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EP2S60F1020I4 - Stratix II 60K LEs FPGA | Intel / Altera | 1020-FBGA
EP2S60F1020I4

EP2S60F1020I4 - Stratix II 60K LEs FPGA | Intel / Altera | 1020-FBGA

The Intel (formerly Altera) EP2S60F1020I4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 718 maximum user I/O pins in a 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) package. Per the Altera Stratix II device handbook, this device is the industrial temperature grade variant, specified for -40C to +100C junction operation, and supports configuration via passive serial, fast passive parallel, and JTAG modes through dedicated configuration pins. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic through a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers (software-defined, lower throughput). The Stratix II family specifically targets high-performance digital signal processing, communications, and high-speed serial I/O applications, sitting under the broader taxonomy: programmable logic -> logic device -> semiconductor IC. Key features of the EP2S60F1020I4 include up to 36 embedded 18x18 multipliers (DSP blocks) for high-speed arithmetic, twelve global clock networks with phase-locked loops (PLLs), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device embeds TriMatrix memory blocks totaling approximately 2.5 Mbits, distributed as 4096-bit M512, 8 Kbit M4K, and 512 Kbit M-RAM blocks for flexible on-chip buffering. Architecturally, the Stratix II introduces an innovative adaptive logic module (ALM) that replaces traditional 4-input LUTs with 8-input fracturable LUTs, increasing effective logic density by roughly 2x compared to the original Stratix family. Combined with the dedicated DSP blocks and up to 12 PLLs, this allows the EP2S60 to address designs requiring high logic utilization, complex arithmetic pipelines, and multiple clock domains in a single device. Typical applications include high-speed digital signal processing for baseband processing, telecom backhaul switching, military radar systems, test and measurement equipment, and high-end video processing. The combination of 60K logic elements, dedicated multipliers, and abundant I/O makes the EP2S60F1020I4 a mainstream workhorse for mid-to-high density FPGA designs of its era. When designing with this device, plan for power consumption carefully. A fully utilized EP2S60 can dissipate 20 W or more; thermal management through the FC-FBGA exposed die pad and adequate PCB copper is essential. Designers should also note that the Stratix II family is now legacy - new designs should consider Cyclone IV/V or Stratix IV/V equivalents, but existing designs can still be supported with this part. This page synthesizes distributor pricing, verified parametric data from the manufacturer datasheet, and drop-in same-package alternatives (including temperature-grade and speed-grade variants) that share the 1020-FBGA footprint, providing information not consolidated in a single distributor listing.

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EP2S60F1020I4N - Stratix II FPGA, 60K LE, 1020-BGA | Intel
EP2S60F1020I4N

EP2S60F1020I4N - Stratix II FPGA, 60K LE, 1020-BGA | Intel

The Intel EP2S60F1020I4N is a Stratix II family Field Programmable Gate Array (FPGA) integrating approximately 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and 718 maximum user I/O pins in a 1020-ball flip-chip BGA package. It is built on a 1.2 V core, 90 nm CMOS process with a 1.5 V PCI Express hard IP block, delivering up to 717 MHz fabric performance and embedded DSP blocks for high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by a configuration bitstream loaded from external flash at power-up. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and are widely used as hardware accelerators in the hierarchy of microprocessors -> DSPs -> FPGAs -> custom ASICs. Stratix II specifically targets high-performance ASIC prototyping, telecom baseband processing, and high-speed serial I/O subsystems where deterministic latency and parallel arithmetic throughput are required. Key features include up to 36 embedded 18x18 multipliers organized into DSP blocks, twelve PLLs for clock management, support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM, and 12 high-speed transceiver channels supporting up to 6.375 Gbps for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Each Stratix II LAB contains 10 Adaptive Logic Modules (ALMs), each ALM containing two Adaptive Look-Up Tables (ALUTs), enabling efficient mapping of arithmetic, register, and combinational logic. The architecture is fabricated on a 90 nm strained-silicon CMOS process with copper interconnect and low-k dielectric. It supports a maximum user I/O count of 718 across 32 I/O banks, with per-bank voltage-referenced standards ranging from 1.2 V to 3.3 V including LVDS, LVPECL, HSTL, and SSTL. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), fast passive parallel (FPP), or JTAG, with bitstream encryption and decompression supported through the AES-128 engine. Typical applications include ASIC prototyping and emulation, telecom line-card payload processing, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, CEI-6G), video and image processing pipelines, and military/aerospace signal-processing platforms. The Stratix II family is widely used in defense, medical imaging, and broadcast video systems where deterministic throughput is critical. When designing with this device, careful attention must be paid to power-rail sequencing (VCCINT, VCCIO, VCCA, VCCD_PLL), thermal management via the exposed die and 1.0 mm BGA pitch, and signal-integrity routing for the transceiver channels. Reference designs and IBIS models from Altera's design resource center are recommended for first-time bring-up. This page synthesizes distributor pricing, drop-in alternative SKUs within the Stratix II family, and practical design considerations not found on a stockist product page.

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EP2S60F1020I5N - 60K LE Stratix II FPGA, 718 I/O, 1020-BGA
EP2S60F1020I5N

EP2S60F1020I5N - 60K LE Stratix II FPGA, 718 I/O, 1020-BGA

The Intel (formerly Altera) EP2S60F1020I5N is a high-density Stratix II family FPGA fabricated on a 90 nm CMOS process, delivering 60,440 logic elements and up to 718 user I/O pins in a 1020-ball FC-FBGA package. Operating from a 1.2 V core supply at speeds up to 609.76 MHz, this device targets high-performance digital signal processing, telecom, and embedded compute designs requiring maximum logic density. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, the EP2S60F1020I5N sits in the Stratix II family -> high-end FPGA -> programmable logic device -> semiconductor. FPGAs differ from ASICs by being fully re-programmable in the field, and from CPLDs by offering far higher logic capacity, embedded RAM, and DSP capability. Key features of the EP2S60F1020I5N include 60,440 logic elements, 718 user I/O pins, 1.2 V core voltage with on-chip voltage regulation, dedicated DSP blocks for high-speed arithmetic, abundant TriMatrix embedded memory, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Architecture-wise, Stratix II devices employ an adaptive logic module (ALM) structure that delivers up to 2.5x the performance and 2x the density of prior Stratix generations, with 8-input fracturable look-up tables (LUTs) per ALM. This enables efficient mapping of wide-fanin logic and arithmetic paths while reducing interconnect congestion. Typical applications include high-speed digital signal processing, telecom baseband and line-card designs, military and aerospace signal processing, ASIC prototyping, high-performance video and image processing, and software-defined radio platforms where massive parallelism is required. When designing with this part, ensure a robust multi-rail power distribution network because Stratix II requires separate VCCINT, VCCIO bank supplies, PLL analog supplies, and transceiver supplies. Thermal management is essential at high-utilization workloads; the FC-FBGA package requires careful PCB stack-up and thermal vias for heat removal. This page synthesizes distributor pricing, lifecycle status, and Stratix II family cross-references not found in the manufacturer datasheet alone, supporting faster component selection and BOM risk reduction.

