EP2AGZ350HF40C3N - Arria II GZ FPGA, 350K LE, 1517-FCBGA | Intel
料号： EP2AGZ350HF40C3N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2715 | $27,150.00 |
| 100 | $2520 | $252,000.00 |
| 500 | $2340 | $1,170,000.00 |
| 1,000 | $2150 | $2,150,000.00 |
EP2AGZ350HF40C3N 概述
What is an FPGA? An FPGA (field-programmable gate array) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams stored in SRAM. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> semiconductor) and are widely used to implement parallel datapaths, custom interfaces, and hardware accelerators that would otherwise require costly ASIC development. The Arria II GZ family targets mid-range applications requiring transceivers and moderate logic density at lower cost than Stratix-class parts.
Key features include transceiver data rates up to 6.553 Gbps, dedicated fractional PLLs, configurable I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and on-chip termination (OCT). The 1517-ball FCBGA package uses flip-chip interconnect for low-inductance power delivery and supports the 0.9 V core voltage typical of Arria II GZ. The device is designed for industrial temperature grades and offers bitstream encryption and JTAG-based configuration with support for EPCS and EPCQ configuration devices.
Architecturally, the EP2AGZ350HF40C3N combines ALM-based adaptive logic modules with hard memory blocks (M9K and M144K), variable-precision DSP blocks, and PCI Express hard IP, enabling efficient implementation of high-performance DSP pipelines, video processing, and protocol bridging functions. Configuration can be loaded via fast passive parallel (FPP), active serial (AS), or JTAG modes.
Typical applications include wireless baseband processing, military radar front-ends, broadcast video switchers, ASIC prototyping, and high-speed serial interface bridging. The integrated transceivers make the device suitable for backplane aggregation, SONET/SDH, and Custom Interconnect designs where 6 Gbps links are needed.
When designing with this device, ensure PCB layout meets Intel's flip-chip BGA decoupling and thermal guidelines, and use the Quartus II design suite (13.0 or later) for synthesis, place-and-route, and timing closure. Note that Arria II GZ is a mature family - verify long-term availability for new production designs.
直接替换替代料： EP2AGZ350HF40C3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGZ350HF40C3N （相同外形与封装尺寸） ——差异在于 Package, Logic Elements, Speed Grade, Transceivers, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP2AGZ350HF40C3G
✅ 直接替换✓ 有现货
$1380 / 个
查看数据手册 →EP2AGZ350HF40C2N
✅ 直接替换✓ 有现货
$2645 / 个
查看数据手册 →EP2AGZ300HF40C3N
✅ 直接替换✓ 有现货
$3623.45 / 个
查看数据手册 →EP2AGZ300HF40C3G
✅ 直接替换✓ 有现货
$5950 / 个
查看数据手册 →EP2AGZ225HF40C3N
✅ 直接替换✓ 有现货
$1820 / 个
查看数据手册 →EP2AGX260FF35C6N
✅ 直接替换✓ 有现货
$1320 / 个
查看数据手册 →EP2AGZ350HF40C3N 最大额定值与电气特性
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory Bits | 21,270,528 |
| User I/Os | 734 |
| Transceivers | Up to 24 (per family datasheet) |
| Transceiver Data Rate | Up to 6.553 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm low-power |
| 封装 | 1517-ball FCBGA (HF40) |
| Operating Temperature Grade | Commercial (C3) |
| Configuration Mode | FPP / AS / JTAG |
| 安装类型 | Surface Mount (flip-chip BGA) |
EP2AGZ350HF40C3N 1517-ball fcbga (hf40) 引脚配置指南
EP2AGZ350HF40C3N（1517-ball fcbga (hf40) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGZ350HF40C3N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGZ350HF40C3N 适用于 6 应用s: Wireless Baseband Processing, ASIC Prototyping, Military Radar Front-End Processing, Broadcast Video Switching and Processing, High-Speed Serial Interface Bridging, Medical Imaging Acceleration.
Wireless Baseband Processing
The EP2AGZ350HF40C3N's 348,500 logic elements and 21,270,528 bits of embedded memory make it suitable for multi-antenna wireless baseband processing. The 6.553 Gbps transceivers interface directly to CPRI/OBSAI links to remote radio heads, while DSP blocks implement channel estimation, FFT/iFFT, and turbo decoding. The 1517-FCBGA package supports the high I/O count required for parallel CPRI lanes plus backplane connectivity.
推荐
ASIC Prototyping
With 348,500 logic elements the EP2AGZ350HF40C3N can emulate ASIC RTL designs of moderate complexity for pre-silicon validation. Quartus II's TimeQuest timing analysis and on-chip logic analyzer (SignalTap) provide deep visibility, while abundant M9K/M144K memory blocks model on-die SRAM behavior. The HF40 BGA footprint and 734 user I/Os expose full design interfaces for prototype bring-up.
推荐
Military Radar Front-End Processing
The Arria II GZ architecture supports high-speed ADC-to-FPGA interfaces via LVDS pairs, making the EP2AGZ350HF40C3N suitable for radar pulse compression and digital beamforming. Transceiver channels aggregate digitized antenna data at up to 6.553 Gbps, and DSP blocks implement FIR filters, FFTs, and CFAR detection. Commercial temperature grade is appropriate for sheltered ground- or shipboard installations.
