10M16SAE144C8G - MAX 10 FPGA 16K LE 101 I/O 144-EQFP | Intel
料号： 10M16SAE144C8G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $45.02 | $45.02 |
| 10 | $40.52 | $405.20 |
| 100 | $36.02 | $3,602.00 |
| 500 | $31.51 | $15,755.00 |
| 1,000 | $27.01 | $27,010.00 |
10M16SAE144C8G 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory blocks that can be re-wired by the end user after manufacture to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy, offering hardware-level parallelism and reconfigurability without the NRE cost of an ASIC. The MAX 10 family extends this concept with on-chip non-volatile flash, so the bitstream is retained without an external boot PROM. Within that taxonomy, the 10M16 sits in the low-density tier of MAX 10 devices, targeting glue-logic, I/O expansion, motor control, and industrial interface bridging.
Key features include 16,000 logic elements distributed across 1,000 logic array blocks (LABs), 549 Kbits of embedded memory (M9K blocks), an integrated 3.3 V analog-to-digital converter (ADC), on-die flash for instant-on configuration, and a single 3.0 V/3.3 V supply core. The device exposes 101 user I/O supporting LVCMOS, LVTTL, LVDS, SSTL, and differential standards, and integrates dedicated hardware multipliers (16x16 DSP blocks) for lightweight signal-processing tasks. Internal phase-locked loops (PLLs) support up to eight global clock networks.
The 10M16SAE144C8G is built on a 55 nm TSMC process with embedded flash cells, providing instant-on capability and dual-image configuration in a single chip. The exposed-pad EQFP-144 package is rated for -40 °C to +85 °C commercial operation (C8G speed/temperature grade), giving designers a balance of timing margin and cost for industrial and consumer applications. The die-level flash plus SRAM architecture eliminates the need for external boot devices, reducing BOM and board area.
Typical applications include industrial control and machine I/O expansion, motor drive control and encoder interfacing, LED display and lighting controllers, low-cost video bridging, USB/UART/SPI peripheral expansion, and portable instrumentation front-ends. The integrated ADC is particularly useful in motor-control feedback loops and sensor aggregation nodes.
When designing with this part, ensure that VCCIO bank voltages match the logic levels of attached peripherals, and that the exposed-pad (EP) is soldered to a sufficient copper area (at least 1 sq inch) to meet the thermal resistance of the EQFP-144 package. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the bare datasheet, including same-family variants and cross-brand migration considerations.
直接替换替代料： 10M16SAE144C8G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M16SAE144C8G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Configuration Memory, Integrated ADC, Embedded 18x18 Multipliers.
快速对比工具——选择替代料号进行并排对比：
10M16SAE144I7G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M25SAE144C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$32.4 / 个
查看数据手册 →10M08SAE144C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$16.25 / 个
查看数据手册 →10M16DAE144C8G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LCMXO2-4000HC-4TQFP144
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3LF-4300C-5BG256C
✅ 直接替换📋 参考替代料（不在目录中）
10M16SAE144C8G 最大额定值与电气特性
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements | 16,000 |
| Number of LABs/CLBs | 1,000 |
| Total RAM Bits | 562,176 |
| Embedded SRAM | 549 Kbit (M9K blocks) |
| Number of User I/O | 101 |
| Number of GPIO | 101 |
| Supply Voltage (Core) | 3.0 V / 3.3 V single supply |
| Process Technology | 55 nm TSMC with embedded flash |
| Configuration Memory | Internal dual-configuration flash (non-volatile) |
| Integrated ADC | 12-bit, 1 MSPS (MAX 10 hard IP) |
| 工作温度 | 0 °C to +85 °C (commercial, C8G grade) |
| Speed Grade | 8 (C8G) |
| 封装 | 144-LQFP Exposed Pad (EQFP-144) |
| 安装类型 | Surface Mount |
| Lead-Free / RoHS | Compliant per manufacturer product page |
| 生命周期状态 | Active |
10M16SAE144C8G 144-lqfp exposed pad (eqfp-144) 引脚配置指南
10M16SAE144C8G（144-lqfp exposed pad (eqfp-144) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M16SAE144C8G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M16SAE144C8G 适用于 6 应用s: Industrial Motor Control, LED Display and Lighting Controllers, Industrial I/O Expansion and Glue Logic, Portable Instrumentation and Test Equipment, Automotive Body Electronics and Sensor Aggregation, Video and Display Bridging.
Industrial Motor Control
The 10M16SAE144C8G is well suited to industrial motor control, where its integrated 12-bit 1 MSPS ADC samples phase currents and bus voltage without an external converter, while 16,000 logic elements handle encoder decoding (QEP), field-oriented control (FOC) loops, and PWM generation. Placed between the power stage and the host MCU, it offloads real-time control tasks at deterministic hardware latency, freeing the MCU for supervisory HMI and networking duties. Compared with a software-only implementation on a microcontroller, the MAX 10 reduces interrupt latency and CPU load by up to 70% in field-oriented control loops running at 20 kHz.
推荐
LED Display and Lighting Controllers
The 10M16SAE144C8G drives multi-channel LED displays and architectural lighting fixtures by leveraging its 101 user I/O pins, each capable of high-speed LVCMOS signaling to FET drivers. With 16K LE, designers can implement per-pixel PWM at refresh rates above 4 kHz, eliminating visible flicker in DMX-512 or SPI-driven LED strips. The non-volatile flash allows instant-on behavior on power-up with no boot delay, critical for emergency lighting and signage. This combination of high I/O count and on-die flash makes the 10M16 a strong fit over discrete 74HC logic for medium-density lighting arrays.
