10M50DCF672I7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel
料号： 10M50DCF672I7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $269 | $2,690.00 |
| 100 | $245 | $24,500.00 |
| 250 | $228 | $57,000.00 |
| 500 | $212 | $106,000.00 |
10M50DCF672I7G 概述
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic resources, routing, and I/O behavior are defined by user-supplied configuration data. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP > standard logic, and are classified within programmable logic devices (PLDs). The MAX 10 family specifically extends this concept by embedding configuration flash and analog blocks directly on-chip, allowing instant-on behavior at power-up without an external boot PROM - a feature traditionally reserved for CPLDs but now delivered with FPGA-class logic density.
Key features include up to 50K logic elements (LEs), 312 Kbits of embedded memory in 9-Kbit M9K blocks, 144 18x18 multipliers for DSP workloads, four general-purpose PLLs, and a 12-bit successive-approximation analog-to-digital converter (ADC) with up to 17 external channels. The device supports LVDS, LVCMOS, SSTL, and differential I/O standards up to 500 MHz, and provides dual-configuration flash for fail-safe field upgrades and remote reconfiguration through JTAG or serial protocols.
From an architectural standpoint, the 10M50DCF672I7G integrates the configuration flash, user flash (UFM), ADC, voltage regulators, and temperature-sensing diode on-die, reducing BOM count and board area. The 672-FBGA package exposes the full MAX 10 I/O count of 500, allowing dense board designs with multiple high-speed interfaces such as parallel memory buses, MIPI bridges, or industrial control peripherals.
Typical applications include industrial motor control, video bridging and image processing, factory automation I/O expansion, low-cost PCIe endpoint bridging, and portable medical instrumentation where the ADC and instant-on flash simplify firmware bring-up. The integrated 12-bit ADC at 1 MSPS is particularly useful for sensor conditioning, eliminating an external analog front end.
When designing with the 10M50DCF672I7G, ensure the PCB land pattern follows the 672-ball FineLine BGA 1.0 mm pitch recommended footprint and that all core/PLL/IO supply pins are decoupled per the Intel MAX 10 power distribution network (PDN) guidelines. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation; the device is supported in Quartus Prime Standard and Pro editions.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the MAX 10 family, and practical design considerations not found in the manufacturer datasheet alone.
直接替换替代料： 10M50DCF672I7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M50DCF672I7G （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Speed Grade, PLLs, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
10M50DCF672C8G
✅ 直接替换✓ 有现货
$51.75 / 个
查看数据手册 →10M50DCF672C7G
✅ 直接替换✓ 有现货
$65.97 / 个
查看数据手册 →10M50DAF672I7G
✅ 直接替换✓ 有现货
$144.2 / 个
查看数据手册 →10M40DCF672I7G
✅ 直接替换✓ 有现货
$72.65 / 个
查看数据手册 →10M50DAF672C8G
✅ 直接替换✓ 有现货
$97.6 / 个
查看数据手册 →10M50DCF672I7G 最大额定值与电气特性
| Family | MAX® 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| Embedded Memory Blocks | M9K 9-Kbit blocks |
| DSP Blocks (18x18 Multipliers) | 144 |
| User I/Os | 500 |
| 封装 | 672-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Configuration Memory | On-chip dual-configuration flash |
| PLLs | 4 general-purpose |
| Integrated ADC | 12-bit SAR, 1 MSPS, up to 17 analog input channels |
| Temperature Sensor | On-die diode |
| On-chip Voltage Regulators | Yes (internal core regulation) |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) |
| Speed Grade | 7 |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| Configuration Interface | JTAG, Active Serial (AS), Passive Serial (PS) |
10M50DCF672I7G 672-ball fbga (fineline bga), 1.0 mm pitch 引脚配置指南
10M50DCF672I7G（672-ball fbga (fineline bga), 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M50DCF672I7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M50DCF672I7G 适用于 6 应用s: Industrial Motor Control, Video Bridging and Image Processing, Factory Automation I/O Expansion, Portable Medical Instrumentation, Low-Cost PCIe Endpoint Bridging, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10M50DCF672I7G is well suited for industrial motor control because its 144 18x18 DSP blocks and 50K logic elements deliver real-time field-oriented control (FOC) for three-phase PMSM and induction motors at switching frequencies up to 100 kHz. The integrated 12-bit SAR ADC with 17 analog channels samples motor phase currents, DC-bus voltage, and temperature sensors without an external analog front end, reducing BOM cost. Industrial temperature grade (-40C to +100C) and instant-on dual-configuration flash support fail-safe field firmware upgrades in factory automation cells.
推荐
Video Bridging and Image Processing
The 10M50DCF672I7G's 500 user I/Os and LVDS support at up to 500 Mbps enable bridging between MIPI CSI-2, parallel CMOS, and LVDS image sensors, making it ideal for industrial camera and machine-vision systems. The 1,677,312 bits of embedded SRAM buffer full-HD frames line-by-line for image preprocessing (gamma, lens correction) before forwarding over Ethernet or USB 3.0 bridges. The 55 nm low-power process keeps typical core power under 1.5 W, allowing fanless embedded designs in surveillance and inspection equipment.