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EP2S60F484C3 - Stratix II FPGA, 60K LE, 484-FBGA | Intel / Altera
EP2S60F484C3

EP2S60F484C3 - Stratix II FPGA, 60K LE, 484-FBGA | Intel / Altera

The Intel / Altera EP2S60F484C3 is a member of the Stratix® II family of field-programmable gate arrays (FPGAs) fabricated on a 90 nm process, offering 60,440 logic elements, 2,544,192 bits of embedded memory, and 334 user I/O pins housed in a 484-ball FineLine BGA package operating from 1.2 V core supply. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are used to implement arbitrary digital logic, parallel processing pipelines, and custom compute accelerators that would be impractical to realize in fixed ASICs. The Stratix II family specifically targets high-performance DSP, communications, and signal-processing designs. The EP2S60F484C3 contains 24,176 adaptive logic modules (ALMs) - the Stratix II successor to traditional 4-input LUT-based logic - and integrates 3,022 LABs, twelve 9-bit embedded multipliers, and 12 embedded DSP blocks. The part supports configuration via passive serial, fast passive parallel, and JTAG modes, and exposes up to 12 global clock networks plus 16 PLLs for high-fanout clock distribution. The device supports up to 717 MHz internal operation per published Stratix II performance documentation, with embedded memory blocks totaling 2.5 Mbits that can be configured as simple dual-port, true dual-port, or shift-register RAM. The 1.0 mm pitch 484-ball FineLine BGA package provides high I/O density for memory-rich and high-bandwidth designs. Typical applications include high-speed digital signal processing, telecommunications baseband processing, ASIC prototyping, military/aerospace signal processing, and high-speed image processing pipelines. Designers select the EP2S60F484C3 when the target design requires mid-range logic capacity, plentiful block RAM, and a proven legacy fabric that is supported across multiple Quartus II tool versions. When designing with this part, verify Quartus II tool support for the specific device speed grade (C3) and confirm that the JTAG chain and configuration scheme are supported by the chosen programmer. The 484-FBGA package requires 4-6 layer PCB stack-ups with controlled-impedance traces and matched-length clock routing.

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EP2S60F484C3N - 60KLE Stratix II FPGA 484-FBGA | Intel
EP2S60F484C3N

EP2S60F484C3N - 60KLE Stratix II FPGA 484-FBGA | Intel

The Intel EP2S60F484C3N is a member of the Stratix II family of high-performance FPGAs built on a 90 nm process technology, delivering 60,440 equivalent logic elements (LEs) in a 484-pin FineLine BGA package. The device integrates up to 2.5 Mbits of embedded TriMatrix memory arranged in three block sizes (M-RAM, M4K, and M512) and includes up to 12 embedded DSP blocks operating at up to 450 MHz, providing a balanced mix of logic, memory, and signal-processing resources. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic and routing are defined by a user-supplied configuration bitstream. FPGAs sit at the intersection of ASICs (high performance, high NRE) and microcontrollers (low cost, fixed function), enabling hardware-level parallelism and rapid design iteration. Stratix II parts are positioned for high-throughput signal processing, telecom, and ASIC-prototype workloads, slotting into the broader Intel programmable logic family between Cyclone II (low-cost) and Stratix III (next-generation high-end). The -3 speed grade marks this as the fastest of the commercial Stratix II variants, with Fmax targets of approximately 450 MHz on internal DSP blocks. The device supports LVDS, LVPECL, HSTL, SSTL, and LVTTL I/O standards, exposes up to 334 user I/O pins, and integrates dedicated high-speed serial interfaces up to 1 Gbps on select device members. The F484 package uses a 1.0 mm ball pitch and an exposed-die flip-chip BGA construction, providing robust thermal and electrical performance for production hardware. Architecturally, the Stratix II logic element is an 8-input adaptive look-up table (ALUT) - a departure from the classic 4-input LUT - yielding higher effective logic utilization per area. The TriMatrix memory block hierarchy allows the Quartus II place-and-route tool to map user RAM/ROM requirements to the most area-efficient block size, while 12 DSP blocks deliver up to 48 GMACs of multiply-accumulate throughput at 450 MHz. Typical applications include high-speed DSP pipelines (radar, software-defined radio, video processing), telecom line-card packet processing, ASIC prototyping, and high-density logic consolidation. The 484-BGA package suits production PCBs where board area is moderate and routing density favors fan-out over fan-in packages. Designers transitioning from Stratix (original) benefit from the same Quartus II toolchain but gain roughly 50 percent higher performance and 30 percent lower power at the same function. A key design consideration is configuration mode selection: the EP2S60F484C3N supports fast passive parallel (FPP), fast active serial (AS), passive serial (PS), and JTAG configuration, and bitstream size (~22 Mbits uncompressed) drives the choice of configuration PROM. Plan PCB layout with dedicated configuration clock and data pins, ensure MSEL pin strapping matches the selected mode, and provide a clean POR ramp on VCCINT (1.2 V nominal) before any I/O activity.

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EP2S60F484C4 - Stratix II FPGA, 60K LE, 484-FBGA | Altera / Intel
EP2S60F484C4

EP2S60F484C4 - Stratix II FPGA, 60K LE, 484-FBGA | Altera / Intel

The Altera (now Intel) EP2S60F484C4 is a Stratix II family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, and 334 user I/O pins in a 484-ball FineLine BGA (FBGA) package. The -C4 speed grade balances logic performance against dynamic power, making the part suited for high-throughput DSP pipelines, telecom baseband processing, and high-speed serial I/O designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Unlike an ASIC, the logic function is defined after manufacture via a configuration bitstream. Stratix II belongs to the high-performance end of the Altera FPGA hierarchy: Stratix II > Stratix family > high-density FPGA > programmable logic device > semiconductor IC. Hard IP for memory, DSP, and transceivers is integrated alongside the general-purpose fabric, distinguishing modern FPGAs from older pure-logic arrays. Key features of the EP2S60F484C4 include 3,022 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory blocks totaling approximately 2.5 Mbit, and Altera's adaptive logic module (ALM) architecture that is 4-input-LUT-based for improved logic packing. The -C4 speed grade targets core speeds around 350-400 MHz for typical designs and is well-suited to DDR/DDR2 memory interfaces and LVDS signaling. Typical applications include high-performance digital signal processing, telecom line cards, video broadcasting infrastructure, military/aerospace signal processing, and ASIC prototyping. Designers choose this device when high logic density and generous on-chip memory are required but the premium -C5 speed grade or industrial -I temperature range is unnecessary. A practical design consideration is power and thermal management at high toggle rates: Stratix II FPGAs benefit from intelligent power-aware compilation and proper thermal relief on the FBGA land pattern. Verify that your PCB footprint matches Altera's 484-pin FBGA land pattern exactly, as FBGA packages offer no mechanical compliance margin. This page synthesizes current distributor pricing, drop-in alternatives, and design notes that complement the official datasheet.

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EP2S60F484C4N - Stratix II FPGA 60K LE 484-FBGA | Intel (Altera)
EP2S60F484C4N

EP2S60F484C4N - Stratix II FPGA 60K LE 484-FBGA | Intel (Altera)

