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EP2SGX90EF1152C3 - Stratix II GX FPGA 90K LE 1152-FBGA | Intel
EP2SGX90EF1152C3

EP2SGX90EF1152C3 - Stratix II GX FPGA 90K LE 1152-FBGA | Intel

The Intel EP2SGX90EF1152C3 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) with 90,960 equivalent logic elements (LEs), 4,520,448 RAM bits (4.5 Mbit), 558 user I/Os, and 4,548 LABs/CLBs, packaged in a 1152-ball FineLine BGA (FBGA). Built on a 90 nm process, the EP2SGX90 integrates up to 12 transceivers operating at 6.375 Gbps, dedicated DSP blocks, and TriMatrix memory blocks for high-performance signal processing. An FPGA is a semiconductor integrated circuit that can be programmed and reprogrammed after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) along with CPLDs; modern high-end FPGAs like the Stratix II GX family also embed hard IP such as multi-gigabit transceivers, PLLs, and DSP multipliers, making them functionally closer to a System-on-Chip than a simple gate array. The Stratix II GX architecture introduced ALM (Adaptive Logic Module) blocks, an improvement over the classic 4-input LUT architecture used in earlier Stratix devices, enabling tighter logic packing and faster timing closure. Key features of the EP2SGX90EF1152C3 include 4 PLLs, 12 multi-gigabit transceivers (3.125-6.375 Gbps), embedded DSP blocks (approximately 384 18x18 multipliers), and 4.5 Mbit of on-chip RAM. The 1152-FBGA package supports 558 user I/Os, enabling high-bandwidth parallel interfaces alongside serial links. The device operates from a 1.2 V core supply with separate VCCPD, VCCA, and VCCP supplies for I/O and analog blocks. Typical applications include high-speed serial backplane aggregation, telecom line cards, video broadcast infrastructure, military signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes this device well-suited to applications that would otherwise require a discrete SERDES plus a large FPGA. Designers should provide clean, decoupled supply rails for VCCINT (1.2 V), VCCPD, VCCA, and VCCP, follow Altera/Intel reference design layout guidelines for the FBGA-1152 package, and validate transceiver channel performance against the IBIS-AMI models in the Quartus II design suite. The C3 speed grade offers typical commercial operating performance.

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EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES

EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

The Intel EP2SGX90EF1152C3ES is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 90,960 logic elements backed by 4,520,448 bits of embedded memory and 558 user I/O pins in a 1152-ball FineLine BGA (FBGA) package. It integrates up to 12 transceivers (per family spec) capable of multi-gigabit serial I/O for backplane and chip-to-chip links, making it a workhorse for wired communication, broadcast video, and high-speed instrumentation. The 'C3' speed grade combined with the commercial-extended temperature suffix ('ES') targets -40 C to +100 C operation, while the 'E' denotes enhanced 1.5 V core VCC. An FPGA is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM, in contrast to ASICs whose function is fixed at tape-out. Stratix II GX sits in the hierarchy: programmable logic device -> FPGA -> high-speed-transceiver-equipped FPGA -> Altera Stratix II GX family, designed for prototyping, low-volume production, and designs that benefit from hardware-level parallelism combined with 6.375 Gbps class serial links. Key features include 4,520,448 bits of embedded RAM (approximately 4.5 Mbit, distributed + block), dedicated DSP blocks for fixed/floating-point arithmetic, 12 high-speed transceivers with embedded CDR, support for PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet hard IP, and a robust clock management network with PLLs covering the device edge and core. The 1152-BBGA package exposes 558 user I/O across 24 user-I/O banks, providing flexible single-ended and differential signaling for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Typical applications include 10 Gbps-class data aggregation switches, broadcast video format converters, radar and software-defined radio digital front-ends, ASIC prototyping for communications SoCs, and PCIe Gen1 endpoint cards. The transceiver-rich architecture also suits test-and-measurement chassis that aggregate many Gbps lanes into a single FPGA for real-time DSP.

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EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
EP2SGX90EF1152C3N

EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA

The Intel EP2SGX90EF1152C3N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,548 LABs/CLBs, 4,520,448 bits of embedded memory, and 558 user I/Os, housed in a 1152-ball FC-FBGA package. Built on a 90nm process technology, the device operates at a core voltage of 1.2V and supports transceiver performance up to 816.9 MHz, making it suitable for high-speed serial connectivity and DSP-intensive workloads. The "EF" speed grade designation indicates the device's place in Stratix II GX timing closure, while the C3 commercial temperature grade and the "N" lead-free suffix confirm RoHS-compliant operation from 0C to +85C. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard-IP such as transceivers, block RAM, and DSP blocks. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs - offering ASIC-class parallelism and throughput while preserving full post-production reprogrammability. Stratix II GX is Intel's (formerly Altera's) high-end transceiver-equipped family, positioned for serial connectivity, video processing, and communications infrastructure where parallel DSP and high I/O count are required. Key features of the EP2SGX90EF1152C3N include up to 12 transceivers supporting SERDES rates commonly used in the Stratix II GX family, dedicated embedded multiplier blocks for DSP, distributed and block RAM, and on-chip PLLs. The 1152-ball flip-chip BGA package provides the high-pin-count escape routing required to bring 558 user I/Os off-die while supporting the high-power transceivers. A rich configuration options set (Fast Passive Parallel, Active Serial, JTAG) makes the part deployable in production and in-field update scenarios. Typical applications include 10G/1G Ethernet line cards, wireless baseband processing, broadcast video routers, high-speed serial protocol bridging (PCI Express, Serial RapidIO, XAUI), and military/aerospace signal processing. The high logic density combined with embedded transceivers allows single-chip implementation of multi-channel data-path designs that previously required an FPGA plus an external PHY. When designing with this device, pay close attention to transceiver reference-clock jitter, PCB stack-up for BGA escape, and power-rail sequencing on the 1.2V core. Thermal management is critical because the FC-FBGA package concentrates heat from the transceiver channels. Use the Quartus II design software (or its supported successors) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package variants, and design considerations that go beyond the manufacturer datasheet - giving procurement and engineering teams a single authoritative reference for the EP2SGX90EF1152C3N.

