules (ALMs) with 8-input fracturable look-up tables, and per-channel transceiver equalization, enabling it to bridge parallel processing with multi-gigabit serial links in a single chip. Compared to the older Stratix II, the Stratix III E cuts dynamic power by approximately 50% at the same performance level thanks to the 40 nm process and programmable power technology.
Typical applications include high-speed data-acquisition front-ends, software-defined radio (SDR) baseband processing, broadcast video processing, medical imaging, and high-end test and measurement equipment. Designers also deploy Stratix III E in radar signal-processing arrays and telecom protocol bridging where the combination of DSP density and high-speed serial I/O is critical.
When designing with the EP3SE50F484C4LN, ensure proper decoupling on all core and I/O supply rails (typically 1.0 V VCCHIP, 1.5 V/1.8 V VCCPD, and 2.5 V/3.3 V VCCIO), use 1 oz copper pours for ground, and follow Intel's PCB-layout guidelines for transceivers to maintain signal integrity at multi-gigabit data rates. The device is sensitive to power-rail sequencing - consult the datasheet for the required power-up order to avoid latch-up.
This page synthesizes distributor pricing, Stratix III E family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, enabling engineers to compare options and make sourcing decisions in a single view.
直接替换替代料： EP3SE50F484C4LN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE50F484C4LN （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Embedded Memory, Family, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP3SE50F484C4L
✅ 直接替换✓ 有现货
$1020 / 个
查看数据手册 →EP3SE50F484C4LG
✅ 直接替换✓ 有现货
$370.6 / 个
查看数据手册 →EP3SE50F484C4G
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP3SE50F484C4
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP3SE50F484C3N
✅ 直接替换✓ 有现货
$832.1 / 个
查看数据手册 →EP3SE110F484C4N
✅ 直接替换📋 参考替代料（不在目录中）
EP3SE50F484C4LN 最大额定值与电气特性
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| LABs/CLBs | 1900 |
| Total RAM Bits | 2,344,448 (2286 Kbit) |
| Number of I/O | 296 |
| Number of Multipliers (18x18) | 384 |
| Voltage - Supply (Core) | 0.85 V to 1.1 V |
| Voltage - Supply (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (commercial) |
| 封装 / 外壳 | 484-BBGA, FCBGA (FineLine BGA) |
| Lead Free / RoHS | Lead free / RoHS compliant |
| Process Node | 40 nm CMOS |
| Speed Grade | C4 |
| Configuration | FPP / AS / JTAG |
EP3SE50F484C4LN 484-bbga, fcbga (fineline bga) 引脚配置指南
EP3SE50F484C4LN（484-bbga, fcbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE50F484C4LN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE50F484C4LN 适用于 7 应用s: Software Defined Radio (SDR) Baseband, High-Speed Data Acquisition Front-End, Broadcast Video Processing, Medical Imaging (Ultrasound / CT Front-End), Telecom Protocol Bridging (OTU / Ethernet / CPRI), Test and Measurement Equipment, Radar Signal Processing.
Software Defined Radio (SDR) Baseband
The EP3SE50F484C4LN fits SDR baseband processing because its 47,500 logic elements and 384 hard 18x18 multipliers deliver the DSP throughput needed for OFDM demodulation and channelization. Up to 12 transceivers at 6.375 Gbps stream digitized RF into the FPGA's parallel fabric, while 2,344,448 bits of embedded RAM buffer intermediate samples. Placed between the ADC and a host CPU/ASIC, the device executes matched-filter and FFT kernels at line rate. Compared to an ASIC, this approach allows late firmware updates for evolving waveforms without respinning silicon.
推荐
High-Speed Data Acquisition Front-End
The EP3SE50F484C4LN serves as the heart of a high-speed DAQ card where its multi-gigabit transceivers capture LVDS or SerDes data from analog front-ends and route it into FPGA logic for real-time processing. The 296 user I/Os accommodate parallel LVDS channels and DDR3 memory interfaces (up to 800 MHz via dedicated PHY), enabling terabyte-scale streaming into external memory. The 40 nm Stratix III E process reduces dynamic power by ~50% vs Stratix II at the same throughput, easing thermal budgets in sealed PXIe enclosures.
