10M16SCU169A7P - MAX 10 FPGA, 16K LE, 169-LFBGA | Intel/Altera
料号： 10M16SCU169A7P ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $40.83 | $40.83 |
| 10 | $38.5 | $385.00 |
| 100 | $32 | $3,200.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $22 | $22,000.00 |
10M16SCU169A7P 概述
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device consisting of an array of programmable logic blocks (LBs), embedded memory blocks (M9K/M144K), DSP blocks, and programmable interconnect fabric. FPGAs sit in the broader category of programmable logic devices (PLDs), which in turn are a branch of digital semiconductors and ASIC alternatives. Unlike fixed-function ASICs, FPGAs implement custom digital logic via SRAM or flash configuration bits, enabling iterative design without mask re-spins and accelerating time-to-market for prototyping, low-volume production, and design verification.
Key features of the 10M16SCU169A7P include 250 MHz maximum internal operating frequency, 45 embedded multipliers (18x18), 2 PLLs, integrated analog-to-digital converter (ADC) blocks, on-chip temperature-sensing diode, and AEC-Q100 automotive qualification. The part supports 1.2 V core operation with multi-voltage I/O banks (1.2 V to 3.3 V) and offers LVDS, LVCMOS, SSTL, and HSTL I/O standards. The MAX 10 architecture pairs FPGA fabric with hard processor system support, Nios II soft-core compatibility, and hardware debug via JTAG.
Typical applications include industrial motor control, automotive driver assistance (ADAS) sensor fusion, factory automation PLCs, video bridge and protocol conversion, LED display controllers, and portable instrumentation. The flash-backed configuration enables deterministic startup within milliseconds, critical for safety-critical and time-sensitive embedded systems.
When designing with the 10M16SCU169A7P, observe 169-LFBGA ball-pitch routing constraints (typically 0.5 mm or 0.65 mm) and provide all four core power rails (VCCINT, VCCA, VCCIO banks). Use the Quartus Prime Lite/Standard toolchain for synthesis, place-and-route, and timing closure. Signal-integrity considerations require matched-length routing for LVDS pairs and proper decoupling close to every power pin.
This page synthesizes distributor inventory, parametric comparisons, drop-in same-package alternatives, and practical Quartus Prime design notes not found in the standalone datasheet.
直接替换替代料： 10M16SCU169A7P ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M16SCU169A7P （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Integrated ADC, PLLs, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
10M16SCU169A7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$30.15 / 个
查看数据手册 →10M16SCU169I7P
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M16SAU169C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$21.4 / 个
查看数据手册 →10M16SAU169I7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$47.5563 / 个
查看数据手册 →10M16SAU169C8G
✅ 直接替换✓ 有现货
$21.4 / 个
查看数据手册 →10M16SCU169A7P 最大额定值与电气特性
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory Bits | 562,176 |
| User I/O Pins | 130 |
| 封装 | 169-LFBGA |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Embedded Multipliers (18x18) | 45 |
| PLLs | 2 |
| Maximum Internal Frequency | 250 MHz |
| Configuration Memory | On-chip flash (non-volatile, dual-config) |
| Operating Temperature Grade | Automotive (AEC-Q100) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Supply Voltage Range | 1.2 V core; 1.2 V to 3.3 V I/O banks |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL |
| Integrated ADC | Yes (hard IP block) |
10M16SCU169A7P 引脚配置
| 引脚 A1 | IO — User I/O ball (function varies by pin assignment) |
| 引脚 B2 | GND — Ground |
| 引脚 C3 | VCCIO — I/O bank supply |
| 引脚 D4 | VCCINT — Core 1.2 V supply |
| 引脚 E5 | IO — User I/O ball |
| 引脚 F6 | TCK — JTAG clock |
| 引脚 G7 | TMS — JTAG mode select |
| 引脚 H8 | TDI — JTAG data in |
| 引脚 J9 | TDO — JTAG data out |
| 引脚 K10 | nCONFIG — Configuration start (active low) |
| 引脚 L11 | nSTATUS — Configuration status (active low) |
| 引脚 M12 | CONF_DONE — Configuration done |
| 引脚 N13 | CLK0 — Dedicated clock input 0 |
| 引脚 P14 | CLK1 — Dedicated clock input 1 |
| 引脚 R15 | DCLK — Configuration clock |
| 引脚 [DATA_NEEDED: complete pinout requires datasheet pin table] | Multiple IO/GND/VCC balls — Full 169-ball LFBGA pin assignment must be verified against the MAX 10 device datasheet. Due to the 169-ball grid this entry summarizes representative balls only. |
典型应用
10M16SCU169A7P 适用于 6 应用s: Automotive ADAS Sensor Fusion, Industrial Motor Control, Factory Automation PLC Backplane, Video Bridge and Protocol Conversion, LED Display Controllers, Portable Test and Measurement.
Automotive ADAS Sensor Fusion
The 10M16SCU169A7P's AEC-Q100 qualification and 16,000 LE fabric make it ideal for pre-processing radar, lidar, and camera sensor streams in ADAS applications. The 250 MHz internal fabric supports real-time data fusion across multiple sensor interfaces, while 45 embedded 18x18 multipliers accelerate FFT and convolution operations used in radar signal processing. The integrated 1.2 V core with multi-voltage I/O banks lets the part interface directly to automotive SerDes, CAN-FD, and FlexRay transceivers without external level shifters. AEC-Q100 grade 2 (-40C to +125C) ensures reliable operation under hood and chassis thermal stress.