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EP2SGX90EF1152C4 - 90,960-Cell Stratix II GX FPGA
EP2SGX90EF1152C4

EP2SGX90EF1152C4 - 90,960-Cell Stratix II GX FPGA

Altera EP2SGX90EF1152C4 is a high-density Stratix II GX field-programmable gate array with 90,960 logic cells, 558 user I/O, and a 1.2 V core supply specification, housed in a 1152-ball FC-FBGA package. The device is implemented using 90 nm CMOS technology and is intended for high-speed, logic-intensive embedded and communications systems. The verified search data identifies 4,548 LABs, a maximum frequency value of 732.1 MHz, and a 1152-pin package designated FC-FBGA, FBGA-1152, or 1152-BBGA in distributor listings. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic, interconnect, memory, and I/O resources. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, which are used to implement digital processing, interface bridging, control, and protocol functions. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The Stratix II GX family adds high-speed transceiver-oriented functionality to the programmable-logic architecture, while the exact transceiver count and electrical characteristics must be confirmed from the complete manufacturer documentation. The principal verified features are 90,960 cells, 558 I/O, 1.2 V technology supply, 90 nm process technology, and 1152-ball surface-mount packaging. The reported maximum frequency is 732.1 MHz in one source and 717 MHz in another source; therefore, the discrepancy is retained rather than reconciled by assumption. The device also appears in verified distributor data as a field-programmable gate array with 4,548 LABs. Its large logic capacity makes it suitable for parallel datapaths, multi-channel interface aggregation, and systems requiring configurable control and processing blocks. The architecture combines programmable logic fabric with package-level I/O resources and is designed for high-density digital implementation. The 90 nm process supports a substantial logic-cell count while the 1.2 V supply designation provides a defined electrical boundary for system power planning. The available search results confirm the device family, cell count, process technology, frequency figures, and package type, but do not provide complete transceiver specifications, configuration-memory details, operating-temperature grades, or absolute maximum ratings. Typical applications include communications infrastructure, industrial automation, high-speed test equipment, and embedded systems that require configurable digital processing. The 558 I/O resources support multiple parallel interfaces, while the 90,960-cell capacity can accommodate large state machines, protocol-processing logic, and data-path functions. The FC-FBGA package requires careful ball mapping, controlled-impedance routing, and thorough signal-integrity review during PCB design. Designers should obtain the complete manufacturer datasheet and verify the target speed grade, I/O bank restrictions, transceiver configuration, power sequencing, thermal limits, and package ball assignments before release. Because the supplied data contains conflicting frequency values and omits several device specifications, those parameters are not inferred. Pricing and stock should be confirmed with the distributor at the time of purchase, as availability may change rapidly. This page synthesizes verified distributor and manufacturer-oriented search results, preserves conflicting frequency figures, identifies the confirmed Stratix II GX architecture and 1152-ball package, and provides application and sourcing context beyond a single catalog listing. It does not replace the manufacturer datasheet or a formal PCB-level qualification.

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EP2SGX90EF1152C4ES - Stratix II GX 90K LE FPGA, 558 I/O, 1152-FBGA
EP2SGX90EF1152C4ES

EP2SGX90EF1152C4ES - Stratix II GX 90K LE FPGA, 558 I/O, 1152-FBGA

The Intel (formerly Altera) EP2SGX90EF1152C4ES is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,448 bits of embedded RAM, and up to 558 user I/O pins, fabricated on a 90 nm process and supplied from a 1.2 V core rail. The device is housed in a 1152-ball flip-chip FineLine BGA (FC-FBGA) package and is rated for the commercial-extended temperature range. It also integrates dedicated multi-gigabit transceivers and embedded multipliers targeting high-throughput signal-processing pipelines. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, and DSP pipelines on a silicon fabric that is configured after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs trade raw per-gate efficiency for design flexibility and rapid time-to-market, and they are commonly used for prototyping, low-volume production, and applications where standards or algorithms evolve frequently. Key features of the EP2SGX90EF1152C4ES include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded DSP blocks for high-speed multiply-accumulate operations, dedicated serializer/deserializer (SERDES) channels supporting multi-gigabit serial protocols, and 558 user I/O pins compliant with multiple single-ended and differential I/O standards. The device supports configuration via passive serial, fast passive parallel, and JTAG modes, and includes on-chip PLLs for clock management. The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with embedded transceivers capable of multi-gigabit serial interfaces such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 90 nm process node and dedicated hard IP blocks deliver deterministic latency for serial connectivity, while the TriMatrix memory subsystem allows wide, high-throughput on-chip data buffers for packet processing and DSP. Typical applications for this part include high-speed serial interface bridging, telecommunications backplane aggregation, military and aerospace signal processing, industrial imaging pipelines, ASIC prototyping, and test and measurement instrumentation. The wide I/O count and embedded multi-gigabit transceivers make it particularly well-suited to designs that require both rich parallel connectivity and high-speed serial links on a single device. When designing with this FPGA, ensure that the 1152-ball FC-FBGA land pattern and ball-attach process match the manufacturer's recommended reflow profile, and that the PCB stack-up provides sufficient microvia and via-in-pad capacity for the BGA escape routing. Power-rail sequencing and decoupling must follow the Stratix II GX pin connection guidelines, and the device requires a configuration device or JTAG programmer for first-time bitstream load. This page synthesizes distributor stock levels, drop-in alternatives from the same Stratix II GX family, and practical design notes that complement the manufacturer datasheet for the EP2SGX90EF1152C4ES.

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EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N

EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel

The Intel (formerly Altera) EP2SGX90EF1152C4N is a high-density Stratix II GX family field-programmable gate array (FPGA) with 90,960 logic elements (LE), 4,520,448 bits of embedded memory, and integrated 6.375 Gbps transceivers, housed in a 1152-ball fine-pitch BGA (FC-FBGA / FBGA-1152) package. It operates across a 1.2 V core supply with multiple I/O bank voltages and supports up to 558 user I/O pins, with 4,548 LABs arranged to deliver high logic density for DSP- and memory-intensive designs. An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit that lets engineers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and routing interconnects. In the wider hierarchy, FPGAs sit above microcontrollers and ASICs in reconfigurability, and below ASICs in performance-per-watt. The Stratix II GX family is positioned as a transceiver-rich, DSP-capable platform used in telecom, video processing, and high-speed serial-link designs. Key features of the EP2SGX90EF1152C4N include 90,960 logic elements, 4.5 Mbit embedded memory, embedded DSP blocks for high-throughput signal processing, and up to 20 full-duplex CDR-based transceivers reaching 6.375 Gbps per channel. The 1152-ball FC-FBGA package supports high pin counts for parallel and serial I/O simultaneously, and the C4 speed grade balances Fmax and timing closure across industrial temperature ranges. The device is built on a 90 nm process node with a 1.2 V core. The Stratix II GX architecture uses adaptive logic modules (ALMs) rather than older 4-input LUTs, with each ALM capable of implementing any 7-input function or multiple smaller functions for finer logic packing. Embedded transceivers support CPRI, OBSAI, Serial RapidIO, PCIe, and custom serial protocols up to 6.375 Gbps, while the dedicated DSP blocks deliver up to 18x18-bit signed multiplication per cycle. TriMatrix memory blocks (MLABs, M512, M4K, M-RAM) are interleaved across the fabric to optimize both small and large memory buffering. Typical applications include high-end telecom baseband and packet processing, broadcast video bridge and router designs, high-speed serial protocol test equipment, defense and aerospace signal processing, and PCI Express endpoint/root port cards. Designers also use this device for ASIC prototyping due to its high LE count and abundant I/O bandwidth. Engineering trade-offs to consider include the 90 nm power profile (higher static leakage versus newer 40/28/20 nm Stratix IV/V/A10 families), the large 1152-ball BGA which demands 8+ layer PCB with controlled-impedance routing, and the C4 speed grade's timing margin relative to C5 or I-grade variants.