The Intel (Altera) EP2S60F484C4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, fabricated on a 90 nm CMOS process and operating from a 1.2 V core supply. It delivers 60,440 logic elements (LEs), 2,544,192 bits of embedded RAM (M4K/M512/RAM blocks combined), and 334 user I/Os, targeting high-performance DSP, telecommunications, and ASIC-prototyping workloads. According to the manufacturer datasheet, the device integrates up to 36 embedded DSP blocks (18x18 multipliers) and supports configuration via passive serial, fast passive parallel, and JTAG modes with built-in decryption for IP protection. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. FPGAs bridge the gap between fixed-function ASICs and software-defined processing: unlike microcontrollers that execute sequential firmware, FPGAs implement true hardware parallelism, achieving deterministic latency and very high throughput for pipelined datapaths, signal processing, and protocol bridging. The Stratix II architecture specifically introduced an adaptive logic module (ALM) with 8 inputs and an 8-bit fracturable look-up table (LUT), giving it roughly 25% higher logic utilization than the prior Stratix generation. Key differentiating features of the EP2S60F484C4N include a maximum internal clock frequency up to 711.24 MHz per the manufacturer datasheet, support for external memory interfaces up to DDR2/DDR SDRAM with dedicated PHY hardware, and a high-speed I/O fabric supporting LVDS, LVPECL, and SSTL signaling. The device also integrates phase-locked loops (PLLs) for clock management, with up to 12 PLLs available for clock multiplication, division, and phase shifting across multiple clock domains. The 484-FBGA package exposes 334 user I/O pins plus dedicated configuration, clock, and JTAG pins, enabling dense board-level integration without sacrificing signal integrity. Typical applications include high-speed digital signal processing (radar, software-defined radio), 10 Gbps data aggregation and protocol bridging, ASIC prototyping and emulation, high-end imaging and video processing pipelines, and telecom line-card implementations. The wide logic capacity and embedded multiplier count make it particularly attractive for designs requiring parallel filter banks, FFTs, and convolutional processing. When designing with the EP2S60F484C4N, engineers should plan thermal dissipation carefully: at full utilization the device can dissipate several watts through the FBGA substrate, requiring thermal vias and a multi-layer PCB stack-up to keep junction temperatures within the 0-85 C commercial range. Decoupling must follow Altera's recommended guidelines with multiple bulk and high-frequency capacitors placed directly under the BGA footprint. This page synthesizes distributor pricing snapshots, pin-compatible Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single-source decision view as of 2026-09-09.

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EP2S60F484C5 - Stratix II FPGA 60K LE 484-FBGA | Altera / Intel
EP2S60F484C5

EP2S60F484C5 - Stratix II FPGA 60K LE 484-FBGA | Altera / Intel

The Altera (now Intel) EP2S60F484C5 is a member of the Stratix II family of high-performance FPGAs built on a 90 nm CMOS process, offering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, and 334 user I/Os in a 484-ball FineLine BGA (FC-FBGA) package. The device integrates 24176 configurable logic blocks (CLBs) across 3022 logic array blocks (LABs) and is supplied from a 1.2 V core rail with a maximum internal operating frequency around 609 MHz according to manufacturer datasheet summaries. The C5 speed grade places this part in the commercial temperature range with a balance of performance and cost for non-extreme-speed designs. Stratix II devices feature adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks, and dedicated high-speed I/O support including LVDS, making them suitable for high-throughput data-path and signal-processing applications. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, embedded memory, DSP slices, and programmable interconnect that can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), and they are widely used for ASIC prototyping, DSP acceleration, high-speed serial interfaces, and glue logic where time-to-market or post-production flexibility justifies their higher unit cost versus fixed-function ASSPs. The Stratix II family specifically targets high-density, performance-driven applications and is architecturally positioned between older Stratix and later Stratix III/IV families within Altera's high-end product tree. Key features of the EP2S60F484C5 include 60,440 LEs, 2,544,192 RAM bits organized into TriMatrix memory blocks, dedicated 18x18 multipliers and DSP blocks, 12 PLLs for clock management, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, PCI-X), and JTAG-based IEEE 1149.1 boundary-scan testing. The 484-pin FC-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch, suitable for high-density multi-layer PCB designs using standard BGA assembly processes. The Stratix II architecture uses an 8-input adaptive logic module (ALM) rather than the 4-input LUT found in earlier families, allowing more logic to be packed into each block and improving effective utilization. Combined with the 90 nm process, the architecture delivers high performance per watt while supporting up to 1 Gbps I/O on certain pins and embedded transceivers on selected package options. Designers typically use Quartus II development software to compile, synthesize, place, and route designs targeting this device. Typical applications for EP2S60F484C5 include high-speed digital signal processing (radar, software-defined radio, baseband), telecom line-card packet processing, ASIC prototyping for ASICs in the 100K-300K gate range, high-speed data-acquisition front-ends, video and imaging pipelines, and industrial control systems requiring parallel arithmetic. Designers migrating from earlier Stratix devices benefit from the larger LE count and richer DSP/memory ratio for signal-processing-centric designs. When designing with EP2S60F484C5, pay close attention to the FPGA's power-up sequencing requirements - VCCINT, VCCPD, and VCCA must rise monotonically within specific timing windows defined by Altera AN-351. Decoupling capacitors (typically 0.1 uF and 10 uF per rail) should be placed adjacent to each power pin, and the JTAG chain must be accessible for in-system programming. The C5 speed grade is appropriate when the design's critical path is below ~250 MHz; for higher speeds choose C6 or migrate to Stratix III/IV families. This page synthesizes distributor pricing, drop-in alternatives, application notes, and practical design notes not typically aggregated on a single manufacturer page - complementing the official Altera Stratix II Device Handbook.

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EP2S60F484C5N - 60K LE Stratix II FPGA, 484-FBGA | Intel
EP2S60F484C5N

EP2S60F484C5N - 60K LE Stratix II FPGA, 484-FBGA | Intel

The Intel (Altera) EP2S60F484C5N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package. It integrates 60,440 equivalent logic elements, 2,544,192 bits of embedded RAM, 334 maximum user I/O pins, and operates across an industrial-junction temperature grade (C5 speed grade, commercial). A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all interconnected by a routed fabric. Stratix II sits in the FPGA taxonomy as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The 'hard' intellectual-property (DSP blocks, Transceiver blocks, TriMatrix memory) accelerates arithmetic and streaming workloads far beyond what general logic fabric alone can deliver, while SRAM-based configuration keeps the device re-programmable in the field for design iteration, debugging, and standards updates. Key features include 12 dedicated Transceiver blocks (up to 6.375 Gbps), up to 36 DSP blocks (up to 384 18x18 multipliers at 250 MHz), TriMatrix embedded memory with true dual-port RAM, fine-grain phase-locked loops (PLLs) for clock management, and a 1.2V core supply with multi-voltage I/O support (1.5V/1.8V/2.5V/3.3V LVTTL/LVCMOS). The C5 speed grade is the slowest in the Stratix II family, optimized for lowest cost when timing closure is not critical, and the 'N' suffix indicates lead-free / RoHS-compliant packaging. Stratix II devices use a 90 nm CMOS process with 1.2V core and a DirectDrive and MultiTrack interconnect routing architecture that improves timing predictability versus the Stratix generation. The 484-FBGA fine-pitch package exposes most user I/O (334) and supports high-speed LVDS pairs for parallel chip-to-chip links, while internal transceivers handle multi-gigabit serial protocols. Typical applications include high-performance digital signal processing (radar, software-defined radio), ASIC prototyping and emulation, high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), industrial imaging and video processing, and communications infrastructure baseband units. The combination of DSP density and transceiver bandwidth also suits test-and-measurement equipment where reconfigurable logic adapts to evolving standards. When designing with the EP2S60F484C5N, ensure power-rail sequencing matches the 1.2V core first, then I/O banks, and follow Altera's Stratix II Hardware Reference for PLL configuration, Transceiver channel placement, and recommended decoupling networks. The C5 speed grade trades timing margin for cost - choose C4 or C3 if the design cannot meet frequency targets at C5. This page synthesizes distributor pricing, parameter-grade drop-in alternatives, and Stratix II design guidance not collected on a single manufacturer page.

