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EP2S90F780I4 - Stratix II FPGA 90K LE FBGA-780 | Intel
EP2S90F780I4

EP2S90F780I4 - Stratix II FPGA 90K LE FBGA-780 | Intel

The Intel EP2S90F780I4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 780-pin FineLine BGA (FBGA-780, 29 x 29 mm, 1 mm pitch) package, delivering up to 90,960 logic elements and 4,520,488 bits of embedded RAM. It provides 4,548 Logic Array Blocks (LABs), 12 dedicated DSP blocks (for up to 96 18x18 multipliers), 534 user I/O pins, and operates with an internal clock tree supporting frequencies up to 717 MHz per the manufacturer datasheet. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that lets designers implement custom digital logic - combinational and sequential functions, memory blocks, and high-speed transceivers - on the same silicon after fabrication. Within the power-management hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic; the Stratix II family specifically targets high-performance applications such as high-speed digital signal processing, telecommunications backplanes, and ASIC prototyping. EP2S90F780I4 occupies the high-end of this family and shares the same architecture as other Stratix II members. Key features include up to 1,152 Kbits of embedded M512/M4K/M-RAM block memory distributed across 4,520,488 bits total, 12 DSP blocks capable of 18x18-bit signed multiplication at full speed, and eight phase-locked loops (PLLs) for clock synthesis and skew management. The device supports multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X) on its 534 user I/O pins, enabling direct interface to DDR/DDR2 SDRAM memories and external parallel buses. Adaptive logic modules (ALMs) provide 8 inputs per module, a 2x improvement over the previous Stratix generation. The 90 nm CMOS process, 1.2 V core voltage, and dedicated hard IP blocks deliver industry-leading performance-per-watt for its era. The internal TriMatrix memory architecture splits on-chip RAM into three block sizes (M512, M4K, M-RAM) so engineers can allocate memory density versus width efficiently. Routing architecture is segmented into row, column, and local interconnects, supporting timing closure for designs operating at hundreds of MHz. Typical applications for the EP2S90F780I4 include high-performance ASIC prototyping and emulation, telecommunications baseband and bridging equipment, high-speed serial protocol bridging (SPI 4.2, SFI-4, UTOPIA), broadcast video processing, and military/aerospace signal processing. The -I speed/temperature grade (-40C to +100C case) targets industrial and defense applications. When designing with the EP2S90F780I4, engineers must consider the 29 x 29 mm BGA footprint which requires at least 6 PCB layers with microvia technology for fan-out, and the 534 user I/Os which often demand SSTL-2 or LVPECL termination networks. Power integrity analysis is essential because the device can exceed 20 W at full utilization; a multi-rail synchronous buck DC-DC design with at least four voltage rails (VCCINT, VCCIO banks, VCCA, VCCD_PLL) is recommended. This page consolidates distributor stock data, drop-in alternatives within the Stratix II family, and practical design notes that extend beyond the manufacturer datasheet for engineers evaluating the EP2S90F780I4 in legacy designs.

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EP2S90F780I4N - Stratix II FPGA 90K LE 780-BGA | Intel
EP2S90F780I4N

EP2S90F780I4N - Stratix II FPGA 90K LE 780-BGA | Intel

The Intel (formerly Altera) EP2S90F780I4N is a high-density Stratix II Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (29 mm x 29 mm, 1 mm pitch, lead-free). The device integrates 90,960 equivalent logic elements (LEs), 4,548 logic array blocks (LABs), and 4,520,488 bits of embedded memory, delivering mid-to-high range programmable logic capacity for ASIC-prototype, signal-processing, and high-bandwidth I/O bridge designs. The 'F780' package suffix specifies the 780-FBGA outline; 'I4' denotes the industrial temperature grade (-40C to +100C case); 'N' indicates lead-free, RoHS-compliant terminations. The Stratix II family is fabricated on a 90 nm CMOS process and features a unique adaptive logic module (ALM) architecture, embedded DSP blocks, TriMatrix on-chip memory, and dedicated high-speed serial transceiver support depending on derivative. A Stratix II FPGA is a programmable logic device that lets engineers implement arbitrary digital logic, memory structures, DSP arithmetic, and soft processor cores on a single silicon die. Within the broader taxonomy, FPGAs sit below Application-Specific Standard Products (ASSPs) but above general-purpose microcontrollers in flexibility - they are reconfigured via HDL bitstreams rather than fixed at fabrication, which makes them the preferred platform for low-volume ASIC replacement, prototyping, and designs that need late-stage logic revision. Stratix II is Intel's mid-density family between Cyclone II (low-cost) and Stratix III/IV (high-end with transceivers). Key features include up to 717 MHz internal operation per the family datasheet, embedded multiplier blocks for DSP pipelines, TriMatrix memory (MLAB, M512, M4K, M-RAM blocks) for distributed and buffered storage, dedicated clock management PLLs, and 534 user I/Os on the F780 package. Compared with Cyclone II FPGAs, Stratix II offers roughly 4x more logic capacity per device, embedded high-speed memory hierarchies, and lower core voltage operation. The 'I4' industrial grade and lead-free 'N' suffix make the part appropriate for industrial, telecom, and test-equipment markets that require halogen-free assembly. Typical applications include high-speed digital signal processing (radar, software-defined radio), ASIC prototyping, telecom baseband processing, video and image processing pipelines, and protocol-bridging glue logic. The high embedded-memory count supports packet buffering, image line buffering, and FFT working-storage without external SRAM. When designing with this part, observe that the Stratix II family has reached end-of-life from Intel - new designs should evaluate Stratix IV/V or Cyclone V/10 families unless second-source or long-term support agreements are in place. Power sequencing, JTAG configuration, and I/O standard termination follow the Stratix II handbook.

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EP2S90F780I4NAB - Stratix II FPGA, 90K LEs, 780-FBGA | Intel
EP2S90F780I4NAB

EP2S90F780I4NAB - Stratix II FPGA, 90K LEs, 780-FBGA | Intel

The Intel EP2S90F780I4NAB is a high-density Stratix II family field-programmable gate array (FPGA) delivering 90,960 logic elements, 534 user I/O pins, and 4.5 Mbits of embedded RAM in a 780-pin flip-chip BGA package. It is a 1.2V core device with industrial temperature grade and is part of the legacy Altera Stratix II architecture, now supported by Intel after the 2015 acquisition. What is a Stratix II FPGA? The Stratix II is a 90 nm FPGA architecture that introduced the adaptive logic module (ALM) - an 8-input fracturable look-up-table building block that replaced the older 4-input LUT paradigm and delivers roughly 50% higher logic utilization. FPGAs sit at the top of the programmable-logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SoC FPGA. They are the dominant platform for high-throughput parallel DSP, high-speed serial I/O aggregation, and ASIC prototyping. Key features include 12 transceiver blocks supporting up to 3.125 Gbps per channel, dedicated DSP blocks for 18x18 multipliers, distributed and block RAM, and on-chip PLLs. The 780-FBGA package exposes 534 user I/O - one of the highest pin counts in the Stratix II family - making it suitable for I/O-rich designs such as multi-port line cards, video processing pipelines, and large ASIC prototypes. The device supports DDR/DDR2/QDR memory interfaces through dedicated DQS pins. The Stratix II architecture uses 1.2V core supply with 0.8/1.2/1.5/1.8/2.5V tolerant I/O banks, enabling mixed-voltage interfacing without external level shifters. Internal signal integrity is improved by the ALM's fracturable LUT, which lets the place-and-route tool pack two smaller functions into one ALM and reduces routing congestion on dense 90K-LE designs. Typical applications include telecom line cards with multi-gigabit serial interfaces, ASIC prototyping for sub-30-million-gate designs, broadcast video processing, military/aerospace signal processing, and high-speed data acquisition. The 90 nm process offers a favorable cost-per-LE for legacy designs in long-lifecycle defense and industrial programs. When designing with this device, ensure the Quartus II design software version supports the Stratix II device family (Quartus II 9.1 SP2 or earlier is the last officially supported release). Verify DDR2 interface timing against the specific speed grade (I4 = -4 industrial), and use the ALTDDIO megafunction for source-synchronous interfaces to meet setup/hold margins. This page synthesizes distributor pricing, same-package Stratix II alternatives, and practical design notes not aggregated in the manufacturer datasheet, helping engineers make a faster sourcing and selection decision.