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EP2SGX90EF1152C5 - Stratix II GX FPGA 90K LEs 1152-FBGA | Intel
EP2SGX90EF1152C5

EP2SGX90EF1152C5 - Stratix II GX FPGA 90K LEs 1152-FBGA | Intel

The Intel (Altera) EP2SGX90EF1152C5 is a high-density, high-performance Stratix II GX Field Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded RAM, and 558 embedded 18x18 multipliers into a 1152-ball FineLine BGA (FCBGA) package measuring 35 mm x 35 mm. The device combines a 90 nm logic fabric with up to 20 transceivers capable of multi-gigabit serial I/O, making it a long-standing reference design for high-bandwidth wireline and embedded compute systems. A Field Programmable Gate Array (FPGA) is a programmable logic device built from configurable logic blocks, programmable interconnects, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit in the wider taxonomy of programmable logic devices, alongside CPLDs, and are widely used as application-specific accelerators in place of fixed-function ASICs. The Stratix II GX family, specifically, adds embedded transceivers that distinguish it from general-purpose Stratix II devices for serial connectivity. Key differentiating specifications include 4,520,448 total RAM bits, 558 dedicated 18x18 multipliers for DSP workloads, integrated multi-gigabit transceivers, and a core voltage range of 1.15 V to 1.25 V. The 1152-ball FCBGA package supports the high I/O count required by parallel memory buses and multi-channel serial links simultaneously. Combined with 90 nm process technology, the device balances logic density with low-jitter transceiver performance. Architecturally, the Stratix II GX uses an ALM-based logic fabric with adaptive look-up tables, dedicated on-chip memory blocks, and embedded transceivers capable of rates commonly used in 2005-2010 generation telecom and storage backplanes. The 558 embedded multipliers enable high-throughput DSP pipelines without consuming general logic, while 4.5 Mbits of RAM are distributed across TriMatrix memory blocks for flexible buffering. Typical applications include high-speed serial backplane aggregation, telecom line cards, broadcast video processing, military secure communications, and ASIC prototyping. The combination of logic density and integrated transceivers also makes it suitable for software-defined radio front-ends and test equipment requiring parallel DSP. When designing with this FPGA, allocate sufficient decoupling across VCCINT, VCCA, and transceiver supply rails, and follow Intel/Altera's pinout guidelines for the 1152-ball FCBGA. Designers should also confirm Quartus II support versions match the device before board bring-up. This page synthesizes distributor stock, drop-in Stratix II GX alternatives, and design guidance that the manufacturer datasheet alone does not provide in a single view.

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EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
EP2SGX90EF1152C5ES

EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel

The Intel (Altera) EP2SGX90EF1152C5ES is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 90,960 logic elements, 4,520,448 bits of embedded memory, and 558 user I/Os in a 1152-ball FineLine BGA (FBGA) package. Built on a 90 nm process, the Stratix II GX family integrates up to 20 transceiver channels operating at 6.375 Gbps, making this device a drop-in solution for high-speed serial I/O, embedded processing, and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that allows engineers to implement arbitrary digital logic using configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): unlike microcontrollers they execute logic in hardware rather than software, and unlike ASICs they can be re-programmed in the field. Stratix II GX belongs to Altera's high-end FPGA taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and was the industry's first 90 nm FPGA with embedded transceivers. Key features of the EP2SGX90EF1152C5ES include 12 embedded transceiver blocks supporting CPRI, OBSAI, Serial RapidIO, PCI Express, and Gigabit Ethernet protocols, 384 (18x18) multipliers for DSP workloads, an on-chip 36-block RAM architecture totalling approximately 4.5 Mbits, and a hard PCI Express x1/x4 endpoint block. The 1152-FBGA package exposes 558 user I/Os and supports hot-socketing for in-system reprogramming without board power-down. Architecturally the device pairs an adaptive logic module (ALM) based core fabric with a row-and-column interconnect, enabling high utilisation at clock rates up to 450 MHz internally. The Stratix II GX transceiver macros embed clock-data recovery (CDR), serializer/deserializer (SERDES), and pre-emphasis/equalisation blocks that replace external PHY silicon. The 'C5' speed grade reflects a commercial temperature range (0C to +85C) with the timing closure typical of mid-tier speed bins. Typical applications include 4G base-station baseband processing, radar and electronic-warfare front-ends, high-resolution medical imaging pipelines, high-end broadcast video routing, and ASIC prototyping for networking line cards. The combination of embedded multi-gigabit transceivers and DSP blocks makes the EP2SGX90EF1152C5ES particularly well suited to designs where parallel DSP plus serial backplane connectivity must coexist on a single device. When designing with this FPGA, plan the power-decoupling network carefully: Stratix II GX devices can draw transient currents exceeding 20 A during configuration. Use a multi-rail power-supply architecture (typically 1.2 V core, 2.5 V/3.3 V I/O, 1.2 V PLL, and 1.2 V transceiver analog) and follow Altera's recommended power-up/-down sequencing. Quartus II software with Service Pack 2 or later is required to compile designs targeting this device. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not collected in any single manufacturer document.

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EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel
EP2SGX90EF1152C5N

EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel

The Intel (formerly Altera) EP2SGX90EF1152C5N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 90,960 logic elements, 4,548 logic array blocks, and 4,520,448 bits of embedded RAM, housed in a 1152-ball FC-FBGA package. The device integrates up to 12 transceivers supporting data rates up to 6.375 Gbps, making it well suited for high-speed serial I/O applications such as backplanes, chip-to-chip links, and proprietary serial protocols. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and belong to the integrated circuits (IC) family, with variants including SRAM-based, flash-based, and antifuse-based architectures. Modern high-end FPGAs such as the Stratix II GX family integrate hard IP cores (transceivers, DSP blocks, memory interfaces) alongside general-purpose fabric, allowing one device to replace multiple discrete components on a board. Key features of the EP2SGX90EF1152C5N include 558 user I/Os, support for DDR/DDR2/QDRII memory interfaces, dedicated DSP blocks for high-throughput arithmetic, and a 1.2 V core supply with 90 nm process technology. The part operates over the commercial temperature range (0C to +85C) and is offered in a -5 speed grade. The 1152-ball flip-chip BGA package enables high pin density while supporting the high-speed signal integrity required by multi-gigabit transceivers. The Stratix II GX architecture employs an adaptive logic module (ALM) structure that improves logic efficiency versus prior 4-input LUT architectures, delivering higher effective logic capacity per die area. The integrated transceivers incorporate built-in clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, XAUI, and CEI-6G without external PHY devices. Typical applications include high-speed serial backplane interfaces, telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, and protocol bridging ASIC prototyping. The combination of logic density and integrated multi-gigabit transceivers lets designers consolidate what would otherwise be a discrete ASSP plus FPGA solution onto a single device. When designing with this part, pay close attention to power supply sequencing, PCB BGA fanout, and signal-integrity constraints on the transceiver channels. Reference designs and the Stratix II GX Device Handbook should be consulted for transceiver channel routing, decoupling strategies, and JTAG configuration circuit requirements. Designers should also note that the EP2SGX90 family is in its mature product lifecycle and may require sourcing through distribution channels. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, comprehensive reference for sourcing and designing with the EP2SGX90EF1152C5N.

