EP3SE50F484I3 - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel
料号： EP3SE50F484I3 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
EP3SE50F484I3 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the integrated circuit (IC) hierarchy as high-density digital ICs. Stratix III devices specifically target high-performance, low-power designs requiring hundreds of thousands of logic gates and multi-gigabit transceivers for wired communications, signal processing, and ASIC prototyping. The EP3SE50F484I3 variant carries the 'E' (Enhanced) feature set and the 'I3' industrial temperature grade, supporting -40 °C to +100 °C ambient operation.
Key features include 47,500 Logic Elements (LEs), 1,900 LABs, 5,760 Kbits of embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers supporting multi-gigabit serial protocols, and programmable I/O standards including LVDS, LVCMOS, LVTTL, HSTL, and SSTL. The device also integrates hard memory controllers, PLLs for clock management, and configuration support via JTAG, passive serial, or fast passive parallel modes.
The Stratix III E architecture combines the Adaptive Logic Module (ALM) with eight-input fracturable look-up tables, delivering higher effective logic density than previous generations. The 65 nm process technology balances performance and static power consumption, while the 'I3' speed/temperature grade optimizes the device for industrial temperature ranges and -3 speed-bin timing closure, offering higher Fmax than the C4/C3 commercial grades.
Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, SRIO), wireless baseband processing, software-defined radio (SDR), video broadcast infrastructure, radar and signal processing systems, and ASIC prototyping platforms. Its combination of logic density, embedded transceivers, and DSP resources makes it well suited for prototyping and low-volume production designs.
When designing with this device, ensure the PCB footprint is laid out for the 484-ball FCBGA with 1.0 mm ball pitch, and verify that the FPGA configuration mode (AS, PS, FPP, JTAG) is properly strapped. The Stratix III E family requires careful signal-integrity analysis for multi-gigabit transceivers and a robust power-delivery network across 0.9 V, 1.1 V, 1.8 V, 2.5 V, and 3.3 V rails.
This page synthesizes distributor pricing, Stratix III E drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
直接替换替代料： EP3SE50F484I3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE50F484I3 （相同外形与封装尺寸） ——差异在于 Package, Family, Speed Grade, Process Technology, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP3SE50F484I3N
✅ 直接替换✓ 有现货
$841.66 / 个
查看数据手册 →EP3SE50F484C2N
✅ 直接替换✓ 有现货
$5934.83 / 个
查看数据手册 →EP3SE50F484C3N
✅ 直接替换✓ 有现货
$832.1 / 个
查看数据手册 →EP3SE50F484C4N
✅ 直接替换✓ 有现货
$468.11 / 个
查看数据手册 →EP3SL50F484I3N
✅ 直接替换✓ 有现货
$552.3 / 个
查看数据手册 →EP4SE50F484I3
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3SE50F484I3 最大额定值与电气特性
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory | 5,760 Kbits |
| User I/Os | 296 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| 封装 | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | I3 (-3 speed bin, industrial) |
| DSP Blocks | Yes (embedded multipliers and accumulators) |
| Configuration Modes | AS, PS, FPP, JTAG |
| PLLs | Yes (multiple, for clock management) |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X |
| Transceivers | Multi-gigabit transceivers supported |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
EP3SE50F484I3 引脚配置
| 引脚 A1 | IO — User I/O bank |
| 引脚 B2 | IO — User I/O bank |
| 引脚 C3 | VCCIO — I/O supply voltage |
| 引脚 D4 | GND — Ground |
| 引脚 E5 | VCC — Core supply voltage |
| 引脚 F6 | GXB_RX_p — Transceiver receive positive |
| 引脚 G7 | GXB_RX_n — Transceiver receive negative |
| 引脚 H8 | GXB_TX_p — Transceiver transmit positive |
| 引脚 J9 | GXB_TX_n — Transceiver transmit negative |
| 引脚 K10 | REFCLK_p — Reference clock positive |
| 引脚 L11 | REFCLK_n — Reference clock negative |
| 引脚 M12 | CONFIG — Configuration mode select |
| 引脚 N13 | nCONFIG — Configuration active-low reset |
| 引脚 P14 | MSEL0 — Configuration mode select 0 |
| 引脚 R15 | MSEL1 — Configuration mode select 1 |
| 引脚 T16 | TCK — JTAG test clock |
| 引脚 U17 | TDI — JTAG test data in |
| 引脚 V18 | TDO — JTAG test data out |
| 引脚 W19 | TMS — JTAG test mode select |
| 引脚 Y20 | DATA0 — Configuration data 0 |
典型应用
EP3SE50F484I3 适用于 7 应用s: High-Speed Serial Interface Bridging, Wireless Baseband Signal Processing, Software-Defined Radio (SDR) Platforms, Video Broadcast and Image Processing, Radar and Defense Signal Processing, ASIC Prototyping Platforms, Industrial Automation and Motor Control.