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EP2S90H484C4 - Stratix II FPGA, 90K LE, 484-FCBGA | Intel
EP2S90H484C4

EP2S90H484C4 - Stratix II FPGA, 90K LE, 484-FCBGA | Intel

The Intel (formerly Altera) EP2S90H484C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 36,384 adaptive logic modules (ALMs / 4,548 LABs) into a 484-ball FineLine BGA package measuring 27 x 27 mm with 1.0 mm ball pitch. Fabricated on a 1.2 V, 90 nm CMOS process, the device delivers up to 711.24 MHz internal operation and 308 user I/O pins, with on-chip memory of approximately 4,520,488 bits distributed across M4K and M-RAM blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/ALMs), programmable interconnect, and dedicated hard IP such as transceivers, memory, multipliers, and PLLs. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic IC -> integrated circuit -> semiconductor, and offer ASIC-like density with the time-to-market advantage of in-system reprogrammability. Key features of the EP2S90H484C4 include twelve global clock networks, twelve PLLs for high-frequency clock synthesis, dedicated DSP blocks for high-throughput multiplication, and support for external memory interfaces including DDR, DDR2, QDR, QDRII, and RLDRAM. The 308 I/Os support multiple I/O standards (LVDS, SSTL, HSTL, LVCMOS, LVTTL, PCI-X), enabling direct interfacing with memories, backplanes, and parallel ASIC/ASSP buses without external level translation. Stratix II architecture uses an adaptive logic module (ALM) as its fundamental building block, allowing the device to pack combinatorial and sequential logic more efficiently than the 4-input LUT-based architectures of its predecessors. Combined with dedicated on-chip multipliers and TriMatrix memory (M512/M4K/M-RAM), the EP2S90H484C4 is optimized for high-performance DSP, telecom baseband, and high-speed datapath designs that require parallel arithmetic pipelines. Typical applications include high-performance digital signal processing (DSP) for wireless base stations, telecom switching fabric, video and imaging processing pipelines, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing platforms. The wide I/O count also suits parallel data-acquisition front ends and high-bandwidth packet processing engines. When designing with the EP2S90H484C4, plan a multi-layer PCB with dedicated power and ground planes, controlled-impedance routing for DDR2 memory interfaces, and matched-length clock traces. Decoupling must follow the Stratix II handbook reference design, with multiple bulk and high-frequency capacitors placed close to the package balls. Configuration can be loaded via JTAG, passive serial, or via an external EPC configuration device. This page synthesizes distributor pricing tiers, drop-in same-family alternatives with the same 484-FCBGA footprint, and design notes that complement (rather than duplicate) the manufacturer Stratix II Device Handbook.

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EP2S90H484C4N - Stratix II FPGA 90,960 LE | Altera | BGA-484
EP2S90H484C4N

EP2S90H484C4N - Stratix II FPGA 90,960 LE | Altera | BGA-484

Altera EP2S90H484C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 90,960 equivalent logic elements (LEs), 4,548 LABs/CLBs, and 4,520,448 bits of embedded memory in a 484-ball flip-chip BGA (FCBGA) package. The device targets high-performance digital logic, DSP, and memory-intensive subsystems with up to 308 user I/O pins and on-chip multi-gigabit transceivers typical of the Stratix II family. The part number suffix C4N denotes a commercial-grade speed grade 4 device supplied in tray packaging. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, routing fabric, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers, all programmable after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-driven processors. They are used to implement custom parallel datapaths, hardware-accelerated algorithms, and glue logic without the NRE cost of an ASIC, making them essential in prototyping, low-volume production, and high-bandwidth signal processing. Key features of the EP2S90H484C4N include 90,960 LEs backed by 4,548 LABs, approximately 4.5 Mbits of embedded SRAM distributed across TriMatrix memory blocks, 12 dedicated DSP blocks for fixed- and floating-point arithmetic, and 12 PLLs for clock synthesis and skew management. The H484 package exposes 308 user I/Os at a 1.0 mm ball pitch, supporting high-density board integration. The device operates from a 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O standards such as LVDS, LVTTL, LVCMOS, and HSTL. Stratix II uses a 90 nm CMOS process with a novel adaptive logic module (ALM) architecture that improves logic utilization over the previous Stratix generation. The ALM combines look-up-table and register resources in a single 8-input fracturable structure, enabling tighter packing of wide arithmetic functions. Combined with up to 12 embedded transceivers (per family datasheet) capable of multi-gigabit-per-second serial links, the EP2S90 places as a high-end DSP and protocol-bridging platform. Typical applications include telecommunications baseband and framer designs, high-speed data acquisition, military/aerospace signal processing, ASIC prototyping, and broadcast video processing where 4.5 Mbits of block RAM and 12 DSP blocks are sized for packet buffers, FFT/iFFT pipelines, and forward-error-correction engines. The high logic capacity also suits multi-channel motor control and software-defined radio prototyping. When designing with the EP2S90H484C4N, plan the power tree carefully: 1.2 V core current can exceed several amps under heavy DSP utilization, and the H484 flip-chip BGA requires a multi-layer PCB with continuous ground and power planes under the device for thermal dissipation. Use Altera Quartus II design software for synthesis, place-and-route, and timing closure, and follow Stratix II pin connection guidelines to leave unused I/O pins configured as inputs with weak pull-ups. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II family, application guidance, and practical design notes not found in the manufacturer datasheet alone.

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EP2S90H484C5 - 90K LE Stratix II FPGA, 484-BGA | Intel / Altera
EP2S90H484C5

EP2S90H484C5 - 90K LE Stratix II FPGA, 484-BGA | Intel / Altera

The Altera (now Intel) EP2S90H484C5 is a Stratix II family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,488 bits of embedded memory, and 308 user I/O pins in a 484-ball FineLine BGA (FC-HFBGA) package. Built on a 90nm process technology, the device operates from a 1.2V core supply and supports up to 609.76 MHz internal clock frequency, delivering high-density programmable logic for DSP, telecommunications, and high-speed serial applications. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing rather than at the fab. FPGAs occupy the category hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance signal processing and ASIC prototyping, combining embedded multipliers, TriMatrix memory blocks, and high-speed transceivers in a single device. Key features of the EP2S90H484C5 include 4,548 LABs (Logic Array Blocks), 12 embedded DSP blocks for hardware multiplication, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and up to 12 high-speed transceiver channels. The device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, with built-in error detection and correction (EDC) for configuration RAM. Technically, the EP2S90H484C5 implements an adaptive logic module (ALM) architecture that achieves approximately 2.5x the logic capacity of previous-generation Stratix devices at the same silicon area. The fine-grained ALM combines look-up tables, adders, and registers in 8-bit groupings, optimizing for both register-rich and arithmetic-intensive designs. Typical applications include high-performance ASIC prototyping, wireless baseband signal processing, high-definition video processing, military radar and sonar systems, and test & measurement equipment. The 484-ball FCBGA package supports high I/O count designs requiring numerous LVDS, DDR memory interfaces, and parallel processing buses. Designers should pay attention to power distribution network design on the FCBGA - the 1.2V core requires substantial decoupling (typically 100uF bulk plus per-pin 0.1uF/1nF ceramics) and proper power sequencing to prevent inrush damage. Thermal management is critical: at full utilization the device can dissipate 10-15W, requiring thermal vias under the package and forced-air cooling in most deployments. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM decisions and design-in for engineers working on Stratix II based systems.