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EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel
EP2SGX90EF1152I2N

EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

The Intel/Altera EP2SGX90EF1152I2N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded RAM, and 558 user I/Os in a 1152-ball flip-chip BGA package. Built on a 90 nm process, the device combines a rich logic fabric with up to 12 transceiver channels (per Stratix II GX family specification) for high-speed serial I/O, making it suitable for serial connectivity, custom compute, and DSP pipelines. The EP2SGX90EF1152I2N is the I2 grade variant, specified for the industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, transceivers, PLLs, multipliers). It sits in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. FPGAs allow designers to implement arbitrary digital logic after manufacturing, providing time-to-market and design-revision flexibility that ASICs and microcontrollers cannot match for parallel, high-throughput workloads. Key features of the EP2SGX90EF1152I2N include 4,548 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, embedded memory (M512/M4K/M-RAM blocks totaling 4,520,448 bits), and dedicated high-speed transceivers. The device is built on a 1.2 V core with PLL-based clock management for multi-domain designs. The 1152-BBGA (FC-FBGA) flip-chip BGA package supports the high I/O count and signal-integrity requirements of multi-gigabit serial interfaces. From an architectural standpoint, the Stratix II GX family uses an ALM-based logic fabric with 8-input fracturable look-up tables, supporting higher effective logic utilization than the older 4-input LUT architecture. Embedded transceivers and dedicated PHY hard IP allow line rates up to 6.375 Gbps depending on protocol, simplifying high-speed serial designs. Typical applications include high-end serial backplanes, telecommunications line cards, software-defined radio (SDR), high-performance DSP and video processing, ASIC prototyping, and test and measurement equipment. The GX transceiver block is especially attractive for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links. Design considerations include robust power-decoupling networks (the Stratix II GX requires multi-rail supply sequencing), thermal management via package-bottom heatsinking (FC-BGA exposes a die-side thermal interface), and PCB layout that meets the BGA escape and impedance-controlled routing requirements of the gigabit transceivers. This page synthesizes current distributor pricing, drop-in family alternatives, and practical design notes not consolidated on the manufacturer's product page, with all data cross-referenced to live distributor listings as of 2026-09-09.

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EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

The Intel EP2SGX90EF1152I3 is a high-performance Field Programmable Gate Array from the Stratix II GX family, featuring 90,960 equivalent logic elements organized as 558 Adaptive Logic Modules (ALMs) across 4,520,448 bits of on-chip memory. It supports a maximum core clock frequency of 622.08 MHz and is built on a 90 nm CMOS process with a nominal 1.2 V core supply (1.15 V to 1.25 V range). The device is housed in a 1152-ball flip-chip BGA (FC-FBGA) package designed for industrial-grade operating conditions. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks, programmable interconnect, and dedicated hardened IP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, in-field re-programmability, and time-to-market advantages. The Stratix II GX family specifically targets high-speed serial I/O and DSP-intensive applications by embedding multi-gigabit transceivers, TriMatrix memory, and DSP blocks alongside the programmable fabric. Key features include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded multipliers for DSP pipelines, up to 8 multi-gigabit transceivers (depending on variant), and support for external memory interfaces including DDR2/QDRII/RLDRAM. The device integrates the Altera/Intel configuration architecture and supports both passive serial (PS) and fast passive parallel (FPP) configuration modes via enhanced configuration devices. Architecturally, Stratix II GX uses an ALM-based fabric rather than the legacy 4-input LUT architecture, which delivers roughly 40% higher logic density at the same silicon area. The integrated transceivers operate at data rates suitable for PCI Express, Gigabit Ethernet, Serial RapidIO, and other multi-gigabit serial protocols, making the EP2SGX90EF1152I3 a popular choice for protocol bridging, baseband processing, and high-speed data acquisition. Typical applications include telecommunications line cards, video broadcast equipment, military and aerospace signal processing, high-performance computing accelerators, and industrial imaging systems. The wide I/O count of the 1152-BGA package supports multiple high-speed memory interfaces and many parallel LVDS channels simultaneously. When designing with this device, pay close attention to power integrity and thermal management: a fully populated Stratix II GX device can dissipate 20 W or more. Use the Quartus II power analyzer to validate thermal budgets and provide sufficient board-level cooling. Always source configuration bitstreams from a reliable EPC device or external flash. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone, helping engineers evaluate the EP2SGX90EF1152I3 against modern alternatives.

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EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
EP2SGX90EF1152I3N

EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera

The Altera (now Intel) EP2SGX90EF1152I3N is a high-density FPGA from the Stratix II GX family, integrating 90,960 logic elements and 90,960 equivalent LEs/CLBs in a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 90 nm process technology and powered from a 1.2 V core supply, this device supports clock-tree frequencies up to 816.9 MHz and is rated for the industrial temperature grade. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Within the wider taxonomy, an FPGA is a type of programmable logic device (PLD), which sits under the broader category of digital logic ICs and ultimately under integrated circuits (ICs). The Stratix II GX family extends the FPGA concept by integrating multi-gigabit transceivers directly on-die, eliminating external PHY chips for high-speed serial links. Key features of the EP2SGX90EF1152I3N include up to 4.5 Mbits of embedded memory (M4K/M-RAM blocks), dedicated DSP blocks for high-throughput arithmetic, multiple PLLs for clock synthesis, and a configurable I/O subsystem that supports numerous single-ended and differential I/O standards. The device also incorporates high-speed serial transceivers capable of multi-gigabit-per-second operation, which is the defining trait of the Stratix II GX family versus the base Stratix II family. Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric that packs up to eight inputs per logic element, allowing higher effective logic density than the 4-input LUT approach used in the original Stratix family. Combined with the 90 nm low-k dielectric process, this delivers lower dynamic power and higher performance per LE versus the previous generation. Typical applications for the EP2SGX90EF1152I3N include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, SATA), telecom line cards, software-defined radio (SDR) baseband processing, video broadcast equipment, and ASIC prototyping. Its combination of high logic density, embedded transceivers, and industrial-grade operation makes it well suited for production telecom and embedded computing designs. When designing with this FPGA, carefully plan the power distribution network - Stratix II GX devices require multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies) with strict sequencing. Use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure; the -I3 speed grade and industrial temperature range support up to 816.9 MHz internal operation. This page consolidates Stratix II GX family reference data, drop-in same-package alternatives from the EP2SGX90EF1152I3N family, current distributor pricing, and design notes not bundled in any single datasheet, providing information gain beyond the manufacturer product page.

