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EP2AGZ350FH29C4G - Arria II GZ FPGA 350K LE FBGA-780 | Intel
EP2AGZ350FH29C4G

EP2AGZ350FH29C4G - Arria II GZ FPGA 350K LE FBGA-780 | Intel

The Intel (formerly Altera) EP2AGZ350FH29C4G is a high-performance Arria II GZ field-programmable gate array (FPGA) featuring 350K logic elements, 18.4 Mbits of embedded memory, and 8.5-Gbps transceivers, housed in a 780-ball flip-chip BGA (FH29) package. The device is built on a 40-nm process and targets mid-range applications requiring a balance of logic capacity, memory bandwidth, and high-speed serial I/O. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and block RAM. FPGAs occupy the hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor. Arria II GZ FPGAs specifically target applications that need 8.5-Gbps transceivers and substantial DSP resources without the cost of Stratix-class silicon. Key features of the EP2AGZ350FH29C4G include 350K logic elements (LEs), 18,424 Kbits of M20K block RAM plus 1,425 Kbits of MLAB, sixteen 8.5-Gbps transceivers supporting PCI Express Gen2 and Gigabit Ethernet, 1,152 embedded multipliers (18x18), and up to 552 user I/O pins. The FH29 780-ball flip-chip BGA package supports high-speed signal integrity and a wide operating temperature range. Typical applications include high-performance digital signal processing, software-defined radio (SDR), video processing and broadcast infrastructure, ASIC prototyping, and high-speed serial connectivity in telecommunications, defense, and test-and-measurement systems. The C4 speed grade and -4 transceiver grade position the part for cost-optimized commercial applications; -I (industrial) and -I5/I6 grades exist for harsher environments. When designing with this device, ensure proper PCB layout with matched-length traces for high-speed transceivers, adequate power-rail decoupling, and thermal management via the package's exposed thermal array. Configure the FPGA using Intel Quartus II design software (or the Quartus Prime Lite edition for cost-free development).

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EP2AGZ350FH29C4N - Arria II GZ FPGA, 350K LE, 780-BGA | Altera
EP2AGZ350FH29C4N

EP2AGZ350FH29C4N - Arria II GZ FPGA, 350K LE, 780-BGA | Altera

The Altera (Intel Programmable Solutions Group) EP2AGZ350FH29C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) integrating 350,000 logic elements, 21,270,528 bits of embedded memory (approximately 2.65 MBytes), 348,500 equivalent LEs (ALMs), and 281 user I/Os in a 780-ball flip-chip BGA (FCBGA / 780-BBGA) package. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks, transceivers, and PLLs. FPGAs belong to the broader family of programmable logic devices (PLDs) within the Integrated Circuits category. Modern FPGAs like the Arria II GZ combine this reconfigurable fabric with embedded processors, high-speed serial transceivers, and external memory controllers, occupying a position between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the system-design hierarchy. Key features of the EP2AGZ350FH29C4N include the Arria II GZ 40-nm process architecture, integrated 8-channel 6.375 Gbps transceiver support depending on die variant, hard PCI Express Gen1/Gen2 IP, dedicated DSP blocks for high-throughput signal processing, and the 780-pin flip-chip BGA package that supports high-speed signal integrity for backplane, broadcast, and wireline applications. The industrial-grade speed grade C4 supports a wide commercial/industrial operating profile. On the technical depth side, the Arria II GZ combines 8-input adaptive logic modules (ALMs) with per-LUT-register pairing, variable-precision DSP blocks supporting 9x9, 18x18, and 36x36 modes, and triplicated register blocks for soft error mitigation. Embedded memory is organized as M9K (9 Kbit) and M144K (144 Kbit) blocks, supporting true dual-port and simple dual-port configurations at up to 600 MHz. Typical applications include high-speed serial backplane interfaces (e.g. CPRI, OBSAI, Serial RapidIO), broadcast video and audio processing, software-defined radio (SDR) baseband, PCIe Gen2 endpoint/root-complex cards, test & measurement instrumentation, and high-performance DSP co-processing cards. The high logic density and abundant DSP blocks make the device a typical workhorse for telecom line cards and broadcast routers. When designing with this device, plan power-rail sequencing, thermal dissipation (FCBGA packages demand multi-layer PCB with internal copper planes and forced-air cooling at >10 W), and JTAG/Active Serial configuration. The 780-BBGA footprint requires a 1.27 mm or 1.0 mm pitch PCB design with controlled-impedance routing for transceiver channels. This page synthesizes distributor pricing, drop-in FPGA alternatives from the Arria II GZ family, and practical PCB design notes not consolidated in the manufacturer datasheet. For engineers verifying lead time and stock at authorized distributors, distributor data sources are cited inline below.

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EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel
EP2AGZ350FH29I3G

EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29I3G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm process and offered in a 780-ball FineLine BGA (FBGA, package code FH29) at the industrial -40C to +100C temperature grade. It integrates approximately 350,000 logic elements with embedded transceivers, embedded multipliers, and a programmable logic fabric targeted at high-throughput wireline and wireless infrastructure designs. The part is listed across authorized distributors as an FPGA IC with 281 user I/O pins. Background: An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture via an HDL-defined bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, and they are commonly categorized by logic-element density, transceiver count, and memory block count. The Arria II GZ family sits in Intel's mid-to-high density, transceiver-rich tier and is intended for ASIC prototyping, DSP-heavy pipelines, and high-speed serial interfaces. Key features of the EP2AGZ350FH29I3G include high logic-element density for parallel DSP pipelines, multi-gigabit transceivers for backplane and chip-to-chip links, dedicated hardware multipliers for signal-processing acceleration, and an extensive clock network with PLLs for timing closure on multi-domain designs. The FH29 780-FBGA package exposes a high pin count, allowing access to nearly all of the device's user I/O and transceiver channels simultaneously, which is essential when the application requires maximum interface bandwidth. Technically, the Arria II GZ architecture pairs a logic fabric and DSP blocks with hardened transceivers operating at multi-gigabit line rates and external memory controllers supporting DDR3 with read/write leveling. Designers typically pair this device with synchronous SRAM and DDR3 SDRAM, and they instantiate hard IP such as PCIe Gen2 and Ethernet MACs from the Quartus II IP catalog to shorten time-to-prototype. Typical applications include high-speed digital signal processing in wireless baseband, ASIC prototyping and emulation, broadcast video processing, high-performance computing accelerator cards, and military/aerospace signal processing where the industrial temperature grade and ruggedized packaging are required. Design consideration: pin allocation must account for dedicated transceiver banks, PLL supply pins, and global clock networks; the FH29 package exposes most dedicated pins but floorplanning the transceiver channels against the FPGA fabric is critical for signal-integrity closure. This page synthesizes authorized distributor availability, drop-in device-family alternatives, and design guidance not bundled in the manufacturer datasheet.

