PIC32MM0064GPM036T-I/MV
PIC32MM0064GPM036T-I/MV - 32-bit 25MHz 64KB Flash MCU | Microchip
The Microchip PIC32MM0064GPM036T-I/MV is a 32-bit MIPS32 microAptiv PIC microcontroller from the eXtreme Low Power (XLP) PIC32MM GPM family, featuring 64KB of Flash program memory and 8KB of SRAM in a 40-pin UQFN (5x5 mm) package with exposed pad. It operates at up to 25 MHz (some variants advertise 48 MHz depending on revision), integrates USB 2.0 Full-Speed with on-chip transceiver, ECC-protected memory, and a rich peripheral set including 12-bit ADC, comparators, PWM, I2C, SPI, and UART. The device targets low-power and cost-sensitive embedded designs that require 32-bit performance with sub-microamp sleep currents.
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program memory (typically Flash), data memory (SRAM), and a set of on-chip peripherals (timers, communication interfaces, ADC/DAC, GPIO) on a single die. Microcontrollers sit at the hierarchy: microcontroller -> embedded processor -> semiconductor IC -> electronic component. The PIC32MM GPM family specifically targets battery-powered IoT, consumer, and industrial applications by extending Microchip's XLP (eXtreme Low Power) lineage with sleep currents as low as 500 nA in deep sleep modes.
Key features include 64KB (64K x 8) Flash with ECC, 8KB SRAM, integrated USB 2.0 Full-Speed transceiver, four 16-bit timers, three analog comparators, a 12-bit ADC with up to 24 channels, two I2C, three SPI, and up to six UART modules. The 40-pin UQFN (5x5 mm) package with exposed thermal pad enables compact PCB layouts while supporting up to 38 GPIO pins. Hardware-level ECC on Flash and RAM improves reliability for industrial and safety-conscious applications.
Architecturally, the PIC32MM GPM uses the MIPS32 microAptiv core (M4K microMIPS-compatible) with a multi-stage pipeline, hardware multiply/divide, and a deterministic interrupt controller. The dual-mode Flash controller supports live update of one bank while executing from the other, enabling firmware field upgrades without downtime. The integrated USB 2.0 Full-Speed transceiver eliminates external PHY components, reducing BOM cost for HID, CDC, and custom USB device applications.
Typical applications include USB HID peripherals (keyboards, mice, custom input devices), USB-to-UART bridges, low-power IoT sensor nodes, battery-powered consumer electronics, industrial control interfaces, and small appliances requiring 32-bit performance with USB connectivity. The XLP feature set also makes it suitable for wearables and remote sensor nodes powered by coin-cell batteries.
When designing with this device, ensure the exposed pad is soldered to a sufficient ground copper pour for thermal dissipation. Decouple VDD with 100 nF ceramic capacitors placed as close as possible to the supply pins, and add a 10 uF bulk capacitor near the package. For USB applications, the D+/D- traces must be routed as a 90-ohm differential pair with proper length matching. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the standalone datasheet.
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