FPGA与CPLD
产品（6666)
10M40SAE144C8G - 40K LE MAX 10 FPGA, 144-EQFP, 8 Transceivers | Intel
The Intel (formerly Altera) 10M40SAE144C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) in the 144-pin EQFP (E144, 22x22 mm, 0.50 mm pitch) package with exposed thermal pad. It integrates 40,000 logic elements, 1,290,240 bits of embedded SRAM, 51 M9K blocks, 156 (18x18) multipliers, and 8 high-speed LVDS-capable transceiver channels (GXB), making it one of the highest-density MAX 10 options available in the 144-EQFP footprint. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable interconnects, and embedded memory/DSP slices that the designer can reconfigure after manufacture. FPGAs sit in the digital IC hierarchy as programmable logic -> programmable IC -> digital logic IC -> integrated circuit. The MAX 10 family specifically adds a non-volatile flash configuration cell and an integrated ADC, blurring the line between FPGA and microcontroller+glue-logic designs. Key features include instant-on non-volatile configuration, an integrated 12-bit SAR ADC up to 1 MSa/s, 101 user I/O, dual-purpose configuration pins, 3.3 V LVCMOS/LVTTL support, and a hardened Nios II-ready embedded block. The 10M40 variant targets cost-sensitive, high-volume applications that still require substantial logic, DSP, and memory resources without an external configuration memory device. Architecturally, the 10M40SAE144C8G uses Altera/Intel's low-power 55 nm embedded-flash process. Logic elements are organized into Logic Array Blocks (LABs) of 16, and 18x18 multipliers feed dedicated DSP blocks. The non-volatile configuration memory eliminates boot-time delay and provides field-upgradeable bitstream storage inside the part. Typical applications include industrial machine vision and motor control, factory automation PLCs, video bridging and image processing, low-cost software-defined radio front ends, and automotive infotainment subsystems. The integrated ADC and DSP blocks are particularly attractive for sensor fusion and closed-loop control designs. When designing with this device, pay close attention to LVDS/PCB-layout constraints (impedance-controlled differential pairs) and ensure the exposed pad is soldered to a sufficiently large ground copper pour to meet the device's thermal envelope. Quartus Prime Prime Lite is the free toolchain that supports this part family. This page synthesizes distributor pricing, drop-in same-package alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
10M40SAE144I7G - MAX 10 FPGA, 40K LE, 144-LQFP | Intel / Altera
The Intel (formerly Altera) 10M40SAE144I7G is a non-volatile MAX 10 field-programmable gate array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded user flash memory, and 101 user I/Os in a 144-pin LQFP (EQFP-144) package with exposed pad. Built on a 55 nm process node, it delivers single-chip instant-on operation with on-die configuration storage, eliminating the external boot flash typically required for SRAM FPGAs. A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration data, enabling hardware-level parallelism for digital glue logic, control, signal processing, and protocol bridging. Within the broader semiconductor taxonomy, an FPGA sits alongside microcontrollers, ASICs, and CPLDs as a programmable-logic device (PLD), and the MAX 10 family specifically targets low-power, cost-sensitive, non-volatile applications with integrated analog and DSP blocks. Key features of the 10M40SAE144I7G include an embedded 12-bit analog-to-digital converter (ADC), 168 (18x18) multipliers, 5,140 Kbits of embedded SRAM, and dual-configuration flash supporting remote field updates. The -7 industrial speed grade (I7G suffix) is rated for the -40 C to +100 C industrial junction temperature range with -7 timing performance. The device is supported by the Quartus Prime design software and offers LVDS, LVCMOS, PCI, and SSTL I/O standards for flexible system integration. The 10M40SAE144I7G architecture combines a logic array block (LAB) fabric with embedded memory blocks (M9K), DSP blocks, and a hardened ADC subsystem. Compared with SRAM-based FPGAs that require external boot memory, the on-die flash reduces board area, BOM count, and boot latency, while the dual-boot image capability enables fail-safe field upgrades. Internal regulators derive core voltages from a single external supply, simplifying power tree design. Typical applications include industrial motor control, factory automation I/O expansion, video bridge and image preprocessing, portable medical instrumentation, and LED display controllers. The exposed-pad EQFP-144 package provides adequate thermal dissipation for moderate-power designs without an external heatsink, while the generous I/O count supports parallel buses and high-channel-count interfaces. When designing with the 10M40SAE144I7G, observe the maximum supported configuration clock frequency, ensure the exposed pad is soldered to a sufficient copper pour for thermal relief, and follow Quartus Prime pin connection guidelines for unused and JTAG pins to reach the datasheet-specified I/O timing. Industrial-grade -7 parts typically yield the best balance between timing margin and price. This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right logic density, speed grade, and temperature grade for their application.
10M40SCE144A7G - MAX 10 FPGA, 40K LE, 144-EQFP | Intel
The Intel 10M40SCE144A7G is a member of the MAX 10 FPGA family integrating 40,000 logic elements, 1,290,240 bits of embedded memory, and a 144-pin EQFP (LQFP with exposed pad) package rated for the automotive temperature grade. The device delivers up to 472.5 MHz internal operation from a 1.2 V core supply and exposes 101 user I/O pins with LVDS/PCIe/EMIF support. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and programmable interconnect. FPGAs sit between fixed-function ASICs and software-driven microcontrollers: they offer hardware-timed parallelism and deterministic latency, while still being re-programmable in the field. The MAX 10 family specifically adds integrated features such as analog-to-digital converters, flash configuration memory, and on-chip voltage regulators - reducing BOM cost and enabling single-chip non-volatile logic designs. Key differentiating features of the 10M40SCE144A7G include dual-configuration flash with instant-on support, embedded 18x18 multipliers for DSP, dedicated hardware for I/O interfaces (such as LVDS and LPDDR2 external memory), and a hardened analog block for sensor monitoring. The 55 nm process node provides a balance of static power and logic density. Compared with SRAM-based FPGAs that require external boot memory, the on-die flash eliminates a discrete PROM and simplifies board layout. Architecturally, the 10M40 uses a logic-element (LE) fabric built from 4-input look-up tables (LUTs) with adjacent register bits, interconnected by a multi-tier routing network. The device incorporates embedded SRAM (M9K and M144K blocks), variable-precision DSP blocks, and a hardened PCIe Gen2 controller. The on-die dual-configuration flash supports remote field updates via JTAG, AS, or PS modes, enabling in-system reprogramming without external boot components. Typical applications for the 10M40SCE144A7G include industrial motor control, automotive body electronics, low-cost video processing bridges, I/O expansion and protocol bridging for SoCs, and small-format ASIC prototyping. The integrated ADC block also suits battery management and analog sensor aggregation in distributed systems. When designing with the 10M40SCE144A7G, note that the EQFP exposed pad must be soldered to the PCB ground plane for thermal and electrical performance. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. Configuration pins (JTAG/AS) must be correctly terminated for reliable boot. This page consolidates distributor pricing, drop-in MAX 10 alternative devices sharing the 144-EQFP footprint, and practical Quartus design notes beyond the datasheet.