推荐
Broadcast Video Switching and Processing
Broadcast video routers require high-throughput switching fabrics with low latency; the EP2AGZ350HF40C3N's 734 user I/Os and 24 transceivers handle uncompressed 3G-SDI switching and 10GbE trunk aggregation in single-chip implementations. Embedded memory buffers line-rate video streams while DSP blocks implement color-space conversion and scaling. Industrial temperature grade and 0.9 V core voltage support 24/7 rack-mount reliability.
推荐
High-Speed Serial Interface Bridging
The EP2AGZ350HF40C3N's up to 24 multi-gigabit transceivers and rich memory subsystem enable bridging between protocols such as Serial RapidIO, PCIe Gen2, SATA, and 10 Gigabit Ethernet. PLLs and PCS hard IP reduce logic usage, freeing ALMs for protocol-stack firmware and DMA engines. The HF40 1517-ball package supports high lane counts with clean signal-integrity routing on standard high-speed PCB stackups.
推荐
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems rely on FPGA-accelerated DSP pipelines to reconstruct images in real time. The EP2AGZ350HF40C3N's combination of abundant DSP blocks, embedded memory, and high I/O bandwidth enables back-projection, FIR filtering, and beamforming at clinically relevant frame rates. The HF40 FCBGA package supports the dense, thermally efficient layouts required in compact imaging carts.
推荐
推荐产品汇总
工程参考数据： EP2AGZ350HF40C3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGZ350HF40C3G | EP2AGZ350HF40C2N | EP2AGZ300HF40C3N | EP2AGZ300HF40C3G | EP2AGZ225HF40C3N | EP2AGX260FF35C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (HF40) | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (HF40) - same | 1517-ball FCBGA (FF35) - same pin count |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GX |
| Logic Elements | 348,500 | 348,500 | 348,500 | 300,000 | 300,000 | 225,000 | 260,000 |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps | Up to 6.553 Gbps |
| Speed Grade | C3 | C3 | C2 (slower) | C3 | C3 | C3 | C6 (slower) |
| RoHS / Lead-Free | Compliant (N variant lead-bearing) | RoHS-compliant / lead-free | Compliant (N variant lead-bearing) | Compliant (N variant lead-bearing) | RoHS-compliant / lead-free | Compliant (N variant lead-bearing) | Compliant (N variant lead-bearing) |
| Approx. Unit Price (qty 1) | USD 2,850 | USD 2,900 (approx) | USD 2,700 (approx) | USD 2,300 (approx) | USD 2,350 (approx) | USD 1,750 (approx) | USD 2,100 (approx) |
关键差异点
- Higher logic density than 300K variant with same footprint （对比 EP2AGZ300HF40C3N)
- Faster speed grade than C2 sibling （对比 EP2AGZ350HF40C2N)
- Lead-bearing N variant supports legacy assembly lines （对比 EP2AGZ350HF40C3G)
- GZ family provides enhanced PLLs versus GX family （对比 EP2AGX260FF35C6N)
设计说明
The EP2AGZ350HF40C3N in the 1517-ball FCBGA (HF40) package dissipates significant power under typical utilization (often 8-15 W). Per Intel's Arria II GZ thermal management guidelines, designers must provide a minimum 4-layer PCB stack-up with dedicated inner power planes, an array of thermal vias under the die footprint, and adequate airflow (typically 200 LFM) to keep junction temperature below 100 C. Always run the Quartus II PowerPlay early power estimator during architecture to size the cooling solution before layout commitment.
The 1517-ball FCBGA uses 1.0 mm ball pitch requiring high-density interconnect (HDI) PCB fabrication with laser-drilled micro-vias and via-in-pad construction for clean signal and power delivery. Decoupling: place 0.1 uF X7R capacitors within 100 mils of every VCCINT/VCCPD/VCCA ball, plus bulk 10-22 uF X5R capacitors distributed across the package perimeter. Reference Intel's Arria II GZ pin connection guidelines for the full decoupling checklist - omitting recommended caps can cause configuration failure or in-system bitstream corruption.
Common pitfalls: (1) mixing C (commercial) and I (industrial) temperature grade parts on the same BOM line - they share the same footprint but the I grade has different speed-grade binning; (2) failing to enable on-chip termination (OCT) for LVDS pairs, causing signal-integrity failures on high-speed links; (3) using the wrong configuration mode - fast passive parallel (FPP) requires an external flash controller while AS mode uses EPCS/EPCQ devices. Always verify the Quartus II pin assignment matches the schematic before board fabrication.
Multi-gigabit transceiver channels up to 6.553 Gbps demand controlled-impedance differential routing (100 ohm differential, typically 85 ohm to ground reference) with continuous reference planes and minimum via stubs. Keep TX and RX pairs length-matched within 5 mils and isolate from noisy digital signals. The HF40 ball map assigns dedicated transceiver banks; route these on the top layer or in symmetric stripline pairs to preserve signal integrity. Cross-reference Intel's Arria II GZ transceiver layout guidelines for stack-up recommendations.
合规信息
RoHS compliance per Intel Arria II GZ family product environmental documentation. AEC-Q100 not applicable - FPGAs are not qualified to automotive discrete semiconductor stress standards. Halogen-free packaging declared per industry standard. C3 suffix denotes commercial temperature grade (0 C to +85 C).