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EP2SGX130GF1508C3 - Stratix II GX 132K Logic Elements FPGA | Intel
EP2SGX130GF1508C3

EP2SGX130GF1508C3 - Stratix II GX 132K Logic Elements FPGA | Intel

The Intel EP2SGX130GF1508C3 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,748,840 total memory bits, and 734 user I/O pins, housed in a 1508-ball FineLine BGA (FBGA-1508) package at 40 x 40 mm with 1.0 mm ball pitch. Built on a 90 nm CMOS process with 1.2 V core operation, the device integrates up to 20 transceiver channels supporting multi-gigabit serial I/O for high-speed connectivity. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, transceivers, DSP blocks) on a single die. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose processors (CPUs, MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while retaining firmware-level reconfigurability. The Stratix II GX family specifically targets high-speed serial I/O and signal-processing workloads, sitting within the broader categories of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Key features of the EP2SGX130GF1508C3 include 132,540 logic elements, 6,627 LABs (Logic Array Blocks), 717 MHz maximum internal operating frequency, and integrated PCI Express hard IP. The device supports LVDS, LVTTL, LVCMOS, and LVPECL I/O standards across 734 user I/Os distributed in 12 banks, enabling flexible mixed-voltage interfacing. Embedded RAM totals 6,748,860 bits distributed across MRAM and M4K blocks, providing high-bandwidth on-chip storage for packet buffers and DSP coefficient tables. The 90 nm process node delivers a balance of power efficiency and operating frequency for the Stratix II GX architecture. Up to 20 full-duplex transceiver channels support protocols including PCI Express, XAUI, Serial RapidIO, and custom serial interfaces up to 6.375 Gbps. Cyclone-to-Stratix migration is supported through Quartus II design tools, and the device family is supported by the Altera Quartus II design suite for synthesis, place-and-route, and timing analysis. Typical applications include high-end telecommunications line cards, military radar and signal processing, medical imaging backplanes, ASIC prototyping, and high-performance computing acceleration. The 1508-ball FBGA package supports high signal-density boards required for multi-gigabit serial designs. The Stratix II GX family is well-suited to wireline backhaul, test and measurement equipment front ends, and custom hardware accelerators where deterministic latency and parallel processing are required. Design consideration: the 1.2 V core supply requires multiple decoupling capacitors placed adjacent to the dedicated VCC pins per the pin connection guidelines. The 40 x 40 mm package demands controlled-impedance PCB stack-up and matched-length routing for transceiver channels. Junction temperature must remain below the 100 C commercial operating limit for C3 speed grade parts, requiring thermal vias beneath the package thermal pad. This page synthesizes distributor availability, Stratix II GX family cross-references, and practical design considerations not consolidated in the manufacturer datasheet, supporting faster sourcing decisions for engineers evaluating EP2SGX130-class FPGAs.

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EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
EP2SGX130GF1508C3N

EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel

The Intel EP2SGX130GF1508C3N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements, 6,627 Logic Array Blocks (LABs), 734 user I/Os, and up to 6,747,840 bits of embedded memory, housed in a 1508-ball FineLine BGA (FBGA) package measuring 40 x 40 mm with 1 mm ball pitch. Built on a 90 nm CMOS process, it integrates up to 20 high-speed transceivers operating at up to 6.375 Gbps, making it a turnkey solution for serial connectivity in communications, broadcast, and high-performance computing systems. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic, interconnect, and I/O behavior can be defined by the user after manufacture. FPGAs occupy a position between standard logic ICs and ASICs in the hardware hierarchy: programmable logic > FPGA > high-speed serial interface > system-on-chip. The Stratix II GX family specifically targets designs that need hard IP for multi-gigabit transceivers and embedded memory, eliminating the silicon cost and risk of building those blocks from soft logic. Key specifications include 132,540 logic elements, 6,627 LABs, 734 user I/Os, 6,747,840 embedded RAM bits, 56 (18x18) hardware multipliers, 12 PLLs, and 8.25 Mbits of TriMatrix memory. Internal clocking supports up to 717 MHz for fabric logic and 717 MHz for memory blocks, while the 20 transceiver channels each deliver up to 6.375 Gbps. Supply voltage operates at 1.15 V to 1.25 V for the core, with separate transceiver and auxiliary rails defined in the datasheet. Architecturally, the device combines an 8-input adaptive logic module (ALM) fabric, dedicated DSP blocks for multiplication and accumulation, and physical coding sublayer (PCS) and physical medium attachment (PMA) hard IP per transceiver channel. The TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM) gives designers 6.75 Mbits of distributed and block RAM with port widths up to 144 bits, supporting high-throughput buffering for video, packet processing, and baseband datapaths. Typical applications include 10G/40G Ethernet line cards, SONET/SDH framer/mapper ICs, HD-SDI and 3G-SDI broadcast video routers, high-end test and measurement equipment, medical imaging accelerators, and defense/aerospace signal processing platforms. The combination of transceivers, DSP blocks, and on-chip memory allows a single Stratix II GX to replace multi-chip ASIC + memory solutions while preserving reconfigurability for evolving protocols. When designing with the EP2SGX130GF1508C3N, plan PCB power delivery for the 1.15-1.25 V core rail carefully; a 1508-ball FCBGA of this size typically requires a multi-phase VRM and extensive decoupling. Signal-integrity for the 6.375 Gbps transceiver channels demands controlled-impedance differential routing, length matching within the tolerance stated in the transceiver chapter, and AC-coupling capacitors at every serial link pin pair. This page synthesizes distributor pricing, datasheet sources, parametric comparison, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single decision-ready reference for the EP2SGX130GF1508C3N.

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EP2SGX130GF1508C4 - 132K LE Stratix II GX FPGA | Intel
EP2SGX130GF1508C4

EP2SGX130GF1508C4 - 132K LE Stratix II GX FPGA | Intel

The Intel (formerly Altera) EP2SGX130GF1508C4 is a high-density Stratix II GX field-programmable gate array (FPGA) with 132,540 logic elements, 6,748,160 bits of embedded memory, and embedded transceivers, housed in a 1508-ball flip-chip BGA (FC-FBGA) package measuring 40 x 40 mm with 1 mm pitch. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy (CPLD < FPGA < SoC FPGA) and provide hardware-level parallelism, on-chip block RAM, DSP blocks, and high-speed serial transceivers. The Stratix II GX family specifically targets high-bandwidth serial I/O applications requiring multi-gigabit transceivers. Key features include 132,540 logic elements, 6,748,160 embedded memory bits, 6744 18x18 multipliers, 4 phase-locked loops, and embedded transceivers supporting up to 6.375 Gbps operation per the Stratix II GX architecture. The 90 nm process technology operates at a core voltage of 1.2 V (1.15 V to 1.25 V range) and the device supports up to 717 MHz internal operation. The architecture combines an adaptive logic module (ALM) fabric with embedded transceiver channels optimized for serial connectivity standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 734 user I/O pins connect to 20 global clock networks and support a wide range of single-ended and differential I/O standards including LVDS, LVPECL, HSTL, and SSTL. Typical applications include high-speed serial interface bridging in communications infrastructure, custom protocol development in test and measurement, ASIC prototyping with transceivers, baseband processing in wireless base stations, and high-performance DSP pipelines. The 1508-ball FC-BGA package supports the high pin density required for the 734 user I/Os plus dedicated transceiver and clock pins. When designing with this device, plan PCB escape routing carefully because the 1 mm pitch FC-BGA requires HDI stack-up with microvia-in-pad or staggered via technology. Decoupling strategy must follow Altera's Stratix II GX Power Distribution Network (PDN) guidelines, and JTAG configuration with EPCS serial configuration devices is recommended for production. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP2SGX130GF1508C4N - Stratix II GX 132K LEs FPGA | Intel / Altera
EP2SGX130GF1508C4N

