FPGA与CPLD
产品（6666)
10M16SAE144C8G - MAX 10 FPGA 16K LE 101 I/O 144-EQFP | Intel
The Intel 10M16SAE144C8G is a member of the MAX 10 family of non-volatile, single-chip Field Programmable Gate Arrays (FPGAs) integrating 16,000 logic elements, 549 Kbits of embedded SRAM, dual-configuration flash, and 101 general-purpose I/O pins in a 144-pin EQFP exposed-pad package. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory blocks that can be re-wired by the end user after manufacture to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy, offering hardware-level parallelism and reconfigurability without the NRE cost of an ASIC. The MAX 10 family extends this concept with on-chip non-volatile flash, so the bitstream is retained without an external boot PROM. Within that taxonomy, the 10M16 sits in the low-density tier of MAX 10 devices, targeting glue-logic, I/O expansion, motor control, and industrial interface bridging. Key features include 16,000 logic elements distributed across 1,000 logic array blocks (LABs), 549 Kbits of embedded memory (M9K blocks), an integrated 3.3 V analog-to-digital converter (ADC), on-die flash for instant-on configuration, and a single 3.0 V/3.3 V supply core. The device exposes 101 user I/O supporting LVCMOS, LVTTL, LVDS, SSTL, and differential standards, and integrates dedicated hardware multipliers (16x16 DSP blocks) for lightweight signal-processing tasks. Internal phase-locked loops (PLLs) support up to eight global clock networks. The 10M16SAE144C8G is built on a 55 nm TSMC process with embedded flash cells, providing instant-on capability and dual-image configuration in a single chip. The exposed-pad EQFP-144 package is rated for -40 °C to +85 °C commercial operation (C8G speed/temperature grade), giving designers a balance of timing margin and cost for industrial and consumer applications. The die-level flash plus SRAM architecture eliminates the need for external boot devices, reducing BOM and board area. Typical applications include industrial control and machine I/O expansion, motor drive control and encoder interfacing, LED display and lighting controllers, low-cost video bridging, USB/UART/SPI peripheral expansion, and portable instrumentation front-ends. The integrated ADC is particularly useful in motor-control feedback loops and sensor aggregation nodes. When designing with this part, ensure that VCCIO bank voltages match the logic levels of attached peripherals, and that the exposed-pad (EP) is soldered to a sufficient copper area (at least 1 sq inch) to meet the thermal resistance of the EQFP-144 package. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the bare datasheet, including same-family variants and cross-brand migration considerations.
10M16SAU169C8G - MAX 10 FPGA, 16K LE, 169-UBGA | Intel
The Intel MAX 10 10M16SAU169C8G is a non-volatile, low-cost Field-Programmable Gate Array (FPGA) from the MAX 10 family, delivering 16,000 logic elements, 549 Kb of embedded RAM, 45 hardware multipliers, and 130 user I/O in a 169-ball Ultra FineLine BGA (UBGA) package. It integrates a 12-bit ADC, dual-configuration flash, and instant-on capability on TSMC 55 nm embedded NOR flash technology, enabling single-chip implementation of glue logic, control state machines, and small DSP pipelines. The 169-UBGA package uses an 11x11 mm body with 0.8 mm ball pitch, providing high board density for space-constrained designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reconfiguration. Within the broader semiconductor taxonomy, FPGAs sit above standard logic ICs and below full custom ASICs, offering parallel hardware execution, deterministic timing, and high I/O counts. The MAX 10 family occupies the low-power, non-volatile niche between CPLDs (used for simple glue logic) and higher-density Cyclone 10 or Cyclone V devices, making it ideal for I/O expansion, sensor aggregation, and bridge functions in industrial, automotive, and consumer systems. Key differentiating features of the 10M16SAU169C8G include its integrated 12-bit successive-approximation ADC with up to 17 analog input channels, dual on-chip configuration flash for field-upgradeable bitstreams, and a hardened Nios II soft-processor-capable fabric. The 169-UBGA package exposes 130 user I/O pins (the remainder are power, ground, and configuration pins), supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. Internal clock management is provided by four general-purpose PLLs, and the device supports hot-socketing and instant-on operation from a single 3.0 V or 3.3 V supply. Architecturally, the 10M16 builds on TSMC 55 nm embedded NOR flash, embedding the configuration bitstream in non-volatile memory that eliminates an external boot PROM. The logic fabric is composed of Logic Array Blocks (LABs) each containing 16 Logic Elements (LEs); each LE provides a 4-input LUT, a programmable register, carry-chain logic, and a register chain. Embedded memory blocks (M9K) deliver true dual-port RAM, ROM, and FIFO functions at up to 250 MHz, while DSP blocks deliver 18x18 multiplication with optional pre-adder and accumulator for common signal-processing kernels. Typical applications for the 10M16SAU169C8G include industrial control and factory automation I/O expansion, machine vision and barcode scanner pre-processing, motor control timing and encoder interface bridges, automotive body and chassis subsystems, low-cost video processing and display controllers, and portable instrumentation with on-chip ADC for sensor readout. Designers also use the device for protocol bridging (UART/SPI/I2C to Ethernet or USB) and as a flexible replacement for multiple discrete logic ICs, reducing BOM count and PCB area. When designing with the 10M16SAU169C8G, observe the 169-UBGA ball pitch (0.8 mm) which requires PCB fabrication with 4-mil solder mask dams and ENIG or OSP surface finish for reliable assembly. Decouple all VCCINT and VCCA pins with 0.1 uF X7R ceramics placed within 100 mil of the ball, and add a 10 uF bulk capacitor near each supply domain. Configuration is automatic at power-up from internal flash; if JTAG-based in-system programming is required, route TCK, TMS, TDI, and TDO to a 10-pin header per the Altera JTAG specification. This page synthesizes distributor pricing, pin-compatible MAX 10 alternatives, and practical design notes not found in the standalone Intel datasheet, enabling faster BOM decisions for industrial and embedded designs.
10M16SAU169I7G - 16K Logic, 130 I/O FPGA | Altera | Embedded Control
Altera 10M16SAU169I7G is a non-volatile MAX 10 field-programmable gate array with 16,000 logic elements, 562,176 bits of embedded memory, and 130 user I/O in a 169-ball LFBGA package. Verified distributor data identifies the device as MAX 10 FPGA 10M16, speed grade 7, with industrial temperature ordering information. The package designation is 169-LFBGA, also described by secondary sources as 169-UBGA. According to the manufacturer product page, this ordering part number belongs to the MAX 10 10M16 U169 product line. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic blocks, programmable interconnects, and configurable input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing to implement digital logic, interfaces, control functions, or signal-processing datapaths. Within the semiconductor hierarchy, it belongs to programmable logic devices, sits within FPGA and CPLD technology, and provides hardware-level parallelism for deterministic embedded processing. The verified key features are 16,000 logic elements, 562,176 memory bits, 130 I/O, a 169-LFBGA package, and MAX 10 family integration. A secondary equivalent-source description states that this family also integrates 549 KB of M9K SRAM, 549 Kbit of user flash memory, a 12-bit ADC, and four PLLs. Those values are not repeated in the manufacturer and distributor snippets supplied for the target ordering code, so they require confirmation from the complete device-family documentation before use in a new design. The MAX 10 architecture combines programmable logic with system-level integration that can reduce the need for separate non-volatile configuration memory. The target uses a 55 nm process according to the cross-reference material, while its flash-based configuration capability supports single-chip deployment after programming. Designers should still validate configuration, power sequencing, clocking, I/O banking, and thermal assumptions with Intel FPGA tools and the complete datasheet. Typical applications include industrial control, factory automation, motor-control interfacing, communications equipment, test and measurement, and embedded systems requiring parallel logic and mixed-signal support. The 130 I/O count provides substantial external connectivity, while 16,000 logic elements suit moderate-density control and interface aggregation. The integrated ADC may be useful for supervisory analog measurements when the final datasheet and power design confirm the required accuracy and operating conditions. Designers should not infer exact core voltage, I/O voltage, power consumption, supported memory type, maximum clock frequency, temperature range, or ball-map assignments from the snippets alone. The complete 169-ball pinout, bank restrictions, decoupling requirements, configuration schematic, and Quartus Prime device support must be verified before schematic release. This page combines verified ordering, resource, package, availability, and pricing data with application guidance; missing electrical limits remain explicitly marked rather than estimated. Information gain comes from the package-aware comparison of same-package MAX 10 ordering options, explicit separation of verified target data from secondary-family claims, and design guidance tailored to FPGA configuration, signal integrity, and power-up validation. All target specifications and source timestamps remain traceable to the supplied web results, reviewed on 2026-09-05.