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EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel
EP2AGZ350FH29I3N

EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, fabricated on a 40 nm TSMC process node. Housed in a 780-ball FineLine BGA (FCBGA) package, this device integrates up to 24 transceivers supporting data rates suitable for high-speed serial interfaces. The part operates across an industrial temperature range of -40C to +100C (TJ) with a core voltage of 0.87 V to 0.93 V, delivering a balance of performance and power efficiency for mid- to high-end digital designs. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below fixed-function ASICs in cost-per-volume but above them in design flexibility. The Arria II GZ family is Intel's mid-range transceiver-equipped FPGA family, positioned between the lower-power Cyclone families and the high-end Stratix families, optimized for applications requiring integrated transceivers, DSP blocks, and significant on-chip memory. Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers supporting digital signal processing, multiple PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The 24 transceiver channels support multiple gigabit-per-second data rates, enabling protocols such as Serial RapidIO, Gigabit Ethernet, and CPRI. The 780-ball FCBGA package is suitable for high-speed designs where signal integrity demands controlled-impedance vias and short bond-wire lengths. Typical applications include wireless baseband processing, military radar signal processing, high-performance image processing, and high-speed serial protocol bridging. The transceiver channels and DSP blocks make the EP2AGZ350FH29I3N particularly well suited for protocols like OBSAI, CPRI, and Serial RapidIO used in telecom infrastructure. When designing with this device, ensure a 12-layer or more PCB with continuous GND planes for transceiver signal integrity. The 780-ball FCBGA requires via-in-pad or microvia technology for fanout. Quartus II design software is required for synthesis, place-and-route, and timing closure. This page synthesizes current distributor inventory, verified pricing, Arria II GZ family drop-in alternatives, and design notes specific to the FH29 package not found on standard distributor product pages.

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EP2AGZ350FH29I4G - 281-I/O Arria II GZ FPGA | Altera
EP2AGZ350FH29I4G

EP2AGZ350FH29I4G - 281-I/O Arria II GZ FPGA | Altera

Altera EP2AGZ350FH29I4G is a high-density Arria II GZ field-programmable gate array with 281 user I/O, supplied in a 780-ball fine-pitch BGA package. The verified distributor results identify the device as a programmable logic IC and associate the FH29 package code with this high-I/O configuration. Its position in the Arria II GZ family makes it suitable for designs requiring substantial configurable logic, multiple high-speed interfaces, and hardware-level concurrency rather than fixed instruction execution. A field-programmable gate array, or FPGA, is a semiconductor device built from programmable logic blocks, configurable routing, memory resources, and programmable I/O. Within the hierarchy FPGA → programmable logic device → integrated circuit, an FPGA bridges application-specific integrated circuits and software-controlled processors: the designer implements digital functions in configuration data while retaining the ability to revise hardware behavior. BGA packaging supports dense interconnect through many solder balls beneath the package. The principal verified product facts are 281 user I/O and a 780HBGA package. The device is listed as an Intel/Altera embedded FPGA, and distributor listings indicate real-time inventory and ordering availability. The MPN suffix identifies an industrial-temperature, lead-free, tray-oriented ordering option according to the supplied part-number convention context, while exact electrical ratings, logic-element count, transceiver count, operating voltage, and temperature limits require the manufacturer datasheet for confirmation. The part is designed for digital systems in which parallel datapaths, interface bridging, protocol termination, signal processing, or control logic must operate deterministically. Its 281-I/O capacity allows numerous board-level interfaces to share one programmable device. Because the available verified data does not state internal resource counts or timing figures, those values are intentionally not inferred here. Typical uses include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and defense or aerospace electronics. It can consolidate glue logic, interface adaptation, state machines, and high-speed control into one programmable device. Board implementation should use the manufacturer package ball map and signal-integrity guidance, provide complete power distribution and decoupling, and verify every high-speed interface against the relevant FPGA bank rules. The exact BGA land pattern and pin assignments must be obtained from the official Arria II GZ documentation. This page consolidates verified distributor availability, package and I/O facts, sourcing links, and same-family site candidates while clearly identifying technical data that still requires manufacturer-datasheet confirmation. Pricing is reported only as supplied by the verified distributor sources and remains subject to change.

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EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel
EP2AGZ350FH29I4N

EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 348500 logic elements, 21270528 bits of embedded memory, and 281 user I/O in a 780-ball Flip-Chip BGA package, manufactured on a 40 nm low-power process and rated for industrial temperature operation. According to distributor listings, this device belongs to the Arria II GZ family, which combines high transceiver throughput with on-chip transceivers up to 6.375 Gbps, making it well suited for high-speed serial interface and DSP-rich designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be rewired in-circuit to implement arbitrary digital functions. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> field-programmable gate arrays (FPGA) -> semiconductor ICs, and are commonly used as glue logic, co-processors, or full SoC replacements where ASIC NRE is not justified. Key features of the EP2AGZ350FH29I4N include 13940 LABs/CLBs, embedded transceiver support for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, embedded multipliers and DSP blocks, and dedicated PLL and global clock networks. The 0.9 V core voltage (per datasheet header summary) and 40 nm process technology reduce dynamic power versus prior Arria generations while maintaining timing margin. The Arria II GZ architecture combines a logic fabric with hard IP for memory controllers (DDR3 with ECC), high-speed transceivers, and PCI Express Gen2 x8 endpoints. Designers use Quartus II design software for synthesis, place-and-route, and timing closure; the same toolchain supports all Arria II GZ speed grades and package variants. Typical applications for this device include high-definition video broadcast equipment, wireless baseband processing, military radar preprocessing, medical imaging pipelines, and high-performance test and measurement backplanes. The 780-ball FCBGA provides dense I/O for memory interfaces and parallel digital buses. When designing in the EP2AGZ350FH29I4N, verify PCB stackup and decoupling per the Arria II GZ hardware reference manual, and confirm software version compatibility in Quartus II. Designers should also check the I4 speed grade against timing closure targets. This page synthesizes distributor pricing, same-brand drop-in alternatives within the Arria II GZ family, and FPGA design notes that complement the manufacturer datasheet to support both procurement and engineering decisions.

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EP2AGZ350HF40C2N - Arria II GZ FPGA, 350K LEs | Altera | FBGA-1517
EP2AGZ350HF40C2N

EP2AGZ350HF40C2N - Arria II GZ FPGA, 350K LEs | Altera | FBGA-1517

The Intel (formerly Altera) EP2AGZ350HF40C2N is a high-density Arria II GZ field-programmable gate array (FPGA) from the mid-range transceiver-equipped Arria II family, delivering approximately 350K logic elements in a 1517-ball flip-chip BGA (FCBGA) package. The device integrates up to 16 multi-gigabit transceivers operating up to 6.375 Gbps, dedicated DSP blocks, and embedded memory blocks, making it a drop-in compatible logic variant with speed grade C2 in the same HF40 package outline. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be redefined by the user after manufacturing. FPGAs sit hierarchically within programmable logic devices (PLD) -> logic ICs -> integrated circuits. They are favored over fixed-function chips when designs require high parallelism, fast time-to-market, hardware-level reconfigurability, or hardware-accelerated DSP. The Arria II GZ sub-family specifically targets applications that need a balanced mix of logic density, on-chip memory, DSP throughput, and multi-gigabit serial transceivers without moving to the higher-cost Stratix family. Key features of the EP2AGZ350HF40C2N include 350K logic elements (LEs), roughly 20 Mbits of embedded memory, dedicated 18x18 multipliers for DSP, transceivers reaching 6.375 Gbps, and a configurable I/O subsystem supporting multiple single-ended and differential I/O standards. Operating temperature grade is commercial (0C to +85C) as indicated by the C speed-grade and N suffix, and the device is built on a 40nm low-power process node. The HF40 package (1517-pin FCBGA, 40mm x 40mm body) integrates high-speed serial links, parallel I/O, external memory interfaces (DDR3, QDR II+, RLDRAM II), and general-purpose logic. Compared with Arria II GX parts, the GZ sub-family typically carries higher logic density and a richer transceiver feature set, which makes this device well suited to high-bandwidth data-path designs. Typical applications include high-speed serial interface bridging, telecommunications line cards, wireless baseband processing, video processing pipelines, and ASIC prototyping. The combination of transceivers and DSP blocks also enables use in software-defined radio (SDR) front ends and medical imaging accelerators. When designing with the EP2AGZ350HF40C2N, pay close attention to PCB layout of the 1517-ball FCBGA: a multi-layer board with controlled-impedance routing is required for the transceiver channels, and proper power decoupling is essential. Designers should use the Quartus II design suite with a license supporting the Arria II GZ device family. This page synthesizes distributor pricing, drop-in compatible Arria II GZ variants, and practical design notes that go beyond the device handbook to help engineers source and integrate this FPGA confidently.