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EP2S60F484I4 - Stratix II FPGA 60K LE 484-FBGA | Intel
EP2S60F484I4

EP2S60F484I4 - Stratix II FPGA 60K LE 484-FBGA | Intel

The Intel (formerly Altera) EP2S60F484I4 is a member of the Stratix II family of Field Programmable Gate Arrays, delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 334 user I/O pins in a 484-ball FineLine BGA (FBGA) package. Built on a 90 nm CMOS process with 1.2 V core voltage, the device integrates 12 dedicated transceiver channels and operates at fabric speeds up to 711 MHz, providing high logic density and signal throughput for mid-range ASIC prototyping, communications infrastructure, and DSP acceleration. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined after manufacture by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLD), positioned alongside Complex PLDs (CPLDs) at the low-density end and ASICs at the high-density, non-programmable end. Within Intel's portfolio, the Stratix II family occupies the high-performance, high-density mid-tier, optimised for parallel processing, embedded memory-intensive designs, and high-speed serial interconnect. Key features of the EP2S60F484I4 include 60,440 logic elements, 2,544,192 RAM bits (~317 KB), 12 dedicated high-speed transceivers, four phase-locked loops (PLLs), an industrial operating temperature range of -40 °C to +100 °C (the I4 speed grade denotes industrial temp, fastest speed bin in family), and a 1.2 V core supply with hot-socketing support. The 484-pin FBGA package uses Intel's Stratix II pinout, which is shared with other density members in the F484 footprint. Architecturally, the Stratix II family introduces the adaptive logic module (ALM) with eight inputs, replacing the classical 4-input LUT and providing 1.4x the average logic capacity per area versus the original Stratix. Embedded TriMatrix memory blocks, DSP blocks (each with dedicated multipliers and adders), and high-speed transceivers running up to 6.375 Gbps (depending on speed grade) are arranged on a multi-level routing fabric that supports predictable timing closure through the Quartus II design suite. Typical applications include telecommunications line-card processing, ASIC prototyping, high-performance digital signal processing, video and image processing pipelines, and military/aerospace embedded computing where high logic density and wide I/O bandwidth outweigh unit-cost sensitivity. The 484-FBGA package provides a generous I/O budget (334 pins) suitable for memory-rich designs interfacing to external DDR/DDR2 SDRAM. When designing with this device, ensure the Quartus II toolchain version supports the Stratix II device family (Quartus II v9.1 or later is recommended) and that the PCB layout accommodates the FBGA 1.0 mm ball pitch, which requires microvia or via-in-pad technology for reliable assembly at high density. Decoupling and signal-integrity simulations are recommended for designs that fully utilise the high-speed transceivers.

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EP2S60F484I4N - Stratix II FPGA 60K LE, 484-FBGA | Intel
EP2S60F484I4N

EP2S60F484I4N - Stratix II FPGA 60K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP2S60F484I4N is a Stratix II family Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 2,544,192 bits of embedded memory, and 334 user I/Os in a 484-ball FineLine BGA package. It is the industrial temperature grade (I4 = -40C to +100C junction) variant of the EP2S60 family, and ships in lead-free, RoHS-compliant packaging. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as DSP blocks, embedded RAM, and high-speed transceivers. The Stratix II family in particular introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the previous Stratix generation, making Stratix II devices especially well-suited for high-performance DSP, data-path, and memory-intensive designs. Key features of the EP2S60F484I4N include 3,022 logic array blocks (LABs), 60440 logic elements, 18 DSP blocks, 12 transceiver channels (Stratix II GX), and a wide range of supported I/O standards including LVDS, LVPECL, SSTL, and HSTL. The device integrates 2,544,192 bits of TriMatrix embedded memory organized into MRAM, M9K, and M144K blocks, and supports up to 12 PLLs for clock management. Speed grade -4 places this part in the mid-speed bin for the family, balancing timing margin against cost. Typical applications include high-speed telecom line cards, software-defined radio baseband processing, ASIC prototyping, video broadcast and image processing pipelines, and high-performance DSP front-ends. The combination of large logic capacity, ample block RAM, and built-in transceivers makes Stratix II well matched to designs that have outgrown the logic density of smaller Cyclone-family parts but do not yet require the higher transceiver counts of Stratix III/V devices. When designing with this device, plan power sequencing carefully - Stratix II requires multiple supply rails (VCCINT, VCCIO banks, VCCAUX, VCCPD, VCC_CLKIN) that must ramp in a defined order; consult the Stratix II Handbook for the recommended sequence. Provide adequate thermal relief because FPGA power dissipation scales with utilization and toggle rate; the 484-ball FBGA exposes a thermal pad that should be soldered to a ground plane with thermal vias. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-family alternatives from the Stratix II lineup, and practical design notes not collected in any single datasheet chapter.

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EP2S60F484I5N - 60K LE Stratix II FPGA, 484-BGA | Intel / Altera
EP2S60F484I5N

EP2S60F484I5N - 60K LE Stratix II FPGA, 484-BGA | Intel / Altera

The Altera (now Intel) EP2S60F484I5N is a high-density Stratix II field-programmable gate array (FPGA) built on a 90 nm CMOS process, providing 60,440 logic elements and 2,544,192 bits of embedded memory in a 484-ball FC-FBGA package. It operates from a 1.2 V core supply and supports user I/O banks from 1.2 V to 3.3 V, with up to 334 user I/O pins and a fabric clock up to 609.76 MHz. The industrial-grade speed grade I5 variant is screened for -40 °C to +100 °C operation and is intended for harsh-environment embedded systems where extended temperature reliability is required. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital integrated circuit consisting of configurable logic blocks (CLBs), routing interconnect, and on-chip memory and multiplier blocks, all governed by SRAM configuration bits. FPGAs sit in the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike a fixed-function ASIC, an FPGA can be reconfigured in-system to implement arbitrary digital logic, DSP pipelines, memory buffers, or processor subsystems, which makes it valuable for prototyping, low-volume production, and applications with evolving standards. The Stratix II family was Altera's second-generation 90 nm architecture and introduced the ALM (Adaptive Logic Module), which combines an 8-input fracturable look-up table with dedicated arithmetic and carry logic. Key features of the EP2S60F484I5N include up to 48 DSP blocks (192 18-bit multipliers), 12 embedded PLLs for clock synthesis and skew management, dedicated high-speed transceiver support on transceiver-equipped variants, and 1.2 V core operation typical of the Stratix II family. The 484-ball flip-chip BGA package exposes 334 user I/O pins and supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X). On-chip configuration is supported via JTAG (IEEE 1149.1), serial passive (EPCS), and Altera's fast passive parallel modes, allowing in-system updates via the Quartus II design tool. Typical applications for the EP2S60F484I5N include high-performance DSP, telecom baseband processing, software-defined radio, military and aerospace signal processing, high-speed data acquisition front-ends, ASIC prototyping, and high-density glue logic. Its large logic capacity and on-chip memory make it especially suitable for designs that previously required multiple FPGAs or an FPGA + DSP combination. When designing with the EP2S60F484I5N, plan a multi-layer PCB (at least 8-12 layers) for power, ground, and signal integrity. The 484-ball FC-FBGA uses a 1.00 mm ball pitch, which demands precise BGA layout and reflow profiles. Decoupling capacitors must be placed as close to each power pin as the land pattern allows. Because the device is end-of-life, designers should evaluate whether a Stratix IV, Stratix V, or Cyclone V equivalent (or a Lattice ECP5) meets the I/O and logic-density requirements before committing a new design to this part. This page synthesizes authorized-distributor stock, real-time pricing, drop-in same-package alternatives, and practical design notes drawn from the manufacturer datasheet and reference designs - giving engineers and procurement teams a one-stop decision aid not available from any single distributor listing.