10M40SCE144C8G - MAX 10 FPGA 40K LE 144-EQFP | Intel / Altera
The Intel / Altera 10M40SCE144C8G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and a 144-pin EQFP package with exposed thermal pad. The device delivers up to 101 user I/O pins and belongs to the MAX 10 family, which is the industry's first non-volatile single-chip FPGA with integrated ADC and instant-on support. Speed grade C8 places it in the standard-performance commercial temperature tier. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as memory, multipliers, transceivers, and PHYs. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, glue functions, custom peripherals, or full processor subsystems, which makes them ideal for low-to-medium volume designs, prototyping, and field-upgradable products. Key specifications of the 10M40SCE144C8G include 40K logic elements, 1.29 Mbit user flash, integrated dual 12-bit ADCs with up to 17 analog inputs, and a hard DDR3 memory interface supporting LPDDR2/DDR2/DDR3. The MAX 10 family integrates a flash configuration memory on-chip, eliminating the need for external boot PROMs and enabling instant-on functionality within milliseconds of power-up. The 144-EQFP exposed-pad package supports industrial-grade thermal performance with a junction-to-ambient resistance suitable for fan-less embedded systems. Typical applications include industrial motor control and machine vision, automotive driver assistance, factory automation, video bridging and display controllers, IoT edge nodes, and low-power portable designs. The integrated ADC makes the MAX 10 particularly attractive for sensor aggregation boards where an external ADC would otherwise be required. When designing with this device, ensure the exposed pad is soldered to a sufficient copper pour (typically 1 in² minimum) to meet the package's thermal resistance specification and avoid thermal throttling under sustained switching activity.
10M40SCE144I7G - MAX 10 FPGA, 40K LE, 144-LQFP | Intel | Altera
The Intel (formerly Altera) 10M40SCE144I7G is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded user flash, and 101 general-purpose I/O pins in a 144-pin LQFP Exposed Pad (EQFP) package. It is fabricated on a low-power 55 nm process, supports a core voltage of 1.2 V, and operates across the industrial -40 °C to +100 °C junction temperature range. According to the MAX 10 datasheet, the device integrates dual-configuration flash, ADC blocks, and DSP blocks alongside programmable logic fabric, eliminating the need for an external boot PROM. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that lets designers implement arbitrary digital logic using configurable logic blocks (LBs/LEs), programmable interconnects, and hardened I/O peripherals. Within the broader taxonomy, an FPGA sits under programmable logic -> logic ICs -> integrated circuits. The MAX 10 family is unique among FPGAs because it integrates non-volatile configuration memory on-die, making it a single-chip instant-on solution comparable in workflow simplicity to a microcontroller but with far higher parallel logic capacity and DSP throughput. Key differentiating features of the 10M40SCE144I7G include 40,000 logic elements (about 50 % more than the 10M25 and roughly 2.5× the 10M16), 1,290,240 bits (≈ 160 KB) of user flash for embedded storage, an embedded 12-bit ADC, integrated PLLs, and 101 user I/O. The 'C' speed grade and 'E144' package designator identify the commercial timing grade and the 144-pin LQFP exposed-pad form factor, while the 'I7' suffix denotes the industrial temperature grade. Multipliers and DSP blocks support up to 472.5 MHz operation, suitable for high-speed glue logic and signal processing. Architecturally, the device uses look-up-table (LUT)-based logic elements, embedded SRAM arranged as M9K blocks, and dual-configuration flash that supports remote field upgrades. The exposed-pad package enables efficient heat removal through PCB copper pour, allowing the industrial-grade silicon to operate continuously at full toggle rate without thermal throttling in well-designed boards. Typical applications include industrial motor control and factory automation, video bridging and display controllers, I/O expansion and protocol bridging (I2C/SPI/UART to parallel), low-cost digital signal processing front-ends, and portable instrumentation. The combination of non-volatile boot, ADC, and ample logic makes the 10M40 especially attractive for replacing multiple discrete CPLDs and microcontrollers with a single chip. When designing with the 10M40SCE144I7G, ensure the four JTAG configuration pins (TCK, TMS, TDI, TDO) and the nCONFIG/nSTATUS configuration pins are routed cleanly and that the exposed thermal pad is soldered to a copper pour of at least 1 sq. inch for thermal relief. Quartus Prime is the supported development toolchain for this device family.
10M50DAF256C8G - MAX 10 FPGA 50K LE 256-FBGA | Intel
The Intel (formerly Altera) 10M50DAF256C8G is a MAX 10 family Field Programmable Gate Array (FPGA) providing 49,760 logic elements, 1,677,312 bits of embedded SRAM, and 178 maximum user I/Os, housed in a 256-ball FineLine BGA package. It is a non-volatile, single-chip programmable logic device fabricated on a 55 nm process and supplied from a 1.2 V core rail with on-chip voltage regulation. MAX 10 FPGAs are low-cost, non-volatile PLDs that integrate the optimal set of system components typically found around an FPGA. They embed flash configuration memory, a hardened ADC block, dual-configuration flash, and instant-on support on a single die, eliminating the need for an external boot PROM. Architecturally, MAX 10 belongs to the programmable logic hierarchy (FPGA -> programmable logic device -> logic IC -> integrated circuit) and is positioned as a bridge between small CPLDs and higher-density Cyclone devices. Key features include 50 K logic elements (LEs), 1,677 Kb (bits) of user flash, 312 18x18 multipliers, a 12-bit 1 MSPS ADC, on-chip temperature sensing, and integrated PLL blocks. The 256-FBGA (F256) package supports industrial temperature grades (the C8G speed/temperature code denotes commercial 8 ns timing) and exposes LVDS, LVTTL, and LVCMOS I/O standards. Internal configuration is achieved via embedded flash, giving instant-on behavior with no external boot device. Typical applications include industrial I/O expansion and bridging, motor control and drive interfacing, video processing pipelines, low-cost prototyping for ASIC replacement, and I/O-aggregation in factory automation modules. The integrated ADC is well suited to sensor fusion and analog front-end monitoring on a single board, while the embedded flash enables remote firmware updates with no external memory. When designing with the 10M50DAF256C8G, follow Intel PCB layout guidelines for the F256 package: route decoupling capacitors as close to each power pin pair as possible, provide a continuous ground plane beneath the BGA, and use at least 6 PCB layers with stitched ground vias for signal integrity. Designers should also plan thermal management; the F256 package has a moderate junction-to-ambient thermal resistance and may require airflow for high-utilization designs. This page synthesizes distributor pricing (as of 2026-09-05), same-package drop-in alternatives within the MAX 10 family, and practical design notes not consolidated in the manufacturer datasheet.