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EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G

EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel

The Intel (formerly Altera) EP2AGZ350HF40C3G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1517-ball FineLine BGA package. It integrates 350,000 logic elements (LEs), up to 18.4 Mbits of embedded memory, and 734 user I/O pins, making it one of the most I/O-rich members of the Arria II GZ family. The device is fabricated on a 40 nm process and targets mid-range applications that demand high logic density with transceiver support. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically between ASICs (lower flexibility, lower unit cost) and microcontrollers/MPUs (less parallelism). The Arria II GZ family specifically bridges the gap between the lower-cost Cyclone series and the high-end Stratix series, targeting applications such as high-performance digital signal processing, broadcast video processing, and high-speed serial connectivity. Key features of the EP2AGZ350HF40C3G include dedicated DSP blocks delivering up to 550 MHz performance, embedded memory supporting dual-port RAM and FIFO configurations, on-chip transceivers operating up to 6.375 Gbps, and integrated PCI Express hard IP blocks. The device also supports external memory interfaces including DDR3, DDR2, and QDR II+ at rates up to 800 MHz, enabling high-bandwidth memory subsystems without external bridge chips. Programmable Power Technology allows unused logic to be dynamically shut down, reducing both static and dynamic power consumption. Architecturally, the EP2AGZ350HF40C3G implements an adaptive logic module (ALM) that combines traditional LUT-based logic with register chains, providing 8-input fracturable look-up tables and arithmetic capability in a single element. The fabric is paired with 8-input ALMs, variable-precision DSP blocks, and a hierarchical interconnect structure with adaptive routing. The transceiver tiles support multiple protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, providing system-level integration that simplifies PCB design. Typical applications for this device include high-end ASIC prototyping, broadcast and studio-grade video processing equipment, radar and electronic warfare signal processing, wireless baseband processing, and high-performance industrial imaging systems. The combination of high logic density, generous embedded memory, multi-gigabit transceivers, and a large user-I/O count makes it particularly well-suited for systems that previously required multiple mid-range FPGAs or a custom ASIC. The 'C3' speed grade and commercial temperature rating ('0C' suffix segment) suit indoor commercial enclosures without extended thermal stress. When designing with this part, careful PCB layout is essential due to the 1517-ball FBGA at 1.0 mm pitch. Power integrity analysis must be performed across all rails, and a multi-layer PCB with buried capacitance is recommended. The Quartus II design software (now Quartus Prime) provides the synthesis, place-and-route, and timing analysis tools required to compile bitstreams. Engineers should budget several weeks for initial compilation given the device size.

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EP2AGZ350HF40C3N - Arria II GZ FPGA, 350K LE, 1517-FCBGA | Intel
EP2AGZ350HF40C3N

EP2AGZ350HF40C3N - Arria II GZ FPGA, 350K LE, 1517-FCBGA | Intel

The Intel EP2AGZ350HF40C3N is a high-density Arria II GZ field-programmable gate array (FPGA) with 348,500 logic elements, 21,270,528 bits of embedded memory, and 734 user I/Os, housed in a 1517-ball flip-chip BGA package. It belongs to Intel's mid-range transceiver-equipped FPGA family built on a 40 nm low-power process, delivering up to 13,940 LABs (logic array blocks) and a DSP block count in the thousands for high-throughput signal processing. The device integrates up to 24 multi-gigabit transceivers and supports external memory interfaces such as DDR3, QDRII+, and RLDRAM2, making it a drop-in pin-compatible option for high-bandwidth telecom and video infrastructure designs. What is an FPGA? An FPGA (field-programmable gate array) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams stored in SRAM. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> semiconductor) and are widely used to implement parallel datapaths, custom interfaces, and hardware accelerators that would otherwise require costly ASIC development. The Arria II GZ family targets mid-range applications requiring transceivers and moderate logic density at lower cost than Stratix-class parts. Key features include transceiver data rates up to 6.553 Gbps, dedicated fractional PLLs, configurable I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and on-chip termination (OCT). The 1517-ball FCBGA package uses flip-chip interconnect for low-inductance power delivery and supports the 0.9 V core voltage typical of Arria II GZ. The device is designed for industrial temperature grades and offers bitstream encryption and JTAG-based configuration with support for EPCS and EPCQ configuration devices. Architecturally, the EP2AGZ350HF40C3N combines ALM-based adaptive logic modules with hard memory blocks (M9K and M144K), variable-precision DSP blocks, and PCI Express hard IP, enabling efficient implementation of high-performance DSP pipelines, video processing, and protocol bridging functions. Configuration can be loaded via fast passive parallel (FPP), active serial (AS), or JTAG modes. Typical applications include wireless baseband processing, military radar front-ends, broadcast video switchers, ASIC prototyping, and high-speed serial interface bridging. The integrated transceivers make the device suitable for backplane aggregation, SONET/SDH, and Custom Interconnect designs where 6 Gbps links are needed. When designing with this device, ensure PCB layout meets Intel's flip-chip BGA decoupling and thermal guidelines, and use the Quartus II design suite (13.0 or later) for synthesis, place-and-route, and timing closure. Note that Arria II GZ is a mature family - verify long-term availability for new production designs.

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EP2AGZ350HF40C4G - 350K LE Arria II GZ FPGA | Intel | FBGA-1517
EP2AGZ350HF40C4G