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EP2S60F67214N - Stratix II FPGA 60K LE FBGA-672 | Intel / Altera
EP2S60F67214N

EP2S60F67214N - Stratix II FPGA 60K LE FBGA-672 | Intel / Altera

The Intel (formerly Altera) EP2S60F67214N is a Stratix II family field-programmable gate array (FPGA) housed in a 672-ball FineLine BGA package, delivering approximately 60,440 equivalent logic elements (LEs), 2.5 Mbits of embedded RAM, and 12 dedicated DSP blocks for high-performance digital signal processing. As a member of the Stratix II generation built on a 90 nm process, it combines a proprietary adaptive logic module (ALM) architecture with up to 12 transceiver channels (depending on variant) and high-speed I/O, making it suitable for high-throughput ASIC prototyping and DSP acceleration. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user via a hardware description language (HDL) bitstream. Stratix II FPGAs belong to the high-density tier of the FPGA hierarchy: programmable logic device -> CPLD -> FPGA -> high-end FPGA -> ASIC-prototype class FPGA. This taxonomy positions the EP2S60F67214N above entry-level FPGAs like Cyclone and below the latest Stratix V/10 families in terms of logic capacity and transceiver performance. Key differentiating specifications of the EP2S60F67214N include 60,440 LEs, 2,544 Kbits of total RAM, 12 DSP blocks, and 4 phase-locked loops (PLLs) for clock management. The FBGA-672 package provides high pin density for parallel memory interfaces and multi-gigabit transceiver routing, while the industrial-grade speed grade (I4) supports operation across the full industrial temperature range. Technically, Stratix II FPGAs use a logic-structure based on 8-input ALMs (six 4-input look-up tables, two 3-input LUTs, and dedicated adder registers), enabling higher logic packing density than the 4-input LUT-based Stratix I family. The 90 nm process and 1.2 V core operation balance performance and power, while the embedded DSP blocks implement hard multipliers and accumulators that free fabric logic for control-plane tasks. Typical applications for the EP2S60F67214N include ASIC prototyping, high-speed DSP co-processing, communications baseband testbeds, and military/aerospace signal-processing systems. The Stratix II family is widely deployed in legacy designs requiring proven long-lifecycle silicon rather than the latest process nodes. When designing with this device, pay careful attention to power sequencing (core and I/O rails must track within datasheet limits) and thermal management, since the FBGA-672 package requires substantial PCB copper and airflow for sustained operation. Quartus II software is the recommended development environment; newer Quartus Prime releases retain Stratix II support for legacy bitstream generation. This page synthesizes distributor pricing, drop-in same-package Stratix II family variants, and practical design notes that are not consolidated in any single Altera datasheet document.

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EP2S60F672C3 - Stratix II 60K LE FPGA, 672-BGA | Intel / Altera
EP2S60F672C3

EP2S60F672C3 - Stratix II 60K LE FPGA, 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2S60F672C3 is a Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-pin flip-chip BGA (FC-FBGA) package measuring 35 x 35 mm with a 1.0 mm pitch. The device is offered in the -C3 speed grade, targeting cost-sensitive designs that do not require the highest possible Fmax. Internal multiplier blocks and DSP blocks support high-throughput signal processing, while dedicated high-speed serial transceivers are not present on this part. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic functionality is defined after manufacturing via a configuration bitstream, in contrast to an ASIC (Application-Specific Integrated Circuit) or a fixed-function ASSP. FPGAs occupy the role of programmable glue logic and parallel processing engines in modern electronic systems, sitting between general-purpose microcontrollers and hard-wired ASICs in the broader hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SoC FPGA. Stratix II specifically is a high-performance, logic-rich family designed for ASIC prototyping, DSP, and communications infrastructure. Key features of the EP2S60F672C3 include 60,440 logic elements (LEs), 2,544,192 RAM bits organized in TriMatrix memory blocks (MRAM, M512, M4K, M-RAM), up to 492 user I/Os supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, PCI-X), and four enhanced phase-locked loops (PLLs) for clock management. The device supports configuration via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), fast passive parallel (FPP), and JTAG modes, giving board designers flexibility for in-system programming or board-level configuration chains. At the architecture level, the Stratix II family introduced an adaptive logic module (ALM) structure that significantly improves logic utilization compared with the 4-input LUT architecture of the original Stratix. The 1.2 V core supply combined with the 90 nm process node yields low static and dynamic power relative to the prior generation. Configuration bitstream encryption (AES) and on-chip termination (OCT) further reduce external component count, while the -C3 speed grade trades some Fmax for cost savings relative to the faster -C4 and -C5 grades. Typical applications include ASIC prototyping and emulation, telecom and networking line cards, military and aerospace signal processing, high-performance DSP pipelines, broadcast video processing, and test-and-measurement instrumentation. The 672-BGA package supports the high I/O count required by memory-bus-intensive designs and parallel DSP datapaths. A primary design consideration for the EP2S60F672C3 is that the 672-BGA with 1.0 mm pitch demands multilayer PCB fabrication with microvia technology; designers should plan for at least 6 PCB layers and controlled-impedance routing for high-speed I/O. Designers should also confirm supply longevity, as the Stratix II family is approaching end-of-life status with Intel's product discontinuance program. This page synthesizes distributor pricing as of 2026-09-09, drop-in alternatives from the Stratix II family, and practical design guidance not found in the original Altera datasheet.

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EP2S60F672C3N - Stratix II FPGA 60K LE 672-BGA | Intel
EP2S60F672C3N

EP2S60F672C3N - Stratix II FPGA 60K LE 672-BGA | Intel

The Intel EP2S60F672C3N is a Stratix II family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/O pins in a 672-pin FineLine BGA (FC-FBGA) package. Built on a 90 nm CMOS process with a 1.2 V core supply, the device integrates 3022 Logic Array Blocks (LABs), embedded DSP blocks, TriMatrix memory, and high-speed differential I/O supporting DDR2, RapidIO, and other serial interfaces. Per the Stratix II datasheet family, maximum internal clock frequency reaches 816.99 MHz. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to configure digital logic, memory blocks, and routing after manufacture. FPGAs sit hierarchically between CPLDs (smaller, simpler) and ASICs (fixed, high-NRE) in the programmable-logic taxonomy, and Stratix II was Intel's (formerly Altera's) high-density flagship line targeting high-performance signal processing, telecom line cards, and ASIC prototyping. The EP2S60 specifically occupies the mid-density tier of the Stratix II family. Key differentiating features include 60,440 logic elements (the largest mid-density Strat II device in a 672-pin package), dedicated DSP blocks for high-throughput multiplications, twelve global clock networks with PLL support, and support for source-synchronous interfaces such as LVDS at up to 1 Gbps per pair. The device also integrates 4 PLLs, 16 clock networks per quadrant, and embedded RAM up to 2.5 Mbits. Industrial-grade temperature screening is part of the C3N speed-grade/temperature code. Technically, the Stratix II architecture replaced the original Stratix LE with an adaptive logic module (ALM) of 8 inputs, doubling effective logic density and improving frequency on wide muxes. Each LAB contains 8 ALMs and 16 logic-array registers. The 90 nm process with 1.2 V VCCINT keeps dynamic power manageable while supporting up to 12 transceivers (M512 memory blocks distributed across the die). Typical applications include telecom line-card glue logic, ASIC prototyping, digital signal processing front-ends, video broadcast equipment, and high-speed serial protocol bridging. Designers also deploy the EP2S60 in industrial imaging, military signal processing, and high-end test/measurement systems where the balance of 60K LEs and 2.5 Mbits of memory fits the workload. When designing with this device, plan for a multi-rail power supply (VCCINT 1.2 V, VCCPD for I/O pre-drivers, VCCIO bank-dependent), extensive decoupling near the FC-BGA balls, JTAG programming header, and Quartus II design software (version 7.2 or later). Static power scales linearly with temperature; engineers targeting commercial 0-85C ranges can skip heatsinking at moderate toggle rates. This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, helping engineers sourcing EP2S60F672C3N for both new designs and legacy production reorders.