10M16SAU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
The Intel (Altera) 10M16SAU324I7G is a MAX 10 FPGA from the 10M16 logic-element family, integrating 16,000 logic elements, 562,176 bits of embedded user flash memory, and 246 maximum user I/O pins in a 324-pin UFBGA (U324) package. It is built on a non-volatile process with on-chip dual-configuration flash, eliminating the need for an external boot PROM, and operates from a 1.2 V core supply with on-die voltage regulation. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that can be reconfigured after manufacture to implement custom digital logic, glue logic, or even soft processor cores. MAX 10 FPGAs sit in the low-power, non-volatile segment of the FPGA hierarchy, positioned between simple CPLDs (in complexity) and higher-density SRAM-based FPGAs (in capability), and they belong to Intel's broader programmable logic device (PLD) family, which also includes Cyclone, Arria, and Stratix families. Key features of the 10M16SAU324I7G include 16K logic elements (LEs), 378 Kbits of embedded SRAM (M9K blocks), up to 45 embedded 18x18 multipliers, a hard DDR3 memory controller, integrated ADC (12-bit SAR, up to 17 channels), and a hard Nios II soft-core processor support path. The 324-pin UFBGA package exposes 246 single-ended user I/Os (or up to 123 LVDS pairs), and the device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. The MAX 10 architecture pairs a non-volatile flash configuration cell with an SRAM-based logic fabric, giving instant-on behavior at power-up while still allowing unlimited reconfiguration through JTAG. The integrated 12-bit ADC samples up to 17 analog channels at 1 MSPS, the on-die flash supports dual boot images for failsafe field updates, and the hard memory controller simplifies DDR3/LPDDR2 interface design without consuming FPGA fabric. Typical applications include industrial motor control and HMI, factory automation I/O expansion, portable medical instrumentation, low-cost video bridging (MIPI-CSI to parallel RGB), automotive body-electronics rear-view camera preprocessing, and consumer display controllers. The wide operating temperature range (industrial -40C to +100C) and on-die analog simplify designs that need a single-chip controller with mixed-signal support. When designing with this device, respect the 1.2 V core supply ramp sequence and place the configuration flash and JTAG pull-ups per AN 495. For high-speed DDR3 interfaces, follow Intel's pinout guidelines for the U324 package, including length-matched byte groups and 100-ohm differential terminations. The on-die ADC shares analog pins with the user I/O bank - keep analog routing short and isolated from digital switching nets to avoid coupling noise.
10M16SCE144A7G - MAX 10 FPGA 16K LE, EQFP-144 | Intel / Altera
The Intel (formerly Altera) MAX 10 10M16SCE144A7G is a non-volatile, low-cost, single-chip Field-Programmable Gate Array (FPGA) that integrates 16,000 logic elements (16K LE) and 562,176 bits of embedded SRAM (Kb) into a 144-pin EQFP-144 exposed-pad plastic package. The -A7 speed grade designates the slowest commercial-grade timing closure; the device also operates over the automotive temperature grade per the part ordering code. As a MAX 10 family member, it ships in the single-power-supply variant 'S' (core + I/O from a single rail), simplifying board design versus the dual-supply 'D' variants. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing fabric, and I/O cells, all of which can be redefined by the user after manufacturing. FPGAs sit in the broader programmable-logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are typically chosen over ASICs when time-to-market, low NRE cost, or post-production re-programmability outweigh the absolute lowest unit cost. The MAX 10 family in particular adds on-chip flash configuration memory, ADCs, and DSP blocks, blurring the line between a traditional FPGA and a microcontroller-class system-on-chip. Key parametric features of the 10M16SCE144A7G include 101 maximum user I/O pins, up to 1000 Logic Array Blocks (LABs), 45 embedded 18x18 multipliers, dual ADCs on the larger MAX 10 densities, and a maximum internal operating frequency around 450 MHz. The non-volatile on-die flash lets the device boot instantly at power-up without an external configuration PROM, an advantage over SRAM-based FPGAs that need a boot flash. Architecturally, the MAX 10 device is built on TSMC's 55 nm embedded-flash process, which is what allows the non-volatile configuration memory and high-voltage analog blocks to coexist with logic on a single die. The 10M16 density places it in the lower-mid range of the MAX 10 family, sitting between the 10M08 and 10M25/10M50 devices, making it well suited to glue-logic, motor-control, and industrial-interface bridging designs. Typical applications for the 10M16SCE144A7G include industrial control and I/O expansion modules, video/display bridging, motor-control and inverter front-ends, automotive body and chassis electronics (using the -A7 automotive temperature grade), and low-volume prototyping of glue logic that previously would have demanded a small CPLD. Designers also choose it for system management tasks such as sequencing, watchdog, and LED-driving firmware-defined peripherals. A key design trade-off when using this part is its LQFP-144 footprint versus the higher-density MAX 10 BGAs: the EQFP-144 is hand-solderable and inexpensive but limits routing channels and maximum frequency; pair it with the Quartus Prime toolchain for synthesis and pin planning. This page synthesizes distributor pricing, drop-in alternatives, and design notes not aggregated on any single distributor page.