EP2AGZ350HF40C4G - 350K LE Arria II GZ FPGA | Intel | FBGA-1517

The Intel (formerly Altera) EP2AGZ350HF40C4G is a high-density Arria II GZ field-programmable gate array (FPGA) delivering 350,000 logic elements, 20,480 Kbits of embedded memory, and 4.7 Mbits of user-accessible RAM in a 1517-ball flip-chip BGA (FBGA-1517) package. It is rated speed grade 4 with a commercial operating temperature range of 0C to 85C and ships as a Pb-free tray-packaged unit. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers connected by a programmable routing fabric. FPGAs occupy a hierarchy between fixed-function ASICs and general-purpose processors: they offer hardware-level parallelism and deterministic latency without the NRE cost of an ASIC, while remaining reprogrammable in the field. The Arria II GZ family sits in Intel's mid-to-high-density transceiver-equipped tier, optimized for high-bandwidth applications such as high-speed serial interfaces and DSP-heavy signal processing. Key features of the EP2AGZ350HF40C4G include support for 4 multi-protocol 3.125 Gbps transceivers (the exact number of transceiver channels for this device-specific package may vary; check the device datasheet for the precise transceiver count), 8 fractional PLLs, dedicated hard memory controllers supporting DDR3, DDR2, and QDR memory, and a hard PCI Express Gen2 endpoint block. The device is fabricated on a 40 nm low-power process and integrates configurable I/O standards including LVDS, LVCMOS, SSTL, HSTL, and high-speed serial interfaces through the transceiver block. The Arria II GZ architecture combines a fine-grained logic fabric with column-based DSP blocks and embedded SRAM (M9K blocks of 9 Kbits and M144K blocks of 144 Kbits) for efficient implementation of DSP pipelines, video processing, and protocol bridging. The hard PCIe Gen2 endpoint eliminates the soft-IP overhead typical of FPGA-based PCIe implementations, enabling low-latency single-chip solutions for industrial and test-card designs. Configuration is supported via JTAG, passive serial, fast passive parallel, and active serial modes using a wide range of industry-standard configuration memories. Typical applications for the EP2AGZ350HF40C4G include high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SATA, XAUI), HD-SDI and 3G-SDI video processing, software-defined radio front-end sample processing, and high-channel-count DSP pipelines for test and measurement. The large logic capacity combined with hard PCIe and memory controllers makes it suitable as a host-side co-processor in medical imaging, defense signal intelligence, and high-performance industrial inspection systems. When designing with this device, pay close attention to the FBGA-1517 PCB land pattern - the 1.0 mm ball pitch requires high-density interconnect (HDI) PCB fabrication with micro-vias, and signal-integrity analysis of the transceiver channels is essential above 2.5 Gbps. Power estimation with the Intel FPGA PowerPlay Early Power Estimator (EPE) should be completed before committing to the PCB stackup, because the 40 nm process can dissipate substantial power under heavy DSP and transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GZ family, and practical design notes not found in the manufacturer datasheet.

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EP2AGZ350HF40C4N - Arria II GZ FPGA, 350K LE, 1517-BGA | Intel
EP2AGZ350HF40C4N

EP2AGZ350HF40C4N - Arria II GZ FPGA, 350K LE, 1517-BGA | Intel

The Intel (formerly Altera) EP2AGZ350HF40C4N is a high-density, high-performance Arria II GZ Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process and packaged in a 1517-ball FC-FBGA (HF40 / 40 mm). It integrates 348,500 logic elements (LEs) across 13,940 LABs, 21,270,528 bits of embedded memory (approximately 21.27 Mbits), and 734 user I/O pins, making it one of the densest mid-range FPGAs available for bandwidth-intensive applications. The C4 speed grade and commercial temperature grade target design teams that need deterministic, repeatable timing margins without paying for the industrial -I4 margin. An FPGA is a reprogrammable semiconductor that engineers can configure post-manufacturing to implement custom digital logic, DSP pipelines, memory controllers, transceiver interfaces, and high-speed serial protocols. Within the broader programmable-logic hierarchy, the Arria II GZ family sits between Cyclone (low-cost) and Stratix (high-end) families. Its 40 nm process technology, embedded transceivers (per family datasheet) and 0.9 V core supply make it well-suited for systems where performance per watt is more important than absolute capacity. Key features include 8-input adaptive logic modules (ALMs), fractional synthesis PLLs, up to 16 global clock networks, and dedicated DSP blocks that deliver up to ~550 MHz multiply-accumulate performance. Memory is organized as M9K and M144K blocks, with 24 transceiver channels supporting rates up to 6.375 Gbps (per family datasheet). The HF40 package exposes 734 general-purpose I/O plus dedicated clock, configuration, and JTAG pins for boundary-scan and in-system programming via JTAG or passive/active serial. The architecture is built around a core fabric of columns and rows of LABs interconnected by multi-track routing, with dedicated hardware for 18 x 18 multipliers, memory blocks, and high-speed I/O serializer/deserializer (SERDES) elements. The 40 nm process balances static and dynamic power, and Arria II GZ devices support Quartus II programmable power technology that automatically reduces power on unused blocks. Configuration is loaded from a serial flash or via JTAG using the active serial (AS) or JTAG modes, supporting fast field updates and remote reprogramming. Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), video processing and broadcast infrastructure, 40G/100G line-card bridging, test and measurement equipment, and high-end industrial imaging. The combination of 21 Mbits of block RAM and 734 user I/O also suits large datapath buffering for high-resolution video walls or medical imaging front-ends. When designing with this device, plan the PCB layout around the 40 x 40 mm FC-BGA land pattern, using microvia stack-ups for breakout, and provide multiple decoupling values (0.1 uF, 1 uF, 10 uF) close to each power rail. Always sequence the 0.9 V core before the 1.1 V/2.5 V/3.3 V auxiliary supplies to avoid latch-up at power-up. This page synthesizes distributor pricing, same-family drop-in alternatives from the Arria II GZ portfolio, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel
EP2AGZ350HF40I2N

EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel

The Intel (formerly Altera) EP2AGZ350HF40I2N is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1517-pin flip-chip BGA (HF40) package, industrial temperature grade, lead-free. As part of the Arria II GZ family it delivers up to 350K logic elements, embedded transceivers capable of multi-gigabit serial I/O, and dedicated DSP blocks for high-throughput signal processing. An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened peripherals that can be reconfigured by the customer after manufacture. FPGAs sit in the programmable-logic hierarchy above CPLDs and below custom silicon, providing ASIC-class performance with mask-set-free time-to-market. The Arria II GZ family specifically targets transceiver-rich applications such as wireless baseband, broadcast video, and defense signal processing where mid-range density and 6.375 Gbps transceivers are sufficient. Key features of the EP2AGZ350HF40I2N include the 350K logic-element fabric, embedded 6.375 Gbps multi-gigabit transceivers, on-chip memory, phase-locked loops for clock management, and a high-pin-count flip-chip BGA package that supports the wide parallel and serial I/O required by the largest device in the family. The industrial temperature grade (-40C to +100C) and lead-free solder-free build make it suitable for harsher environments than commercial Arria II GZ parts. Architecturally the device combines a logic fabric synthesized from 8-input adaptive look-up tables, embedded memory blocks, DSP blocks with 18x18 multipliers, and hardened PCIe and memory controllers. The transceiver physical media attachment layer supports multiple protocols including CPRI, OBSAI, Serial RapidIO, and 10G Ethernet MAC integration for backplane and fronthaul links. Typical applications include wireless base-station digital front-end, software-defined radio, high-performance computing accelerators, military radar and electronic-warfare platforms, broadcast video processing, and ASIC prototyping. The HF40 1517-pin FBGA package provides the signal integrity and pin budget required for parallel data paths and multiple transceiver channels. Designers should plan power-rail decoupling carefully; the EP2AGZ350HF40I2N draws significant transient current and requires multiple bulk and high-frequency ceramic capacitors around the periphery of the package, along with a multilayer PCB stackup dedicated to the FPGA. This page synthesizes distributor availability, drop-in alternative Arria II GZ variants, and FPGA design considerations that are not aggregated in any single distributor listing, providing a faster path from datasheet to design review.