推荐
Industrial I/O Expansion and Glue Logic
The 10M16SAE144C8G is widely used as I/O expansion and protocol-bridging glue logic in industrial PCs, PLCs, and embedded SBCs. It can translate between UART, SPI, I2C, parallel bus, and proprietary protocols at wire-speed without CPU intervention. With 101 user I/O, a single MAX 10 can replace multiple 74-series logic ICs, reducing PCB area and BOM cost. The integrated dual-configuration flash enables in-field firmware updates with failsafe fallback, a feature rarely found in discrete logic implementations.
推荐
Portable Instrumentation and Test Equipment
For portable oscilloscopes, data loggers, and bench instruments, the 10M16SAE144C8G combines signal acquisition, on-die ADC, and real-time DSP in a single low-power chip. Its integrated 12-bit ADC handles trigger and threshold detection, while 16K LE runs FIR filters, FFT pre-processing, and display refresh. The 55 nm flash process keeps active power below 200 mW typical, and the non-volatile configuration eliminates boot-time delays for handheld instruments that must start instantly when the user presses the power button.
推荐
Automotive Body Electronics and Sensor Aggregation
The 10M16SAE144C8G aggregates multiple sensor inputs (temperature, pressure, position) in body control modules and small sensor hubs, replacing several discrete microcontrollers and ADCs with a single chip. Its 16K LE handles CAN/LIN message filtering and PWM actuator control, while the integrated 12-bit ADC reads analog sensors directly. Designers should select the industrial or automotive MAX 10 variant for under-hood or chassis deployments; the standard C8G grade is suitable only for cabin and infotainment applications where ambient temperature stays within 0-85 °C.
推荐
Video and Display Bridging
The 10M16SAE144C8G bridges legacy parallel RGB or LVDS displays to modern MIPI-DSI or HDMI sources in industrial HMIs and kiosks. Its 16K LE is sufficient for color-space conversion and pixel-rate FIFO buffering, and the 549 Kbit embedded RAM acts as line buffers for deinterlacing or scaling. Designers targeting multi-lane LVDS benefit from the device's LVDS-capable I/O bank, eliminating external serializer/deserializer chips. Compared with an ASSP bridge, the MAX 10 offers programmable timing margins and quick customization for non-standard display resolutions.
推荐
推荐产品汇总
工程参考数据： 10M16SAE144C8G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M16SAE144I7G | 10M25SAE144C8G | 10M08SAE144C8G | 10M16DAE144C8G | LCMXO2-4000HC-4TQFP144 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP (TQFP-144) - same footprint, exposed-pad variants available |
| Logic Elements | 16,000 | 16,000 | 25,000 (+56%) | 8,000 (-50%) | 16,000 | 4,000 LUTs (-75%) |
| Embedded RAM | 549 Kbit (562,176 bits) | 549 Kbit | 675 Kbit (+23%) | 378 Kbit (-31%) | 549 Kbit | 92 Kbit (-83%) |
| User I/O | 101 | 101 | 101 | 101 | 101 | 115 (+14%) |
| Temperature Grade | Commercial 0 °C to +85 °C | Industrial -40 °C to +100 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C |
| Speed Grade | 8 | 7 (faster) | 8 | 8 | 8 | 4 |
| Integrated ADC | 12-bit 1 MSPS (MAX 10 hard IP) | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | None |
| Configuration Memory | Internal dual-image flash (non-volatile) | Internal dual-image flash | Internal dual-image flash | Internal dual-image flash | Internal dual-image flash | Internal flash (single image) |
关键差异点
- Higher logic density in the same EQFP-144 footprint （对比 10M08SAE144C8G)
- Integrated 12-bit ADC eliminates external converter （对比 LCMXO2-4000HC-4TQFP144)
- Dual-image flash for failsafe field updates （对比 LCMXO2-4000HC-4TQFP144)
设计说明
Solder the exposed thermal pad (EP) of the EQFP-144 package to a continuous ground copper pour with at least 1 square inch of area to meet the package thermal resistance rating. The EP is electrically tied to GND inside the package; missing or insufficient EP soldering raises junction temperature and may cause thermal shutdown under high I/O switching loads. Add thermal vias (0.3 mm drill, 1.2 mm pitch, 4x4 array minimum) beneath the EP to inner ground planes for improved heat spreading.
Decouple each VCC and VCCIO supply pin with a 0.1 µF X7R ceramic capacitor placed within 2 mm of the pin, plus a bulk 10 µF tantalum or polymer capacitor per power rail. MAX 10 FPGAs have multiple VCCIO banks; tie each bank to its own regulator or filter if mixing 3.3 V and 1.8 V logic. Use the Intel Quartus Prime PowerPlay tool to estimate dynamic current, which scales with toggle rate and is often underestimated during early design.
Do not assume the MAX 10 E144 footprint is pin-compatible across all density variants; the 10M04/10M08/10M16/10M25 E144 packages share the same pinout but differ in I/O count and pin function. Always re-run Quartus pin assignments when migrating between densities. Also note that JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) have fixed pin locations and cannot be reassigned as user I/O in user mode.
合规信息
RoHS and lead-free status confirmed per Altera/Intel product page. REACH, halogen-free, and conflict-mineral compliance not explicitly listed in the verified web data. The MAX 10 10M16SAE144C8G is a commercial-grade part and is not AEC-Q100 qualified; for automotive deployments, consult Intel's automotive-grade MAX 10 variants.