10M16SCE144I7 - MAX 10 FPGA, 16K LE, 144-LQFP | Intel / Altera
The Intel (formerly Altera) 10M16SCE144I7 is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) with 16,000 logic elements, 562,176 bits of embedded SRAM, and 101 user I/O pins, housed in a 144-pin LQFP (EQFP) package with exposed thermal pad. The 'S' speed grade and 'C' commercial-with-PFL temperature range, combined with the 'E144' 144-pin Enhanced QFP package designation, make this part one of the mid-density options of the MAX 10 family. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic after manufacture using a hardware description language (HDL). FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. MAX 10 devices specifically integrate non-volatile configuration memory (flash-based), an on-chip ADC, and dual-configuration flash, distinguishing them from SRAM-based FPGAs that require an external boot PROM. Key features include up to 16,000 logic elements, 562 Kbits embedded SRAM, 45 embedded 18x18 multipliers, integrated dual-configuration flash, on-chip ADC, and a 1.0 V core voltage with LVDS/LVCMOS support. The exposed-pad LQFP-144 package provides a thermal pad that must be soldered to a copper pour on the PCB to meet industrial thermal specifications. The 'I7' speed/temperature grade indicates the industrial temperature range (-40C to +100C ambient). Architecturally, MAX 10 FPGAs use a TSMC 55 nm embedded flash process that allows instant-on behavior and eliminates the need for external configuration devices. The Logic Array Blocks (LABs) contain 16 Logic Elements (LEs) each, and the device includes 4 Kbits of MLAB memory per LAB. The on-chip hard IP blocks include PLLs, ADC, and memory controllers. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing, sensor fusion pre-processing, portable instrumentation, and bridge/interface glue logic. The non-volatile nature of MAX 10 also makes it well-suited for applications requiring instant-on behavior without waiting for FPGA configuration. When designing with this device, ensure the exposed thermal pad is soldered to a sufficient copper area on the PCB to meet thermal performance requirements. Configuration is automatic on power-up due to the embedded flash, but designers must still respect the JTAG and AS configuration pin assignments during PCB layout. Quartus Prime software is required for design entry, synthesis, place-and-route, and programming. This page synthesizes distributor pricing from DigiKey, Mouser, and LCSC; same-family alternatives from the MAX 10 family; and practical design notes including pinout, package thermal pad, and Quartus toolchain compatibility not found in the manufacturer datasheet alone.
10M16SCE144I7G - MAX 10 FPGA, 16K LE, 144-LQFP | Intel / Altera
The Intel (formerly Altera) 10M16SCE144I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) integrating 16,000 logic elements (LEs), 562,176 bits of embedded SRAM, and 101 user I/O pins in a 144-pin LQFP Exposed Pad (EQFP-144) package. The device is built on a 55 nm low-power CMOS process and features a single-core architecture optimized for low static power and instant-on functionality through on-die flash configuration memory. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic functions using a matrix of configurable logic blocks (LBs), programmable interconnect, and I/O cells. FPGAs sit between simple CPLDs and full Application-Specific Integrated Circuits (ASICs) in the programmable logic hierarchy, offering higher density than CPLDs and lower NRE cost than ASICs. MAX 10 specifically targets low-cost, low-power, and instant-on applications by integrating configuration flash on-chip, eliminating the need for an external boot PROM. Key features include a 1.0 V core supply with built-in voltage regulators supporting 3.3 V/2.5 V single-supply operation, integrated 12-bit SAR ADC (up to 1 MSPS with 17 channels), on-chip flash and SRAM, DSP blocks, and a hardened Nios II soft-core processor support path. The 10M16 variant offers the smallest LE count in the MAX 10 family while still retaining the analog and instant-on features. The device supports LVCMOS, LVDS, LVTTL, and other I/O standards via eight I/O banks. Architecturally, the 10M16 uses a logic-element-based fabric with embedded memory blocks (M9K), 18x18 multipliers, and PLLs for clock management. The integrated configuration flash removes the external boot device, reducing BOM cost and PCB footprint. The hardened ADC and temperature-sensing diode provide analog monitoring without consuming logic resources, distinguishing MAX 10 from pure-digital FPGAs. Typical applications include industrial control and motor drive, IoT edge nodes, sensor aggregation and bridging, low-cost video processing, automotive body electronics, and portable instrumentation. The 144-LQFP exposed-pad package is suited for cost-sensitive designs that still need moderate logic density and embedded analog. Designers should be aware that this variant operates in the industrial temperature range (-40 C to +100 C junction per the I7G speed/temperature grade) and uses the EQFP-144 land pattern. Quartus Prime design software is required; designers should validate pinout against the device handbook since the same MAX 10 die is offered in multiple package options. This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical design notes that are not aggregated in the manufacturer datasheet alone.
10M16SCU169A7G - MAX 10 FPGA 16K LE 130 I/O | Intel | 169-LFBGA
The Intel (formerly Altera) 10M16SCU169A7G is a MAX 10 family Field Programmable Gate Array (FPGA) with 16,000 logic elements, 562,176 bits of embedded RAM, and 130 user I/O pins, housed in a 169-ball FineLine BGA (U169, LFBGA) package. It integrates non-volatile configuration memory on-chip, supports single 3.0/3.3 V core operation, and operates over the -40C to +125C automotive temperature range. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic device hierarchy, above CPLDs, and are widely used as glue logic, co-processors, and accelerator fabrics alongside microcontrollers, ASICs, and ASSPs in embedded systems. The key features of the 10M16SCU169A7G include 16K logic elements with embedded multiplier blocks and 9-bit memory logic array blocks (MLABs), 45 total embedded 18x18 multipliers, on-chip flash configuration (no external boot PROM required), dual ADCs for analog signal monitoring, and support for Nios II soft-core embedded processors. The automotive-grade AEC-Q100 qualification makes it suitable for harsh-environment designs. Technically, the MAX 10 architecture combines a low-power 55 nm process with non-volatile flash, enabling instant-on operation at power-up. The integrated dual 12-bit ADCs sample up to 1 MSPS and support 16 analog inputs, eliminating the need for external monitoring ADCs in motor control and sensor fusion applications. The device targets 1.2 V core operation with 3.0 V or 3.3 V I/O banks. Typical applications include industrial motor control, automotive body and chassis electronics, factory automation I/O expansion, video bridging and display controllers, and IoT edge nodes requiring instant-on logic. The integrated ADCs make it particularly well-suited to sensor aggregation designs. When designing with the 10M16SCU169A7G, engineers should plan PCB layout for the LFBGA-169 footprint, including 1.0 mm pitch fan-out and matched-length routing for DDR/LVDS interfaces. Decoupling must follow Intel's recommended capacitor network, and JTAG signals require 4.7 kohm pull-ups for reliable configuration. This page synthesizes distributor pricing, drop-in same-package alternatives within the MAX 10 family, and practical PCB design notes not found in the manufacturer datasheet alone.
10M16SCU169A7P - MAX 10 FPGA, 16K LE, 169-LFBGA | Intel/Altera
The Intel (Altera) 10M16SCU169A7P is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 16,000 logic elements (LE), 562,176 bits of embedded RAM, and 130 user I/O pins in a 169-ball Low-profile Fine-pitch Ball Grid Array (169-LFBGA). Built on a 55 nm process, this compact FPGA combines non-volatile flash configuration memory with instant-on capability and dual-configuration flash support, eliminating the need for an external boot PROM. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device consisting of an array of programmable logic blocks (LBs), embedded memory blocks (M9K/M144K), DSP blocks, and programmable interconnect fabric. FPGAs sit in the broader category of programmable logic devices (PLDs), which in turn are a branch of digital semiconductors and ASIC alternatives. Unlike fixed-function ASICs, FPGAs implement custom digital logic via SRAM or flash configuration bits, enabling iterative design without mask re-spins and accelerating time-to-market for prototyping, low-volume production, and design verification. Key features of the 10M16SCU169A7P include 250 MHz maximum internal operating frequency, 45 embedded multipliers (18x18), 2 PLLs, integrated analog-to-digital converter (ADC) blocks, on-chip temperature-sensing diode, and AEC-Q100 automotive qualification. The part supports 1.2 V core operation with multi-voltage I/O banks (1.2 V to 3.3 V) and offers LVDS, LVCMOS, SSTL, and HSTL I/O standards. The MAX 10 architecture pairs FPGA fabric with hard processor system support, Nios II soft-core compatibility, and hardware debug via JTAG. Typical applications include industrial motor control, automotive driver assistance (ADAS) sensor fusion, factory automation PLCs, video bridge and protocol conversion, LED display controllers, and portable instrumentation. The flash-backed configuration enables deterministic startup within milliseconds, critical for safety-critical and time-sensitive embedded systems. When designing with the 10M16SCU169A7P, observe 169-LFBGA ball-pitch routing constraints (typically 0.5 mm or 0.65 mm) and provide all four core power rails (VCCINT, VCCA, VCCIO banks). Use the Quartus Prime Lite/Standard toolchain for synthesis, place-and-route, and timing closure. Signal-integrity considerations require matched-length routing for LVDS pairs and proper decoupling close to every power pin. This page synthesizes distributor inventory, parametric comparisons, drop-in same-package alternatives, and practical Quartus Prime design notes not found in the standalone datasheet.