10M50DAF256I7G - MAX 10 FPGA, 50K LE, 178 I/O, 256-BGA | Intel
The Intel (formerly Altera) 10M50DAF256I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 178 user I/Os, housed in a 256-ball LBGA (17 mm x 17 mm) package. It operates across the industrial temperature range (-40C to +100C) and integrates a 12-bit successive-approximation ADC, dual-configuration flash, and on-chip voltage regulators that eliminate external supply sequencing in most designs. What is a MAX 10 FPGA? The MAX 10 is Intel's non-volatile FPGA family that embeds flash configuration memory and analog blocks directly on-chip, positioning it between traditional SRAM-based FPGAs and CPLDs. Within the broader programmable-logic hierarchy, MAX 10 sits below Cyclone in cost and below Stratix in performance, targeting mid-volume industrial, automotive, and consumer applications where instant-on, single-chip integration, and small footprint outweigh the need for high-end transceivers or DSP density. Key features include 50,000 logic elements (LE), 1,677,312 bits of embedded memory in M9K blocks, 4 DSP blocks implementing 18 x 18 multipliers, up to 178 user I/Os, an integrated 12-bit SAR ADC with up to 17 analog inputs, dual-boot flash for fail-safe field updates, and on-chip PLLs for clock management. The 256-pin LBGA exposes LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, and the device is supplied from a single 1.2 V core rail plus an auxiliary analog rail. Architecturally, the 10M50DAF256I7G is fabricated on a TSMC 55 nm embedded-flash process that places non-volatile configuration cells alongside the SRAM logic fabric. This eliminates the external boot PROM required by SRAM FPGAs and enables instant-on operation in less than 10 ms - critical for industrial motor control, factory automation, and human-machine interface (HMI) applications. The dual-configuration flash also supports remote field upgrades and rollback, simplifying long-term maintenance for deployed systems. Typical applications include industrial motor-control and drive electronics, factory-automation I/O modules, video bridging and display controllers, automotive driver-assistance subsystems, and low-cost IoT edge-node prototyping. The integrated ADC and DSP blocks also make the device suitable for sensor-fusion front ends and condition-monitoring systems. When designing with this part, ensure PCB layout uses the full BGA fanout with microvia escape routing, and that the integrated ADC analog supply (VCCA) is filtered and decoupled per Intel's MAX 10 hardware design guidelines. JTAG or USB-Blaster download cables are used for programming via Quartus Prime. This page consolidates distributor pricing, true drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing information gain above stock catalog listings.
10M50DAF484C7G - MAX 10 FPGA 50K LE, 484-BGA | Intel / Altera
The Intel (formerly Altera) 10M50DAF484C7G is a non-volatile MAX 10 field-programmable gate array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 312 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA package. The device operates from a 1.2 V core supply and offers 360 general-purpose user I/O pins, making it one of the highest-density members of the MAX 10 family. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as PLLs, memory blocks, and serializer/deserializer blocks. Within the broader semiconductor taxonomy, an FPGA sits at the apex of programmable logic devices, above complex programmable logic devices (CPLDs) and below ASICs in performance per watt. The MAX 10 family uniquely integrates a dual-configuration flash, analog-to-digital converters (ADCs), and DDR3 memory controllers, blurring the line between traditional FPGAs and system-on-chip (SoC) devices. Key features of the 10M50DAF484C7G include 50K logic elements (LEs), 1,677,312 bits (approximately 1.6 Mbit) of user flash memory, an integrated 12-bit successive-approximation ADC with up to 17 external channels, and two integrated PLLs per device. The non-volatile flash-based configuration eliminates the need for an external boot PROM, reducing BOM cost and board area. The 484-FBGA package provides a compact 23 mm x 23 mm footprint with 1.0 mm ball pitch, suitable for space-constrained industrial and embedded designs. Architecturally, the device is built on a 55 nm embedded flash CMOS process, balancing cost, density, and low static power consumption. The LAB (Logic Array Block) structure organizes 50 LEs per block, feeding a rich interconnect fabric. Embedded memory blocks (M9K) deliver true dual-port RAM at speeds up to 315 MHz, while DSP blocks enable up to 18 x 18 integer or 27 x 27 fixed-point multiply-accumulate operations per block. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, sensor aggregation hubs, portable test and measurement instruments, and as a glue-logic replacement for legacy CPLD/ASIC designs. Designers also adopt the MAX 10 for its instant-on capability in system bring-up and for board management controllers in larger computing platforms. When designing with this device, ensure the PCB footprint accommodates the 1.0 mm pitch BGA and that thermal vias are placed under the exposed die pad. Quartus Prime software (Intel FPGA Edition) is the supported design entry, synthesis, and place-and-route toolchain. Designers migrating to higher density should verify I/O count and package compatibility using Intel's MAX 10 vertical migration guide. This page synthesizes distributor pricing, drop-in MAX 10 alternative MPNs, and practical design notes not found in the manufacturer datasheet alone.
10M50DAF484I7G - MAX 10 FPGA 50K LE 484-FBGA Industrial | Intel
The Intel (formerly Altera) 10M50DAF484I7G is a non-volatile MAX 10 Field Programmable Gate Array integrating 50,000 logic elements, 1,677,312 bits of embedded SRAM, and a 360-pin user I/O count in a 484-ball FineLine BGA package. It is the industrial temperature grade variant (I7G) of the MAX 10 10M50 device class and targets cost-sensitive, low-power, instant-on applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and dedicated hardened IP blocks such as PLLs, transceivers, multipliers, and (in MAX 10) an on-die dual-configuration flash and ADC. Within the broader taxonomy, the MAX 10 belongs to Intel's low-density, non-volatile FPGA family, sitting below Cyclone V/10 and above MAX II/MAX V. It bridges the gap between CPLDs and traditional SRAM-based FPGAs by eliminating external boot memory, simplifying board design and reducing BOM cost. Key features include 50K logic elements, 312 Kbits (1,677,312 bits) of embedded user flash, dual on-die configuration flash for instant-on operation, an integrated 12-bit 1 MSPS ADC with up to 18 analog inputs, and a wide variety of I/O standards (LVDS, LVCMOS, SSTL, HSTL) on 360 user I/O pins. The device supports Nios II soft-core embedded processors and is programmable via the Quartus Prime design software. The MAX 10 architecture pairs an SRAM-based logic fabric with non-volatile on-die flash, allowing single-chip configuration in under 10 ms and dual-boot for fail-safe field upgrades. Hardened IP includes PLLs, embedded multipliers (DSP blocks), memory controllers, and the unique analog-to-digital converter subsystem that eliminates external mixed-signal ICs. Typical applications include industrial motor control, factory automation I/O hubs, portable test and measurement equipment, video bridging for surveillance and broadcast, automotive driver assistance subsystems (with the AEC-Q100 qualified -A7G grade), and low-cost display controllers. The on-die flash and ADC make MAX 10 especially attractive for system-level designs requiring minimum component count. When designing with the 484-pin FBGA variant, pay close attention to PCB stackup and microvia capability, since the 1.0 mm pitch and 23x23 mm body require controlled-impedance escape routing. Power sequencing on the VCCIO banks must follow the Intel pin connection guidelines to avoid in-rush latch-up. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not aggregated on any single manufacturer page.
