PIC32MM0128GPM028T-I/ML - 32-bit 25MHz 128KB Flash MCU | Microchip
料号： PIC32MM0128GPM028T-I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.47 | $34.70 |
| 100 | $2.95 | $295.00 |
| 500 | $2.52 | $1,260.00 |
| 1,000 | $2.18 | $2,180.00 |
PIC32MM0128GPM028T-I/ML 概述
A 32-bit microcontroller (MCU) is a microcontroller built around a 32-bit data path and 32-bit registers, allowing single-instruction handling of larger data words, higher addressable memory, and richer peripherals than 8-bit or 16-bit predecessors. Within the product taxonomy, an MCU belongs to the broader class of microcontrollers -> embedded processors -> semiconductors. The PIC32MM GPM family in particular combines Cortex-M0+ class power efficiency with a deterministic MIPS32 microAptiv core, often used in touch-sensing, USB-device, and low-power IoT endpoints.
Key features of this part include 128KB Flash with ECC, 16KB SRAM, a 2.5V/3.3V operating voltage range, 21 timers, 4 DMA channels, multiple comparators, PWM outputs, USB 2.0 full-speed device/host/OTG, and an industrial-grade operating temperature range of -40C to +85C. The part is supplied on tape and reel with the -I/ML suffix denoting industrial temperature and the ML = 28-pin QFN with exposed pad package.
The PIC32MM0128GPM028T-I/ML uses a RISC MIPS32 microAptiv core with hardware multiply/divide, integrated FPU-lite, and a microMIPS code-compressed instruction set that reduces Flash footprint by roughly 25%. Built-in ECC on the Flash array improves reliability in industrial and battery-powered environments, while the integrated USB 2.0 full-speed transceiver eliminates the need for an external PHY in USB-device applications.
Typical applications include low-power IoT sensor nodes, USB human-interface devices (HID), capacitive touch panels, wearable health monitors, consumer white goods with LCD displays, and battery-powered industrial sensor hubs. The wide 2.0-3.6V supply range simplifies designs powered directly from single-cell Li-ion or 2x AA cells.
When designing with this MCU, allow adequate copper area beneath the exposed pad for thermal dissipation and connect it to a clean ground plane. Decouple VDD with at least a 100nF X7R ceramic placed within 3mm of the pin, and add a bulk 4.7uF tantalum or ceramic for USB transceivers. Avoid routing high-frequency signals near the QFN pad to minimize coupling.
This page consolidates distributor pricing, parametric data, drop-in alternatives, and application examples that are not found in the manufacturer datasheet alone, giving procurement and design engineers a single source for evaluating the PIC32MM0128GPM028T-I/ML.
直接替换替代料： PIC32MM0128GPM028T-I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MM0128GPM028T-I/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
快速对比工具——选择替代料号进行并排对比：
PIC32MM0128GPM028-I/ML
✅ 直接替换✓ 有现货
$2.3 / 个
查看数据手册 →PIC32MM0064GPM028T-I/ML
✅ 直接替换✓ 有现货
$2.3 / 个
查看数据手册 →PIC32MM0064GPM028T-I/M6
✅ 直接替换✓ 有现货
$1.74 / 个
查看数据手册 →PIC32MM0128GPM028T-I/M6
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MM0128GPM028T-I/SO
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MM0128GPM028T-I/ML 最大额定值与电气特性
| Core Architecture | MIPS32 microAptiv (PIC32) |
| Core Size | 32-Bit |
| Maximum CPU Speed | 25 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Flash ECC | Yes (ECC-enabled) |
| SRAM | 16 KB |
| Operating Voltage Range | 2.0 V to 3.6 V (2.5 V/3.3 V typical) |
| 工作温度范围 | -40 C to +85 C (Industrial) |
| 封装 / 外壳 | 28-QFN (6x6 mm) with exposed pad |
| 安装类型 | Surface Mount |
| Number of Timers | 21 |
| DMA Channels | 4 |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| PWM Channels | Yes (multiple) |
| Comparators | Multiple |
| RoHS 状态 | Compliant |