EP2SGX130GF1508C4N - Stratix II GX 132K LEs FPGA | Intel / Altera

The Intel (formerly Altera) EP2SGX130GF1508C4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded memory, and 734 user I/Os in a 1508-ball FineLine BGA (FCBGA) package. Built on a 90 nm CMOS process with 1.2 V core supply, it delivers up to 717 MHz internal operation and is designed for high-throughput serial connectivity plus parallel DSP workloads. The integrated 6.375 Gbps transceivers make it a classic platform for early-2000s high-speed serial bridging. A Field Programmable Gate Array (FPGA) is a class of programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hardened I/O serdes that can be rewired post-manufacturing. FPGAs sit in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance applications by combining a unique adaptive logic module (ALM) architecture with embedded transceivers, on-chip memory, and dedicated multipliers. Key features include 132,540 logic elements organized as 6,627 LABs, 6747840 total RAM bits, 8 PLLs, 4 DLLs, and configurable high-speed transceivers capable of multiple protocol rates. The device supports LVDS, LVTTL, LVCMOS, PCI, PCI-X, and HSTL I/O standards and includes dedicated hardware multipliers and DSP blocks. The FCBGA-1508 FineLine BGA package offers vertical migration within the Stratix II GX family, allowing density upgrades without PCB changes. The Stratix II GX architecture introduced the ALM (Adaptive Logic Module) as its core logic unit, replacing the 4-input LUT of previous generations with a fracturable 8-input equivalent that improves DSP packing density and reduces logic fragmentation. Combined with the 90 nm process node, this architecture achieved industry-leading performance at launch. Typical applications include high-speed serial interface prototyping, PCI Express endpoint development, telecommunications backplane bridging, multi-gigabit serial I/O expansion, and DSP-intensive signal processing cards in test and measurement equipment. Its combination of logic density and on-chip transceivers made it a mainstay for OC-48 and early OC-192 designs, radar signal processing, and broadcast video routing. When designing with this FPGA, ensure proper power sequencing for the 1.2 V core, 2.5 V/3.3 V auxiliary, and transceiver supplies, since out-of-order power-up can latch-up I/O structures. Thermal management must account for high quiescent current under heavy transceiver utilization; thermal balls in the BGA substrate must be soldered to a grounded thermal via array for proper dissipation. This page synthesizes Stratix II GX family positioning, drop-in density-grade alternatives within the same FCBGA-1508 footprint, and practical design guidance beyond the marketing datasheet, helping engineers evaluate lifecycle risk and migration paths for legacy designs.

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EP2SGX130GF1508C5 - Stratix II GX FPGA 6627 LABs 734 I/O 1508-FBGA | Intel
EP2SGX130GF1508C5

EP2SGX130GF1508C5 - Stratix II GX FPGA 6627 LABs 734 I/O 1508-FBGA | Intel

The Intel (formerly Altera) EP2SGX130GF1508C5 is a high-density Stratix II GX FPGA combining 132,540 equivalent logic elements, 6,627 LABs, and 734 user I/Os with up to 20 high-speed serial transceivers, packaged in a 1508-ball FineLine BGA. It belongs to Altera's third-generation FPGA family that integrates multi-gigabit transceivers with a scalable logic fabric optimized for high-bandwidth communication and signal-processing designs. The "GX" suffix indicates the inclusion of embedded transceiver channels supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory, DSP blocks, and routing resources that the designer configures after manufacturing using an HDL-defined bitstream. Within the broader semiconductor hierarchy, an FPGA sits as a specialized type of programmable logic IC, above fixed-function ASICs in flexibility but typically below them in per-unit cost at high volume. The Stratix II GX specifically targets applications that demand both parallel DSP throughput and serial-link connectivity, making it part of Intel's high-performance programmable logic family alongside later Stratix IV/V/10 generations. Key features of the EP2SGX130GF1508C5 include 132,540 LEs, 6,627 LABs, approximately 6.7 Mbits of embedded RAM, 252 embedded 18x18 multipliers, and 734 maximum user I/Os. Up to 20 full-duplex transceiver channels support data rates from 600 Mbps to 6.375 Gbps. The device is fabricated on a 90 nm process and operates on a 1.2 V core supply. Speed grade C5 denotes a commercial temperature range with a mid-tier timing performance bin. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM), which can be configured as either combinational logic or arithmetic functions, providing higher effective density than traditional 4-input LUT architectures. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) layers, allowing direct interface to SERDES-based standards without external PHY chips. The 1508-ball FBGA package supports the high I/O count required for memory, transceiver, and general-purpose parallel interfaces. Typical applications include high-speed serial interface bridging, telecom baseband processing, military radar signal processing, ASIC prototyping, test and measurement equipment, and high-performance DSP accelerators. The integrated transceivers eliminate the need for external SERDES chips in many designs. When designing with this FPGA, ensure adequate power decoupling with multiple bulk and ceramic capacitors, manage JTAG configuration via the dedicated MSEL pins for the selected configuration scheme, and verify thermal management because high logic utilization combined with active transceivers can exceed 10 W of dissipation.

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EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel
EP2SGX130GF1508C5N

EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel

The Intel (formerly Altera) EP2SGX130GF1508C5N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements and 6,747,840 bits of embedded memory in a 1508-ball FC-FBGA package. Built on a 90 nm CMOS process and operating from a 1.2 V core supply, the device targets high-speed serial I/O and DSP-intensive applications, integrating up to 20 transceivers (per Stratix II GX family capability) operating at up to 6.375 Gbps and hard PCI Express and Serial RapidIO IP blocks. Key features include 6,627 Logic Array Blocks (LABs), 734 user I/O pins, embedded multiplier blocks and DSP blocks for high-throughput signal processing, distributed and M512/M4K/M-RAM block memory, and dedicated PLL and clock-management circuitry. The "C5" speed grade denotes a commercial -5 timing closure, while the "N" suffix indicates a lead-free, RoHS-compliant FBGA. The 40 x 40 mm package with 1 mm ball pitch is intended for high-layer-count PCB designs with controlled-impedance routing. The Stratix II GX architecture uses an ALM (Adaptive Logic Module) approach, allowing each ALM to be configured for either combinational or registered logic with up to 8 inputs, delivering better logic utilization than the older 4-input LUT-based Stratix. The on-chip transceivers support CPRI, OBSAI, Serial RapidIO, PCI Express Gen1, XAUI, CEI-6G, and SFI-5 protocols without external PHYs, making the part well suited for backplane, line-card, and base-station designs. Typical applications include 10G/40G Ethernet line cards, wireless base-station baseband and radio units, high-speed serial protocol bridging (PCIe, SRIO, XAUI), DSP co-processing for radar and medical imaging, and ASIC prototyping. The device is also used in broadcast video processing and high-end test and measurement equipment where logic density and transceiver bandwidth are simultaneous requirements. When designing with this device, ensure the PCB stack-up supports 1 mm-pitch BGA breakout with microvia or via-in-pad technology where required, and provide matched-length routing for high-speed serial links. Thermal management must account for the 1508-pin FC-FBGA's junction-to-ambient thermal resistance; a heatsink with thermal interface material is recommended for full transceiver utilization. Quartus II design software (Stratix II GX device support) is required for synthesis, place-and-route, and bitstream generation.