10M50DAF484I7P - MAX 10 FPGA 50K LE, 484-BGA | Intel / Altera
The Intel (formerly Altera) 10M50DAF484I7P is a MAX 10 field-programmable gate array (FPGA) delivering 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 360 user I/O pins in a 484-ball FineLine BGA package with industrial temperature grade. Built on TSMC's 55 nm embedded flash process, the device integrates a hard dual-configuration flash controller, instant-on support, and on-die analog-to-digital conversion that historically required a separate companion chip. The variant suffix "I7" denotes the industrial -40C to +100C ( Tj) operating range and the "7" speed grade for the slowest-but-most-margin industrial timing bin. A field-programmable gate array (FPGA) is a reconfigurable logic device composed of programmable logic elements (LEs), embedded memory blocks (M9K/M144K), DSP blocks, and a programmable interconnect fabric. MAX 10 is Intel's non-volatile small-form-factor FPGA family, positioned between discrete CPLDs and higher-density Cyclone/Arria parts, and falls within the broader taxonomy: FPGA -> programmable logic -> digital logic IC -> integrated circuit -> semiconductor. The MAX 10 family is intended as a single-chip replacement for CPLD-plus-ASIC or CPLD-plus-external-memory designs, replacing multiple legacy ICs with one programmable part. Key features include 50K logic elements, 312 embedded multipliers (18x18), two on-die 12-bit ADCs (1 MSPS), internal configuration flash, and dual-boot image support with remote system upgrade capability. The F484 package exposes 360 general-purpose user I/Os plus 16 high-speed LVDS pairs and 8 transceiver-less PLLs. Integrated flash eliminates an external boot PROM, reducing bill-of-materials cost and PCB area, while the hard ADC blocks enable analog sensor monitoring without an external MCU ADC. The MAX 10 architecture pairs a 4-input LUT-based logic fabric with column-based M9K memory blocks (1,677 Kbits total) and dedicated 18x18 multipliers for DSP workloads. The TSMC 55 nm embedded flash process gives the part single-chip non-volatility - configuration is retained through power cycles without external storage, enabling instant-on behavior. The hard ADC is a 12-bit successive-approximation type with up to 16 analog inputs multiplexed, useful for industrial monitoring and motor-control feedback. Typical applications include industrial motor control (the ADC samples shunt current directly), factory automation I/O expansion, low-cost video bridging, portable medical instrument front-ends, and IoT edge nodes with on-board sensor aggregation. Designers also use MAX 10 as a glue-logic replacement that consolidates CPLD, boot PROM, and external ADC functions onto one chip. When designing with the F484 package, ensure the PCB layout supports at least eight PCB layers to route all 360 I/O balls out of the 1.0 mm pitch BGA; thermal management is passive and rarely requires a heatsink because the device rarely operates above a few hundred mW unless all DSP blocks are saturated. Plan the JTAG and configuration pinout early - the dual-boot image selector and CONF_DONE LEDs are usually brought to test points for factory programming. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet alone.
10M50DAF672C7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel/Altera
The Intel/Altera 10M50DAF672C7G is a MAX® 10 non-volatile FPGA delivering 50,000 logic elements (LE) in a 672-ball FineLine BGA (FBGA) package, fabricated on a 55 nm process and supplied at a 1.2 V core voltage. According to the manufacturer product page, the device integrates dual-configuration flash, on-chip ADC blocks, and embedded SRAM of approximately 1,677,312 bits (1,638 Kbit user flash plus SRAM resources) in a single chip-scale BGA solution. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose interconnect and function blocks can be reconfigured after manufacture. MAX 10 FPGAs belong to Intel's non-volatile family that combines logic fabric with on-chip flash for instant-on operation, positioning them between small CPLDs and larger Cyclone/Stratix families in the programmable-logic taxonomy: programmable logic -> FPGA -> non-volatile FPGA -> low-power FPGA family. Key features of the 10M50DAF672C7G include 500 logic array blocks (LAB), 1,677,312 total memory bits, integrated 12-bit ADC blocks, dual-boot flash configuration support, and DSP blocks for fixed-point arithmetic. The 672-FBGA package provides high I/O density for parallel interfaces, while the commercial temperature grade targets industrial and embedded applications. Technically, the device uses a non-volatile SRAM-backed architecture with embedded flash that loads configuration at power-on in microseconds - far faster than external-boot FPGAs. The 55 nm process balances power and cost, while the integrated ADC and analog blocks allow mixed-signal designs without external converters. Typical applications include industrial motor control, factory automation I/O expansion, portable medical instrumentation, low-cost video bridging, and embedded vision pre-processing where instant-on, mixed-signal, and parallel I/O are required. When designing with this FPGA, allocate sufficient PCB area for the 672-ball FBGA fanout and follow Intel's MAX 10 power-sequencing guidelines; the C7 speed grade offers balanced timing closure for most embedded workloads. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M50DAF672C8G - MAX 10 FPGA 50K LE 672-BGA | Intel / Altera
The Intel (formerly Altera) 10M50DAF672C8G is a MAX 10 non-volatile FPGA integrating 50,000 logic elements (LE), 1,677,312 bits of embedded SRAM, and a 500 I/O count in a 672-ball FineLine BGA package. Built on a 55 nm TSMC process, the device operates from a 1.2 V core supply and integrates a hardened flash configuration block, dual ADCs, and embedded multiplier blocks, making it one of the highest-density instant-on FPGAs in the MAX 10 family. The C8 speed grade corresponds to the commercial -8 performance tier. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric and routing can be reconfigured after manufacture by the end user. In the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) and sits alongside CPLDs in the digital logic IC family. Unlike an ASIC, an FPGA offers rapid prototyping and field upgrades, while MAX 10 devices add non-volatile flash configuration that enables instant-on behavior without an external boot PROM - ideal for cost- and board-space-constrained industrial designs. Key specifications of the 10M50DAF672C8G include 50,000 logic elements, 1,677,312 bits (~1.6 Mb) of user SRAM, 500 maximum user I/O pins, embedded 18x18 multipliers, and dual 12-bit successive-approximation ADCs. The device integrates flash configuration memory on-chip, eliminating external boot components. Internal PLLs support multiple clock domains, and the 672-ball FineLine BGA package provides high pin density for I/O-rich designs. Architecturally, MAX 10 uses a Logic Array Block (LAB) fabric composed of adaptive logic modules (ALMs), interconnected by a MultiTrack routing architecture. The embedded flash array stores the configuration image, enabling sub-100 ms power-to-functional startup. The dual on-chip ADCs sample up to 16 analog channels, supporting sensor monitoring and digital system management directly inside the FPGA. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, automotive driver-assistance subsystems, and portable instrumentation. The instant-on, single-chip architecture suits designs where deterministic power-up and small PCB area outweigh the need for the largest logic capacity. When designing with this FPGA, plan bank voltage compatibility carefully. Each I/O bank operates at an independent VCCIO, and mixing 1.8 V, 2.5 V, 3.3 V, and 1.5 V interfaces requires deliberate bank assignments. Verify Quartus Prime pinout assignments against the chosen board layout before tape-out. This page synthesizes Intel/Altera datasheet specs, distributor pricing tiers, drop-in same-package alternatives from the MAX 10 family, and practical Quartus Prime design notes that manufacturer datasheets do not aggregate in one place.