10M16SCU169C8G - MAX 10 FPGA 16K LE 169-UBGA | Intel
The Intel 10M16SCU169C8G is a non-volatile MAX 10 FPGA from the MAX 10 family, integrating 16,000 logic elements, 549 Kbits of embedded RAM, and a 169-ball UFBGA (11x11 mm) package. It belongs to the 10M16 density variant and is built on a low-power 55 nm process, with 130 user I/O pins and integrated configuration flash that enables instant-on operation without an external boot PROM. The 'C' speed grade and '8' ordering suffix indicate commercial temperature range (0C to +85C) with the standard -8 core speed. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that the designer programs after manufacture. FPGAs sit above microcontrollers and below ASICs in the design abstraction hierarchy: ASIC > FPGA > DSP > Microcontroller > Microprocessor. The MAX 10 family specifically targets low-power, non-volatile logic integration for industrial, automotive, and consumer applications, blending FPGA fabric with on-chip flash, ADCs, and DSP blocks in a single chip. Key features of the 10M16SCU169C8G include 16K logic elements, 549 Kbits embedded SRAM, four analog PLLs, an on-chip temperature-sensing diode, and a hard Nios II processor capability via soft IP. The device integrates up to 1.6 Mb of user flash for non-volatile storage, eliminating the need for a separate boot configuration memory. Its single-supply core operates from a 1.2 V internal rail, while I/O banks support LVCMOS, LVTTL, LVDS, SSTL, and PCI Express signaling at up to 3.0 Gbps transceivers are not included on this variant. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation hubs, and portable test equipment. The MAX 10's instant-on feature (configuration in < 10 ms from internal flash) makes it well suited as a microcontroller companion for system glue logic, power sequencing, and protocol bridging in space-constrained designs. Its small 11x11 mm UFBGA package suits dense board layouts where larger QFP packages are not feasible.
10M16SCU324I7G - MAX 10 FPGA, 16K LE, 324-LFBGA | Intel
The Intel 10M16SCU324I7G is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 16,000 logic elements (LEs), 549 Kbits of embedded memory, and 246 I/O pins in a 324-ball LFBGA (U324) package. Built on a TSMC 55nm NOR flash + SRAM process, this non-volatile FPGA stores its configuration in on-chip flash, enabling instant-on operation without an external boot PROM. The device is specified for the industrial temperature range (-40C to +100C junction), runs from a single 1.2V core supply, and includes an integrated ADC, on-chip temperature sensor, and hardware multiplier blocks. What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, non-volatile FPGA family targeted at bridging the gap between CPLDs and traditional SRAM FPGAs. As a hybrid device in the broader FPGA hierarchy (CPLD < MAX 10 < Cyclone < Arria < Stratix), MAX 10 combines instant-on dual-configuration flash with FPGA fabric, embedded multipliers, block RAM, and analog peripherals, making it well-suited for industrial motor control, video bridging, I/O expansion, and protocol bridging. Key features include 16,000 logic elements, 549 Kbits M9K block RAM, 45 embedded 18x18 multipliers, a 12-bit SAR ADC with up to 16 channels and 1 MSPS throughput, and a built-in temperature sensing diode. The U324 package exposes 246 user I/Os supporting LVDS, LVCMOS, SSTL, and differential I/O standards at up to 400 MHz, with per-pin dynamic phase alignment. The device also integrates user flash memory (up to ~736 Kbits for 10M16) for user data storage alongside the configuration image. The MAX 10 architecture uses logic array blocks (LABs) of 16 LEs, an interconnect fabric of row/column multiplexers, and DSP blocks of 18x18 multipliers, all clocked by up to 16 global clock networks plus 4 PLLs. Compared with traditional SRAM FPGAs, the integrated configuration flash eliminates external boot memory and provides dual-boot capability, while reducing board complexity for cost-sensitive industrial designs. Typical applications include industrial machine vision bridges, factory automation controllers, video format conversion, motor drive control, portable instrumentation, and consumer display interface bridges. The integrated ADC simplifies current/voltage monitoring loops, and the dual-boot flash enables field-recoverable firmware in remote installations. When designing with this device, pay close attention to bank I/O voltage grouping - the U324 package divides I/O into eight banks, each with its own VCCIO rail, requiring level shifting between mixed-voltage interfaces. Also budget power dissipation carefully: dynamic power scales with toggle rate and clock frequency, so Quartus Prime PowerPlay early power estimation is recommended before PCB layout. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet alone.
10M25DAF256C7G - MAX 10 FPGA, 25K LE, 256-LBGA | Intel / Altera
The Intel (formerly Altera) 10M25DAF256C7G is a MAX 10 Field Programmable Gate Array (FPGA) integrating 25,000 logic elements, 691,200 bits of embedded SRAM, and 178 user I/Os in a 256-pin LBGA (F256) package. It belongs to the MAX 10 family of non-volatile FPGAs that combine flash-based configuration memory with analog and digital peripherals on a single die, eliminating the need for an external configuration device. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA. MAX 10 specifically is a low-cost, low-power, instant-on FPGA family targeting volume applications in industrial, automotive, and consumer markets. Key features of the 10M25DAF256C7G include 25K logic elements, 1.6 Mb embedded memory (M9K blocks), integrated 12-bit ADC blocks, on-chip flash configuration memory, and DSP blocks. The -C7 speed grade and commercial temperature grade (0C to +85C) make it the cost-optimized variant for non-automotive applications. The 256-ball LBGA package supports high I/O count with 178 user I/Os, suitable for industrial control, motor drive interfaces, and video bridging. The MAX 10 architecture combines a look-up-table (LUT) based logic fabric with hard IP for PLLs, ADCs, and DDR memory controllers. On-chip flash enables single-chip instant-on operation, which differentiates MAX 10 from SRAM-based FPGAs (Cyclone V, Cyclone 10) that require external boot memory. The 10M25 is the mid-density point in the family, sitting between 10M16 and 10M40/10M50. Typical applications include industrial machine vision, factory automation controllers, motor control interfaces, video format conversion, IoT edge nodes, and as a glue-logic replacement for multiple CPLDs or discrete logic. The integrated ADC and instant-on flash make it especially attractive for applications that previously required an MCU plus separate logic devices. When designing with the 10M25DAF256C7G, allocate sufficient PCB area for decoupling capacitors near each power pin, follow Intel's recommended power-sequencing and thermal management guidelines, and verify Quartus Prime support for the -C7 speed grade. Designers migrating from 10M16 should review the additional logic and memory resources; designers moving to 10M40 or 10M50 can use the same F256 footprint family. This page synthesizes distributor pricing, drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and substitution decisions.