推荐
Factory Automation I/O Expansion
As a programmable I/O expansion hub, the 10M50DCF672I7G aggregates Profinet, EtherCAT, RS-485, and discrete I/O signals onto a single industrial Ethernet backbone. The 500 GPIO support up to 24 banks of mixed-voltage I/O (1.2 V to 3.3 V), simplifying interface to legacy 5 V sensors via level shifting in the FPGA fabric. Industrial temperature operation and embedded flash support instant-on behavior at power-up with zero boot latency, critical for safety-rated control loops where boot-PROM delay is unacceptable.
推荐
Portable Medical Instrumentation
The 10M50DCF672I7G's integrated 12-bit SAR ADC and on-die temperature sensor make it a strong fit for portable medical devices such as pulse oximeters, glucometers, and bedside monitors. The dual-configuration flash enables secure firmware updates with rollback capability, while the 1.2 V core and on-chip voltage regulators reduce total board footprint for battery-powered form factors. Industrial-grade silicon qualified to -40C to +100C supports clinical and field environments where temperature extremes are common.
推荐
Low-Cost PCIe Endpoint Bridging
The 10M50DCF672I7G supports PCIe Gen2 x1 endpoint implementations through its hard PCIe block (where present in the F672 variant) or soft IP for legacy 32-bit/66 MHz PCI. Designers use the abundant 500 I/Os and 144 multipliers for protocol translation between PCIe and parallel buses, NAND flash controllers, or legacy peripherals. Instant-on flash ensures link training begins within milliseconds of power-up, matching the timing budget of host platforms that expect quick device enumeration.
推荐
IoT Edge Sensor Aggregation
The 10M50DCF672I7G aggregates multiple low-speed sensor buses (SPI, I2C, UART, 1-Wire) into a single high-speed uplink for IoT gateways. The embedded 12-bit ADC handles up to 17 analog channels, interfacing directly with temperature, pressure, and humidity sensors without external signal conditioning. Dual-configuration flash enables remote OTA upgrades with rollback on checksum failure - critical for unattended edge nodes in smart-building and smart-city deployments where physical access is impractical.
推荐
推荐产品汇总
工程参考数据： 10M50DCF672I7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M50DCF672C8G | 10M50DCF672C7G | 10M50DAF672I7G | 10M40DCF672I7G | 10M50DAF672C8G |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA (FineLine BGA) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 (-20%) | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,259,520 (-25%) | 1,677,312 |
| DSP Blocks (18x18) | 144 | 144 | 144 | 144 | 125 (-13%) | 144 |
| User I/Os | 500 | 500 | 500 | 500 | 500 | 500 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Automotive -40C to +125C | Industrial -40C to +100C | Automotive -40C to +125C |
| Speed Grade | 7 | 8 (faster) | 7 | 7 | 7 | 8 (faster) |
| Integrated ADC | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 16 channels | 12-bit SAR, 1 MSPS, 17 channels |
关键差异点
- Industrial temperature grade -40C to +100C with speed grade 7 timing （对比 10M50DCF672C8G)
- Highest-density option in MAX 10 family with 50K logic elements （对比 10M40DCF672I7G)
- On-chip dual-configuration flash enables instant-on without external boot PROM （对比 Cyclone IV EP4CE40F672I7N (predecessor))
设计说明
The 672-ball FineLine BGA requires a 1.0 mm ball pitch PCB land pattern with NSMD (non-solder mask defined) pads per the Intel MAX 10 hardware design guidelines. Use a 4-layer or 6-layer stack-up with continuous ground planes under the BGA for signal and power integrity. Estimate: at 8 mil via-in-pad microvia geometry, breakout routing of 500 I/Os requires at least 6 routing layers plus 2 dedicated power/ground planes. Apply via tenting on the BGA side to reduce solder wicking during reflow.
Although the MAX 10 fabric runs at 1.2 V and typically dissipates 1-2 W, integrated ADC conversions and high-toggle-rate I/Os can push junction temperatures higher in sealed enclosures. Estimate: with theta_JA around 18 C/W on a JEDEC 4-layer test board, a 2 W dissipation yields 36 C rise above ambient. For fanless industrial enclosures, recommend 4-layer board with continuous copper pour stitched to GND, and verify thermal headroom via the MAX 10 on-die temperature-sensing diode read by Quartus' PowerPlay thermal analyzer.
Do not assume all MAX 10 family members share identical pinout across packages - only F672 package variants (DCF672, DAF672) share the same 672-FBGA ball map. F484 and F256 packages use different pinout files and cannot be substituted at the PCB level. Verify the exact pinout file (.pin) in Quartus Prime Pin Planner before tape-out. Also confirm configuration mode (AS/PS/JTAG) is correctly selected by MSEL pins at board bring-up; incorrect MSEL settings cause silent configuration failure with no error indication.
LVDS signaling on the MAX 10 requires 100 ohm differential impedance traces with matched length (±10 mil) within each LVDS pair. The MAX 10 PLL output frequency must be within the device's PLL VCO range (typically 600-1300 MHz depending on speed grade) - check Quartus Prime fitter reports for PLL feedback-path timing closure. For DDR3 memory interfaces, follow the Intel External Memory Interface Handbook for the specific speed grade and use the on-chip hard memory controller.
合规信息
RoHS and REACH compliant per Intel/Altera product declaration. The I7G grade is industrial temperature qualified, not AEC-Q100 - select the 10M50DAF672I7G variant for automotive applications. Lead-free BGA balls comply with JEDEC J-STD-020 MSL-3 moisture sensitivity classification.