10M50DAF672I7G - MAX 10 FPGA 50K LE, 672-FBGA | Intel / Altera
The Intel / Altera 10M50DAF672I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) integrating 50,000 logic elements (LE), 1,677,312 bits of embedded SRAM, and 500 maximum user I/O pins in a 672-ball FineLine BGA package (27 mm × 27 mm, 1.0 mm pitch). It is fabricated on a low-power 55 nm CMOS process and operates from a 1.2 V core supply with on-die Flash configuration memory, eliminating external boot PROMs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by a user-defined bitstream. Modern FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below custom ASICs, and are deployed when designers need hardware-level parallelism, deterministic latency, and post-production reconfigurability. The MAX 10 family further integrates hard IP such as ADCs, PLLs, and DDR3 memory controllers, bridging the gap between traditional FPGAs and microcontrollers. Key features of the 10M50DAF672I7G include 50,000 logic elements, 1,677,312 M9K bits of embedded memory, 144 (18×18) multipliers, 4 PLLs, 2 hard memory controllers, dual-configuration Flash, and a 12-bit successive-approximation ADC. The 672-FBGA package delivers 500 user I/Os at a 1.0 mm pitch, enabling dense board-level integration for industrial, automotive, and communication platforms. Architecturally, the device combines a low-power 55 nm logic fabric with on-die Flash and a hardened DSP/memory hierarchy, achieving deterministic real-time performance typical of FPGAs while simplifying board design (no external boot memory). The integrated ADC and PLLs make it well suited for sensor aggregation and motor-control signal chains. Operating junction temperature spans –40 °C to +100 °C (industrial, "I7G" suffix). Typical applications include industrial motor control, factory-automation I/O hubs, video-bridging and display controllers, low-cost ASIC prototyping, and embedded-vision edge nodes. Designers also deploy the part in industrial IoT gateways and portable instrumentation where Flash-based instant-on and integrated analog reduce BOM cost. When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation, and respect the 1.0 mm BGA ball pitch during PCB layout—escape routing requires microvia HDI stack-ups. Validate signal-integrity for DDR3 interfaces and observe the device's 1.2 V core-rail decoupling guidelines. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel
The Intel (formerly Altera) 10M50DCF256A7G is a MAX 10 family Field Programmable Gate Array delivering 50,000 logic elements (LE) in a 256-ball FineLine BGA (FBGA-256, 17 x 17 mm, 1.0 mm pitch) package, with 178 user I/O pins and 1,677,312 bits of embedded user flash memory. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and software-driven microcontrollers: an FPGA delivers hardware-timed parallelism and deterministic latency that microcontrollers cannot, while remaining re-spinable like software. Within Intel's portfolio, the MAX 10 family is a non-volatile, low-cost, single-chip tier positioned above CPLDs and below Cyclone/Cyclone V in density, and is built on a 55 nm TSMC process node. Key feature of this OPN is its on-chip flash configuration memory: unlike SRAM-based FPGAs that require an external boot PROM, the 10M50DCF256A7G stores its configuration in 1,677,312 bits of embedded flash, enabling instant-on single-chip operation. Additional features include an integrated 12-bit ADC, on-chip temperature-sensing diode, 178 GPIO supporting LVDS/LVCMOS/LVTTL, 4 x PLL, and an integrated 1.2 V core with 3.0/3.3 V-tolerant I/O banks for single-supply or dual-supply operation. The MAX 10 architecture combines a LAB-based logic fabric (50K LE), 9 Kbit M9K SRAM blocks, 144 x 18 x 18 hardware multipliers, and a flash-backed configuration subsystem. The DCF256 speed grade targets industrial-grade -40 C to +85 C operation, and the 1.0 mm pitch FBGA is a mainstream JEDEC-compliant footprint that PCB designers can route with standard 4-layer stack-ups. Typical applications include industrial motor control and IO-Link bridges, factory automation PLCs, low-cost video processing for machine vision, protocol bridging (UART/SPI/I2C to Ethernet), and low-volume prototyping that would otherwise justify an ASIC. The integrated ADC and flash also make it a fit for system-management and power-sequencing designs. When designing with this device, confirm that Quartus Prime (Lite or Standard edition) supports the 10M50DCF256 device symbol and plan JTAG/AS configuration header access for in-system reprogramming. The 1.0 mm pitch FBGA requires NSMD pads with via-in-pad or dog-bone fan-out; verify PCB fab capabilities before committing to layout. This page synthesizes distributor pricing, drop-in MAX 10 pin-compatible alternatives, and practical board-level design notes that go beyond the manufacturer ordering guide.
10M50DCF256C7G - MAX 10 FPGA 50K LE, 178 I/O, 256-FBGA | Intel
The Intel (formerly Altera) 10M50DCF256C7G is a MAX 10 field-programmable gate array (FPGA) in the 256-ball FineLine BGA package, offering 50,000 logic elements (LE), 1,677,312 bits of embedded user flash memory, and 178 maximum user I/O pins. Built on a 55 nm TSMC process, the device integrates dual-configuration flash, a 12-bit 1 MSPS ADC, and DSP blocks supporting up to 472.5 MHz fabric performance in a single non-volatile chip. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that sits in the hierarchy of digital semiconductors between fixed-function ASICs and microcontrollers. Unlike microcontrollers, which execute software instructions sequentially, FPGAs implement parallel hardware logic that the designer configures via HDL code (Verilog or VHDL). The MAX 10 family specifically targets low-cost, high-volume applications by combining programmable logic with hard IP peripherals, eliminating the need for a separate configuration memory device. Key features include 16 full-featured 18 x 18 multipliers, 2 PLLs, 288 Kbits of user SRAM, 1.2 V core operation, and support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device is offered in commercial (0C to 85C) temperature grade with the -7 speed grade, optimized for general-purpose logic, glue replacement, and bridging applications. From an architectural standpoint, the 10M50 uses an SRAM-based LUT-driven fabric backed by on-chip configuration flash, allowing instant-on operation at power-up without external boot devices. The integrated ADC and thermal-sensing diode reduce bill-of-materials cost for industrial control designs that previously required a separate analog companion chip. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image aggregation, portable test instruments, and low-cost PCIe endpoint bridging. The non-volatile nature and small 11 x 11 mm BGA footprint make it equally attractive for space-constrained embedded modules. Designers should pay close attention to the four DDR3/x8 hard memory controller paths on this device, which require strict DQ/DQS group length matching, and to the I/O bank supply grouping (VCCIO per bank) when mixing 1.8 V, 2.5 V, and 3.3 V interfaces on the same chip. Pin assignment with the Quartus Prime Pin Planner is recommended before PCB layout commit.
