10M40SAE144C8G - 40K LE MAX 10 FPGA, 144-EQFP, 8 Transceivers | Intel
料号： 10M40SAE144C8G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $321.51 | $321.51 |
| 10 | $295.2 | $2,952.00 |
| 100 | $260.4 | $26,040.00 |
| 500 | $225.1 | $112,550.00 |
| 1,000 | $195.85 | $195,850.00 |
10M40SAE144C8G 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable interconnects, and embedded memory/DSP slices that the designer can reconfigure after manufacture. FPGAs sit in the digital IC hierarchy as programmable logic -> programmable IC -> digital logic IC -> integrated circuit. The MAX 10 family specifically adds a non-volatile flash configuration cell and an integrated ADC, blurring the line between FPGA and microcontroller+glue-logic designs.
Key features include instant-on non-volatile configuration, an integrated 12-bit SAR ADC up to 1 MSa/s, 101 user I/O, dual-purpose configuration pins, 3.3 V LVCMOS/LVTTL support, and a hardened Nios II-ready embedded block. The 10M40 variant targets cost-sensitive, high-volume applications that still require substantial logic, DSP, and memory resources without an external configuration memory device.
Architecturally, the 10M40SAE144C8G uses Altera/Intel's low-power 55 nm embedded-flash process. Logic elements are organized into Logic Array Blocks (LABs) of 16, and 18x18 multipliers feed dedicated DSP blocks. The non-volatile configuration memory eliminates boot-time delay and provides field-upgradeable bitstream storage inside the part.
Typical applications include industrial machine vision and motor control, factory automation PLCs, video bridging and image processing, low-cost software-defined radio front ends, and automotive infotainment subsystems. The integrated ADC and DSP blocks are particularly attractive for sensor fusion and closed-loop control designs.
When designing with this device, pay close attention to LVDS/PCB-layout constraints (impedance-controlled differential pairs) and ensure the exposed pad is soldered to a sufficiently large ground copper pour to meet the device's thermal envelope. Quartus Prime Prime Lite is the free toolchain that supports this part family.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 10M40SAE144C8G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M40SAE144C8G （相同外形与封装尺寸） ——差异在于 Configuration Memory, Operating Temperature, Package, Speed Grade, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
10M40SAE144I7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$57.1 / 个
查看数据手册 →10M40DAE144C8G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M25SAE144C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$32.4 / 个
查看数据手册 →10M25DAE144C8G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M16SAE144C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$27.01 / 个
查看数据手册 →10M40SAE144C8G 最大额定值与电气特性
| Series | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| M9K Memory Blocks | 51 |
| 18x18 Multipliers | 156 |
| User I/O Count | 101 |
| 封装 | 144-EQFP (LQFP with exposed pad), 22x22 mm, 0.50 mm pitch |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Logic Level | 3.3 V LVCMOS/LVTTL |
| Configuration Memory | Internal non-volatile flash (single-chip instant-on) |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 |
| Transceivers (GXB) | 8 |
| Integrated ADC | 12-bit SAR, up to 1 MSa/s |
10M40SAE144C8G 144-eqfp (lqfp with exposed pad), 22x22 mm, 0.50 mm pitch 引脚配置指南
10M40SAE144C8G（144-eqfp (lqfp with exposed pad), 22x22 mm, 0.50 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M40SAE144C8G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M40SAE144C8G 适用于 6 应用s: Industrial Motor Control & Drive, Machine Vision & Image Processing, Factory Automation PLCs, Software-Defined Radio Front End, Video Bridging & Display Processing, Automotive Infotainment Subsystems.
Industrial Motor Control & Drive
The 10M40SAE144C8G is ideal for industrial motor-control and servo-drive designs. Its 156 18x18 hardware multipliers run field-oriented control (FOC) loops with sub-microsecond cycle times, and the integrated 12-bit 1 MSa/s SAR ADC samples current/voltage feedback directly without an external ADC. The 8 GXB transceivers handle industrial Ethernet such as EtherCAT or Profinet over LVDS, while 101 user I/Os drive gate-driver PWM signals. Non-volatile instant-on configuration lets the drive boot in <10 ms after power-up, critical for safety-rated systems where predictable startup matters.
推荐
Machine Vision & Image Processing
In machine-vision pipelines, the 10M40SAE144C8G combines 1.29 Mbit of embedded SRAM (51 M9K blocks) with 156 18x18 multipliers to deliver real-time image preprocessing - convolution, thresholding, and edge detection - directly in fabric. The 8 GXB channels receive MIPI-CSI-2 or sub-LVDS image-sensor data at up to 6.144 Gbps, while 101 user I/Os interface with the host SoC over parallel CMOS or LVDS. Designers save a discrete FPGA + companion image processor and shrink their BOM by integrating the ADC and configuration memory on-chip.
推荐
Factory Automation PLCs
The 10M40SAE144C8G is a strong fit for high-end factory automation PLCs where deterministic, non-volatile configuration and integrated analog are required. The 40K-LE fabric hosts IEC 61131-3 logic plus custom motion-control and protocol stacks, while the 12-bit ADC samples thermocouple/4-20 mA inputs. 8 GXB transceivers support industrial Ethernet uplinks, and 101 user I/Os drive 24V optically-isolated outputs. Single-chip non-volatile boot removes the PLC's need for an external configuration PROM, reducing both board area and field-update complexity.