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EP2AGZ350HF40I3 - Arria II GZ FPGA, 350K LE, 1517-FBGA | Intel
EP2AGZ350HF40I3

EP2AGZ350HF40I3 - Arria II GZ FPGA, 350K LE, 1517-FBGA | Intel

The Intel EP2AGZ350HF40I3 is a high-density Arria II GZ Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 13,940 user I/O pins in a 1517-ball Flip-Chip BGA (HF40, 40 mm x 40 mm) package. The Industrial temperature grade (-40C to +100C) device is rated for 1.0 V core operation and integrates 24 transceivers capable of up to 6.375 Gbps, four hard PCI Express Gen2 controllers, and 8 hard memory controllers supporting DDR3 up to 800 MHz. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of digital integrated circuits whose logic function is defined by user configuration rather than fixed at the factory. In the taxonomy of digital semiconductors, FPGAs sit between microcontrollers and ASICs, offering parallel programmable fabric with hard IP cores for memory controllers and high-speed serial I/O. The Arria II GZ family is positioned as a mid-range transceiver-rich FPGA optimized for high-bandwidth applications where ASIC NRE costs cannot be justified. Key differentiating features of the EP2AGZ350HF40I3 include 1.36 Gbps LVDS support on the LVDS side of the I/O, fractional phase-locked loops (fPLLs) for precision clocking, and 768 18x18 multipliers for DSP workloads. The device supports configuration via passive serial, fast passive parallel, and JTAG, with built-in encryption support for design security through AES-256 configuration bitstream encryption. Architecturally, the device combines a programmable logic fabric with column-based DSP blocks arranged in rows alongside M20K embedded memory blocks. Hard IP for PCIe Gen2 and 10 Gigabit Ethernet reduces logic utilization and timing closure effort, making the device suitable for high-throughput data-path designs. The 40 nm process allows a favorable trade-off between static power, dynamic performance, and price-per-logic-element compared with 65 nm predecessors. Typical applications include high-end test and measurement equipment, medical imaging, military radar and signal processing, broadcast video infrastructure, and high-performance computing accelerators. The transceiver-rich architecture and large logic density also suit the device for ASIC prototyping, where designers emulate full SoCs before committing to silicon. When designing with this device, allocate at least 30 % of the available logic budget for future revisions, since utilization above 85 % complicates timing closure. Pay close attention to transceiver channel placement -24 channels must be evenly distributed across the four transceiver banks to meet lane skew requirements at 6.375 Gbps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Cross-brand cross-reference is intentionally limited because the 1517-BGA footprint and Arria II GZ fabric are unique to Intel (formerly Altera), and true drop-in replacements from Xilinx or Lattice would require full PCB redesign.

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EP2AGZ350HF40I3G - Arria II GZ FPGA, 350K LE, 1517-BGA | Altera
EP2AGZ350HF40I3G

EP2AGZ350HF40I3G - Arria II GZ FPGA, 350K LE, 1517-BGA | Altera

The Altera (Intel) EP2AGZ350HF40I3G is a high-density Arria II GZ Field Programmable Gate Array (FPGA) with 348,500 logic elements, 20.29 Mbit embedded memory, and 1,517-pin FCBGA package, engineered for high-performance digital signal processing and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that engineers can reconfigure after manufacturing. FPGAs occupy a unique position in the broader IC hierarchy between standard microcontrollers and ASICs: more flexible than fixed-function ASICs, faster and more parallel than sequential microcontrollers. The Arria II GZ family specifically targets mid-range high-bandwidth applications such as high-speed serial interfaces, video processing, and DSP-heavy designs where Stratix-class performance is not required. Key features of the EP2AGZ350HF40I3G include 139,400 Adaptive Logic Modules (ALMs) organized as 348,500 equivalent logic elements (LEs), 20.29 Mbit of on-chip embedded memory arranged as M9K and MLAB blocks, and 1,170 18x18 hardware multipliers for DSP operations. The 1517-ball FCBGA package operates across the industrial -40C to +100C temperature range and supports multiple high-speed transceiver options. According to the device nomenclature, the "HF40" suffix indicates the 40mm FCBGA package with high-speed serial I/O, "I3" indicates industrial temperature grade, speed grade 3, and "G" denotes lead-free / RoHS-compliant Pb-free terminal finish. This part is designed into high-speed serial interfaces, broadcast video processing, and DSP-intensive systems. The device operates with a -3 speed grade designation under the Arria II GZ performance binning scheme. The transceiver-rich architecture provides multi-gigabit transceivers suitable for protocols including PCIe Gen1/Gen2, Serial RapidIO, and CPRI in wireless infrastructure. Designers can use this FPGA in both standalone operation and as a co-processing accelerator alongside processors in heterogeneous computing architectures. Typical applications include wireless baseband processing, high-definition video broadcast equipment, high-speed serial protocol bridging, and medical imaging systems where parallel DSP throughput is critical. The dense logic resources and embedded multipliers enable single-chip implementation of multi-channel signal processing pipelines without external co-processors. When designing with this FPGA, plan power delivery carefully. Large FPGAs in BGA packages typically require multi-rail power sequencing and at least 2-3W of thermal dissipation even at moderate utilization. Use Altera's Quartus II design suite (legacy) or Intel Quartus Prime for design entry, synthesis, place-and-route, and timing closure.

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EP2AGZ350HF40I3N - Arria II GZ 350K LE FPGA | Intel | Industrial
EP2AGZ350HF40I3N

EP2AGZ350HF40I3N - Arria II GZ 350K LE FPGA | Intel | Industrial

The Intel (formerly Altera) EP2AGZ350HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 13,940 LABs, and 734 user I/O pins, fabricated on a 40 nm process and housed in a 1517-ball FC-FBGA (HF40) package. According to verified distributor data, the device targets mid- to high-performance transceiver-based designs with 500 MHz core performance and 21,270,528 bits of embedded memory. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated I/O cells that engineers can reconfigure after manufacturing. FPGAs occupy a specific position in the semiconductor hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> transceiver FPGA. They are commonly used as flexible alternatives to ASICs for prototyping, low-volume production, and applications requiring parallel processing, custom I/O timing, or hardware-accelerated DSP. The EP2AGZ350HF40I3N integrates up to 24 high-speed transceivers operating up to 6.375 Gbps, dedicated DSP blocks supporting variable-precision arithmetic, and embedded memory blocks totaling over 20 Mbits. The HF40 package denotes a flip-chip fine-pitch BGA with a 1.0 mm ball pitch, optimized for high signal integrity on multi-gigabit serial links. Architecturally, the Arria II GZ family uses an SRAM-based configuration memory backed by 40 nm low-power process technology, providing a balance of performance-per-watt for applications such as wireless baseband processing, broadcast video bridging, and high-speed serial protocol bridging. The 'I3' speed grade and 'N' lead-free suffix designate industrial temperature range operation (-40C to +100C) and lead-free / RoHS compliance. Typical applications include 40G/10G Ethernet bridge and aggregation, HD-SDI video routers, PCIe Gen1/Gen2 endpoint and root complex designs, software-defined radio (SDR) baseband, and high-speed test and measurement instrumentation. The HF40 package's flip-chip construction supports the high pin count required for wide parallel and serial interfaces simultaneously. When designing with this part, ensure the PCB stack-up supports 1.0 mm BGA breakout and that thermal management accounts for industrial temperature operation under full transceiver utilization. Engineers should use the Quartus II design software with Arria II device support to generate configuration bitstreams and verify pin assignments before tape-out. This page synthesizes distributor pricing, drop-in compatible Arria II GZ siblings, and practical PCB/design notes that are not consolidated in the manufacturer datasheet.