10M50DCF256C8G - MAX 10 FPGA, 50K LE, 256-BGA | Intel / Altera
The Intel (formerly Altera) 10M50DCF256C8G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) delivering 50,000 logic elements, 1,677,312 bits of embedded user flash, and 178 user I/O pins in a 17x17 mm 256-ball FineLine BGA (FBGA256) package with industrial temperature grade and -8 speed grade. It belongs to the MAX 10 family, the industry's first single-chip, non-volatile programmable logic device family with integrated analog-to-digital converters and dual-configuration flash. A MAX 10 FPGA is a non-volatile SRAM-based logic device with on-chip flash configuration memory. The category hierarchy places MAX 10 within programmable logic devices (PLDs), subdivided into FPGAs (Field-Programmable Gate Arrays) and CPLDs (Complex Programmable Logic Devices). MAX 10 uniquely combines FPGA fabric, on-die flash for instant-on configuration, integrated ADC blocks, and DSP/multiplier blocks in a single low-cost monolithic silicon device, occupying the bridge position between traditional CPLDs (lower density, instant-on) and Cyclone-class FPGAs (higher density, external configuration). Key specifications of the 10M50DCF256C8G include 50,000 logic elements (LEs), 1,677,312 bits of embedded user flash, 172 18x18 multipliers, 5,151 Kbits of embedded RAM (M9K blocks), 178 general-purpose I/Os, four general-purpose PLLs, and two on-chip hard ADC blocks (12-bit, 1 MSPS). It is fabricated on TSMC 55 nm embedded flash CMOS process technology with 1.0V core and 2.5V/3.3V LVCMOS-compatible I/O banks. The device supports instant-on from on-die flash and dual-boot configuration modes for fail-safe field updates. The 10M50DCF256C8G targets industrial, automotive, and consumer applications that require non-volatile configuration, low standby power, and integrated analog. Because configuration is stored on-chip, the device needs no external boot PROM, simplifying PCB layout, lowering BOM cost, and reducing susceptibility to configuration memory corruption during in-field firmware updates. The integrated ADC eliminates an external ADC IC in many motor control and sensor-interface designs, and the dual-boot mode enables A/B firmware images for OTA-capable industrial systems. Typical applications include industrial motor control drives, factory automation I/O modules, portable medical instrumentation, automotive infotainment and ADAS pre-processing, low-cost video processing, I/O expansion bridges for microcontrollers, and replacement of legacy CPLD designs that have outgrown their density. Design considerations include using all four PLL outputs for jitter-sensitive clock domains, observing the FBGA256 PCB escape routing guidelines, and ensuring JTAG signal integrity for in-system programming.
10M50DCF484C7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
The Intel 10M50DCF484C7G is a MAX 10 family Field Programmable Gate Array (FPGA) delivering 50,000 logic elements in a 484-ball FineLine BGA package with 360 user I/O pins. Built on a 55 nm non-volatile process, the device integrates 1,677,312 bits of embedded SRAM and operates at a 1.2 V core supply with speed-grade 7 timing closure. The part ships as a commercial-temperature variant (C suffix) without the optional DDR3 hard memory controller (D prefix - dual supply). A MAX 10 FPGA is a non-volatile programmable logic device from Intel (formerly Altera) that combines LUT-based logic, embedded memory blocks, DSP blocks, and user flash memory on a single chip. In the broader taxonomy, MAX 10 sits below Cyclone V as the low-density, low-cost, instant-on tier of Intel FPGAs and is widely used as a glue-logic and I/O-expansion companion to microprocessors. The 10M50 part number decodes as 10 = MAX 10 family, M50 = 50K logic elements; the C7 suffix indicates commercial temperature range (0 C to 85 C) and speed grade 7. Key features include integrated configuration flash (no external boot PROM required), up to 360 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, hardware multipliers (18x18) for DSP, analog-to-digital converter (ADC) blocks, and dual-purpose configuration pins. The F484 package measures 23 x 23 mm with a 1.0 mm ball pitch, making it suitable for cost-sensitive mid-density designs. Architecturally, MAX 10 uses 4-input adaptive LUTs, 20 Kbit M9K memory blocks, and 144-bit wide DSP blocks. The non-volatile flash enables instant-on operation in under 10 ms, eliminating external boot memory cost and board space. A hard PCIe Gen2 endpoint (x1/x2) is present in the largest MAX 10 variants. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-cost PCIe endpoint cards, and portable test equipment. The integrated flash also enables secure boot and field-update use cases. When designing with this part, verify that Quartus Prime supports the latest tool version for MAX 10, since Intel has announced end-of-life for older Quartus support on selected MAX 10 die. Always check pin assignment compatibility for migrated designs. This page synthesizes distributor pricing across 14 sources, drop-in MAX 10 same-package alternatives, and PCB-layout design notes not collected in the manufacturer datasheet alone.
10M50DCF484C8G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
The Intel 10M50DCF484C8G is a member of the MAX 10 family of non-volatile, single-chip low-cost programmable logic devices, integrating 50,000 logic elements in a 484-ball FineLine BGA package. Built on a 55nm CMOS process, the device delivers up to 360 user I/O pins, 1,677,312 bits of embedded SRAM, and a 1.2V core supply with industrial-grade temperature support. The MAX 10 architecture combines a look-up-table (LUT)-based fabric with hardened analog and memory blocks, replacing multiple discrete components on a single die. A field-programmable gate array (FPGA) is a programmable semiconductor device that lets engineers implement custom digital logic, glue logic, and parallel processing functions after PCB fabrication. In the broader hierarchy, an FPGA sits between microcontrollers and ASICs: more flexible than a fixed-function ASIC but more deterministic and parallel than a sequential microcontroller. MAX 10 specifically adds on-chip flash, ADC blocks, and DDR3 memory controllers that bring system-on-chip (SoC) capability to a low-power, non-volatile FPGA fabric. Key features include up to 1,677 Kbits embedded SRAM, integrated flash configuration memory, on-die ADC blocks, support for DDR3/LPDDR3 external memory interfaces, and hardened DSP and multiplier blocks. Operating junction temperatures range from 0C to +85C (commercial grade), and the part is housed in a 23 mm × 23 mm 484-ball FBGA at 1.0 mm pitch for high-density board designs. Technically, the 10M50DCF484C8G variant is specified at speed grade 8, with internal core voltages of 1.2V and PLL/IO banks at 2.5V/3.3V. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and differential pairs, and integrates embedded multipliers and 18×18 hardware multipliers for high-throughput DSP operations. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image processing, low-cost prototyping, and bridge replacement for legacy CPLD-based designs. The combination of non-volatile configuration and high I/O count makes it well suited for designs where board space and BOM integration are priorities. When designing with this part, allocate a minimum of four PCB layers with a dedicated ground plane to maintain signal integrity on high-speed transceivers, and follow Intel's power plane decoupling recommendations to keep internal rails within ±5% under inrush conditions. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer datasheet page, giving procurement engineers and FPGA designers a one-stop reference for the 10M50DCF484C8G.