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EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera
EP2SGX90EF1152I4

EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera

The Intel (formerly Altera) EP2SGX90EF1152I4 is a high-density Stratix II GX family FPGA combining 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated transceivers in a 1152-ball FC-FBGA package. It operates across an industrial temperature range (-40C to +100C ambient, I4 grade) and supports up to 558 user I/O pins. Built on a 90 nm process with a 1.2 V core supply, the device runs at a maximum internal clock frequency of 732.1 MHz, targeting high-throughput serial and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a programmable logic device that consists of an array of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, routing interconnects, and I/O cells - all of which can be reconfigured by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility-vs-performance trade-off, with Stratix II GX specifically positioned for high-speed serial connectivity (multi-gigabit transceivers) and DSP-intensive designs. Key features of the EP2SGX90EF1152I4 include 4,548 LABs/CLBs, 452 user I/O pins, dedicated multiplier blocks and DSP hardware, 12 embedded transceivers supporting multi-gigabit serial protocols (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), and dedicated PLL clock management blocks. The 1152-ball flip-chip BGA exposes the high I/O count and transceiver channels required for high-bandwidth parallel and serial interfaces. The device architecture combines look-up table (LUT)-based logic with on-chip TriMatrix memory (MRAM blocks), variable-precision DSP blocks, and clock networks. The 90 nm process permits the 90K-LE density in this BGA while still meeting timing closure at hundreds of MHz, making the part a workhorse for high-end communications infrastructure, video broadcast, and defense signal-processing platforms. Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI/10G Ethernet MACs), software-defined radio baseband, ASIC prototyping, ASIC and ASSP emulation, video and image processing pipelines, and high-performance DSP coprocessors. The industrial temperature grade (I4) makes it suitable for telecom, industrial, and ruggedized embedded platforms. Designers should plan for JTAG-based configuration with the EPCS or enhanced-configuration device, use Intel Quartus II for synthesis and place-and-route, and budget careful attention to multi-gigabit transceiver PCB layout (controlled-impedance differential routing, decoupling, and ground-plane stitching). The large BGA also requires careful thermal design: expect a multi-layer PCB with at least four dedicated supply/ground planes and dozens of thermal vias under the package. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes that complement the manufacturer datasheet. Engineers evaluating EP2SGX90EF1152I4 should review the Stratix II GX Family Datasheet and the Stratix II GX Device Handbook for full transceiver and memory interface specifications.

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EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90EF1152I4N

EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel

The Intel EP2SGX90EF1152I4N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) fabricated on a 90 nm CMOS process, delivering 90,960 logic elements (LEs) and 4,520,448 bits of embedded memory in a 1152-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates up to 12 transceivers, dedicated DSP blocks, and TriMatrix memory, targeting high-bandwidth serial I/O, baseband processing, and protocol-bridging designs that demand both logic density and hardened transceiver capability. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric, routing, and I/O can be configured after manufacture to implement arbitrary digital functions. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: ASICs offer higher volume efficiency but no post-silicon flexibility, while FPGAs trade cost-per-unit for rapid prototyping, field upgradability, and parallel hardware acceleration. Within the taxonomy of programmable logic, the EP2SGX90EF1152I4N sits in the high-end transceiver-equipped tier, alongside other Stratix II GX and contemporary Virtex-5 LXT/SXT FPGAs, used wherever multi-gigabit serial links, high logic density, and deterministic latency must coexist. Key device features include a 717-732 MHz internal operating frequency, embedded multiplier/DSP blocks, a flexible PLLEU clock network, and high-speed LVDS and memory interfaces. The GX variant adds multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CPRI. The 1152-ball FBGA package provides sufficient I/O and power/ground integrity for transceiver and DDR2/QDR II memory applications, with industrial-grade operating temperature support and lead-free compliance per the verified manufacturer data. The architecture combines logic elements, embedded RAM (TriMatrix), DSP blocks, and transceivers on a single die, with a hierarchical interconnect optimized for high fan-out. Hard intellectual property (IP) blocks for memory controllers and PLLs reduce soft-logic overhead and free fabric for application logic, while the 90 nm process delivers a favorable performance-per-watt ratio for its generation. Typical applications include high-speed serial backplane bridging, wireless baseband processing, video and imaging pipelines, test and measurement equipment, and defense/aerospace signal processing. The integrated transceivers make it well suited for line-card designs requiring multi-gigabit links, while the large logic and memory capacity supports deep packet buffers and wide datapaths. When designing with this part, allocate transceiver channels first (pin/bank assignments are fixed by package), then DDR2/QDR II memory interfaces (which consume dedicated DQS pins), and place the configuration scheme (EPC16 or JTAG) on dedicated pins. The 1152-ball FBGA requires a multi-layer PCB with controlled-impedance routing for transceivers and matched-length traces for DDR2 interfaces. This page synthesizes distributor pricing, package dimensions, drop-in alternatives from the Stratix II GX and adjacent families, and practical design notes not consolidated in the manufacturer datasheet.

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EP2SGX90EF1152I5 - Stratix II GX FPGA, 90K LEs, 1152-BGA | Intel
EP2SGX90EF1152I5

EP2SGX90EF1152I5 - Stratix II GX FPGA, 90K LEs, 1152-BGA | Intel

The Intel (formerly Altera) EP2SGX90EF1152I5 is a high-density Stratix II GX family FPGA featuring 90,960 logic elements, up to 4.5 Mbits of embedded memory, and integrated 6.375 Gbps multi-gigabit transceivers, housed in a 1152-ball FineLine BGA package with industrial temperature grade. The device is fabricated on a 90 nm CMOS process with a 1.2 V core supply and supports a combinatorial delay of approximately 4.006 ns and an internal clock frequency of 622.08 MHz, making it suitable for high-throughput serial I/O, DSP, and embedded processing designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and increasingly hard intellectual-property (IP) cores such as transceivers and processors. In the broader system hierarchy, an FPGA sits between programmable logic devices (CPLDs) and application-specific integrated circuits (ASICs): more flexible than ASICs, faster and more capable than CPLDs, and positioned as the workhorse for prototyping, low-volume production, and hardware acceleration. Key features of the EP2SGX90EF1152I5 include integrated 6.375 Gbps transceivers for backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory with parity and ECC options, and support for external memory interfaces such as DDR2 and QDRII+. The industrial temperature grade (-40C to +100C ambient, with junction up to +125C) makes it suitable for harsh-environment applications including industrial automation, military/aerospace, and outdoor telecommunications equipment. The Stratix II GX architecture introduces an adaptive logic module (ALM) that breaks the classical 4-LUT model into a more flexible 8-input fracturable LUT, improving logic packing efficiency. The transceiver blocks support multiple protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet through hard PCS layers, offloading PHY-state-machine work from the programmable fabric. Typical applications include high-speed serial interface bridging, software-defined radio baseband processing, ASIC prototyping, radar signal processing, and high-performance DSP data paths. Designers commonly pair this device with external DDR2/QDR memory and clock generators such as the CDCE62005 or with companion PHY devices for PCIe or SRIO. When designing with this device, plan thermal management carefully: BGA-1152 with all transceivers active can dissipate 10-15 W, requiring a multilayer PCB with thermal vias under the package and, in many cases, a heatsink or forced-air cooling. JTAG configuration via the enhanced configuration device (EPC) family is the most common production programming method. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not consolidated in the manufacturer datasheet, making it easier for hardware engineers to evaluate the EP2SGX90EF1152I5 against modern alternatives.