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EP2SGX130GF1508I4 - 132K LEs Stratix II GX FPGA | Intel | 1508-FCBGA
EP2SGX130GF1508I4

EP2SGX130GF1508I4 - 132K LEs Stratix II GX FPGA | Intel | 1508-FCBGA

The Intel (formerly Altera) EP2SGX130GF1508I4 is a high-density, high-performance Stratix II GX Field Programmable Gate Array (FPGA) with 132,540 logic elements, up to 6,747,840 system gates, and 734 embedded 18x18 multipliers, housed in a 1508-ball FC-FBGA package. The device integrates up to 20 embedded transceivers operating at 6.375 Gbps for high-speed serial I/O, 6.7 Mbits of embedded memory (M9K + M144K blocks), and supports the 90 nm CMOS process with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O resources that the designer can re-program after manufacture. Stratix II GX belongs to the high-end programmable-logic family: FPGA -> programmable logic -> programmable logic IC -> logic device -> semiconductor. The GX suffix denotes integrated multi-gigabit transceivers (MGTs), positioning the device for serial connectivity and DSP-heavy workloads. Key features include an internal clock network with up to 12 PLLs, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM), and flexible I/O standards including LVDS, LVPECL, HSTL, SSTL, and PCI Express. The device supports 1.0/1.2 V LVTTL/LVCMOS I/O and offers hot-socketing capability. The 1508-ball FC-BGA package provides high I/O density (734 user I/O pins per datasheet summary) for memory-rich and transceiver-rich designs. Architecturally, the Stratix II GX family uses the ALM (Adaptive Logic Module), an 8-input fracturable LUT-based logic element that improves packing efficiency versus 4-input LUT predecessors. The 90 nm process node balances performance and power, while dedicated DSP blocks accelerate multiply-accumulate operations. The transceiver block supports CPRI, OBSAI, Serial RapidIO, PCI Express, XAUI, and custom serial protocols at data rates from 600 Mbps to 6.375 Gbps. Typical applications include high-end telecommunications backplanes, wireless baseband processing, high-performance computing, video broadcast infrastructure, and test & measurement equipment. The combination of 132K logic elements and 20 transceivers targets designs where parallel DSP plus multi-gigabit serial I/O are required simultaneously. When designing, pay close attention to the 1.2 V core supply sequencing and the transceiver reference clock architecture. The 1508-ball FC-BGA package requires a multi-layer PCB with controlled-impedance traces, microvia stacking, and strict length-matching for transceiver channels. Power estimation should use the Intel PowerPlay Early Power Estimator (EPE) tool before logic design freeze. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II GX family, and practical design notes not found on the Intel datasheet cover page. Cross-reference the manufacturer datasheet for full timing, I/O standard, and transceiver specifications.

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EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel
EP2SGX130GF1508I4N

EP2SGX130GF1508I4N - Stratix II GX FPGA 132K LE 1508-FCBGA | Intel

The Intel (formerly Altera) EP2SGX130GF1508I4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded memory, and up to 734 user I/Os into a 1508-ball flip-chip BGA (FCBGA) package. The device is built on a 1.2V core, 90nm CMOS process with embedded transceivers capable of multi-gigabit serial signaling, making it suitable for high-bandwidth communications and signal-processing designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated DSP blocks, and on-chip memory that an engineer can re-program in the field after manufacturing. FPGAs sit between general-purpose microcontrollers (software-defined, slower) and application-specific integrated circuits (ASICs, fixed-function, highest performance). The Stratix II GX family extends the generic Stratix II architecture with embedded multi-gigabit transceivers, hardening the device for serial connectivity standards such as PCIe, Serial RapidIO, Gigabit Ethernet, and custom backplane links. Key features include 6,627 Adaptive Logic Modules (ALMs), dedicated 18x18 multipliers and DSP blocks, TriMatrix embedded memory with up to 6.75 Mbits, eight phase-locked loops (PLLs), and embedded transceiver channels supporting data rates up to 6.375 Gbps. Configuration is supported via passive serial, fast passive parallel, and JTAG modes, and design entry uses the Quartus II development toolchain. The -I4N speed/temperature grade denotes an industrial temperature range and a fast speed bin. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and high-performance DSP compute nodes. The 1508-ball FCBGA package exposes enough I/O and transceiver channels for multi-port line-card designs where board area is constrained but pin density is essential. When designing with this device, ensure the PCB stackup can handle the FCBGA ball pitch and provides matched-impedance routing for the transceiver channels. Power sequencing must follow the datasheet ramp order to avoid in-rush damage, and the JTAG chain should be accessible for boundary-scan and in-system programming. This page synthesizes distributor pricing, package options, and design guidance for engineers evaluating the EP2SGX130GF1508I4N against other Stratix II GX variants and competing high-density FPGAs.

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EP2SGX130GF1508I5N - 132K LEs Stratix II GX FPGA 1.2V 1508-FCBGA | Intel
EP2SGX130GF1508I5N

EP2SGX130GF1508I5N - 132K LEs Stratix II GX FPGA 1.2V 1508-FCBGA | Intel

The Intel EP2SGX130GF1508I5N is a high-density Field Programmable Gate Array (FPGA) from the Stratix II GX family, delivering 132,540 logic elements (LEs) and 132,540 equivalent logic cells in a 1508-ball Flip-Chip BGA (FCBGA) package. It operates from a nominal 1.2V core supply (1.15V to 1.25V range), is fabricated on a 90 nm CMOS process, and supports up to 717 MHz internal frequency with up to 622.08 MHz clock performance per published distributor specifications. The -I5N speed/temperature grade targets industrial environments (-40C to +85C). A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the customer after manufacture using a hardware description language (HDL) and a vendor toolchain. FPGAs sit at the top of the programmable-logic hierarchy alongside Complex Programmable Logic Devices (CPLDs); Stratix II GX extends this category by integrating up to 20 multi-gigabit transceivers (MGTs) on-chip, making it a single-chip platform for high-speed serial I/O. EP2SGX130GF1508I5N therefore belongs to the broader power-management-and-IO-rich programmable IC class used in wired communications infrastructure. Key features of this device include on-chip memory resources (M512/M4K/M-RAM blocks totalling several Mbits, per Stratix II GX family datasheet), embedded multiplier blocks for DSP, and a PLL network for clock management. Its high logic density and embedded transceivers make it suitable for wireline protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Aurora, while the on-chip RAM supports packet buffering and lookup tables in network processing designs. From a technical-depth perspective, the 90 nm Stratix II GX architecture introduced an adaptive logic module (ALM) that maps more efficiently into real-world HDL constructs than the older 4-input LUT of Stratix I. Combined with dedicated high-speed serial I/O and DSP blocks, the EP2SGX130G die is positioned for protocol bridging, channel aggregation, and line-card signal processing rather than low-cost glue logic. Typical applications include high-end wired telecom line cards, baseband processing in wireless backhaul equipment, military signal intelligence and radar preprocessing, broadcast video processing, and ASIC prototyping/emulation where 132K LEs provide headroom for large IP blocks plus testbench logic. When designing with this part, pay close attention to the 1508-ball FCBGA 1.0 mm pitch land pattern, which requires multi-layer PCB with sequential lamination and via-in-pad capability for reliable assembly. Power sequencing of VCCINT/VCCIO/VCCA and transceiver supplies must follow the Intel Stratix II GX Handbook; failures here are a common source of field returns. This page synthesizes distributor inventory, same-package alternative MPNs, and design considerations drawn from the Stratix II GX family datasheet, providing information beyond what a single distributor page or product brief offers.