| MSL 等级 | MSL3 (per JEDEC J-STD-020) |
| Instruction Set | microMIPS compressed |
| Connectivity | I2C, SPI, UART, USB, CAN (peripherals vary) |
PIC32MM0128GPM028T-I/ML 引脚配置
| 引脚 1 | RA0 — Remappable I/O / analog |
| 引脚 2 | RA1 — Remappable I/O / analog |
| 引脚 3 | RA2 — Remappable I/O / analog |
| 引脚 4 | RA3 — Remappable I/O |
| 引脚 5 | VDD — Positive supply |
| 引脚 6 | VSS — Ground |
| 引脚 7 | RA4 — Remappable I/O |
| 引脚 8 | RA5 — Remappable I/O |
| 引脚 9 | RA6 — Remappable I/O |
| 引脚 10 | RA7 — Remappable I/O |
| 引脚 11 | RB0 — Remappable I/O / analog |
| 引脚 12 | RB1 — Remappable I/O / analog |
| 引脚 13 | RB2 — Remappable I/O / analog |
| 引脚 14 | RB3 — Remappable I/O / analog |
| 引脚 15 | RB4 — Remappable I/O |
| 引脚 16 | RB5 — Remappable I/O |
| 引脚 17 | RB6 — Remappable I/O |
| 引脚 18 | RB7 — Remappable I/O |
| 引脚 19 | VSS — Ground |
| 引脚 20 | VDD — Positive supply |
| 引脚 21 | RB8 — Remappable I/O |
| 引脚 22 | RB9 — Remappable I/O |
| 引脚 23 | RC0 — Remappable I/O |
| 引脚 24 | RC1 — Remappable I/O |
| 引脚 25 | RC2 — Remappable I/O |
| 引脚 26 | RC3 — Remappable I/O |
| 引脚 27 | OSCI — Crystal oscillator input |
| 引脚 28 | OSCO — Crystal oscillator output |
典型应用
PIC32MM0128GPM028T-I/ML 适用于 6 应用s: Low-Power IoT Sensor Nodes, USB HID Devices, Capacitive Touch Panels, Wearable Health Monitors, Consumer White Goods with LCD, Battery-Powered Industrial Sensor Hubs.
Low-Power IoT Sensor Nodes
The PIC32MM0128GPM028T-I/ML's eXtreme low power modes, 2.0-3.6V supply range, and 128KB ECC Flash make it well-suited for battery-powered IoT sensor nodes that transmit over LoRa, BLE co-processor, or sub-GHz radios. The 25MHz microAptiv core delivers deterministic performance for sensor-fusion algorithms while the deep-sleep current stays below the datasheet-specified 1 uA, enabling multi-year coin-cell lifetimes. Place a 100nF X7R decoupling capacitor within 3mm of VDD and connect the QFN exposed pad to a 10x10mm ground copper pour for thermal stability. The 16KB SRAM buffer is sufficient for short sensor-data queues before radio transmission.
推荐
USB HID Devices
With its integrated USB 2.0 full-speed transceiver and 128KB Flash, the PIC32MM0128GPM028T-I/ML targets USB HID peripherals such as keyboards, mice, custom input devices, and industrial HMI panels. The on-chip USB PHY eliminates the need for an external transceiver, reducing BOM cost and PCB area by approximately 30%. The microMIPS instruction set yields 25% Flash savings, leaving headroom for HID report descriptors and bootloaders. Decouple VDD with 100nF plus 4.7uF bulk near the USB D+/D- pins and route the 90-ohm differential pair with controlled impedance.
推荐
Capacitive Touch Panels
The PIC32MM0128GPM028T-I/ML features Microchip's mTouch peripheral and 21 timers, enabling reliable capacitive touch sensing for control panels, white goods, and industrial keypads. The CTMU (Charge Time Measurement Unit) and CVD (Capacitive Voltage Divider) hardware blocks deliver noise-immune touch measurements without an external touch controller. The 128KB Flash supports mTouch libraries plus custom UI firmware. Use guard-ring traces around touch electrodes and isolate them from switching signals for best water-tolerant performance.
推荐
Wearable Health Monitors
The PIC32MM0128GPM028T-I/ML's compact 28-QFN (6x6 mm) footprint, low-power modes, and 2.0-3.6V supply align well with wearable health monitors including fitness bands, pulse-oximetry patches, and continuous glucose monitors. The 25MHz core is fast enough for heart-rate and SpO2 DSP routines while consuming only a few mA active. The integrated 12-bit ADC and comparators interface directly with photodiode or bio-impedance front-ends. Add a 32.768 kHz crystal for accurate RTC timekeeping in sleep mode.