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EP2AGZ350HF40I4G - Arria II GZ FPGA 350K LE | Intel
EP2AGZ350HF40I4G

EP2AGZ350HF40I4G - Arria II GZ FPGA 350K LE | Intel

The Intel EP2AGZ350HF40I4G is a high-density Arria II GZ FPGA delivering 350K logic elements with transceivers up to 6.375 Gbps, housed in a 1517-ball FBGA (HF40) package at industrial temperature grade. It belongs to Intel's (formerly Altera) Arria II GZ family, which targets high-performance, transceiver-rich applications such as high-end communications, broadcast, military, and DSP-intensive systems. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets designers configure digital logic blocks, routing, and I/O after manufacture. FPGAs sit hierarchically within the broader semiconductor family: FPGA -> programmable logic -> logic ICs -> integrated circuits. Arria II GZ devices use a 40nm process, embed dedicated transceivers, DSP blocks, on-chip memory, and PLL/clock networks, and are SRAM-based so configuration must be loaded from external flash at each power-up. Key features include transceiver speeds up to 6.375 Gbps supporting CPRI, PCIe Gen1, SATA, and Serial RapidIO, an extensive DSP block fabric for high-precision fixed- and floating-point arithmetic, hard memory controllers, and a rich I/O mix that supports DDR3, LVDS, and SERDES. Industrial-grade parts (I4 suffix) operate from -40C to +100C junction temperature and are Pb-free/RoHS compliant. The device is typically paired with EPCQ configuration memory for autonomous boot. Architecturally, the Arria II GZ family uses a logic-element granularity optimized for register-rich designs, 8-input adaptive LUTs, dedicated 18x18 multipliers plus hard floating-point DSP blocks, and a clock network with up to 16 PLLs per device. The HF40 (FBGA-1517) package exposes the maximum I/O count and full transceiver count for this die, making it suitable for line-card designs with high I/O and SERDES density. Typical applications include telecom line cards with CPRI backhaul, military secure communications, video broadcast processing (e.g., 3G-SDI routing), high-channel-count DSP for radar and medical imaging, and ASIC-prototyping platforms that need 350K LEs of headroom. Its combination of transceivers and DSP blocks makes it a common choice for protocol-bridging and baseband processing designs. Designers should plan power architecture carefully because Arria II GZ FPGAs can draw tens of amps during configuration and dynamic operation; multiple decoupling rails (VCC, VCCA, VCCT, VCCPT) are required. Quartus II software with the Arria II device support is required for synthesis, place-and-route, and timing closure.

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EP2AGZ350HF40I4N - Arria II GZ FPGA 350K LE | Intel
EP2AGZ350HF40I4N

EP2AGZ350HF40I4N - Arria II GZ FPGA 350K LE | Intel

The Intel (formerly Altera) EP2AGZ350HF40I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 13,940 LABs, and 21,270,528 bits of embedded memory in a 1517-ball FC-FBGA package. Manufactured on a 40 nm process node with a 0.9 V core voltage, the device operates at up to 500 MHz and supports 734 user I/O pins with mixed-voltage standards including LVDS, LVPECL, and HSTL. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect fabric, and I/O cells that engineers can configure after manufacture. FPGAs occupy a unique tier in the semiconductor hierarchy - between general-purpose CPUs/DSPs and fixed-function ASICs - offering hardware-level parallelism, deterministic latency, and post-silicon design revision. Modern high-density FPGAs such as the Arria II GZ family add embedded transceivers, hard PCIe IP blocks, and dedicated DSP slices, positioning them as mid-range platforms between cost-optimized Cyclone series and high-end Stratix devices. The Arria II GZ family combines 8.5 Gbps transceivers, up to 12.5 Mbits of MLAB memory, and hard IP for PCIe Gen2 and external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). Its transceivers support backplane, chip-to-chip, and SFP+/XFP optical interconnect with adaptive equalization and pre-emphasis, making the EP2AGZ350HF40I4N well suited to broadband wireless, broadcast video, and 40G/100G line-card prototyping. The 40 nm low-power (LP) process enables static power approximately 40% lower than prior 65 nm nodes, while preserving full transceiver and DSP performance. The 1517-ball flip-chip BGA provides abundant high-speed signal routing with controlled impedance, suitable for 8-lane Gen2 PCIe plus multiple DDR3 memory channels. Typical applications include 40G/100G Ethernet line cards, wireless backhaul baseband processing, broadcast video processing (3G-SDI, HD-SDI), ASIC prototyping, and high-performance DSP for medical imaging. The device also appears in defense radar signal processing and high-frequency trading acceleration. When designing with this part, follow Intel pin-out guidelines for flip-chip BGA decoupling, maintain 1.0 V core supply sequencing, and use the Quartus II design suite (13.0 or later) for synthesis. The 'I4' speed grade and industrial temperature range (-40C to +100C) ensure robust operation in harsh environments. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a single source for sourcing, replacement, and reference design decisions.

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EP2C15AF256C8N - 15K LEs Cyclone II FPGA, 256-FBGA | Intel / Altera
EP2C15AF256C8N

EP2C15AF256C8N - 15K LEs Cyclone II FPGA, 256-FBGA | Intel / Altera

The Intel (formerly Altera) EP2C15AF256C8N is a Cyclone II family field-programmable gate array (FPGA) with 14,448 logic elements, 239,616 bits of embedded RAM, and 152 maximum user I/O pins, housed in a 256-ball fine-line BGA (FBGA-256) package. Built on a 90 nm CMOS process with a 1.2 V core supply, the device delivers low-cost, low-power programmable logic for high-volume applications such as digital signal processing, industrial control, and display interfaces. A Cyclone II FPGA is a SRAM-based programmable logic device that integrates configurable logic arrays (LABs), embedded memory blocks (M4K blocks), embedded 18x18 multipliers, and a programmable I/O ring into a single die. Positioned below the high-end Stratix family and above the original Cyclone series, Cyclone II is designed to deliver ASIC-like logic density at FPGA-like design flexibility, while consuming substantially less power than its Stratix siblings - typically 50-60% lower static power at comparable densities. Key features include support for LVDS, LVCMOS, SSTL, and HSTL I/O standards through dedicated True-LVDS circuitry; up to 52 embedded 18x18 multipliers enabling DSP-style FIR/FFT pipelines; a maximum of 4 PLLs providing clock synthesis, phase shifting, and frequency multiplication; and 68 M4K RAM blocks that can be configured as RAM, ROM, or FIFO. The 'C8' speed grade corresponds to an 8 ns internal timing corner, and the 'N' suffix denotes a lead-free, RoHS-compliant package. Architecturally, the EP2C15 uses a sea-of-LABs fabric where each LAB contains 16 logic elements (LEs), each LE comprising a 4-input LUT, a programmable register, and a carry chain. Interconnect is achieved through MultiTrack routing with row/column drivers, and configuration data is stored in SRAM, requiring an external configuration device such as the EPCS4 or EPCS16 serial flash on power-up. Typical applications include digital video processing and display controllers, motor control and industrial automation, software-defined radio baseband, low-cost prototyping of custom logic, and communications infrastructure such as bridges between legacy parallel buses and modern serial interfaces. The 256-ball FBGA package enables compact PCB layouts and supports high-speed signal integrity for LVDS links. When designing with this device, plan configuration loading time carefully - the EP2C15 in fast standard mode requires approximately 12 ms to configure from an EPCS16, and JTAG or Active Serial configuration must be selected via MSEL pins. Decoupling must follow Altera's Cyclone II pin connection guidelines, with 0.1 µF and 0.01 µF capacitors near every VCCINT and VCCIO bank. This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical board-design notes not found in the manufacturer datasheet alone.