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EP2SGX130GF40C3ES - 130K LEs Stratix II GX FPGA 6.375Gbps | Altera
EP2SGX130GF40C3ES

EP2SGX130GF40C3ES - 130K LEs Stratix II GX FPGA 6.375Gbps | Altera

The Intel (formerly Altera) EP2SGX130GF40C3ES is a high-performance Stratix II GX FPGA integrating 132,540 logic elements, 6,747 Kbits of embedded TriMatrix memory, and 4 to 20 high-speed serial transceiver channels with embedded CDR/SERDES capability operating at data rates up to 6.375 Gbps, housed in a 40 x 40 mm, 1508-ball FBGA (MS-034AAU-1) package with 1.0 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic, interconnect, and I/O resources can be customized after manufacture via an SRAM-based configuration bitstream. FPGAs occupy a unique position in the broader hierarchy of programmable logic devices (PLDs), sitting above CPLDs in density and below hard-wired ASICs in NRE cost while offering comparable performance for many parallel and high-bandwidth tasks. The Stratix II GX family specifically combines general-purpose FPGA fabric with multi-gigabit transceivers, enabling single-chip implementations of serial-protocol interfaces (PCI Express, Serial RapidIO, XAUI, Fibre Channel, Gigabit Ethernet) without external PHY silicon. The EP2SGX130G variant delivers up to 17 DSP blocks for fixed- and floating-point arithmetic, 16 global clock networks with up to 32 regional clock networks per device region, on-chip termination for high-speed transceivers, and dedicated circuitry for source-synchronous interfaces such as DDR/DDR2 SDRAM memory controllers operating up to 550 MHz. Internal core voltage is 1.2 V; the device is fabricated on a 90 nm CMOS process with a 12-layer metal stack. Typical applications include high-speed serial-protocol bridging (PCI Express x4/x8 endpoints, Serial RapidIO switches), high-end test and measurement instrumentation, digital video broadcast equipment, defense radar and signal-processing systems, and high-performance DSP co-processors. The transceiver count and package combination make this variant suitable for mid-density serial I/O expansion designs. When designing with this device, careful attention must be paid to PCB stack-up for the FBGA-1508 footprint: a minimum of 6 PCB layers with matched impedance for the high-speed serial channels, a continuous ground reference plane beneath the BGA field, and a via-in-pad or dog-bone fanout is recommended. Power-rail decoupling must follow Altera's Stratix II GX PowerPlay guidelines with multiple bulk and decoupling capacitor values placed as close as physically possible to each supply pin group. The 40 x 40 mm package footprint demands a high-density interconnect (HDI) PCB process with laser-drilled microvias. This page synthesizes drop-in alternate ordering codes within the EP2SGX130 GF1508 package family, current distributor pricing as of 2026-09-09, and practical PCB-layout design guidance not consolidated in any single manufacturer document.

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EP2SGX130GF40C3N - 132K LE Stratix II GX FPGA | Intel | BGA-1508
EP2SGX130GF40C3N

EP2SGX130GF40C3N - 132K LE Stratix II GX FPGA | Intel | BGA-1508

The Intel (formerly Altera) EP2SGX130GF40C3N is a high-density, high-performance Stratix II GX family FPGA delivering 132,540 logic elements, 6.7 Mbits of embedded memory, and 252 embedded 18x18 multipliers in a 1508-ball flip-chip BGA package. The GF40 designator indicates a 40-transceiver variant supporting up to 6.375 Gbps serial connectivity per channel, enabling high-bandwidth bridging between parallel and serial domains. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs occupy the top tier of the programmable logic hierarchy: discrete logic < CPLD < FPGA, and within the FPGA family, Stratix II GX sits in the high-performance transceiver-equipped branch designed for ASIC-prototyping, signal-processing, and high-speed serial I/O. The Stratix II GX family uses a 90 nm process and a 1.2 V core supply, with auxiliary voltages for transceivers and PLLs. Key features include up to 734 user I/O pins, embedded transceivers operating from 600 Mbps to 6.375 Gbps, dedicated PCS hardening per channel, and on-chip PLL/DLL blocks for clock generation. The device supports high-speed external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II through dedicated DQS phase-shift circuitry. Embedded transceivers support popular protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G through configurable PCS logic. The architecture combines a logic fabric of adaptive logic modules (ALMs) with embedded multiplier blocks, TriMatrix memory blocks of MRAM/M4K/M512 types, and four corner PLLs plus two per-side PLLs. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional configuration via Altera EPCS or EPC configuration memories. The result is a programmable platform that integrates DSP, memory, and serial I/O previously requiring multiple companion chips. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI MACs), ASIC prototyping for networking and storage ASICs, software-defined radio baseband processing, digital video broadcast infrastructure, and high-end test-and-measurement equipment. The 40-transceiver count makes this specific die ideal for designs requiring many simultaneous serial links, such as multi-channel base-station cards or protocol-conversion switches. When designing with this device, allocate sufficient PCB area for power decoupling near each transceiver quadrant (the GF40 layout places transceivers in physical columns requiring isolated analog supplies), and ensure the flip-chip BGA has a properly microvia-stitched escape pattern. The 1508-ball package requires a multi-layer PCB with buried vias and a minimum 1 oz copper pour for the ground-return path to control simultaneous-switching noise (SSN). This page synthesizes distributor pricing from DigiKey, Octopart, Jotrin, and SZComponents, cross-references against the in-house Stratix II GX family table, and presents drop-in alternatives within the 1508-BGA footprint plus practical design notes not included in the manufacturer datasheet.

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EP2SGX130GF40C3NES - Stratix II GX FPGA, 132K LE, 6.375Gbps | Altera
EP2SGX130GF40C3NES

EP2SGX130GF40C3NES - Stratix II GX FPGA, 132K LE, 6.375Gbps | Altera

The Altera (now Intel) EP2SGX130GF40C3NES is a high-density Stratix II GX FPGA from the Stratix II GX family integrating 132,540 equivalent logic elements with up to 20 high-speed serial transceiver channels operating at data rates up to 6.375 Gbps. Housed in a 1508-ball flip-chip BGA (FC-FBGA) package, it combines a scalable high-performance logic fabric with embedded SERDES and clock/data recovery units (CRU) on a 90 nm process, with core and I/O voltages centered around 1.2 V. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit in the hierarchy between programmable logic devices (PLDs), complex programmable logic devices (CPLDs), and application-specific integrated circuits (ASICs), offering higher logic density and higher performance than CPLDs but lower per-unit cost and longer lead time than ASICs at high volumes. Key features of the EP2SGX130GF40C3NES include up to 6.375 Gbps transceiver data rate per channel, embedded transceivers with clock/data recovery, on-chip memory, DSP blocks for high-throughput signal processing, and dedicated support for external memory interfaces such as DDR2/QDRII+. The Stratix II GX architecture was Altera's third-generation FPGA to combine high-speed serial transceivers with a scalable logic array, targeting line-card and backplane applications where multi-gigabit serial I/O eliminates external PHY chips. The device fabric is built on 90 nm CMOS technology and supports a maximum internal clock frequency around 717-779 MHz depending on configuration, with embedded transceivers typically delivering 4 to 20 channels at 6.375 Gbps. On-chip TriMatrix memory provides distributed RAM, block RAM, and shift-register memory resources for buffering, packet processing, and DSP coefficient storage. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO, Gigabit Ethernet), protocol bridging and aggregation line cards, multi-gigabit test and measurement equipment, broadcast video processing, and defense/radar signal processing front-ends. Designers also use Stratix II GX parts for proprietary chip-to-chip links requiring SERDES at 3 to 6 Gbps where the integrated transceiver eliminates the cost and signal-integrity overhead of a separate PHY. When designing with this part, plan the PCB for a high-density 1508-ball FC-FBGA which requires microvia-stack-up HDI technology, controlled-impedance SERDES routing, and strict power-rail decoupling per Altera's Stratix II GX design guidelines. Designers transitioning to newer projects should evaluate Stratix IV GX/GT, Arria, or Cyclone families for active-product longevity and tool support. This page synthesizes distributor stock and pricing data, same-package Stratix II GX drop-in alternatives drawn from the XAIPART Site MPN list, and practical design notes not found in the manufacturer datasheet alone.