推荐
Consumer White Goods with LCD
Industrial temperature (-40C to +85C), 16KB SRAM, and segment-LCD driver peripherals make the PIC32MM0128GPM028T-I/ML a strong fit for consumer white goods such as washing machines, dishwashers, and microwave oven control boards. The LCD driver can directly multiplex up to 8x32 segments without an external driver, reducing BOM cost. The 128KB Flash stores multilingual UI strings and motor-control state machines. Use TVS diodes on the AC-coupled mains interface to protect MCU I/O from surge transients.
推荐
Battery-Powered Industrial Sensor Hubs
The PIC32MM0128GPM028T-I/ML's industrial temperature grade, ECC Flash, and 4 DMA channels suit battery-powered industrial sensor hubs that aggregate 4-20 mA, Modbus, or wireless sensor data. The microAptiv core plus DMA offload sensor reads, leaving CPU bandwidth for application logic. The 128KB ECC Flash improves reliability in the field, reducing service-call rate due to bit flips. Add an RS-485 transceiver for Modbus and a watchdog supervisor for unattended deployments.
推荐
推荐产品汇总
工程参考数据： PIC32MM0128GPM028T-I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MM0128GPM028-I/ML | PIC32MM0064GPM028T-I/ML | PIC32MM0064GPM028T-I/M6 | PIC32MM0128GPM028T-I/M6 | PIC32MM0128GPM028T-I/SO |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) with exposed pad | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-SOIC - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 64 KB | 64 KB | 128 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 8 KB | 8 KB | 16 KB | 16 KB |
| Core Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| USB 2.0 FS | Yes | Yes | Yes | Yes | Yes | Yes |
| Industrial Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
关键差异点
- Integrated USB 2.0 Full-Speed transceiver （对比 PIC32MM0064GPM028T-I/ML)
- Higher Flash density in same 28-QFN footprint （对比 PIC32MM0128GPM028T-I/SO)
- Tray packaging option for low-volume production （对比 PIC32MM0128GPM028-I/ML)
设计说明
Place a 100nF X7R ceramic decoupling capacitor within 3mm of each VDD pin (pins 5 and 20 on the 28-QFN package), and add a 4.7uF bulk capacitor on the main 3.3V rail. For USB applications, the VUSB pin requires an additional 100nF decoupling cap. Average active current at 25MHz with all peripherals enabled is approximately 8 mA per the Microchip PIC32MM GPM datasheet; deep-sleep current is below 1 uA.
The 28-QFN exposed thermal pad (EP) must be soldered directly to a ground copper pour of at least 10x10 mm to keep junction temperature within spec. At 25MHz active current of 8 mA and 3.3V supply, power dissipation is approximately 26 mW - thermal management is rarely a constraint for this part, but the EP also reduces ground inductance and improves EMI. Avoid thermal relief spokes on the EP - use a continuous copper fill with multiple vias for best heat conduction.
Route the USB D+ and D- differential pair with 90-ohm controlled impedance and matched length within 150 mil. Keep clock traces (OSC1, OSC2) short and surrounded by ground pour to minimize EMI. Place the 32.768 kHz watch crystal within 5mm of OSCI/OSCO pins with a ground guard ring. Reserve a JTAG/SWD footprint (PGECx/PGEDx) for in-circuit programming and debugging per the Microchip development tool guidelines.
Do not float the MCLR pin - tie it to VDD through a 10k pull-up resistor and add a tactile reset switch to ground. Configure the unused I/O pins as digital outputs driven low to minimize supply current. For bootloader applications, reserve the last page of Flash for bootloader code; the PIC32MM0128GPM028T-I/ML has 128KB total Flash split into pages per the device memory map. Verify the configuration bits (FICD, FSEC, FOSC) match your oscillator and code-protect requirements before programming.
合规信息
RoHS and REACH compliant per Microchip product page environmental information. Industrial temperature grade (-I suffix). Not AEC-Q100 qualified; for automotive designs consult Microchip's PIC32MK family. Halogen-free molding compound per Microchip green-compound policy.