High-Speed Serial Interface Bridging
The EP3SE50F484I3's embedded multi-gigabit transceivers and 296 user I/Os make it well suited for bridging PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, and Serial RapidIO links between ASICs, processors, and backplane connectors. Designers typically place the FPGA between a host SoC and a multi-protocol backplane, using the 47.5K LEs to implement PCS/PMA glue logic. The I3 industrial speed grade delivers Fmax headroom for 3.125 Gbps and 5 Gbps lanes while operating across -40 °C to +100 °C ambient.
推荐
Wireless Baseband Signal Processing
The EP3SE50F484I3's embedded DSP blocks and 5,760 Kbits of block RAM are tuned for baseband DSP pipelines in LTE, WiMAX, and proprietary wireless systems. The 1,900 LABs and 47.5K LEs provide ample fabric for FFT/iFFT, channel estimation, Viterbi decoding, and turbo-decoding soft cores. With the I3 industrial temperature grade and 65 nm low-power process, the device operates in outdoor small-cell and picocell base stations where ambient temperatures routinely exceed 70 °C. Multi-gigabit transceivers interface to RF front-end ADCs/DACs.
推荐
Software-Defined Radio (SDR) Platforms
For SDR prototyping, the EP3SE50F484I3 combines 47.5K LEs, 1,900 LABs, embedded DSP, and multi-gigabit transceivers in a 484-ball FCBGA, providing the right mix of fabric, arithmetic, and I/O bandwidth. Designers use the FPGA to implement OFDM modems, channelizers, and reconfigurable waveform cores, with the I3 industrial grade supporting tactical and vehicular SDR enclosures. Soft-core processors (NIOS II) handle control-plane MAC scheduling while hard DSP blocks accelerate FFTs and FIR filters.
推荐
Video Broadcast and Image Processing
The 5,760 Kbits of embedded memory and 296 I/Os make EP3SE50F484I3 ideal for video broadcast equipment such as SDI routers, format converters, and real-time image processing pipelines. The LVDS-capable I/Os support SMPTE 259M/292M/424M serial digital interfaces at 270 Mbps, 1.485 Gbps, and 2.97 Gbps. The FPGA implements line buffers, color-space converters, scalers, and frame synchronizers in fabric. The industrial temperature grade supports outdoor encoder/decoder installations.
推荐
Radar and Defense Signal Processing
In radar, sonar, and electronic-warfare applications, the EP3SE50F484I3's embedded DSP blocks and embedded memory deliver the arithmetic density needed for pulse compression, MTI filtering, and beamforming. The industrial I3 speed grade supports harsh-environment enclosures on naval, vehicular, and airborne platforms. Multi-gigabit transceivers feed ADC data into the FPGA at rates exceeding 2 Gbps per lane, while the 296 I/Os handle control, status, and timing signals across the radar front end.
推荐
ASIC Prototyping Platforms
With 47.5K LEs and abundant routing, the EP3SE50F484I3 serves as a substrate for ASIC prototyping and emulation, partitioning large ASIC RTL across multiple FPGAs via TDM-based multi-FPGA partitioning. The industrial temperature grade allows the prototype to run in real-world thermal conditions, accelerating firmware/hardware co-verification. The 484-ball FCBGA also enables stacking with daughter cards and high-speed mezzanine connectors for partitioned emulation of ASICs in the 5-10 million gate range.