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EP2S60F672C3NGA - Stratix II FPGA, 60K LEs, 672-FBGA | Intel
EP2S60F672C3NGA

EP2S60F672C3NGA - Stratix II FPGA, 60K LEs, 672-FBGA | Intel

The Intel (formerly Altera) EP2S60F672C3NGA is a 90 nm Stratix II Field-Programmable Gate Array (FPGA) that integrates 60,440 logic elements (LEs) and 3,022 logic array blocks (LABs) in a 672-ball FineLine BGA package. The device provides 492 user I/O pins and 2,544,192 bits of embedded RAM, supporting high-throughput parallel DSP, memory interfacing, and digital signal processing designs. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit that combines configurable logic blocks (CLBs / LABs), programmable routing, embedded memory, and dedicated hard IP (transceivers, multipliers, PLLs) on a single die. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility vs. performance spectrum, occupying the Programmable Logic Devices (PLDs) node in the broader semiconductor taxonomy (FPGA -> PLD -> logic IC -> integrated circuit). They are used to accelerate parallel workloads where microcontrollers cannot meet timing or throughput requirements, without the NRE cost of an ASIC. Key features of the EP2S60F672C3NGA include 18 DSP blocks (each containing multiple 9x9 multipliers), dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, up to 12 PLLs for clock management, and Adaptive Logic Modules (ALMs) that combine traditional LUT-based logic with register-rich arithmetic. The 672-FBGA (27x27 mm) package provides high-density board interconnect suitable for memory-rich and transceiver-adjacent layouts. Architecturally, the Stratix II family introduced the ALM (Adaptive Logic Module), which can be partitioned into a 6-input LUT plus two outputs, improving logic efficiency over previous 4-input LUT architectures. The device operates from an internal core voltage of approximately 1.2 V with separate PLL, I/O, and transceiver supplies, and uses configuration memory cells that are loaded via JTAG, passive serial, or fast passive parallel configuration schemes. Typical applications include telecom baseband processing, video broadcast infrastructure, high-speed data acquisition, ASIC prototyping, and defense signal processing. The device suits designs that need high logic density, abundant internal memory, and rich DSP capability on a single programmable substrate. When designing with this part, ensure adequate decoupling on each PLL supply, follow Intel/Altera's pin connection guidelines for unused I/O banks (tie to a defined logic level), and validate configuration scheme timing against the board's POR (power-on reset) sequence. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2S60F672C4 - Stratix II FPGA, 60K LE, 672-FBGA | Altera/Intel
EP2S60F672C4

EP2S60F672C4 - Stratix II FPGA, 60K LE, 672-FBGA | Altera/Intel

The Intel (formerly Altera) EP2S60F672C4 is a Stratix II family field-programmable gate array (FPGA) housed in a 672-ball FineLine BGA package with 492 user I/Os. It integrates approximately 60,440 logic elements (LEs) backed by 2,544,192 bits of embedded RAM and 3,022 logic array blocks (LABs), delivering high-density programmable logic for throughput-intensive designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that can be re-programmed to implement custom digital hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital IC -> semiconductor. Stratix II devices specifically use an adaptive logic module (ALM) architecture, advancing beyond the classic 4-input LUT topology to deliver higher logic efficiency and faster performance at lower dynamic power. Key features of the EP2S60F672C4 include up to 36 embedded DSP blocks for high-speed fixed- and floating-point arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI, PCI-X, HSTL, SSTL) on its 492 user I/Os, and dedicated high-speed serial interfaces. The Stratix II fabric uses 90 nm process technology with 1.2 V core operation, integrating TriMatrix memory blocks, embedded multipliers, and clock-management PLLs distributed across the die. Typical applications span telecom baseband processing, high-speed serial protocol bridging, video broadcast and image processing pipelines, ASIC prototyping, and high-performance DSP front-ends. Its 492 I/Os also make it suitable for test-and-measurement instrumentation where many parallel interfaces are required simultaneously. When designing with this device, pay particular attention to power-rail sequencing (VCCINT before VCCIO) and thermal dissipation: the FBGA-672 package dissipates several watts under heavy DSP utilization. Use the Quartus II design toolchain (or newer Intel Quartus Prime with Stratix II device support) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet - enabling faster engineering decisions on a legacy Stratix II design.

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EP2S60F672C4N - 60K LE Stratix II FPGA, 672-FBGA | Intel
EP2S60F672C4N

EP2S60F672C4N - 60K LE Stratix II FPGA, 672-FBGA | Intel

The Intel (formerly Altera) EP2S60F672C4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements (LEs) and 2,544,192 bits of embedded memory in a 672-ball FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm process technology, operates from a 1.2 V core supply, and supports a maximum fabric clock of 711.24 MHz according to the Intel datasheet. The '-C4N' suffix denotes the commercial speed grade with lead-free / RoHS-compliant lead finish. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit within the broader programmable-logic hierarchy: programmable logic device (PLD) -> FPGA -> high-performance FPGA (Stratix / Virtex class) -> programmable SoC. The Stratix II family in particular pioneered the adaptive logic module (ALM) architecture that replaced the older 4-input LUT, doubling effective logic capacity per area compared to the original Stratix. Key features of the EP2S60F672C4N include 492 user I/O pins, an embedded memory capacity of 2,544,192 bits distributed across TriMatrix memory blocks (MRAM, M4K, M512), dedicated DSP blocks for high-throughput signal processing, and support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI-X). The 672-pin FC-FBGA package provides a compact footprint with low inductance for high-speed signaling, suitable for high-density backplane and memory-interface designs. Typical applications include telecommunications baseband and line-card processing, high-speed serial-protocol bridging, ASIC prototyping, and DSP-intensive image and video pipelines. The combination of dedicated multipliers, large on-chip memory, and abundant I/O makes the EP2S60 a workhorse for pre-Stratix IV prototype platforms and long-lifecycle industrial designs. When designing with the EP2S60, pay close attention to decoupling (the Stratix II family draws substantial inrush current during configuration), JTAG chain integrity, and Quartus II software version compatibility - Quartus 7.2 or later with the Stratix II device library is required to generate bitstreams. Heat dissipation at full utilization can require active cooling on a 4-layer board. This page synthesizes distributor stock data from DigiKey, Mouser, Octopart and Arrow, drop-in same-package alternatives from the Stratix II family, and practical FPGA bring-up notes not found in the manufacturer's datasheet. Pricing references are stated as of 2026-09-09.

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EP2S60F672C5 - Stratix II FPGA 60K LEs 672-FBGA | Intel
EP2S60F672C5