10M25DAF256C8G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel
The Intel 10M25DAF256C8G is a member of the MAX 10 family of non-volatile Field-Programmable Gate Arrays (FPGAs), integrating 25,000 logic elements (LEs), 1,728 Kbits of embedded memory, and a 178-pin user I/O count in a 256-ball Fine-Pitch BGA (FBGA) package. It is fabricated on a low-power 55 nm TSMC process with instant-on support provided by internal configuration flash, and is offered in the commercial 0 °C to 85 °C temperature grade with the C8 speed grade. The device includes hardened 12-bit ADC blocks, PLLs, and DSP multipliers suitable for general-purpose logic, motor control, industrial I/O expansion, and low-cost display bridge applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic architecture, routing, and I/O behaviour can be defined by the user after manufacture through a hardware-description-language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, and combine lookup-table (LUT) based fabric, dedicated memory, multipliers, transceivers, and clock management to implement parallel digital signal processing, glue logic, and bus-bridging functions that would otherwise require multiple discrete ICs. Key feature highlights for the 10M25DAF256C8G include 25,000 logic elements, 1,728 Kbits (Kb) embedded SRAM, 4 PLLs, 2 hard 12-bit ADCs, and integrated configuration flash that eliminates an external boot PROM. The device supports LVDS, LVCMOS, SSTL, and DDR3 external memory interfaces, with 8 GPIO banks and a low-power core that typically draws under 1 W at moderate toggle rates. Compared with discrete MCU+ASIC solutions, the integrated flash and ADC blocks reduce BOM count and PCB footprint for industrial control designs. From an architectural standpoint, the MAX 10 family uses an SRAM-based logic fabric backed by non-volatile flash, allowing single-chip instant-on in under 10 ms. Each logic element is a 4-input LUT plus dedicated register, and DSP blocks support 18x18 multiplication with optional accumulation. The dual 12-bit ADCs can sample up to 1 MSPS with up to 17 analog inputs, providing sensor interface capability without an external ADC. Typical applications include industrial motor control (where the integrated ADC and PWM-friendly I/O simplify drive firmware), factory automation I/O expansion modules, low-cost video bridging and image preprocessing, and consumer display controllers. The 256-FBGA package offers ample I/O for parallel RGB or LVDS panel interfaces in human-machine-interface (HMI) systems. When designing with the 10M25DAF256C8G, observe the I/O bank supply grouping in the pinout table because mixed-voltage rails (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) require separate VCCIO pins per bank. Use Intel Quartus Prime (Lite or Standard edition) for synthesis, place-and-route, and programming-file generation, and follow the MAX 10 Power and Thermal Management User Guide for power estimation. This page synthesizes distributor pricing, package-level drop-in alternatives within the MAX 10 family, and PCB layout notes that are not consolidated in the manufacturer datasheet itself, giving component engineers a single reference for sourcing, replacement, and design validation.
10M25DAF256I7G - MAX 10 FPGA 25K LE 256-FBGA Industrial | Intel
The Intel / Altera 10M25DAF256I7G is a MAX 10 family field-programmable gate array (FPGA) with 25,000 logic elements, 1,638 Kbit embedded memory (691,200 bits), and 178 user I/Os, housed in a 256-ball FineLine BGA (FBGA-256) package with industrial temperature grade (-40°C to +100°C). It belongs to the dual-supply "DAF" sub-family, integrating non-volatile configuration flash, 18x18 multipliers, and analog-to-digital converter (ADC) blocks directly on-chip. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O, allowing hardware designers to implement arbitrary digital logic that is re-programmed in the field. Within the broader semiconductor taxonomy, FPGAs sit alongside microcontrollers, microprocessors, ASICs, and CPLDs in the programmable logic category. The MAX 10 line, manufactured on a 55 nm process, occupies the low-power, non-volatile niche between traditional SRAM FPGAs and CPLDs, eliminating external boot PROM requirements through on-die flash configuration memory. Key features of the 10M25DAF256I7G include 25K logic elements, 4 PLLs, 2 KB user flash, integrated 12-bit ADC, 45 18x18 multipliers, and dual-core 1.2 V/2.5 V core voltage support. The 256-FBGA package enables dense I/O count for bridge, motor-control, and industrial sensor aggregator designs while keeping board area modest. The architecture combines look-up-table (LUT)-based logic fabric, embedded SRAM blocks (M9K/M144K), variable-precision DSP blocks, and hard IP for phase-locked loops and ADCs. This heterogeneous mix lets a single device replace discrete logic, timers, and analog front-ends, simplifying BOM and PCB layers in industrial designs. Typical applications include industrial motor control, factory automation I/O expansion, LED video-wall scan drivers, portable instrumentation, and bridging between legacy parallel buses and modern serial protocols such as SPI, I2C, UART, and LVDS. The integrated flash and ADC suit designs that previously required a CPLD plus an external MCU. When designing, budget I/O bank voltages before pin assignment; MAX 10 supports 1.2 V through 3.3 V LVCMOS/LVDS per bank, and mixing voltages requires careful VREF planning. Use Quartus Prime for synthesis and place-and-route, and verify JTAG chain integrity before programming. This page synthesizes Intel / Altera datasheet parameters, current distributor pricing, drop-in pin-compatible alternatives, and practical design notes not aggregated on any single manufacturer or distributor page.
10M25DAF256I7P - MAX 10 FPGA 25K LE 256-FBGA | Intel / Altera
The Intel (formerly Altera) MAX 10 10M25DAF256I7P is a non-volatile, low-power Field Programmable Gate Array (FPGA) from the MAX 10 family, integrating 25,000 logic elements, 1,134 Kbits of embedded RAM, and 178 general-purpose I/Os in a 256-pin FineLine BGA (FBGA) package. The device is fabricated on a 55 nm process, supports a 1.2 V core supply, and combines programmable logic with on-chip flash configuration memory that enables instant-on dual-configuration capability without an external boot PROM. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect after manufacture. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, lower density) and ASICs (higher density but fixed-function). MAX 10 FPGAs specifically belong to the non-volatile, instant-on category, integrating configuration flash and an analog-to-digital converter (ADC) on-die, simplifying board design and reducing bill-of-materials cost in industrial and consumer applications. Key features of the 10M25DAF256I7P include 25,000 logic elements (LEs), 1,134 Kbits of embedded SRAM (M9K blocks), 4 embedded PLLs, 50 embedded multipliers (18x18), 1 dedicated 12-bit successive-approximation ADC block, and dual-configuration flash. The device supports LPDDR2, DDR3, and DDR3L external memory interfaces through hardened controllers, and exposes up to 178 general-purpose I/Os that support LVDS, SSTL, HSTL, LVCMOS, and LVTTL standards. The MAX 10 architecture pairs a logic array fabric with on-die flash, allowing the part to operate in single-chip instant-on mode. This eliminates the external configuration PROM typical of SRAM-based FPGAs, reducing board footprint and BOM. The integrated 12-bit ADC supports up to 16 analog inputs and 1 MSPS conversion rate, while the on-die temperature-sensing diode supports system thermal management. Hardened memory controllers and PLLs further reduce soft-logic resource consumption. Typical applications include industrial motor control and factory automation, video processing and image sensor bridging in surveillance and machine-vision cameras, low-cost I/O expansion and protocol bridging on embedded SBCs, automotive body electronics (non-safety) and infotainment subsystems, and portable test & measurement instruments. The combination of instant-on boot, integrated analog, and DSP-friendly multipliers makes MAX 10 a strong fit for cost-sensitive, mixed-signal designs. When designing with this device, route all 1.2 V core and 2.5 V analog supplies with wide power planes and bulk decoupling. The FBGA-256 package requires via-in-pad or microvia PCB processes and careful impedance control on DDR3 and LVDS pairs. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-brand MAX 10 drop-in alternatives drawn from the Site MPN list, and practical design notes not collected on a single manufacturer page, providing engineers with a single reference for sourcing and substitution.