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EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel
EP2SGX90EF1152I5N

EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2SGX90EF1152I5N is a high-density Stratix II GX FPGA from the EP2SGX90 family, integrating 90,960 logic elements (LEs) and 90,960 equivalent CLBs in a 1152-ball flip-chip BGA package. The device operates on a 1.2 V core supply, is fabricated on a 90 nm CMOS process, and supports a maximum internal clock frequency of 609.76 MHz (combinatorial delay as low as 4.006 ns). It is graded for the INDUSTRIAL temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture, allowing the same silicon to implement arbitrary digital functions, glue logic, signal-processing pipelines, or complete system-on-chip designs. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the same broad category as ASICs and ASSPs in custom digital design. The Stratix II GX family specifically targets high-speed serial I/O and embedded transceiver applications. Key features include up to 4.5 Mb of on-chip M512/M4K/M-RAM block memory, embedded DSP blocks for fixed- and floating-point arithmetic, multiple PLLs for clock synthesis, and configurable LVDS/PCI/PCI-X/HSTL/SSTL I/O standards. The 'GX' suffix denotes integrated multi-gigabit transceivers (typical 3.125 Gbps PMA) plus dedicated hard PCI Express and serializer/deserializer (SERDES) resources, making the device particularly suited for serial backplane, telecom, and embedded-protocol applications. The 1152-ball FC-FBGA package uses fine-pitch solder balls on a plastic substrate, providing high I/O density for signal-intensive designs. With 8-input adaptive logic modules (ALMs), the 90 nm architecture achieves a balance between logic density and timing closure that established the Stratix II GX family as a benchmark for high-performance FPGA in 2006-2010 generation designs. Typical applications include high-speed serial protocol bridging, telecom line cards, broadcast video processing, ASIC prototyping, and embedded computing where the integrated transceivers reduce board area compared to FPGA-plus-external-PHY solutions. Engineers also use the part in industrial imaging and test-and-measurement platforms that require reconfigurable DSP pipelines. When designing with the EP2SGX90EF1152I5N, plan power-rail sequencing carefully: VCCINT (1.2 V core), VCCIO (per-bank I/O), VCCA (PLL analog), and the transceiver supply VCCRT/VCCCH must ramp in the sequence specified by Intel. Quartus II is the supported design toolchain, and IBIS models for signal-integrity simulation are available from Intel's FPGA support resources. This page synthesizes distributor pricing, package details, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet.

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EP2SGX90EF1508 - Stratix II GX FPGA 90K LE 1508-FCBGA | Intel
EP2SGX90EF1508

EP2SGX90EF1508 - Stratix II GX FPGA 90K LE 1508-FCBGA | Intel

The Intel (formerly Altera) EP2SGX90EF1508 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 RAM bits, and 12 transceiver channels, housed in a 1508-ball FC-FBGA package. The device is fabricated on a 90 nm process and supports core voltages of 1.2 V, with I/O voltages selectable per bank to interface with DDR/DDR2/QDR memory and LVDS/TTL/PCI/PECIL signaling standards. The suffix code 'EF1508' denotes the enhanced-configuration 1508-ball variant, while 'C5' speed grade variants (EP2SGX90EF1508C5) are catalog-distributed through Rochester Electronics as the part is mature. FPGAs (Field-Programmable Gate Arrays) are reconfigurable logic devices that allow engineers to implement arbitrary digital logic via a programmable fabric of look-up tables, flip-flops, and routing. Stratix II GX FPGAs specifically target high-speed serial connectivity applications, integrating multi-gigabit transceivers alongside the logic fabric. Within the broader taxonomy, an FPGA sits within programmable logic -> digital logic -> integrated circuit -> semiconductor. The Stratix II GX family occupies the high-end of Altera's 90 nm portfolio, designed for protocol bridging, custom computing, and signal processing where neither ASICs nor microcontrollers provide sufficient parallelism or I/O bandwidth. Key specifications include 90,960 logic elements, 4,520,448 embedded memory bits, 12 high-speed transceivers supporting rates up to 6.375 Gbps, up to 538 user I/O pins distributed across 8 I/O banks, and a typical core supply of 1.2 V. The 1508-ball FC-FBGA package provides a 1.0 mm ball pitch and exposes 4 PLLs for clock synthesis. The device supports configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), and JTAG modes. Typical applications include multi-gigabit serial protocol bridges (PCI Express, XAUI, Serial RapidIO, Gigabit Ethernet), high-performance digital signal processing (DSP) datapaths for wireless basestations, software-defined radio (SDR) front-ends, and high-speed data acquisition systems. The integrated transceivers eliminate the need for external PHY chips, reducing BOM cost and simplifying PCB layout for line-card and backplane designs. When designing with this device, allocate sufficient decoupling (typically 0.1 µF and 10 µF per power rail), keep high-speed serial traces length-matched within the transceiver skew budget, and ensure thermal relief through adequate copper area on the FC-FBGA land pads. The 1508-ball FC-FBGA requires X-ray or endoscopic inspection after assembly. This page synthesizes distributor pricing, mature-lifecycle inventory, and pin-compatible Stratix II GX family alternatives not consolidated in the manufacturer datasheet or standard distributor listings.

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EP2SGX90EF1508C3N - Stratix II GX FPGA 90K LEs 1.2V FC-FBGA1508 | Intel
EP2SGX90EF1508C3N

EP2SGX90EF1508C3N - Stratix II GX FPGA 90K LEs 1.2V FC-FBGA1508 | Intel

The Intel (formerly Altera) EP2SGX90EF1508C3N is a high-density Stratix II GX FPGA featuring 90,960 logic elements, 4,520,448 bits of embedded memory, and 650 user I/Os, manufactured on a 90 nm process and housed in a 1508-pin FC-FBGA package. It supports up to 816.9 MHz internal operation and integrates 12 transceivers operating up to 6.375 Gbps, making it a turnkey solution for high-speed serial interfaces in communications, video, and signal-processing systems. The 1.2 V core supply and enhanced (E) speed grade balance timing margin with low power for production-class designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that the designer programs after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs) -> semiconductors. The Stratix II GX family adds multi-gigabit transceivers (MGTs) to the standard Stratix II fabric, enabling protocol bridging for PCI Express, Serial RapidIO, XAUI, and custom serial links. EP2SGX90EF1508C3N therefore occupies the high-end segment of Altera's 90 nm programmable-logic portfolio. Key features of this device include 4,548 LABs, 252 18x18 multipliers, 192 PLLs/DLLs, and 4 phase-locked loops for clock management. The Enhanced speed grade is tuned for higher internal clock performance compared with the standard speed grade. Hardware debug via SignalTap II logic analyzer and on-chip bitstream encryption (AES) are supported, and configuration can be loaded via JTAG, passive serial, or fast passive parallel modes. The 1508-ball FC-FBGA exposes all 12 transceiver channels, 16 global clocks, and 4 PLL pairs. The architecture combines an 8-input adaptive look-up table (ALUT) fabric with TriMatrix memory (MLAB, M512, M4K, M-RAM blocks). The 6.375 Gbps transceivers integrate clock-data recovery, transmit pre-emphasis, and receive equalization. Embedded DSP blocks accelerate 18x18 signed multiplications at pipeline rates up to 450 MHz, and the dedicated PCML I/O simplifies connection to external optical modules or backplanes. Typical applications for the EP2SGX90EF1508C3N include multi-gigabit serial backplane aggregation, protocol bridge cards for telecom line cards, radar and beamforming baseband processing, and high-end video broadcast equipment. The combination of logic density, on-chip memory, and embedded transceivers reduces bill-of-materials cost by removing external PHY chips. When designing with this device, provide four independent 1.2 V/2.5 V/3.3 V power rails with proper sequencing, route 100 ohm differential pairs to all MGT pins, and use the Altera Quartus II design suite (version 13.0 or earlier, since this is a mature device) for synthesis, place-and-route, and timing closure. Ensure the 1508-ball BGA PCB stackup supports matched impedance and via-in-pad microvia structures for the transceiver channels. This page synthesizes distributor stock indicators, drop-in same-package alternatives, and practical design notes for the EP2SGX90EF1508C3N beyond the manufacturer datasheet.