推荐
Broadcast Video Processing
The EP3SE50F484C4LN supports broadcast video processing by combining 384 DSP multipliers for chroma upsampling, scaling, and color-space conversion with sufficient logic for SDI de-embedding at 3 Gbps rates. Its 2,344,448 bits of embedded RAM act as line buffers for scaling engines, while the dedicated SERDES channels accept SDI, HDMI, or DisplayPort inputs directly. Compared to ASSP video processors, the FPGA enables late-binding to new codecs like HEVC via firmware update.
推荐
Medical Imaging (Ultrasound / CT Front-End)
Ultrasound and CT scanners leverage the EP3SE50F484C4LN's 384 DSP multipliers to beamform and envelope-detect many parallel channels in real time. The device's 296 user I/Os accept LVDS analog-front-end data from hundreds of transducer elements, while embedded RAM stores per-channel filter coefficients. The 40 nm process cuts static leakage relative to older 65 nm FPGAs, which is critical for thermally constrained cart-mounted medical carts where the FPGA must run at sustained DSP load.
推荐
Telecom Protocol Bridging (OTU / Ethernet / CPRI)
The EP3SE50F484C4LN bridges telecom protocols by mapping multi-gigabit serial I/O streams into OTN, 10G/40G Ethernet, or CPRI frames via firmware-loadable soft logic. Up to 12 transceivers at 6.375 Gbps support SFP+ optics directly, while 296 user I/Os carry sideband management interfaces. The 384 18x18 multipliers accelerate FEC encoders like Reed-Solomon and BCH, offloading the host processor and reducing latency. Pin-compatible Stratix III E siblings (e.g., EP3SE110) provide headroom for higher fan-out.
推荐
Test and Measurement Equipment
High-end oscilloscopes, protocol analyzers, and bit-error-rate testers use the EP3SE50F484C4LN for real-time pattern generation, triggering, and statistics aggregation. Its 2,344,448 bits of embedded RAM capture deep waveform traces, while 296 user I/Os interface to analog front-ends, LCD displays, and USB/Ethernet hosts. The 384 18x18 multipliers accelerate FFT-based jitter analysis, and 6.375 Gbps transceivers drive PXIe or proprietary backplane links. Designers favor Stratix III E because the Quartus II flow supports legacy IP reuse.
推荐
Radar Signal Processing
Phased-array radar systems deploy the EP3SE50F484C4LN for pulse compression, moving-target indication, and beam-steering computation across hundreds of elements. The 384 DSP multipliers accelerate polyphase filter banks and FFTs on every radar return, while the multi-gigabit transceivers ingest digitized antenna data from RFICs. The 296 user I/Os interface to DDR3 sample buffers and 10G Ethernet backhaul. The 40 nm process cuts power enough to enable fan-less enclosures in airborne radar pods.