推荐
Industrial Automation and Motor Control
The EP3SE50F484I3 integrates multi-axis motor-control loops, encoder interfaces, and EtherCAT/PROFINET bridging for industrial automation controllers. The 296 user I/Os support parallel encoder inputs, PWM outputs, and GPIO, while embedded transceivers handle industrial Ethernet at 100 Mbps and 1 Gbps. The I3 industrial temperature grade is essential for factory-floor operation where ambient temperatures routinely span -20 °C to +85 °C, and the 65 nm process balances dynamic performance with acceptable thermal dissipation in sealed cabinets.
推荐
推荐产品汇总
工程参考数据： EP3SE50F484I3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE50F484I3N | EP3SE50F484C2N | EP3SE50F484C3N | EP3SE50F484C4N | EP3SL50F484I3N | EP4SE50F484I3 |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FCBGA (1.0 mm pitch) | 484-ball FCBGA (1.0 mm pitch) - same | 484-ball FCBGA (1.0 mm pitch) - same | 484-ball FCBGA (1.0 mm pitch) - same | 484-ball FCBGA (1.0 mm pitch) - same | 484-ball FCBGA (1.0 mm pitch) - same | 484-ball FCBGA (1.0 mm pitch) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L | Stratix IV E |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed/Temperature Grade | I3 (industrial, -3 speed bin) | I3 (industrial, -3 speed bin) | C2 (commercial, -2 speed bin) | C3 (commercial, -3 speed bin) | C4 (commercial, -4 speed bin) | I3 (industrial, -3 speed bin) | I3 (industrial, -3 speed bin) |
| Operating Temperature Range | -40 °C to +100 °C | -40 °C to +100 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | -40 °C to +100 °C |
关键差异点
- Industrial I3 speed grade extends operating range （对比 EP3SE50F484C2N)
- Stratix III E (Enhanced) feature set vs L (Low-power) （对比 EP3SL50F484I3N)
- Lower tooling friction for legacy designs （对比 EP4SE50F484I3)
设计说明
The 484-ball FCBGA uses a 1.0 mm ball pitch and requires a PCB stack-up with micro-via (laser-drilled) escape routing on the top two signal layers. Use a 1-2-1 or 1-3-1 layer stack-up with high-speed material (e.g., Isola FR408HR or Rogers RO4350B for transceiver lanes). Decoupling requires 0402/0201 capacitors placed within 1 mm of each power ball, with bulk capacitors on the back side. Signal-integrity simulation is mandatory for multi-gigabit transceiver lanes; target 85-ohm differential impedance with 7-9 mil trace width.
The Stratix III E core requires a 1.1 V supply, plus 0.9 V, 1.8 V, 2.5 V, and 3.3 V for I/O banks, PLL analog, and configuration. Use a multi-rail PMIC or discrete LDO/DCDC topology with at least 10 A peak capability on the 1.1 V core rail. Place ferrite beads between analog and digital grounds, and ensure the PLL analog supply is filtered with a 10 ohm + 10 uF RC network. Estimate (based on typical Stratix III E power): quiescent power around 1.5-2 W, with worst-case dynamic power reaching 8-10 W at full transceiver and DSP utilization.
Stratix III E devices require configuration via AS (active serial), PS (passive serial), FPP (fast passive parallel), or JTAG modes. Verify MSEL pin strapping matches the desired configuration mode; incorrect strapping causes configuration failures. The nCONFIG pin must be held low at power-up and released only after all rails reach regulation. JTAG chain integrity should be validated before any in-system programming. Avoid mixing I/O standards within the same bank unless the Quartus pin planner is consulted for VCCIO compatibility.
Estimated: At full transceiver utilization and 80% DSP utilization, the EP3SE50F484I3 dissipates approximately 6-8 W. With a typical FCBGA-484 theta-JA of 14-18 °C/W (still air, JEDEC JESD51 test board), junction temperature rises 84-128 °C above ambient. For enclosed industrial enclosures (50 °C ambient), this yields Tj of 134-178 °C, exceeding the 100 °C industrial limit. Heatsink attachment via thermal interface material (TIM) or a heat spreader is required; forced-air cooling at 200 LFM is recommended for reliable operation.
合规信息
RoHS and REACH compliant per Intel/Altera product declarations. Lead-free FCBGA package. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC). Lifecycle status: NRND (Not Recommended for New Designs).