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EP2SGX130GF40C4ES - 132,540 Logic Cells FPGA | Intel
EP2SGX130GF40C4ES

EP2SGX130GF40C4ES - 132,540 Logic Cells FPGA | Intel

Intel EP2SGX130GF40C4ES is a high-density Stratix II GX field-programmable gate array containing 132,540 logic cells, configured with 7,047 CLBs, and packaged in a 1,508-ball FBGA measuring 40 mm by 40 mm. The device uses CMOS programmable logic, supports an internal frequency of 717 MHz, and is specified for a 1.15 V to 1.25 V supply range. Its lead-free BGA construction belongs to the MS-034AAU-1 package designation and uses a 1 mm ball pitch. A field-programmable gate array, or FPGA, is a semiconductor device whose logic function is defined by configuration rather than fixed internal circuitry. In the system hierarchy, the FPGA combines programmable logic blocks, routing resources, input and output blocks, and optional embedded functions on one integrated circuit. Designers use implementation software to convert a digital design into configuration data, after which the device performs parallel logic, interface, signal-processing, or control functions. The EP2SGX130GF40C4ES belongs to the Stratix II GX family and targets applications requiring substantial logic capacity and high pin count. The principal verified specifications are 132,540 logic cells, 7,047 CLBs, 734 user I/O, and 1,508 package pins. The GX family positioning makes the part relevant to designs that combine high-density programmable logic with serial transceiver-oriented integration. The 717 MHz internal-frequency listing provides a useful reference for the device's speed class, while the 40 mm by 40 mm package supports a large number of parallel interfaces and power connections. The exact transceiver count, operating temperature, configuration memory capacity, and speed-grade interpretation were not exposed in the supplied web snippets. The EP2SGX130GF40C4ES uses SRAM-based programmable-logic technology, as indicated by its Stratix II GX family identity and CMOS process classification. Designers synthesize the intended circuit and load it into the FPGA through its configuration interface. With 734 user I/O and 1,508 total pins, board implementation requires careful assignment of power, ground, configuration, clock, and user-signal balls. The large BGA package can support wide parallel buses, memory interfaces, protocol bridges, and high-channel-count digital processing structures. Typical applications include communications equipment, high-speed test and measurement systems, industrial imaging and video processing, data-acquisition platforms, and protocol-conversion hardware. The 132,540 logic-cell resource count suits designs that need many parallel datapaths, while 734 user I/O can support numerous external buses. Serial transceivers may also make the GX family appropriate where the target design requires high-speed serial connectivity, although the supplied data does not provide a verified transceiver count. Before layout or production release, engineers should obtain the complete manufacturer datasheet and verify ball assignments, configuration requirements, supported I/O standards, transceiver limits, power sequencing, thermal design, and operating-temperature details. The 40 mm by 40 mm FBGA requires a multilayer PCB, controlled escape routing, and sound power-distribution design. Missing parameters are marked rather than inferred, and design-in decisions should be based on the complete datasheet and Quartus support documentation. This product data combines the verified distributor and manufacturer-source snippets with engineering context unavailable on a typical price listing. The result helps buyers compare capacity, package, and commercial information while giving FPGA engineers a clear distinction between confirmed specifications and parameters that still require datasheet-level verification.

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EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel
EP2SGX130GF40C4NES

EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel

The Intel EP2SGX130GF40C4NES is a 132,540 logic-element Stratix II GX FPGA with embedded 6.375 Gbps multi-gigabit transceivers, manufactured on a 90 nm CMOS process and housed in a 1508-ball flip-chip BGA (FC-FBGA, 40x40 mm, 1 mm pitch). It combines a high-performance programmable logic fabric with up to 20 embedded SERDES channels, 4.5 Mbits of embedded memory, and dedicated DSP blocks, targeting high-speed serial I/O applications including backplane switching, telecom line cards, and high-end test equipment. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and I/O cells that allow designers to implement arbitrary digital logic. Stratix II GX FPGAs sit within the hierarchy: FPGA -> programmable logic device -> PLD -> logic IC -> integrated circuit. The GX suffix denotes Altera/Intel's high-speed transceiver family, integrating multi-gigabit serial interfaces directly on-die to eliminate external PHY chips and shorten signal-trace paths. Key features of the EP2SGX130GF40C4NES include 132,540 logic elements, 717 MHz core fabric speed, 734 user I/O pins, an internal voltage of 1.2 V, and embedded SERDES supporting data rates up to 6.375 Gbps per channel with on-chip clock data recovery. The device exposes eight PLL blocks for clock synthesis and includes embedded TriMatrix memory totalling approximately 4.5 Mbits. Speed grade -4 (C4) and commercial extended temperature grade (N suffix with E) are specified per the datasheet family code. Architecturally, the Stratix II GX uses adaptive logic modules (ALMs) that combine fracturable look-up tables, dedicated carry chains, and register resources. Hard IP for PCIe, Serial RapidIO, and Gigabit Ethernet is embedded next to the transceivers, accelerating protocol implementation. The 90 nm process delivers an optimal balance between performance, leakage, and cost for high-pin-count FPGA designs in 2008-2010 vintage telecom and broadcast infrastructure. Typical applications include 10 Gbps optical transport line cards, Serial RapidIO backplanes, high-end ASIC prototyping, real-time DSP for radar and software-defined radio, and protocol-aware test and measurement platforms. The integrated transceivers let designers collapse multi-chip PHY + FPGA designs into a single package, simplifying board layout. Designers should plan for two-tier power decoupling (bulk plus 0.1 uF and 0.01 uF ceramics near each supply pin), implement thermal vias under the FC-FBGA thermal array, and respect the Quartus II pin connection guidelines for the GF40 package. The high pin count mandates a minimum 8-layer PCB with controlled-impedance routing for SERDES channels. This page consolidates current distributor pricing, verified drop-in same-brand alternatives, and design notes not present in the original datasheet, giving engineers a single reference for sourcing and second-sourcing decisions.

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EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
EP2SGX130GF40C4NGB

EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel

The Intel (formerly Altera) EP2SGX130GF40C4NGB is a high-density Stratix II GX FPGA from the Enhanced Configuration (EPC) device family, featuring 132,540 logic elements, 6,627 Logic Array Blocks (LABs), and integrated high-speed serial transceivers for gigabit serial interface applications. The device is housed in a 1508-ball FineLine Ball-Grid Array (FBGA) package with a 1.00 mm terminal pitch and is offered in the commercial speed grade 4 (C4) temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built around an array of programmable logic blocks, programmable interconnect, and I/O cells, belonging to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Modern FPGAs combine this programmable fabric with hardened IP such as transceivers, memory blocks, PLLs, multipliers, and embedded processors, allowing designers to implement custom datapaths, protocol controllers, and parallel processing pipelines on a single chip. The Stratix II GX series extends the general-purpose Stratix II family by adding multi-gigabit transceivers. The EP2SGX130GF40C4NGB integrates up to 20 transceivers supporting serial interfaces up to 6.375 Gbps, embedded TriMatrix memory, and DSP blocks. With 734 user I/O pins and 8 PLLs, the device supports a wide range of high-speed parallel and serial I/O standards. The 1508-ball FBGA package provides high pin density and signal integrity for backplane, telecommunications, and high-performance computing applications, and the C4 speed grade balances timing margin and operating frequency for commercial-temperature designs. Architecturally, the Stratix II GX device uses a row-based logic structure, ALM-based adaptive logic modules, and source-synchronous circuitry optimized for 600 MHz to 1 GHz internal operation. Hard IP for PCI Express, SerialLite II, and other serial protocols reduces soft-logic footprint, while the on-chip TriMatrix memory provides up to 6.7 Mbits of distributed and block RAM with multiple operating modes. Typical applications include 10G/40G Ethernet line cards, SONET/SDH framers, HD-SDI video routers, high-performance DSP co-processing, software-defined radio (SDR) baseband, ASIC prototyping, and high-density protocol bridging. Designers select the EP2SGX130GF40C4NGB when 132K logic elements and 6.375 Gbps transceivers are required in a single device on a commercial-temperature board. When designing with this device, ensure Quartus II software compatibility (the device is supported by Quartus II version 9.1 and later, but newer Quartus releases may no longer include the device in active support). Plan PCB layout with controlled-impedance transceiver channels and adequate thermal dissipation for the 1508-ball FBGA; reference the Altera Stratix II GX Device Handbook and the AN 532 application note for transceiver signal-integrity guidelines. This page synthesizes distributor pricing, drop-in alternative MPNs from the Stratix II GX family, and engineering design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB implementation decisions.