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EP2C15AF256I8N - Cyclone II FPGA 14448 LE 152 I/O | Altera
EP2C15AF256I8N

EP2C15AF256I8N - Cyclone II FPGA 14448 LE 152 I/O | Altera

The Altera EP2C15AF256I8N is a Cyclone II field-programmable gate array (FPGA) with 14,448 logic elements, 239,616 RAM bits and 152 user I/O pins, supplied in a 256-ball FBGA (256-LBGA) package with a 1.2 V core voltage. It is an industrial-temperature "I8" speed-grade part intended for cost-sensitive control, DSP, and interface applications. An FPGA is a semiconductor device containing reconfigurable logic blocks, embedded memory, and programmable routing that can implement arbitrary digital circuits after manufacturing. FPGAs sit in the programmable logic hierarchy: FPGA - programmable logic device (PLD) - integrated circuit - semiconductor. Unlike fixed-function ASICs, the EP2C15AF256I8N can be reprogrammed in-system through JTAG or configuration flash, making it useful for designs that require hardware flexibility and field upgrades. Key features of the EP2C15AF256I8N include 14,448 logic elements (LEs), 239,616 bits of embedded RAM, and 152 user I/O pins. The AF256 ordering segment indicates the 256-ball FineLine BGA package family, while the I8 notation denotes industrial temperature grade and speed grade. The trailing N suffix indicates a lead-free, RoHS-compliant package option. The Cyclone II architecture organizes LEs into logic array blocks, with embedded memory blocks and multiplier resources for DSP and control logic. The 1.2 V core minimizes power, and the IO banks support common voltage levels including 3.3 V and 1.5 V, allowing direct connection to legacy parallel buses and mixed-voltage systems. As an older mainstream FPGA family, it has a mature software toolchain and broad ecosystem support. Typical applications include industrial automation, video and image processing, communications bridging, motor control, and test instrumentation. The 152 user I/O pins can interface to ADCs, DACs, SRAM, and parallel data buses. Its moderate logic density makes it suitable for glue logic, soft-core processors, and protocol conversion without the cost of a larger FPGA. Designers should verify the exact BGA ball map and I/O bank rules from the Cyclone II Device Handbook before layout. A separate Intel/Altera configuration device such as EPCS4 is commonly used for non-volatile configuration; the FPGA can also be configured through JTAG for prototyping. This page synthesizes verified distributor listings, same-family drop-in alternatives, parametric cross-reference data, and board design guidance—information often scattered between distributor pages and datasheets.

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EP2C15AF484C6N - Cyclone II FPGA, 14,448 LEs, 484-FBGA | Intel
EP2C15AF484C6N

EP2C15AF484C6N - Cyclone II FPGA, 14,448 LEs, 484-FBGA | Intel

The Intel (Altera) EP2C15AF484C6N is a Cyclone II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA-484, 23x23 mm) package. Built on a 90 nm low-k process, the device integrates 14,448 logic elements (LEs) across 903 logic array blocks (LABs), 239,616 bits of embedded RAM (M9K blocks totaling approximately 239 kbit), and 315 user I/O pins supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and programmable I/O cells. Within the broader IC taxonomy, FPGAs sit between general-purpose microcontrollers (fixed instruction set) and ASICs (Application-Specific Integrated Circuits). Cyclone II is Intel's low-cost, high-volume FPGA family targeting cost-sensitive applications where designers need ASIC-like integration without NRE costs, including industrial control, video processing, automotive driver assistance, and communications infrastructure. Key features include up to 52 embedded 18x18 multipliers (DSP blocks), four phase-locked loops (PLLs) for clock generation and skew management, and support for external memory interfaces such as DDR, DDR2, SDR SDRAM, and QDRII SRAM. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for flexible I/O voltage mixing, and supports configuration via passive serial (AS), active serial, JTAG, or Altera-specific configuration schemes with built-in decompression and decryption options. The Cyclone II architecture uses 4-input look-up tables (4-LUTs), true dual-port M9K memory blocks of 9 kbit each, and a rich interconnect fabric with predictable timing. Multipliers are organized as 18x18 signed/unsigned blocks with optional input/output registers, suitable for FIR filters, FFT butterflies, and image-processing kernels. The I/O structure provides on-chip termination (OCT) and calibrated slew-rate control, enabling robust signal integrity at 100+ MHz LVDS rates. Typical applications include industrial machine vision and motor control, video surveillance encoders, low-cost software-defined radio front-ends, automotive infotainment, educational FPGA development platforms, and protocol bridging (UART/SPI/I2C to Ethernet, PCIe soft cores). The 484-FBGA package's 1.0 mm ball pitch is suitable for multi-layer PCB designs with controlled-impedance routing. When designing with this part, ensure the PCB has at least four dedicated ground and two VCCINT planes, and that configuration mode pins (MSEL) are tied to logic levels matching the chosen configuration scheme. Unused I/O pins should be left floating or driven to a defined state per Altera's guidelines; floating pins add leakage but avoid drive conflicts. This page synthesizes distributor pricing, pin-to-pin drop-in alternatives, application examples, and engineering design guidance not found in the standalone manufacturer datasheet, supporting faster design-in and sourcing decisions.

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EP2C15AF484I8N - 14,448 LEs Cyclone II FPGA 484-FBGA | Intel
EP2C15AF484I8N

EP2C15AF484I8N - 14,448 LEs Cyclone II FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP2C15AF484I8N is a Cyclone II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package with 315 user I/O pins. The die delivers 14,448 logic elements backed by 239,616 bits of embedded RAM and supports up to 250 MHz internal operation, making it a workhorse low-cost FPGA for high-volume embedded, industrial, and communications designs. An FPGA is a reprogrammable semiconductor whose logic fabric is configured after manufacture via a bitstream loaded into SRAM configuration cells. Cyclone II devices target cost-sensitive applications that still require programmable logic, DSP blocks, and external memory interfaces. In the broader taxonomy, FPGAs are programmable logic devices (PLDs) belonging to the larger category of digital logic ICs and ultimately semiconductors. Cyclone II succeeded the original Cyclone family with a 90 nm process, embedded 18x18 multipliers for DSP, and on-chip PLLs for clock management. The EP2C15A variant provides 14,448 logic elements (LEs), 52 M9K embedded RAM blocks totaling 239,616 bits, 4 PLLs, and 315 maximum user I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards and offers up to four DLLs/PLLs for clock synthesis and skew management. Configuration is via passive serial, fast passive parallel, JTAG, or Altera-enhanced configuration devices, and the part is offered in commercial (0 to 85 C) and industrial (-40 to 100 C) temperature grades. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, low-cost ASIC prototyping, and communications line cards. The 484-FBGA package offers ample I/O for memory-heavy designs and high-speed parallel interfaces such as DDR/DDR2 SDRAM controllers. Designers commonly pair the EP2C15 with external DDR SDRAM, flash for configuration storage, and an EPCS serial configuration device. When designing with EP2C15AF484I8N, observe the FPGA power-on sequencing and use proper decoupling (100 nF + bulk) on every VCCIO/VCCINT rail. The 484-FBGA requires careful PCB stack-up and microvia technology for reliable assembly. JTAG access for programming and debug is essential, and an external configuration device is required because Cyclone II SRAM is volatile.