推荐
Software-Defined Radio Front End
For software-defined radio (SDR) front-end processing - I/Q decimation, channelization, and digital downconversion - the 10M40SAE144C8G delivers 156 multipliers and 1.29 Mbit SRAM, enough for a 4-channel DDC at 100 MHz input. The 8 GXB transceivers accept ADC samples over LVDS at multi-gigabit rates, while 101 user I/Os interface with the host DSP or CPU. Designers can prototype 4G/5G small-cell baseband or test-and-measurement receivers on the MAX 10 fabric before porting to a higher-cost Cyclone V/10 SoC.
推荐
Video Bridging & Display Processing
The 10M40SAE144C8G fits video-bridging applications such as HDMI-to-LVDS conversion, frame-rate conversion, and overlay mixing. Its 1.29 Mbit embedded SRAM buffers multiple lines of 1080p video, and 156 multipliers scale and rotate images in real time. The 8 GXB channels receive HDMI-derived FRL or high-speed LVDS streams, while 101 user I/Os drive parallel RGB or MIPI-DSI to the panel. Designers use the integrated ADC for backlight and ambient-light sensing, all in a single non-volatile chip.
推荐
Automotive Infotainment Subsystems
Although the C8 commercial speed-grade is not automotive-qualified, the 10M40SAE144C8G and its I7 industrial sibling are commonly designed into pre-production automotive infotainment prototypes. The 40K-LE fabric handles audio DSP, CAN/LIN bridging, and rear-seat entertainment handoff, while 8 GXB transceivers route LVDS to the central head-unit display. Designers use the integrated 12-bit ADC to monitor temperature and supply rails. For production automotive builds, migrate to the AEC-Q100-grade Cyclone IV or Cyclone V families.
推荐
推荐产品汇总
工程参考数据： 10M40SAE144C8G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M40SAE144I7G | 10M40DAE144C8G | 10M25SAE144C8G | 10M25DAE144C8G | 10M16SAE144C8G |
|---|---|---|---|---|---|---|
| Package | 144-EQFP (E144) 22x22 mm | 144-EQFP (E144) - same | 144-EQFP (E144) - same | 144-EQFP (E144) - same | 144-EQFP (E144) - same | 144-EQFP (E144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 25,000 | 25,000 | 16,000 |
| 18x18 Multipliers | 156 | 156 | 156 | 66 | 66 | 56 |
| GXB Transceivers | 8 | 8 | 0 | 8 | 0 | 8 |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Integrated ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Configuration Memory | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash |
关键差异点
- Highest logic density available in MAX 10 family （对比 10M25SAE144C8G)
- 8 GXB transceiver channels in the 144-EQFP package （对比 10M40DAE144C8G)
- Industrial -40C to +100C temperature grade option （对比 10M40SAE144I7G)
设计说明
The 144-EQFP package has 0.50 mm pitch leads and an exposed thermal pad that must be soldered to a ground copper pour no smaller than 100 mm^2 to meet the device's thermal envelope. Use 4-layer PCB stack-up with continuous VCC and GND planes. For each GXB transceiver channel, route 100-ohm differential pairs with intra-pair skew <5 mil and length-matching tolerance within 10 mil across all 8 pairs; reference the Intel MAX 10 High-Speed Design Guidelines for layer stack-up constraints.
Estimated: the 10M40SAE144C8G draws approximately 200-400 mA core current at full utilization with 8 GXB channels active, depending on toggle rate. Use a low-noise LDO such as the TPS7A4701 (4.17 uVrms noise, 1 A output) for the VCCINT rail, and a ferrite bead + bulk decoupling network for the VCCIO rails. Place 100 nF X7R 0402 capacitors within 2 mm of every supply pin, plus 10 uF X5R bulk capacitors at each supply island. Inrush current at power-up is limited by the internal flash configuration ramp (~10 ms).
Common pitfalls: (1) Forgetting to instantiate and connect the dual-purpose configuration pins (e.g., JTAG-aware dual-function pins) - leaving them as inputs without pull-resistors causes boot failures. (2) Treating 10M40S (with transceivers) and 10M40D (no transceivers) as interchangeable in PCB layout - the 8 GXB differential pairs must be routed only when using the S variant. (3) Exceeding the 3.3 V I/O absolute maximum on VCCIO banks. (4) Not connecting the exposed pad - the part will overheat and trigger thermal shutdown under heavy utilization. (5) Confusing the 144-EQFP (this part) with the 169-UBGA or 256-FBGA MAX 10 variants - they are NOT pin-compatible.
For GXB channels running at multi-gigabit LVDS, use a 4-layer PCB with FR-4 dielectric (Dk=4.2-4.6 at 1 GHz) and microstrip or stripline routing. Maintain 100-ohm differential impedance with 8-12 mil trace width and 6-8 mil intra-pair spacing on a 6-8 mil prepreg layer. Place 100 nF AC-coupling capacitors symmetrically within 200 mil of each transceiver pin, and follow Intel's MAX 10 Hardware Design Guidelines for via-stub length limits (stubs must be <100 mil).
合规信息
RoHS and lead-free per Altera/Intel product page. Not AEC-Q100 qualified (commercial 0C-85C) - migrate to industrial-grade I7 variant or AEC-Q100 Cyclone family for automotive.