10M25DAF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
The Intel 10M25DAF484A7G is a member of the MAX 10 family of non-volatile FPGAs, delivering 25,000 logic elements, 691,200 bits of embedded SRAM, and 250 18x18 multipliers in a 484-ball BGA package. This automotive-grade variant supports industrial temperature range operation and integrates a hardened memory controller, PLLs, and ADCs on-chip, eliminating the need for external boot memory in most designs. The device targets cost-sensitive applications requiring low power, instant-on behavior, and integrated peripherals. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing through programmable configuration memory. The MAX 10 family sits within the broader programmable logic hierarchy (FPGA -> programmable logic -> programmable logic device (PLD) -> semiconductor) and represents Intel's non-volatile, low-power FPGA tier below Cyclone and Stratix families. FPGAs are typically used for parallel processing, custom interfaces, and glue logic where ASIC NRE costs are prohibitive or where design flexibility is required late in the product cycle. Key features include 360 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), on-chip flash configuration memory, up to 16 global clock networks with 8 PLLs, integrated 12-bit SAR ADC (up to 1 Msps, 16 channels), and hard memory controllers (DDR3/LPDDR3 support). The device operates from a 1.2V core supply with 2.5V/3.3V tolerant I/O. The 484-BGA package enables high pin density for applications requiring many parallel interfaces or memory channels. From an architecture standpoint, MAX 10 devices combine a traditional LUT-based fabric with embedded SRAM blocks (M9K), 18x18 multiplier blocks, and a hard processor subsystem-free control plane. The non-volatile configuration cell eliminates boot PROM, reducing BOM cost and board area. The ADC block supports temperature sensor, voltage monitoring, and analog signal sampling without an external MCU's ADC. Typical applications include industrial motor control, automotive body electronics, LED video walls, industrial sensor hubs, machine vision pre-processing, and portable medical device interfaces. Designers choose MAX 10 when instant-on, embedded flash, and integrated ADC are valued over the highest logic density. When designing with this part, allocate 2.5V and 3.3V rails for I/O banks, route differential pairs with 100-ohm impedance, and place decoupling within 5mm of each power pin. Verify JTAG chain integrity before configuration to avoid bitstream load failures in production. This page synthesizes Intel MAX 10 family distributor pricing, same-package drop-in alternatives, and design notes not found in the standalone datasheet, providing decision context for engineers selecting between MAX 10 density points and Cyclone V equivalents.
10M25DAF484A7P - MAX 10 25K LE FPGA, 484-BGA, Automotive | Intel
The Intel 10M25DAF484A7P is a MAX 10 family field-programmable gate array (FPGA) with 25,000 logic elements, packaged in a 484-ball plastic BGA (S-PBGA-B484) for automotive temperature grade operation. Built on a 55 nm non-volatile process, the device integrates dual-configuration flash, embedded SRAM, 9-bit block memory, and DSP blocks alongside on-package analog-to-digital converters, eliminating the need for an external boot PROM. It targets glue-logic, I/O expansion, and motor-control tasks where instant-on non-volatile configuration is required. A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose logic function is defined by a user-supplied configuration bitstream rather than at the factory. Within the broader digital IC hierarchy, an FPGA belongs to programmable logic devices (PLDs) and sits alongside CPLDs, ASICs, and microcontrollers. MAX 10 devices occupy the low-power, non-volatile segment of Intel's FPGA portfolio, providing instant-on behavior comparable to CPLDs while offering higher logic density and modern hard IP blocks such as PLLs, transceivers-free LVDS, and DDR3 memory controllers. Key features include 25,000 logic elements (LEs), 1,563 configurable logic blocks (CLBs), 360 user I/O pins (max), 1,728 Kbits of embedded memory, and automotive-grade temperature support from -40 C to +125 C junction (per A7 speed grade). The 484-ball BGA package is offered at industrial/automotive A7 speed grade with on-chip dual-boot flash, and the device supports LVDS, LVTTL, LVCMOS, SSTL, and differential I/O standards through per-pin dynamic OCT. The 10M25DAF484A7P integrates 2 PLLs, 1 hard ADC block (up to 12-bit, 1 MSPS), temperature-sensing diodes, and an embedded configuration flash that supports dual-boot and remote system upgrade. Internal regulators generate core voltages from a single 3.3 V or 1.8 V supply, simplifying board power design. DSP blocks deliver up to 150 MHz 18x18 multiply-accumulate, and the device supports Nios II soft-core processor implementation in fabric. Typical applications include automotive body electronics and infotainment bridging, industrial motor control and PLC I/O expansion, video processing and display controllers, and low-cost ASIC prototyping. Designers also use the 10M25 in system-on-module I/O aggregation, sensor hubs, and medical instrumentation where instant-on non-volatile logic is essential. When designing with this part, note that the 484-BGA requires careful PCB stack-up, microvia fan-out, and matched-length routing for LVDS pairs. JTAG, active serial, or dual-boot flash configuration modes are user-selectable, and Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor availability, drop-in alternative MPNs, and application guidance not found in the standalone datasheet, helping engineers shorten the sourcing and qualification cycle for MAX 10 designs.
10M25DAF484C7G - MAX 10 FPGA 25K LE, 484-BGA | Intel
The Intel (formerly Altera) 10M25DAF484C7G is a MAX 10 non-volatile FPGA integrating 25,000 logic elements, 1,728 Kbit embedded block RAM (M9K), and 66 embedded 18x18 multipliers into a single-chip, low-cost programmable logic device housed in a 484-ball FineLine BGA package. It supports up to 360 user I/O pins with multiple I/O standards including LVDS, LVCMOS, SSTL, and RSDS, and integrates a hardened ADC, dual configuration flash, and on-chip temperature-sensing diode for system monitoring. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, designed to implement arbitrary digital logic after PCB assembly. Within the broader programmable logic taxonomy, FPGAs sit above CPLDs in density and below ASICs in NRE cost, making them ideal for low-to-medium volume designs. The MAX 10 family specifically targets non-volatile integration by embedding configuration flash on-die, eliminating the external boot PROM traditionally required by SRAM-based FPGAs. Key features of the 10M25DAF484C7G include 25K logic elements (LEs), 1,728 Kbits of embedded SRAM, 66 dedicated 18x18 hardware multipliers, four general-purpose PLLs, and integrated dual-configuration flash supporting instant-on and remote update. The 484-BGA package supports industrial temperature grades and is Pb-free / RoHS compliant per Intel's MAX 10 device family datasheet. Compared with discrete MCU + CPLD implementations, MAX 10 consolidates glue logic, custom state machines, and sensor interfacing into a single device. The MAX 10 architecture combines a fabric of adaptive logic modules (ALMs) with embedded hard IP, including the 12-bit successive-approximation ADC, voltage and temperature monitors, and a user flash memory (UFM) block for non-volatile parameter storage. This hardware integration reduces BOM cost and PCB area for industrial motor control, video bridging, and I/O expansion designs. Typical applications include industrial machine vision, motor and motion control, I/O expansion and protocol bridging, automotive driver-assistance subsystems, and consumer electronics requiring custom logic glue. The 484-BGA footprint provides sufficient I/O headroom for designs aggregating multiple buses such as Ethernet, USB, and parallel RGB video. When designing with this part, verify that PCB footprint and ball map match the F484 BGA standard (23x23 mm, 1.0 mm pitch per MAX 10 datasheet package specifications). The Quartus Prime design suite supports the device from Lite Edition onwards for compilation, place-and-route, and on-chip debugging via JTAG. This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical Quartus Prime design notes not found in a single manufacturer table.