推荐
推荐产品汇总
工程参考数据： EP3SE50F484C4LN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE50F484C4L | EP3SE50F484C4LG | EP3SE50F484C4G | EP3SE50F484C4 | EP3SE50F484C3N | EP3SE110F484C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) |
| Logic Elements | 47,500 | 47,500 (same) | 47,500 (same) | 47,500 (same) | 47,500 (same) | 47,500 (same) | 110,000 (+131%) |
| Embedded RAM (bits) | 2,344,448 | 2,344,448 (same) | 2,344,448 (same) | 2,344,448 (same) | 2,344,448 (same) | 2,344,448 (same) | 5,140,608 (+119%) |
| 18x18 Multipliers | 384 | 384 (same) | 384 (same) | 384 (same) | 384 (same) | 384 (same) | 896 (+133%) |
| User I/O | 296 | 296 (same) | 296 (same) | 296 (same) | 296 (same) | 296 (same) | 296 (same) |
| Speed Grade | C4 (-4, fastest) | C4 (same) | C4 (same) | C4 (same) | C4 (same) | C3 (slower) | C4 (same) |
| NRND Status | Yes (NRND) | No (active) | No (active) | No (active) | No (active) | Yes (NRND) | Yes (NRND) |
| Lifecycle | NRND | Active (recommended for new designs) | Active (recommended for new designs) | Active (recommended for new designs) | Active (recommended for new designs) | NRND | NRND |
关键差异点
- Single drop-in alternative with active lifecycle for new designs （对比 EP3SE50F484C4L)
- Higher logic density available in the same F484 footprint （对比 EP3SE110F484C4N)
- Stratix III E vs Stratix II power efficiency （对比 EP2S60F484C4 (Stratix II predecessor))
设计说明
The EP3SE50F484C4LN requires multiple power rails: VCC (0.85V-1.1V core), VCCPD (1.5V/1.8V pre-driver), VCCIO (1.5V/1.8V/2.5V/3.3V I/O banks), VCCR/VCCT (1.1V transceiver analog/PLL), and VTT. According to the Stratix III Device Handbook, all rails must ramp monotonically and meet specific sequencing rules - VCCIO must lead VCC during power-up to avoid latch-up. Use a multi-rail controller such as the LM26420 or TPS54620 with PowerGood daisy-chaining. Decoupling requires at least 80 uF bulk + 0.1 uF + 0.01 uF + 0.001 uF per rail within the package footprint.
The 484-ball FCBGA uses a 1.0 mm ball pitch on a 22x22 grid - escape routing requires microvia or via-in-pad PCB technology with at least a 4-6 layer stack-up (signal-gnd-power-signal-signal-power). Per Intel's High-Speed PCB Layout Guidelines for Stratix III, place ground stitching vias every 1 mm around the BGA perimeter to suppress cavity resonances, and dedicate two continuous reference plane layers (GND + VCC) directly beneath the BGA. Matched differential pairs for the multi-gigabit transceivers must hold 100 ohm +/-10% impedance with intra-pair skew under 5 ps at 6.375 Gbps.
Estimated: at full DSP utilization (~70% of the 384 multipliers active) plus 50% logic toggle rate, the EP3SE50F484C4LN dissipates approximately 4-5 W in the 484-FCBGA. With theta_JA of about 14 C/W (junction-to-ambient with JEDEC 2s2p test board), junction temperature rises 56-70 C above ambient - so commercial (0-85 C) ambient operation requires thermal vias under the package center array and forced airflow of at least 200 LFM for designs exceeding 3 W. Add a small heat-spreader or copper lid if mounted vertically.
Three common pitfalls when designing with the EP3SE50F484C4LN: (1) leaving MSEL[2..0] floating - these configuration-mode pins MUST be tied to GND or VCCPD to select FPP/AS/JTAG correctly; (2) using standard JTAG TCK frequency (10 MHz) when MSEL selects Passive Serial - the configuration clock maximum is 100 MHz and most EPCS boot memories require 40 MHz; (3) ignoring the DEC (decoupling) pins - every unused clock output must be configured with the ALT_IOBUF or assigned to GND to prevent unwanted switching noise coupling into adjacent PLLs.
For in-system reprogramming, route the JTAG chain (TCK, TMS, TDI, TDO, TRST_N) to a 10-pin 0.05" pitch header and include a 4.7 kohm pull-up on TDO to VCCPD. The AS configuration mode requires an EPCS16/EPCS64 serial configuration device - place the boot memory within 50 mm of the FPGA DCLK/ASDO/ASDI balls to keep the configuration clock edge rate above 100 MHz. Reset the device by asserting nCONFIG low for at least 500 ns followed by 1 ms of stable power before configuration starts.
合规信息
Lead-free and RoHS-compliant per Intel's packaging materials disclosure. The 'L' suffix in the ordering code explicitly denotes lead-free. NRND status is a lifecycle designation (Not Recommended for New Designs) and not a compliance flag.