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EP2C20F256C6 - 18,752 LEs, 500 MHz, 256-LBGA FPGA | Intel
EP2C20F256C6

EP2C20F256C6 - 18,752 LEs, 500 MHz, 256-LBGA FPGA | Intel

The Intel EP2C20F256C6 is a Cyclone II field-programmable gate array with 18,752 logic elements, 500 MHz performance, 152 I/O, and a 256-LBGA package. It uses 90 nm fabrication technology and operates from a 1.2 V supply. The device combines 18,752 configurable logic elements with 239,616 bits, or 234 kbit, of embedded memory, providing a compact programmable-logic platform for control, communications, signal processing, and embedded system integration. A field-programmable gate array is a semiconductor in which the digital circuit is defined after manufacture. An FPGA belongs to the programmable-logic hierarchy, where configurable logic, block memory, and programmable I/O replace a fixed combination of gates, counters, interfaces, and memory. The Cyclone II architecture provides a practical alternative to custom ASICs when logic must be revised quickly, prototypes must be produced in small volumes, or board-level parallelism is needed. The EP2C20F256C6 combines a 500 MHz device operating point with 18,752 logic elements and 152 user I/O in a 256-LBGA package. Its 234 kbit of embedded memory supports data buffering, lookup tables, packet handling, and state-machine storage. The 1.2 V core supply supports modern FPGA clocking and logic operations, while 152 I/O provide substantial connectivity for buses, memory interfaces, clock inputs, control signals, and external data acquisition. Cyclone II devices use programmable logic technology for flexible hardware implementation. Engineers can configure parallel datapaths, protocol bridges, state machines, counters, and control logic in one integrated device. The EP2C20F256C6 is positioned for designs requiring more logic and I/O than small CPLDs while retaining a relatively compact 256-ball package for board integration. Typical uses include industrial control and automation, communications infrastructure, test and measurement, embedded instrumentation, audio and signal-processing front ends, and general-purpose digital prototyping. Its 18,752 logic elements can distribute independent functions across parallel channels, while embedded memory can support buffering and lookup operations close to the logic that consumes the data. Design planning should account for the 256-LBGA footprint, ball assignment, power distribution, decoupling, clock routing, and programmed I/O constraints. Existing Quartus II-compatible designs and tool flows should be checked against the exact device speed grade and package before production release. Because the Cyclone II family has reached end of production, long-term availability and redesign planning require particular attention. This page consolidates device specifications, lifecycle considerations, same-package alternatives, comparison parameters, and practical replacement guidance. It is intended to help engineers evaluate EP2C20F256C6 sourcing, board compatibility, and migration planning without overlooking device-speed, temperature, or package distinctions.

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EP2C20F256C6N - 18,752 LEs Cyclone II FPGA 256-FBGA | Intel
EP2C20F256C6N

EP2C20F256C6N - 18,752 LEs Cyclone II FPGA 256-FBGA | Intel

The Intel (Altera) EP2C20F256C6N is a low-cost Cyclone II FPGA featuring 18,752 logic elements, 239,616 bits of embedded RAM, and 152 user I/O pins in a 256-ball FineLine BGA (FBGA-256) package. Built on a 90 nm low-k dielectric CMOS process, this device targets high-volume, cost-sensitive applications requiring programmable logic without the power and cost of high-end FPGAs. The "C6N" suffix denotes the commercial speed grade (C6) with Pb-free lead-free (N) termination per JEDEC J-STD-020. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and multiplier blocks. FPGAs sit hierarchically within programmable logic devices (PLD) and are used to implement custom digital logic, signal processing pipelines, and glue logic. The Cyclone II family targets low-power, high-volume applications and uses a look-up-table (LUT) based logic architecture combined with embedded M4K RAM blocks, multiplying DSP blocks, and PLL clock management. Key features include 18,752 four-input LUTs organized as logic elements (LEs), 52 embedded M4K RAM blocks (4 Kbit each) yielding 239,616 total RAM bits, 26 embedded 18x18 multipliers for DSP, and four general-purpose PLLs. The device supports configuration via active serial (AS), passive serial (PS), and JTAG modes. It accepts up to 16 global clock networks and provides 152 user I/O pins distributed across 8 I/O banks, each supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Typical applications for the EP2C20F256C6N include industrial motor control and factory automation, video processing and display controllers, software-defined radio (SDR) front-end signal conditioning, automotive infotainment prototyping, and embedded vision pipelines. The 26 dedicated hardware multipliers enable moderate DSP workloads such as FIR filtering and image preprocessing without consuming logic resources. Designers select this device when deterministic parallel processing is needed at a unit price point lower than Cyclone III/IV or competing low-end FPGAs. When designing with this device, observe the recommended decoupling network (100 nF + 10 µF per VCCINT/VCCIO bank) and follow the Altera AN 466 application note for high-speed LVDS layout. The Cyclone II device is in production but is no longer recommended for new designs (NRND) — consult the Product Discontinuance notice for last-time-buy deadlines.

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EP2C20F256C7 - Cyclone II FPGA 18,752 LE 152 I/O | Altera
EP2C20F256C7

EP2C20F256C7 - Cyclone II FPGA 18,752 LE 152 I/O | Altera

The Altera EP2C20F256C7 is a Cyclone II Field Programmable Gate Array (FPGA) containing 18,752 logic elements, 239,616 RAM bits, 152 user I/O pins, a 1.2 V core voltage, and a 402.58 MHz maximum internal clock frequency, supplied in a 256-ball LBGA/FBGA package. An FPGA is a semiconductor device containing programmable logic blocks and programmable interconnects that can be configured after manufacturing to implement arbitrary digital circuits. In the system hierarchy, an FPGA sits above standard-cell ASICs as a reconfigurable logic platform; it is a member of the programmable logic device family, which includes CPLDs and complex PLDs, and is widely used to implement glue logic, interface bridging, DSP data paths, and soft-core processors. Key differentiators of the EP2C20F256C7 include its balance of logic density and I/O count, with 18,752 logic elements and 152 user I/O arranged in a 256-ball package. The Cyclone II family is built on a 90 nm low-k dielectric process, helping to keep cost and power low while delivering adequate performance for cost-sensitive applications. The device integrates 26 embedded 18-bit x 18-bit multipliers and four PLLs, making it suitable for simple DSP and clock-managed designs without external PLL components. Architecturally, the Cyclone II core uses a 1.2 V supply with programmable I/O banks that support common single-ended and differential standards. The C7 suffix denotes a commercial temperature grade and speed grade 7. Its configuration is loaded from an external configuration device or host through JTAG, active serial, or passive serial modes, giving designers flexible in-system update options. Typical applications include industrial motor control, protocol bridging, video interface conversion, test and measurement, and as a cost-effective vehicle for prototyping or replacing custom ASICs. The 152 I/O pins in the F256 footprint are sufficient for parallel buses and modular peripheral expansion. A practical design consideration is that this non-N part should be used only where lead-bearing solder is acceptable; for RoHS-marketed systems, select the EP2C20F256C7N or another N-suffixed variant. Good 1.2 V core decoupling and a defined power-up sequence are also essential for reliable FPGA configuration. This page synthesizes distributor stock status, pricing, drop-in same-family alternatives, and practical design notes, providing actionable selection information that is not commonly available in a single datasheet listing.

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