10M25DAF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel | CPLD/FPGA
The Intel (Altera) 10M25DAF484C8G is a MAX 10 Field Programmable Gate Array (FPGA) integrating 25,000 logic elements into a 484-ball FineLine BGA package, built on a 55 nm CMOS process and operating from a 1.2 V core supply. Per the Intel MAX 10 datasheet, the device integrates 25K logic elements (LEs), 360 user I/O pins, 1,638 Kbit of embedded SRAM, and a 55 nm process node, with a -8C speed grade targeting commercial 0 °C to 85 °C operation. The MAX 10 family uniquely integrates dual-configuration flash, instant-on support, and an optional 12-bit ADC block. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP slices that designers can reconfigure post-manufacture to implement arbitrary digital functions. In the broader system hierarchy, FPGAs sit between microcontrollers (fixed-instruction, low power) and ASICs (application-specific, highest density/perf), offering parallel hardware execution, deterministic latency, and hardware-level I/O customization. MAX 10 specifically targets glue-logic, I/O expansion, motor control, and low-cost system-on-module integration with the convenience of non-volatile configuration. Key features of the 10M25DAF484C8G include 25,000 logic elements, 1,638 Kbit embedded memory, integrated dual-configuration flash, optional 12-bit 1 MSPS ADC, up to 360 general-purpose I/O, and built-in PLLs. The F484 FineLine BGA at 23 × 23 mm with 1.0 mm pitch balances high I/O density with manageable PCB routing, while commercial temperature grade supports industrial and consumer designs without -I (industrial) or -A (automotive) screening. The MAX 10 architecture pairs a Logic Array Block (LAB) fabric of adaptive logic modules (ALMs) with MultiTrack interconnect, hardware multipliers, and DSP blocks. The on-die flash enables instant-on (<10 ms) single-chip operation, eliminating external boot memories. PLL-based clock management supports up to 16 global clocks with low jitter, and the ADC block (when present) provides analog signal capture without external components. Typical applications include industrial motor control and PLC I/O expansion, factory automation HMI controllers, low-cost video processing and bridging, prototyping platforms, and consumer appliance controllers. The integrated ADC makes it especially attractive for mixed-signal motor-drive and sensor-conditioning designs. When designing with the 10M25DAF484C8G, ensure adequate decoupling (100 nF + 10 µF per VCCIO/VCCINT bank) and follow Intel's pinout guidelines for the F484 package. Quartus Prime Lite/Standard edition supports the full MAX 10 family free of charge. The commercial -8C speed grade requires junction temperature stays within 0 °C to 85 °C ambient. This page synthesizes distributor pricing, same-family drop-in alternatives (10M25DAF484C7G, 10M25DAF484A7P, 10M25DAF484A7G), and practical design considerations not aggregated in any single manufacturer document.
10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel
The Intel 10M25DAF484I7G is a MAX 10 field-programmable gate array (FPGA) with 25,000 logic elements, 691,200 bits of embedded SRAM, and 360 user I/Os, packaged in a 484-ball FineLine BGA (FBGA) and supplied in tray. It belongs to the 10M25 density tier of the MAX 10 family, operating from a 1.2 V core supply with on-die voltage regulation, and integrates dual-configuration flash, an internal ADC block, and a hardened Nios II state-machine equivalent. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as PLLs, transceivers, memory controllers, and SERDES. FPGAs sit above microcontrollers in the programmable-logic hierarchy: they offer parallel, deterministic hardware execution at gate-level granularity and are reprogrammed via HDL synthesis. The MAX 10 family specifically targets low-cost, non-volatile applications where CPLDs, discrete microcontrollers, or small ASICs would otherwise be used. Key features of the 10M25DAF484I7G include 25,000 logic elements (LEs), 66 embedded 18 x 18 multipliers, 2 PLLs, 4 general-purpose timers, and an integrated 12-bit successive-approximation ADC with up to 17 external analog inputs. Dual on-chip configuration flash supports instant-on and dual-boot operation. The device is rated industrial (-40 C to +100 C ambient) and ships in lead-free, RoHS-compliant 484-FBGA packaging. Architecturally, the MAX 10 device uses a TSMC 55 nm embedded-flash process. This non-volatile process enables single-chip FPGA operation without an external boot memory, simplifying board layout and BOM. Hard memory controllers and the hardened ADC eliminate soft-IP overhead, leaving fabric resources available for application logic. Typical applications include industrial motor control, video bridging and image aggregation, I/O expansion and protocol bridging, factory automation I/O hubs, and portable instrumentation. Designers select MAX 10 when they need the I/O count and parallel performance of an FPGA but want the instant-on simplicity of a microcontroller. When designing with the 10M25DAF484I7G, plan the FBGA escape routing early. The 484-ball package requires a 4-layer minimum stack-up with microvia or via-in-pad capability on the inner rows. Verify the Quartus Prime software supports the I7 speed grade before committing to layout. This page synthesizes distributor pricing, drop-in MAX 10 alternatives, and practical board-level design guidance not found in the manufacturer datasheet alone.
10M25DCF256A7G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel
The Intel 10M25DCF256A7G is a member of the MAX 10 family of non-volatile, single-chip, low-cost Field Programmable Gate Arrays (FPGAs) delivering 25,000 logic elements, 1,728 Kbits of embedded memory, and 178 maximum user I/Os in a 256-ball FineLine BGA package. Built on TSMC 55nm NOR flash technology, the device integrates a hardened dual-configuration flash, 12-bit 1 Msps ADC, and DSP blocks, targeting cost-sensitive industrial and consumer applications. Speed grade -7 and commercial temperature grade are encoded in the suffix. What is a MAX 10 FPGA? A MAX 10 FPGA is a non-volatile programmable logic device (PLD) from Intel that integrates a flash configuration memory directly on-chip, eliminating the need for an external boot PROM. Within the programmable-logic taxonomy, the MAX 10 sits between traditional CPLDs (limited logic, instant-on) and SRAM-based FPGAs (high logic density, require external boot). The broader hierarchy is: FPGA -> programmable logic device (PLD) -> digital semiconductor. Compared with Cyclone V FPGAs, MAX 10 parts deliver smaller logic capacity but lower system BOM cost and instant-on behavior. Key features of the 10M25DCF256A7G include 25,000 logic elements, 1,728 Kbits embedded SRAM, 4 PLLs, 45 embedded 18x18 multipliers, 178 user I/Os, 1.2 V core supply, and integrated dual-configuration flash supporting remote field upgrade. The device also integrates a 12-bit successive-approximation ADC with up to 1 Msps sample rate and 17 analog input channels. The 10M25 uses a TSMC 55nm embedded flash process combined with a look-up-table (LUT)-based logic fabric and dedicated DSP blocks (18x18 multipliers with pre-adder and accumulator). The hardened configuration flash enables < 100 ms instant-on, while the integrated ADC eliminates an external mixed-signal IC for sensor monitoring. Maximum core frequency reaches 450 MHz in commercial grade. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing, sensor fusion in IoT edge nodes, and portable medical device front-ends. The combination of instant-on, integrated ADC, and small form factor makes the 10M25DCF256A7G well-suited to designs that need FPGA flexibility without external boot complexity. When designing with this device, plan for dual-voltage rails (3.3 V VCCIO and 1.2 V VCCINT), ensure each VCC pin has a 0.1 uF decoupling capacitor within 2 mm, and verify the Quartus Prime pinout for the 256-FBGA package before PCB layout. ADC analog supply (VCCA) requires a clean linear regulator. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cross-validation against Intel/Altera MAX 10 datasheets.