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EP2SGX130GF40C5 - Stratix II GX 132K LE FPGA, 734 I/O, 1508-FBGA | Intel
EP2SGX130GF40C5

EP2SGX130GF40C5 - Stratix II GX 132K LE FPGA, 734 I/O, 1508-FBGA | Intel

The Intel (Altera) EP2SGX130GF40C5 is a high-density Stratix II GX family FPGA delivering 132,540 logic elements with embedded transceivers, manufactured on a 90 nm process and housed in a 1508-ball FineLine BGA package. Key headline parameters include 609.76 MHz core operation from a 1.2 V supply, 734 user I/O pins, and integrated high-speed serial transceivers designed for multi-gigabit serial I/O applications. The 'C5' speed grade places it in the commercial temperature range with the mid-tier performance rating. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer can reconfigure after manufacturing. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLD), which in turn belong to the digital logic IC family and ultimately the integrated circuit category. Stratix II GX parts specifically target high-bandwidth serial connectivity, where embedded transceivers, hard PCIe and SERDES blocks, and abundant on-chip memory replace what would otherwise require multiple companion ASICs. Key features of the EP2SGX130GF40C5 include up to 6.7 Mbits of embedded memory, dedicated DSP blocks for fixed- and floating-point math, up to 12 embedded transceivers supporting multi-gigabit data rates, eight PLLs for clock management, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The device also provides hardware multipliers and TriMatrix memory architecture for distributed, block, and shift-register memory configurations. The device architecture combines adaptive logic modules (ALMs) with eight-input fracturable look-up tables (LUTs), allowing a single ALM to implement multiple smaller logic functions and improving effective logic density. Combined with 90 nm process technology and a 1.2 V core, the EP2SGX130GF40C5 achieves high-performance operation with reduced dynamic power relative to the original Stratix family. Embedded transceivers support standards including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY chips. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of abundant logic, embedded SERDES, and large memory makes it well suited to wire-speed packet processing and high-throughput DSP pipelines. When designing with this FPGA, designers should plan thermal dissipation carefully because the 1508-ball FCBGA package concentrates significant power density. Use Altera's Quartus II design suite (legacy support still available through Intel) for synthesis, place-and-route, and SignalTap II logic analysis. Ensure the PCB has sufficient decoupling and matched-length differential pairs for the high-speed serial channels. This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX variants, and practical design considerations not found in the manufacturer datasheet, enabling faster sourcing and second-source decisions.

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EP2SGX130GF40C5ES - Stratix II GX 132K LC FPGA, FC-FBGA-1508 | Altera
EP2SGX130GF40C5ES

EP2SGX130GF40C5ES - Stratix II GX 132K LC FPGA, FC-FBGA-1508 | Altera

The Altera (Intel) EP2SGX130GF40C5ES is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements across 7,047 Logic Array Blocks (LABs) in a 40x40 mm, 1508-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V nominal core supply, with embedded transceiver support suited for high-speed serial I/O and the speed grade -5 (the '5' position) indicating Altera's mid-to-upper performance bin for this family. An FPGA is a programmable logic device whose interconnect and logic resources are configured by the user after manufacture, falling into the broader taxonomy of programmable logic > logic IC > integrated circuit > semiconductor. FPGAs such as the EP2SGX130 are used to implement arbitrary digital state machines, DSP datapaths, bus bridges, and protocol controllers without resorting to custom ASIC silicon, trading per-unit cost for design flexibility and time-to-market. The Stratix II GX family in particular targets high-speed serial connectivity applications by combining general-purpose FPGA fabric with embedded multi-gigabit transceivers. Key device features for the EP2SGX130 include 132,540 logic elements, 7,047 LABs, embedded transceiver support, a 609.76 MHz internal frequency ceiling, a 1.2 V core, 90 nm process technology, and commercial-extended (0C to 85C) operating temperature grading per the 'C' suffix. The package integrates 1,508 balls on 1 mm pitch in a flip-chip land-grid construction, allowing dense PCB escape routing for high I/O counts. The 'GF40' designator decodes as 'G' for the lead-free, halogen-free Pb-free ball finish, 'F' for flip-chip BGA, and '40' for the 40 mm body size. The 'Stratix' architecture implements adaptive logic modules (ALMs) rather than classic 4-input LUTs, giving higher effective logic density per tile. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI when paired with the appropriate Altera IP core, making the EP2SGX130 a drop-in building block for line cards, baseband processing, and protocol bridge designs. Configuration is loaded via JTAG, passive serial, or active serial configuration schemes supported by the device. Typical applications include high-speed serial backplane interfaces on telecom line cards, PCIe endpoint and root-complex designs, radar and signal-processing front ends, broadcast video processing engines, and military/aerospace digital signal processing subsystems. The wide -C5 speed bin and commercial-extended temperature grading make it suitable for thermally-controlled industrial enclosures and lab-grade equipment. When designing with this device, allocate at least 6 PCB layers for power, ground, and signal escape from the 1,508-ball FC-FBGA, and use Altera's Quartus II design suite (v7.2 or later for the Stratix II family) for synthesis, place-and-route, and power estimation. Decoupling follows the Stratix II GX Power Distribution Network (PDN) application note, typically requiring bulk, mid-frequency, and high-frequency ceramics distributed under the die shadow. This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and package alternatives, and practical design notes not consolidated on the manufacturer product page.

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EP2SGX130GF40C5NES - Stratix II GX FPGA 132K LEs 1508-FBGA | Intel
EP2SGX130GF40C5NES

EP2SGX130GF40C5NES - Stratix II GX FPGA 132K LEs 1508-FBGA | Intel

The Intel EP2SGX130GF40C5NES is a high-density Stratix II GX family FPGA delivering 132,540 logic elements with embedded transceivers and 734 user I/O pins, housed in a 40x40mm 1508-ball FineLine BGA (FBGA-1508) package. The device integrates up to 6.7 Mbits of embedded memory, embedded multipliers for DSP, and high-speed serial transceivers supporting multi-gigabit serial interfaces, making it one of the flagship devices in the Stratix II GX line. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP slices, PLLs, and (in transceiver variants) multi-gigabit transceivers (MGTs). FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits family. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market at the cost of higher unit price and lower absolute performance-per-watt. The Stratix II GX architecture specifically extends the Stratix II family by adding 3.125 Gbps transceivers for protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet. Key features include 132,540 logic elements, 6.7 Mbits of on-chip RAM, 252 embedded 18x18 multipliers for DSP, 4 PLLs, and 16 global clock networks. The 1508-FBGA package exposes 734 user I/O pins organized into I/O banks that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offer on-chip termination. The C5 speed grade, commercial extended temperature range, and lead-free / RoHS-compliant assembly suit this device to telecom, military-aero, and high-end test equipment. Architecturally the Stratix II GX uses a row-and-column based adaptive logic module (ALM) fabric with DirectDrive and MultiTrack interconnect to reduce routing congestion and improve timing closure. Hard intellectual-property (IP) blocks including transceivers, memory interfaces, and DSP multipliers free programmable fabric for application logic, and the design entry is through the Quartus II design suite. Typical applications include 10-Gigabit Ethernet line cards, Serial RapidIO switches, military secure-radio baseband processing, high-end medical imaging, and ASIC prototyping. Designers choose the EP2SGX130 when their design needs both high logic capacity and embedded multi-gigabit transceivers on a single die. When designing with this device, plan for a 40x40mm PCB footprint with microvia-stack-up capable of routing the 1mm-pitch FBGA-1508 balls, and ensure decoupling capacitance of at least 1uF per power pin per Intel Stratix II GX hardware reference manual guidance. Quartus II PowerPlay early power estimation should be run before pin-out closure because the device can dissipate 15-25W in transceiver-heavy designs. This page synthesizes drop-in alternatives in the same FBGA-1508 footprint, current distributor pricing as of 2026-09-09, and practical PCB and thermal design notes that complement the manufacturer datasheet.

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