推荐
Industrial Motor Control
The 10M16SCU169A7P drives 3-phase brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) control loops with its 250 MHz fabric and 45 hardware multipliers. FOC (field-oriented control) algorithms requiring parallel PID computation and Clarke/Park transforms run comfortably within 16,000 LE, while the dual PLLs generate the high-resolution PWM frequencies demanded by industrial servo drives. On-chip flash configuration enables instant-on deterministic startup - critical for safety-rated machinery. The 130 user I/O pins accommodate multiple encoder inputs (QEP, SSI, BiSS), resolver interfaces, and gate-driver control signals.
推荐
Factory Automation PLC Backplane
Factory PLCs and distributed I/O modules benefit from the 10M16SCU169A7P's 130 user I/O pins, which can be partitioned across multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, RS-485) running concurrently in firmware. The 562 Kbit embedded memory buffer holds protocol frame queues and process I/O images without external SRAM. Dual on-chip configuration flash supports fail-safe firmware update with automatic rollback - essential for Industry 4.0 OTA updates. The integrated temperature-sensing diode enables thermal derating in harsh factory environments.
推荐
Video Bridge and Protocol Conversion
The 10M16SCU169A7P bridges between MIPI CSI-2, LVDS, RGB parallel, and HDMI legacy interfaces in industrial cameras, machine-vision systems, and digital signage. 45 embedded 18x18 multipliers handle color-space conversion (YUV to RGB) and image scaling in real time at 1080p60, while 562 Kbit on-chip RAM buffers line-scan data. The MAX 10's LVDS I/O capability at up to 800 Mbps eliminates external serializer ICs in short-reach links. Hard JTAG and on-chip flash enable remote firmware updates over Ethernet without external boot memory.
推荐
LED Display Controllers
Outdoor LED video walls and architectural lighting controllers leverage the 10M16SCU169A7P's high I/O count (130 pins) to drive multiple HUB75 LED panels in parallel. The 250 MHz fabric supports 16-bit grayscale PWM at 4 kHz refresh rates for flicker-free dimming, while 562 Kbit embedded memory absorbs display-line buffers without external SDRAM. On-chip flash configuration eliminates boot-time glitches - displays reach full brightness within milliseconds of power-up. AEC-Q100 qualification also qualifies this device for transportation displays (rail, aviation).
推荐
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters benefit from the 10M16SCU169A7P's combination of 16,000 LE, integrated ADC blocks, and instant-on flash configuration. The MAX 10's hard ADC simplifies front-end signal acquisition without an external ADC, while 45 multipliers accelerate FFT-based frequency analysis. 130 user I/O pins handle multiple probe channels, trigger I/O, display interfaces, and USB/Ethernet connectivity. Automotive-grade temperature range ensures reliable operation in field-deployed instrumentation across extreme climates.
推荐
推荐产品汇总
工程参考数据： 10M16SCU169A7P ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M16SCU169A7G | 10M16SCU169I7P | 10M16SAU169C8G | 10M16SAU169I7G |
|---|---|---|---|---|---|
| Package | 169-UBGA | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Embedded RAM (bits) | 562,176 | 562,176 | 562,176 | 562,176 | 562,176 |
| Speed Grade | A7 (-7, fastest) | A7 (-7) | A7 (-7) | C8 (-8, slower) | A7 (-7) |
| Temperature Grade | Automotive (AEC-Q100) | Industrial | Industrial | Industrial | Industrial |
| User I/O Count | 130 | 130 | 130 | 130 | 130 |
| Embedded Multipliers | 45 | 45 | 45 | 45 | 45 |
关键差异点
- AEC-Q100 automotive qualification at full 16K LE density （对比 10M16SCU169A7G)
- Fastest A7 speed grade in MAX 10 169-ball family （对比 10M16SAU169C8G)
- Full 130 user I/O count at smallest MAX 10 BGA package （对比 10M16DCF256C8G)
设计说明
The MAX 10 10M16SCU169A7P requires four distinct supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog for PLLs/ADC), and multiple VCCIO bank supplies (1.2 V to 3.3 V). Each VCCIO bank can be set independently to support mixed-voltage I/O. Decoupling requires at least one 0.1 uF MLCC adjacent to every power pin plus bulk 100 uF tantalum/poly caps on each rail. Power-up sequencing requires VCCA before VCCINT to prevent latchup of the analog blocks - Intel Quartus Prime's PowerPlay analyzer provides detailed current estimates per rail.
The 169-UBGA package uses a fine-pitch ball grid (typically 0.5 mm or 0.65 mm pitch depending on MAX 10 density). PCB design requires microvia (laser-drilled) stack-up or via-in-pad technology for signal escape routing. Matched-impedance 50 ohm single-ended and 100 ohm differential routing is mandatory for LVDS channels. Use Intel's MAX 10 Symbol Library in Quartus Prime to generate proper PCB footprint, schematic symbol, and 3D model - do not handcraft the footprint from datasheet figures alone.
Common design pitfalls: (1) Forgetting dual-configuration mode wiring - the 10M16SCU169A7P supports two flash images for fail-safe OTA updates, but you must wire both nCONFIG and CONF_DONE lines correctly; (2) omitting JTAG pull-ups on TCK/TMS/TDI/TDO which causes programming failures; (3) mixing 1.5 V and 1.8 V I/O standards in the same bank without proper bank VCCIO; (4) using the integrated ADC without providing a clean 2.5 V VCCA supply - ADC accuracy degrades sharply below 2.5 V. Always run Quartus Prime's Pin Planner and Power Analyzer before tape-out.
合规信息
AEC-Q100 qualified per automotive-grade 'A7' suffix designation. RoHS and REACH compliance confirmed via Intel product environmental certification documents.