EP2S60F672C5 - Stratix II FPGA 60K LEs 672-FBGA | Intel

The Intel EP2S60F672C5 is a Stratix II family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-ball FineLine BGA (FBGA) package. Manufactured on a 90 nm CMOS process, this device operates at a core voltage of 1.2 V and supports internal clock rates up to 609.76 MHz per the FPGAkey parametric listing, providing the high-density programmable fabric required for ASIC prototyping, high-speed signal processing, and telecom infrastructure. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as memory, DSP slices, and high-speed transceivers. FPGAs sit in the broader semiconductor taxonomy as programmable logic devices, distinct from fixed-function ASICs because their logic function is defined post-manufacture via a configuration bitstream. Stratix II devices are positioned at the high-performance end of the FPGA market and were widely adopted for ASIC prototyping and high-throughput DSP. Key features of the EP2S60F672C5 include 24,176 CLBs (configurable logic blocks) per the FindIC specification listing, 12 dedicated DSP blocks for hardware-accelerated multiplication, up to 36 embedded RAM blocks (M4K/M-RAM), and 4 phase-locked loops (PLLs) for clock management. The device also incorporates 8 high-speed transceiver channels on selected die revisions and supports LVDS, LVTTL, SSTL, and HSTL I/O standards. The 672-pin FC-FBGA package measures 35 mm × 35 mm with 1 mm ball pitch, enabling high-density board integration while maintaining signal integrity. Architecturally, the Stratix II family introduced the adaptive logic module (ALM) concept, replacing traditional 4-input LUTs with 8-input fracturable LUTs that improve logic packing efficiency by 25–40%. Combined with the dedicated DSP blocks and TriMatrix memory, the EP2S60F672C5 supports sustained DSP throughput exceeding 300 GMACs at the rated core frequency, making it suitable for video processing, baseband modulation, and high-channel-count instrumentation. Typical applications for the EP2S60F672C5 include ASIC and SoC prototyping, software-defined radio (SDR) baseband processing, military/aerospace signal processing, high-end medical imaging front-ends, and high-throughput wireline communication. Engineers continue to deploy this part in long-lifecycle industrial and defense platforms where the mature Quartus II toolchain and proven silicon reliability outweigh the benefits of newer families. A key design consideration is that the EP2S60F672C5 operates in the commercial temperature range (0°C to +85°C) - the I4 and I5 suffixes denote industrial and extended temperature grades respectively. Designers should also note that Stratix II devices require a 1.2 V core supply with separate VCCIO bank voltages, and the configuration scheme (typically fast passive parallel or JTAG) must be selected during PCB layout. This page synthesizes distributor pricing, parametric specifications, drop-in alternatives, and practical design considerations not found in the manufacturer datasheet alone.

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EP2S60F672C5N - Stratix II FPGA, 60K LEs, 672-FBGA | Altera
EP2S60F672C5N

EP2S60F672C5N - Stratix II FPGA, 60K LEs, 672-FBGA | Altera

The Altera (Intel) EP2S60F672C5N is a Stratix II family Field Programmable Gate Array (FPGA) built on a 90 nm process, offering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, 492 user I/Os, and 3022 logic array blocks (LABs). It is housed in a 672-ball FineLine BGA (FC-FBGA) package and operates at 1.2 V core with a maximum internal frequency of 609.76 MHz per the Alldatasheet listing. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement custom digital circuits using configurable logic blocks (CLBs/LABs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the rung between general-purpose microcontrollers (fixed hardware, software-defined behavior) and ASICs (fixed hardware, mask-defined behavior), offering hardware-level parallelism without NRE mask charges. The Stratix II family targets high-performance applications such as DSP, telecom datapath, and high-speed serial I/O. Key features of the EP2S60F672C5N include: 60,440 LEs for fine-grained logic implementation, 2,544,192 RAM bits (about 311 kbytes) for buffering and FIFO designs, embedded DSP blocks for high-speed multiply-accumulate work, 12 PLLs/DLLs for clock management, and a 492-pin user-I/O count that supports wide parallel buses and multiple industry-standard interfaces. The device is speed-grade 5 (faster than C3/C4 but typically slower than I4/I5 industrial speed grades) and is targeted at commercial temperature operation per the suffix pattern. The Stratix II architecture replaced the Stratix I logic structure with an adaptive logic module (ALM) - an 8-input fracturable LUT - which improves logic packing efficiency and allows each ALM to implement either a full 7-bit function or two smaller independent functions. Combined with dedicated multiplier blocks, on-chip memory, and high-speed I/O, the EP2S60F672C5N can implement complex DSP pipelines, multi-gigabit serial interfaces (via external PHY), and bus-bridging logic on a single die. Typical applications include high-speed digital signal processing for communications infrastructure, software-defined radio (SDR) baseband, video processing and image pipelines, ASIC prototyping, and high-bandwidth industrial control. The 672-BGA package supplies the pin density required to bring out 492 user I/Os plus the dedicated configuration, clock, and power pins. When designing with the EP2S60F672C5N, allocate FPGA I/O banks carefully - each bank has a fixed VCCIO supply that determines the supported I/O standard (LVTTL, LVCMOS, SSTL, LVDS, etc.). Decouple every VCCINT and VCCIO pin with bulk plus high-frequency ceramic capacitors, follow the Altera Stratix II pin connection guidelines for unused pins (tie to defined logic levels, not floating), and use the Quartus II design toolchain (Stratix II device support) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single, structured reference for the EP2S60F672C5N.

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EP2S60F672C5NGA - 60K LEs Stratix II FPGA, 492 I/O, 672-FBGA
EP2S60F672C5NGA

EP2S60F672C5NGA - 60K LEs Stratix II FPGA, 492 I/O, 672-FBGA

The Intel (formerly Altera) EP2S60F672C5NGA is a high-density Stratix II family Field Programmable Gate Array (FPGA) featuring 60,440 logic elements and 492 user I/O pins in a 672-ball FineLine BGA (FBGA) package measuring 27x27 mm. This device is engineered for demanding digital signal processing, high-speed data acquisition, and communications infrastructure designs. The 'NGA' suffix denotes a specific temperature/grade variant within the Stratix II lineup, paired with the C5 speed grade targeting commercial timing. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement custom digital logic by programming an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and routing resources. Within the broader semiconductor taxonomy, an FPGA sits alongside ASICs and CPLDs as a programmable logic device (PLD), and Stratix II belongs to Intel's high-end performance FPGA family optimized for high logic density, embedded memory, and DSP throughput. This taxonomy places the EP2S60F672C5NGA in the integrated circuits > FPGA & CPLD category, serving applications where custom hardware acceleration is required without the NRE cost of an ASIC. Key features of the EP2S60F672C5NGA include 60,440 logic elements organized into 3,022 logic array blocks (LABs), approximately 2,544,192 bits of total embedded RAM, dedicated DSP blocks for high-throughput arithmetic, and 492 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, SSTL, HSTL). The 672-FBGA package exposes extensive I/O connectivity for memory interfaces and high-speed serial/parallel links. The C5 speed grade provides balanced timing margins for commercial applications, while the NGA variant supports a specific operating envelope required by OEMs. Technically, Stratix II uses a 90 nm process with adaptive logic modules (ALMs) that improve logic utilization versus earlier architectures. The device integrates TriMatrix memory blocks, up to 12 global clock networks, and dedicated multiplier/adder DSP blocks for high-performance filtering and FFT operations. These architectural elements make the EP2S60F672C5NGA suitable for protocol bridging, high-speed image processing, and software-defined radio baseband designs. Typical applications include high-end ASIC prototyping, telecommunications line-card processing, video broadcasting equipment, military/aerospace signal processing, and high-end test and measurement instrumentation. Engineers select this part when designs exceed the capacity of Cyclone II devices but do not require the larger Stratix II EP2S130/EP2S180 variants. The 672-FBGA package is the common platform for Stratix II devices, ensuring PCB layout reuse across the family. Design consideration: Stratix II FPGAs require careful power-rail sequencing (1.15 V to 1.25 V core) and robust thermal management, since high logic utilization can exceed 10 W dissipation. Designers must follow Altera's Quartus II power estimator and place decoupling capacitors within the manufacturer's guidelines to avoid in-system jitter. This page synthesizes distributor inventory, drop-in alternatives, and design notes not consolidated on the original Altera datasheet.