10M50DCF484I6G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
The Intel 10M50DCF484I6G is a member of the MAX 10 family of non-volatile FPGAs, integrating 50,000 logic elements, 1,638 Kbit embedded RAM, and a 12-bit 1 Msps ADC into a single 484-ball FineLine BGA package. It features dual-configuration flash, on-chip temperature sensing, and instant-on support, targeting industrial, automotive, and communications applications where single-chip programmability replaces discrete processor-plus-logic designs. A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, supplemented by hardened IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the wider taxonomy, an FPGA sits beneath programmable logic and above fixed-function ASICs in design flexibility, allowing in-system reconfiguration after manufacture. The MAX 10 family specifically adds non-volatile configuration and analog integration, removing the need for an external boot flash that legacy SRAM FPGAs require. Key features of the 10M50DCF484I6G include 50K logic elements, 2,140 Kbits of total embedded memory (RAM + user flash), 144 (18x18) multipliers, four general-purpose PLLs, and a 12-bit 1 Msps successive-approximation ADC with up to 18 single-ended channels. The device operates over the industrial -40C to +100C junction range, integrates a 3.3 V/2.5 V LVCMOS/LVDS capable I/O bank structure totaling 360 user I/Os, and supports JTAG, AS, PS, and JTAG-based passive serial configuration modes. Architecturally, the device is built on a 55 nm embedded-flash process that stores configuration in on-chip non-volatile memory, enabling instant-on (< 1 ms to user I/O activation in single-supply mode) and dual-boot between two configuration images. Integrated hard IP for PCIe Gen2 x1, I2C, SPI, UART, and SDR/DDR/LPDDR memory controllers shortens design time and frees logic resources for application code. Typical applications include industrial motor control and machine vision, automotive driver-assistance and infotainment bridges, factory automation I/O expansion, video bridging, and low-cost prototyping for ASIC replacement. The integrated ADC also makes the part suitable for sensor aggregation front-ends. When designing with this device, allocate at least two PCB layers for power and ground planes because the core (1.2 V) and I/O (1.2 V to 3.3 V) rails have distinct ramp requirements. Quartus Prime must be used for synthesis, place-and-route, and bitstream generation; consult the MAX 10 device family pin connection guidelines for unused-pin termination. This page synthesizes distributor pricing, drop-in alternatives drawn from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
The Intel (formerly Altera) 10M50DCF484I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) from the MAX 10 family, integrating 50,000 logic elements, 1,677,312 bits of embedded SRAM, and a 1.6 Mb user flash memory block in a 484-ball FineLine BGA package. The device is built on TSMC's 55 nm embedded flash process technology and operates across an industrial -40C to +100C junction temperature range with a 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as PLLs, DSP blocks, and high-speed transceivers. Within the broader hierarchy, the MAX 10 belongs to the non-volatile FPGA class - a sub-category of programmable logic devices (PLDs) - and is positioned as a low-power, instant-on replacement for CPLDs and small SRAM FPGAs in glue-logic, control, and bridging applications. Key features of the 10M50DCF484I7G include 360 general-purpose I/O pins (LVDS-capable), 4 PLLs, 144 (18x18) hardware multipliers, dual configuration flash with on-chip flash boot, an integrated ADC (12-bit, up to 17 channels), and support for external memory interfaces up to DDR3/LPDDR2. Hardened Nios II soft-core capability allows embedded processor integration without external CPUs. The 484-FBGA (F484) package has a body size of 23 x 23 mm with 1.0 mm ball pitch. Architecturally, MAX 10 FPGAs use a logic-element fabric of 8-input adaptive LUTs distributed across LABs, fed by a multi-tier routing hierarchy. The 10M50 variant places the device at the mid-density point of the MAX 10 family (between 10M25 and 10M08 at the lower end and the original Cyclone V derivatives at the higher end), making it suitable for designs that outgrow CPLDs but do not require Cyclone 10 or Arria-class resources. Typical applications for the 10M50DCF484I7G include industrial motor and motion control, I/O expansion and bridging (PCIe Gen2 root port, I2C/SPI/UART), video processing and display controllers, factory automation PLC interfaces, and portable test equipment. The integrated ADC enables sensor aggregation on the same die. When designing with this device, pay attention to the I/O bank supply structure: the F484 package supports 8 I/O banks plus a dedicated configuration/JTAG bank. Each bank requires its own VCCIO supply, and unused banks must still be powered to a valid level (typically 2.5 V) to keep I/O buffers in a defined state. The device also requires a 10 kohm external pull-up on the nCONFIG pin during configuration boot. This page synthesizes distributor pricing, drop-in pin-compatible variants from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M50DCF672C7G - MAX 10 FPGA 50K LE 672-BGA | Intel
The Intel (formerly Altera) 10M50DCF672C7G is a MAX 10 Field Programmable Gate Array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and a 672-pin FineLine BGA package. Built on TSMC's 55nm embedded flash process, this non-volatile FPGA integrates flash configuration memory directly on-chip, enabling instant-on operation without an external boot PROM. The -7 speed grade and C (commercial, 0C to +85C) temperature grade make this variant a general-purpose mid-density option for cost-sensitive industrial and consumer designs. What is a MAX 10 FPGA? The MAX 10 is Intel's non-volatile FPGA family that combines traditional FPGA fabric with integrated analog, memory, and configuration flash on a single die. Positioned within the programmable logic taxonomy (FPGA -> programmable logic -> semiconductor IC -> integrated circuit), MAX 10 devices deliver instant-on dual-configuration capability, on-chip ADC, and DSP blocks at low system cost compared to SRAM-based FPGAs that require external boot devices. The 10M50 specifically targets mid-range logic densities around 50K LE. Key features include 500 user I/O pins, up to 1.677 Mbit embedded SRAM, 4 PLLs, embedded 12-bit ADC blocks, and hardware multiplier/DSP blocks for signal processing. The 672-BGA FineLine package supports high I/O density with multiple LVDS/ LVCMOS / SSTL / HSTL I/O standards. The device also integrates Nios II soft processor support for embedded control tasks. Architecturally, the MAX 10 uses a logic-element-based fabric with LABs (Logic Array Blocks), MLABs (Memory Logic Array Blocks), and dedicated 18x18 multipliers. Embedded flash cells handle single-chip configuration and dual-image storage for fail-safe field updates. The integrated ADC operates up to 1 MSPS with up to 16 analog inputs, eliminating external ADC ICs in many designs. Typical applications include industrial motor control and machine vision, factory automation I/O expansion, low-cost video processing and display bridging, portable test and measurement equipment, and as a glue-logic replacement for CPLDs and discrete digital ICs. When designing with the 10M50DCF672C7G, ensure proper power decoupling with bulk and high-frequency ceramic capacitors near each supply pin, route LVDS pairs with matched-length 100 ohm differential impedance, and respect the maximum I/O toggle rate to avoid simultaneous switching noise (SSN) on adjacent outputs. This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical board-level design notes not found in the manufacturer datasheet alone.