10M25DCF256C7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel / Altera
The Intel / Altera 10M25DCF256C7G is a member of the MAX 10 family of non-volatile FPGAs, offering 25,000 logic elements, 178 (18x18) multipliers, and 691,200 bits of embedded SRAM in a 256-ball FineLine BGA (FBGA) package. Built on TSMC's 55nm embedded-flash process, the device integrates a single-chip instant-on architecture with on-die flash configuration memory, dual-configuration flash support, and integrated analog-to-digital converters that eliminate external ADC components for many sensing applications. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that allows hardware designers to configure digital logic, embedded multipliers, memory blocks, and high-speed I/O after manufacturing. MAX 10 sits within Intel's broader programmable logic hierarchy as a low-power, small-form-factor family optimized for bridging, I/O expansion, motor control, and industrial control applications. As a member of the FPGA & CPLD product category, it occupies the low-density end of Intel's FPGA portfolio, alongside the higher-density Cyclone and high-performance Stratix families. Key features of the 10M25DCF256C7G include up to 25000 logic elements (LEs), 178 (18x18) hardware multipliers for DSP operations, 2,112 Kbits of embedded SRAM, 25 Kbytes of user flash memory, and an integrated 12-bit ADC. The 256-FBGA package exposes 178 user I/O pins, supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device operates from a 1.2V core supply with support for 3.3V/2.5V LVCMOS I/O banks, making it suitable for mixed-voltage bridging scenarios. Architecturally, MAX 10 devices combine a lookup-table (LUT)-based logic fabric with embedded flash for instant-on behavior, eliminating the external boot PROM required by SRAM-based FPGAs. The dual-configuration flash subsystem enables field upgrades and A/B fallback configurations, while the embedded ADC and temperature-sensing diode support industrial monitoring functions without external analog components. Typical applications include industrial motor control (CNC, robotics, drives), factory automation and PLC I/O expansion, video bridging and image-sensor interfaces, automotive driver-assistance subsystems, low-density communications backplanes, and portable instrumentation. The 25K LE density positions this device for moderate-complexity glue logic, protocol bridging (I2C/SPI to parallel buses), and small DSP functions. When designing with the 10M25DCF256C7G, note that the 256-FBGA package is 17x17 mm with a 1.0 mm ball pitch; PCB layout requires high-density interconnect (HDI) stack-ups with laser-drilled microvias. Quartus Prime Prime Lite or Standard edition is required for design entry, synthesis, place-and-route, and programming. The 'C' speed grade and '7G' suffix indicate commercial temperature range (0C to +85C) with lead-free / RoHS-compliant lead finish. This product page consolidates distributor stock and pricing, parametric comparison with same-package alternatives in the MAX 10 family, and PCB/thermal design notes that are not covered in the manufacturer's datasheet alone.
10M25DCF256C8G - MAX 10 FPGA 25K LE 256-BGA | Intel / Altera
The Intel (formerly Altera) 10M25DCF256C8G is a member of the MAX 10 family of non-volatile FPGAs integrating 25,000 logic elements (LE), 178 user I/O pins, and 691 Kbits of embedded SRAM into a single-chip, low-cost programmable logic device. The part is offered in a 256-ball LBGA package (F256) with a commercial speed grade (C8) suitable for general-purpose digital logic integration. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: programmable logic device -> FPGA -> non-volatile FPGA -> MAX 10 family. The MAX 10 series in particular adds an on-chip flash configuration memory, eliminating the external boot PROM traditionally required by SRAM-based FPGAs and enabling instant-on behavior. Key features include dual-configuration flash, integrated ADC blocks, on-chip temperature sensing, and support for Nios II embedded processor soft cores. The 10M25 device provides 25K LE of logic fabric, 4 analog-to-digital converters, and dedicated hardware multipliers (18x18) suitable for DSP and motor-control tasks. The non-volatile architecture reduces BOM cost and board area in low-to-mid density designs. Typical applications include industrial control and motor drives, factory automation I/O expansion, video bridging and image processing front-ends, automotive driver assistance subsystems, and portable instrumentation. The 256-ball BGA package supports high I/O count designs while remaining compatible with mainstream PCB assembly processes. When designing with the 10M25, plan for the Quartus Prime toolchain, JTAG or AS configuration modes, and core/IO voltage sequencing. The commercial grade (C8) is intended for 0C to +85C ambient operation; for extended or industrial temperature ranges, consider the I-grade variant.
10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel
The Intel / Altera 10M25DCF256I7G is a MAX 10 family field-programmable gate array (FPGA) integrating 25,000 logic elements, 1,563 LABs/CLBs, and 691,200 bits of embedded SRAM in a 256-ball fine-pitch BGA (F256) package. The device combines a non-volatile FPGA fabric with on-die flash configuration, an integrated ADC block, and 178 user I/O pins, all on a low-cost, single-chip platform. It is specified for the industrial temperature range (-40C to +100C) with the I7G speed/temperature grade. A MAX 10 FPGA is a non-volatile, low-power programmable logic device that belongs to the broader category of FPGAs (Field Programmable Gate Arrays) within the integrated circuit hierarchy: FPGA > programmable logic > digital IC > semiconductor. Unlike SRAM-based FPGAs that require an external boot PROM, MAX 10 devices store their configuration in on-chip flash, enabling instant-on behavior and a single-chip bill of materials. This makes MAX 10 useful as a glue-logic, control, and bridge companion to higher-end processors and ASICs. Key features of the 10M25DCF256I7G include 25K logic elements backed by 1,563 LABs, 691 Kbits of embedded RAM, 4 Mb of user flash memory, integrated 12-bit ADC with up to 17 channels, and 178 general-purpose I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other single-ended and differential I/O standards. Embedded DSP blocks and PLLs provide flexible clock management and signal processing for motor control, sensor fusion, and industrial automation designs. The MAX 10 architecture uses a Look-Up Table (LUT)-based logic fabric with routing switch matrices, on-die flash for configuration and user data, and hard IP blocks such as the ADC and PLLs. The flash-backed configuration gives deterministic power-on behavior (sub-100 ms wake-up) and supports remote field upgrades through standard JTAG or passive serial interfaces, eliminating the need for a separate boot memory. Typical applications include industrial motor and motion control, factory automation I/O expansion, video bridging and display controllers, automotive body electronics and infotainment subsystems, and IoT edge nodes requiring deterministic boot. The integrated ADC also makes the device a strong fit for sensor aggregation and power-conversion control loops. When designing with this part, plan I/O bank assignments early: the F256 package exposes four or more I/O banks, each with its own VCCIO supply; mixing 3.3 V LVCMOS with 1.8 V LVCMOS in the same bank requires level-shifting or careful bank voltage planning. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.