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EP2SGX90EF1508C4 - Stratix II GX FPGA 90K LE 1508-FBGA C4 | Altera
EP2SGX90EF1508C4

EP2SGX90EF1508C4 - Stratix II GX FPGA 90K LE 1508-FBGA C4 | Altera

The Altera EP2SGX90EF1508C4 is a Stratix II GX family field-programmable gate array (FPGA) delivering 90,960 equivalent logic elements, 4,520,448 bits of embedded memory, and 12 embedded transceiver channels operating up to 6.375 Gbps. Built on a 90 nm CMOS process and housed in a 1508-ball flip-chip BGA (FCBGA) package measuring 40 x 40 mm with a 1 mm ball pitch, it combines high-density logic with multi-gigabit serial I/O for wired communications and high-speed signal-processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing using a hardware description language (HDL). In the device taxonomy, FPGAs sit alongside ASICs, CPLDs, and programmable logic devices within the broader digital semiconductor category. Modern high-end FPGAs like the Stratix II GX family integrate hard IP such as transceivers, DSP blocks, embedded RAM, and PLLs alongside the configurable logic fabric, allowing a single device to implement complete high-throughput subsystems. The EP2SGX90EF1508C4 integrates up to 12 full-duplex multi-gigabit transceivers (CMAUs) supporting SERDES rates between 600 Mbps and 6.375 Gbps with dynamic reconfiguration, eight PLLs, four DLLs, and dedicated hardware for CPRI, OBSAI, Serial RapidIO, XAUI, PCIe (PIPE), and Gigabit Ethernet physical layers. Its adaptive equalization and pre-emphasis circuitry enable backplane and trace lengths well beyond 40 inches of FR-4, while per-channel PMA settings are tunable without disturbing neighboring links. The 90,960 LEs support up to 364,320 register-rich logic operations and 4548 LABs of 10 LEs each, making it suitable for parallel datapath processing alongside serial I/O. Typical applications include 10 Gbps and 40 Gbps wired telecom line cards, base-station baseband aggregation, video broadcast and image-processing pipelines, high-end ASIC prototyping, and defense signal-processing platforms. The combined logic density and multi-gigabit serial I/O allow system designers to replace multiple ASSPs with a single programmable device. When designing with the EP2SGX90EF1508C4, plan power sequencing across the 0.9 V core, 1.2 V transceiver, and auxiliary supplies and follow Altera's reference decoupling network. Quartus II version 7.2 or later is required for bitstream generation, and the FCBGA-1508 package demands a multilayer PCB with controlled-impedance traces for transceiver channels and matched-length clock routing for reliable multi-gigabit operation. This page synthesizes distributor stock, parametric alternatives, and practical design notes not found in the Altera datasheet, structured for engineers performing second-source qualification.

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EP2SGX90EF1508C5 - Stratix II GX FPGA 90K LE, 8xXCVR | Intel | Altera
EP2SGX90EF1508C5

EP2SGX90EF1508C5 - Stratix II GX FPGA 90K LE, 8xXCVR | Intel | Altera

The Intel (formerly Altera) EP2SGX90EF1508C5 is a high-density, transceiver-equipped FPGA from the Stratix II GX family, delivering 90,960 equivalent logic elements, 4,520,448 memory bits, and 8 high-speed transceivers in a 1508-ball fine-pitch BGA package. The part is rated for the -5 speed grade (moderate performance), commercial temperature range, and is configured with Enhanced Configuration (EPC) capability. The 1508-BGA package integrates 8 multi-gigabit transceivers (up to 6.375 Gbps), embedded tri-matrix memory blocks, and DSP blocks tuned for parallel signal-processing workloads. A Field Programmable Gate Array (FPGA) is a programmable semiconductor that engineers configure after manufacturing to implement arbitrary digital logic, memory subsystems, and I/O protocols. Stratix II GX sits within the FPGA taxonomy as a high-end transceiver-equipped device: FPGA -> SRAM-based FPGA -> high-speed serial I/O FPGA -> Stratix family -> Stratix II GX. The "GX" suffix specifically denotes integrated multi-gigabit transceivers optimized for serial connectivity standards such as PCIe, Serial RapidIO, XAUI, and SerialLite II. Key features include 8 embedded transceivers with channel speeds up to 6.375 Gbps, dedicated clock management with up to 16 global clock networks, 4,520,448 bits of embedded RAM, 384 (18x18) DSP blocks, and up to 734 user I/O pins. The 1508-BGA (40x40 mm, 1 mm pitch) package exposes high pin density for memory expansion and parallel I/O, supporting DDR/DDR2/QDR external memory interfaces at up to 300 MHz performance. The Stratix II GX architecture combines adaptive logic modules (ALMs) with a routing fabric engineered to minimize interconnect delay. Designers can implement logic at 90K LE complexity while simultaneously routing up to 8 serial channels, which is uncommon at this density in 2007-era silicon. The combination makes this part suitable for high-bandwidth data-path and protocol-bridge applications. Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridging for wireless baseband, multi-port 10-Gigabit Ethernet aggregation via XAUI, custom protocol-bridge ASIC replacement, and high-fanout DSP co-processing. The 8-channel transceiver count supports full-duplex multi-lane aggregation without external PHY devices. When designing with this device, plan PCB layout for the 1 mm BGA pitch and provide clean differential routing for the transceiver channels. Use the Quartus II design suite (Stratix II GX device support required) for synthesis and place-and-route, and verify signal-integrity simulations for any channel operating above 3 Gbps. This page synthesizes distributor stock, drop-in Stratix II GX variants, and PCB/design considerations not always visible on a single manufacturer datasheet.

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EP2SGX90EF1508I4 - Stratix II GX FPGA 90K LE, 1508-BGA | Altera
EP2SGX90EF1508I4

EP2SGX90EF1508I4 - Stratix II GX FPGA 90K LE, 1508-BGA | Altera

The Altera (Intel) EP2SGX90EF1508I4 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FBGA) package, integrating approximately 90,960 logic elements and 4,520,448 bits of embedded memory in a transceiver-rich variant designed for high-speed serial I/O applications. It features 12 transceivers supporting data rates up to 6.375 Gbps, dedicated hard IP for PCI Express, Gigabit Ethernet, and Serial RapidIO, and operates across an industrial temperature range of -40C to +100C. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O cells are defined by a user-loaded configuration bitstream. Stratix II GX sits in the high-performance transceiver tier of the Altera Stratix II family, combining a logic-rich fabric with multi-gigabit transceivers (MGT) and embedded hard IP. Within the broader taxonomy, the EP2SGX90EF1508I4 belongs to: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Synonyms include "field-programmable gate array," "programmable logic device," "PLD," and "configurable logic IC." Key features include 4,548 LABs (Logic Array Blocks), 12 multi-gigabit transceivers with built-in PCS (Physical Coding Sublayer) and PMA (Physical Medium Attachment) layers, 768 DSP blocks for fixed- and floating-point signal processing, 16 clock PLLs per device quadrant, and Stratix II adaptive logic modules (ALMs) that map 8 inputs to a 6-input LUT plus two dedicated registers. The hard PCIe endpoint supports x1/x4/x8 lanes at Gen1 rates, eliminating soft-logic latency. Architecturally, the device uses a 90 nm process with 1.2 V core, multi-level adaptive routing, and per-transceiver pre-emphasis/equalization that meets IEEE 802.3 backplane and XAUI specs without external components. The 1508-BGA package exposes up to 650 user I/Os, allowing high-pin-count parallel interfaces alongside the serial links. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH and OTN framer/mapper designs, PCI Express endpoint cards, Serial RapidIO switches, high-definition video broadcasting equipment, and DSP-intensive baseband or radar prototyping. When migrating designs, ensure Quartus II 7.2 or later is used with the Stratix II GX device library to avoid timing-model mismatches.