10M50DCF672C8G - MAX 10 FPGA, 50K LE, 672-BGA | Intel
The Intel (Altera) 10M50DCF672C8G is a non-volatile FPGA from the MAX 10 family, delivering 50,000 logic elements in a 672-ball FineLine BGA package with 1.0 mm pitch. It integrates 1,677,312 bits of embedded SRAM, supports up to 500 general-purpose I/O pins, and features an 8-bit speed grade C8 commercial temperature rating. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs are a category of programmable logic devices sitting under the broader hierarchy of digital ICs -> logic ICs -> programmable logic. The MAX 10 series in particular targets low-power, low-cost, non-volatile applications that require integrated features like ADCs, DSP blocks, and on-die flash configuration memory, eliminating the need for external boot ROMs. Key features include 50K logic elements, 1,677,312 bits of user flash memory, embedded 12-bit ADC blocks, hardware multiplier blocks for DSP, and a hardened Nios II soft processor support infrastructure. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards, with multi-voltage I/O banks allowing 1.2V to 3.3V interfacing on the same die. Configuration is instant-on because the configuration image is stored in on-chip flash. The MAX 10 architecture combines a traditional FPGA fabric with hardened peripherals, enabling system-level integration in a single chip. The 672-BGA package provides generous I/O count for high-pin-count designs, while the non-volatile flash memory eliminates external boot components, reducing BOM cost and board area. Typical applications include industrial motor control, factory automation I/O expansion, video processing bridges, portable medical instrumentation, and IoT edge nodes. The integrated ADC and DSP blocks make it well suited for sensor aggregation and signal conditioning, while the non-volatile configuration supports instant-on industrial PC and HMI designs. When designing with this device, verify that the 672-BGA PCB footprint supports your I/O assignment and that the Quartus Prime toolchain is used for synthesis and place-and-route. Note that the C8 speed grade represents a commercial-temperature part (0C to 85C); choose an I7 or I8 grade for industrial (40C to 100C) operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
10M50DCF672I7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel
The Intel 10M50DCF672I7G is a non-volatile FPGA from the MAX® 10 family, integrating 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 500 user I/Os in a 672-ball FineLine BGA package. Built on a low-power 55 nm process, it operates at a 1.2 V core supply and targets cost-sensitive applications that require single-chip programmability, instant-on dual-configuration flash, and integrated analog-to-digital conversion. The MAX 10 architecture combines a look-up-table (LUT)-based fabric with hard memory blocks, DSP blocks, PLLs, and embedded flash, eliminating external boot memories. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic resources, routing, and I/O behavior are defined by user-supplied configuration data. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP > standard logic, and are classified within programmable logic devices (PLDs). The MAX 10 family specifically extends this concept by embedding configuration flash and analog blocks directly on-chip, allowing instant-on behavior at power-up without an external boot PROM - a feature traditionally reserved for CPLDs but now delivered with FPGA-class logic density. Key features include up to 50K logic elements (LEs), 312 Kbits of embedded memory in 9-Kbit M9K blocks, 144 18x18 multipliers for DSP workloads, four general-purpose PLLs, and a 12-bit successive-approximation analog-to-digital converter (ADC) with up to 17 external channels. The device supports LVDS, LVCMOS, SSTL, and differential I/O standards up to 500 MHz, and provides dual-configuration flash for fail-safe field upgrades and remote reconfiguration through JTAG or serial protocols. From an architectural standpoint, the 10M50DCF672I7G integrates the configuration flash, user flash (UFM), ADC, voltage regulators, and temperature-sensing diode on-die, reducing BOM count and board area. The 672-FBGA package exposes the full MAX 10 I/O count of 500, allowing dense board designs with multiple high-speed interfaces such as parallel memory buses, MIPI bridges, or industrial control peripherals. Typical applications include industrial motor control, video bridging and image processing, factory automation I/O expansion, low-cost PCIe endpoint bridging, and portable medical instrumentation where the ADC and instant-on flash simplify firmware bring-up. The integrated 12-bit ADC at 1 MSPS is particularly useful for sensor conditioning, eliminating an external analog front end. When designing with the 10M50DCF672I7G, ensure the PCB land pattern follows the 672-ball FineLine BGA 1.0 mm pitch recommended footprint and that all core/PLL/IO supply pins are decoupled per the Intel MAX 10 power distribution network (PDN) guidelines. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation; the device is supported in Quartus Prime Standard and Pro editions. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the MAX 10 family, and practical design considerations not found in the manufacturer datasheet alone.
10M50SAE144C8G - MAX 10 FPGA, 50K LE, 144-EQFP | Intel
The Intel 10M50SAE144C8G is a MAX 10 non-volatile Field Programmable Gate Array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 101 maximum user I/Os, packaged in a 144-pin plastic Enhanced QFP (EQFP-144) with exposed thermal pad. It is fabricated on TSMC's 55 nm NOR-flash-based embedded non-volatile process and targets low-cost, low-power, instant-on applications. A MAX 10 FPGA is a single-chip, non-volatile programmable logic device that integrates the optimal set of system components for cost-sensitive and space-constrained designs. It sits within Intel's programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> MAX 10 family -> low-density non-volatile FPGA. Unlike SRAM-based FPGAs, MAX 10 devices configure in milliseconds from on-chip flash, eliminating the need for external boot memory. Key features include dual-configuration flash with self-divided remote system upgrade support, integrated 12-bit analog-to-digital converter (ADC), on-chip temperature-sensing diode, and up to 1.4 Mb of user flash memory. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability. Per-block RAM is 9 Kbits (M9K) with independent parity/ECC. Architecturally, the 10M50 includes Logic Array Blocks (LABs) of 16 Logic Elements each, Multiplier blocks (18x18), and a high-speed serial interface absent in this density. The embedded flash subsystem allows dual-boot and instant-on operation; combined with the on-chip ADC, the part is targeted at industrial I/O modules, motor control pre-processing, and portable test equipment. Typical applications include industrial control and factory automation I/O expansion, portable medical device signal conditioning, video bridging and image aggregation, automotive driver-assistance sub-systems, and I/O expansion for microcontrollers/SoCs. Instant-on capability makes it suitable for power-sequenced industrial systems. When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation. The exposed thermal pad must be soldered to a sufficiently large copper pour to meet the 31.6 C/W theta-JA rating. This page synthesizes authorized distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.