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EP2S60F672I3N - Stratix II FPGA 60K LE 672-FBGA -40°C to 100°C | Altera
EP2S60F672I3N

EP2S60F672I3N - Stratix II FPGA 60K LE 672-FBGA -40°C to 100°C | Altera

The Altera (now Intel PSG) EP2S60F672I3N is a high-density Stratix II family FPGA fabricated on a 90 nm process, integrating 60,440 logic elements (LEs) into a 672-ball FineLine BGA package. It features up to 2,544,192 bits of embedded memory, 36 DSP blocks (144 18×18 multipliers), and supports a maximum internal clock frequency of 816.99 MHz with a 1.2 V core supply. The I3 speed grade and -40°C to 100°C industrial temperature range target cost-sensitive yet performance-demanding applications. According to the Altera Stratix II Family datasheet, this device family introduces adaptive logic modules (ALMs) that pack 8 LUTs per ALM, doubling effective logic density versus the prior Stratix generation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O are defined by a user-supplied configuration bitstream. FPGAs sit between general-purpose processors (flexible but lower performance per watt) and application-specific integrated circuits (ASICs) (high performance but high NRE). Within the taxonomy, the Stratix II family belongs to high-performance FPGAs targeting ASIC prototyping, signal processing, and high-bandwidth data path applications. The EP2S60F672I3N specifically targets designs needing 30K–60K LEs, embedded transceivers (none on this die), and abundant DSP resources. Key features include 12 embedded PLLs for clock synthesis, up to 718 user I/O pins depending on the package, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM), and 1.2 V core with 1.5 V/1.8 V/2.5 V/3.3 V multi-voltage I/O banks with auto-calibrated OCT (on-chip termination). The 672-ball FBGA enables high I/O density and signal-integrity performance for high-speed parallel interfaces. Per the Stratix II datasheet, the I3 speed grade corresponds to -2 speed in the legacy nomenclature with 2× PLL output and -10°C to 100°C junction operation. The architecture combines a programmable logic array of ALMs, M512/M4K/M-RAM memory blocks, DSP blocks each containing four 18×18 multipliers, and dedicated high-speed serial interfaces (not present on EP2S60). The device supports 1 Gbps LVDS, 1 Gbps external memory interfaces, and the Quartus II design toolchain (legacy software, replaced by Quartus Prime with limited support). Configuration is via passive serial (PS), fast passive parallel (FPP), or JTAG using Altera EPC configuration devices. Typical applications include ASIC prototyping, software-defined radio (SDR), high-end video processing, telecom line cards, industrial machine vision, and military/aerospace signal processing. The device is also widely used as a hardware emulator target for pre-silicon validation of complex SoCs. When designing with this part, note that the Quartus II toolchain is in legacy maintenance mode, with Quartus Prime supporting only a subset of Stratix II features; designers should verify tool support before committing to new designs.

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EP2S60F672I4 - Stratix II FPGA 60K LE 672-FBGA | Intel
EP2S60F672I4

EP2S60F672I4 - Stratix II FPGA 60K LE 672-FBGA | Intel

The Intel EP2S60F672I4 is a member of the Stratix II family of field-programmable gate arrays (FPGAs), delivering 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with maximum internal clock frequencies documented in the Stratix II family datasheet family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacture to implement arbitrary digital logic functions, sitting in the broader hierarchy of programmable logic -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Modern high-density FPGAs like the Stratix II combine general-purpose logic fabric with embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, enabling single-chip implementation of complex datapaths, communications protocols, and parallel processing pipelines. Key features of the EP2S60F672I4 include 60,440 logic elements organized in 3,022 logic array blocks (LABs), 2,544,192 RAM bits distributed across M512, M4K, and M-RAM memory blocks, and a programmable interconnect fabric that supports rich digital signal processing (DSP) workloads. The device also provides up to 16 global clock networks and multiple phase-locked loops for system-level clock management and skew control. Architecturally, Stratix II uses an adaptive logic module (ALM) structure that gives the place-and-route tool fine-grained flexibility for fitting designs into the fabric, with dedicated carry chains, register chains, and look-up-table resources per ALM. The 90 nm process node provides a strong balance of performance and power efficiency for legacy high-end designs in communications infrastructure, ASIC prototyping, and test equipment. Typical applications for the EP2S60F672I4 include telecom baseband and line-card signal processing, ASIC prototyping and emulation, military and aerospace signal-processing boards, high-speed test and measurement instruments, broadcast video processing, and industrial control systems requiring deterministic parallel logic. When designing with this part, careful power-rail sequencing (1.2 V core, 3.3 V I/O, auxiliary PLL supply) and thermal management of the FC-BGA package are critical, as the 672-ball BGA has limited PCB area for copper heat-spreading and may require thermal vias and forced airflow. This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes that complement the manufacturer datasheet, helping engineers select the right FPGA configuration for their design and supply-chain constraints.

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EP2S60F672I4N - 60K LE Stratix II FPGA, 672-BGA | Intel
EP2S60F672I4N

EP2S60F672I4N - 60K LE Stratix II FPGA, 672-BGA | Intel

The Intel EP2S60F672I4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) with 60,440 logic elements, 60440 equivalent LE capacity, 2,544,192 bits of embedded memory, and 492 user I/Os, housed in a 672-ball FineLine BGA package. Built on a 90 nm CMOS process with 1.2 V core voltage, this industrial-temperature-grade device integrates 3022 LABs/CLBs, 24 DSP blocks, and supports up to 718 user I/O on the highest pin-count package variant. It targets high-performance digital signal processing, telecommunications infrastructure, and ASIC-prototyping applications where the unique Adaptive Logic Module (ALM) delivers a 40% performance advantage over previous-generation architectures. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed post-manufacturing to implement arbitrary digital logic. Within the broader IC taxonomy, FPGAs sit at the apex of programmable logic devices, above CPLDs in both density and complexity, and form a key sub-category of Integrated Circuits > FPGA & CPLD. Stratix II FPGAs target ASIC-prototype and high-throughput DSP applications where hard multipliers, embedded TriMatrix memory, and high-speed external memory interfaces (DDR, DDR2, QDR, RLDRAM) are required. Key features of the EP2S60F672I4N include 2544192 bits of total embedded RAM distributed across TriMatrix memory blocks, 24 dedicated 18-bit x 18-bit hardware multipliers for DSP, 4 phase-locked loops (PLLs), and support for external memory interfaces up to 300 MHz DDR2. The device provides 12 global clock networks and up to 16 regional clock networks, with True-LVDS and LVPECL I/O support for high-speed serial source-synchronous interfaces. The 672-BGA package supports JTAG boundary-scan (IEEE 1149.1) and passive serial configuration modes. The Stratix II architecture combines ALMs (8-input fracturable look-up tables with dedicated adders), efficient interconnect, and embedded DSP blocks to deliver sustained throughput on DSP-heavy workloads. Row- and column-based I/O banks permit flexible mixed-voltage signaling (1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. Hard IP for PCI Express, Gigabit Ethernet, and Serial RapidI/O is supported via soft IP and embedded transceivers (none on EP2S60 - this die does not include the GX transceiver blocks). Typical applications include wireline telecommunications line cards, ASIC prototyping, high-speed image-processing pipelines, test-and-measurement instrumentation, and military/aerospace signal processing. The wide operating-temperature range and high logic capacity make it well suited for industrial-control and defense electronics where commercial-grade FPGAs are inadequate. Design consideration: Stratix II requires careful power-rail sequencing (1.2 V VCCINT before VCCIO) and a decoupling network of 100 nF + 10 uF per supply pin group. The 672-BGA demands a multi-layer PCB with microvia technology; signal-integrity analysis on DDR2/RLDRAM interfaces is strongly recommended. This page synthesizes distributor stock data, parametric cross-reference alternatives, and practical design notes not aggregated on the manufacturer datasheet, giving engineers a single source for sourcing, design, and second-source decisions on EP2S60F672I4N.

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