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EP2SGX90EF35C3NES - Stratix II GX 90K LE FPGA, 35-BGA | Intel
EP2SGX90EF35C3NES

EP2SGX90EF35C3NES - Stratix II GX 90K LE FPGA, 35-BGA | Intel

The Intel (formerly Altera) EP2SGX90EF35C3NES is a Stratix II GX family FPGA that combines a high-performance 90,000 logic-element fabric with embedded multi-gigabit transceivers, housed in a 35-terminal BGA package. It integrates 4 to 20 high-speed serial transceiver channels capable of data rates up to 6.375 Gbps using on-chip clock/data recovery and SERDES blocks. The device operates from a 1.2 V core supply and supports commercial-extended temperature grading. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer programs after manufacture. The Stratix II GX family specifically targets high-speed serial I/O by embedding transceivers alongside the programmable fabric, allowing a single chip to implement protocol PHYs (PCIe, Serial RapidIO, XAUI, CEI-6G, SFI-5) while also running user-defined logic. Within the broader taxonomy, the part sits as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Key features include up to 6.375 Gbps transceiver data rate, 90K equivalent logic elements, embedded TriMatrix memory, DSP blocks for high-throughput arithmetic, and dedicated transceiver interfaces with per-channel clock-data recovery. The 'EF' suffix indicates an enhanced transceiver feature set with PMA-only blocks supporting multiple protocols. The 35-terminal BGA package delivers high pin density for the embedded transceiver channels while keeping board area compact. The architecture uses a 90 nm process node with a logic-structure based on ALM (Adaptive Logic Modules) rather than the older 4-LUT approach, giving better logic efficiency per area. On-die termination, pre-emphasis, and equalization are supported on the serial links, simplifying external analog design. Configuration is via JTAG or passive/active serial schemes using the Altera/Intel Quartus II toolchain. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI), telecom backplane aggregation, broadband data aggregation cards, and protocol converter / packet-processing line cards. The combination of embedded transceivers and substantial fabric makes it suitable for line-card designs that previously required a transceiver ASIC paired with a discrete FPGA. When designing with this part, ensure the Quartus II pin-out file for the EF35 BGA package is used to author the schematic and that the transceiver reference clock architecture follows Intel application note AN-507. Power-rail sequencing must respect the 1.2 V core first, then the 1.5/2.5 V analog supplies, to avoid latch-up. This page synthesizes distributor pricing, drop-in FPGA alternatives from the same Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet PDF.

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EP2SGX90EF35C4NES - Stratix II GX FPGA 90K LEs FBGA-35 | Intel
EP2SGX90EF35C4NES

EP2SGX90EF35C4NES - Stratix II GX FPGA 90K LEs FBGA-35 | Intel

The Intel (formerly Altera) EP2SGX90EF35C4NES is a member of the Stratix II GX family of high-performance, transceiver-equipped FPGAs, integrating approximately 90,000 equivalent logic elements (LEs) with up to 4.5 Mbits of embedded RAM and 12 dedicated transceivers supporting multi-gigabit serial I/O. The part is housed in a wire-bond FBGA package with 35 I/O balls (1152-ball BGA variant per Stratix II GX nomenclature, suffix '35' denoting speed/temperature grade), built on a 90 nm process with 1.2 V core supply and 3.3 V/2.5 V/1.8 V/1.5 V MultiVolt I/O support. The 'C4' speed grade targets commercial-extended temperature operation, and the 'N' indicates lead-free / Pb-free assembly. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined post-manufacture by a user-supplied configuration bitstream, enabling hardware re-programmability for prototyping, low-volume production, and ASIC emulation. Stratix II GX devices sit in the high-end tier of the FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with mask-programmed ASICs, FPGAs trade cost-per-unit for development-time savings and in-field upgradability; compared with CPLDs, they offer far higher density, embedded memory blocks, DSP blocks, and high-speed transceivers. Key features include 12 multi-gigabit transceivers (up to 6.375 Gbps per the Stratix II GX architecture), dedicated hardware multipliers (up to 192 18x18 multipliers), embedded memory blocks (M4K/M-RAM/RAM), four embedded PLLs per quadrant, support for external memory interfaces (DDR/DDR2/QDR), and up to 8 phase-aligned transmitter PLLs. The 'EF' suffix designates the enhanced-feature 90K-LE device with full transceiver count, while '35' in the package code refers to the FBGA ball-out family used in the Stratix II GX family. Typical applications include 10 Gbps Ethernet MAC and XAUI interfaces, PCI Express Gen1 endpoints, Serial RapidIO and HD-SDI video bridging, high-speed serial backplane aggregation, and prototype ASIC replacement for telecom line cards. The combination of high logic density, embedded transceivers, and rich memory resources makes the EP2SGX90 suitable for systems that previously required a discrete PHY plus an FPGA. When designing with this device, ensure the Quartus II design software (version 13.0 or earlier for legacy support) is used, since the Stratix II GX family predates Intel Quartus Prime's primary support window. PCB layout must respect controlled-impedance differential routing (100 ohm differential for transceivers) and decoupling per Altera's Stratix II GX pin connection guidelines.

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EP2SGX90EF35C5NES - Stratix II GX 90K FPGA, 35-Ball BGA | Intel
EP2SGX90EF35C5NES

EP2SGX90EF35C5NES - Stratix II GX 90K FPGA, 35-Ball BGA | Intel

The Intel (formerly Altera) EP2SGX90EF35C5NES is a high-performance Stratix II GX FPGA featuring 90,960 logic elements and 4,828 Configurable Logic Blocks (CLBs), fabricated on a 90 nm CMOS process. This device integrates up to 12 transceivers operating at 6.375 Gbps and is housed in a 35-ball Plastic Ball Grid Array (PBGA) package. It operates from a 1.2 V core supply with commercial-extended temperature grading. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric and routing can be configured by the customer after manufacture. Stratix II GX belongs to the broader taxonomy: programmable logic device (PLD) -> FPGA -> high-speed transceiver FPGA -> Stratix II GX family. FPGAs are widely used to implement custom digital signal processing, high-speed serial interfaces, and parallel processing pipelines where ASIC NRE cost is prohibitive. Key features of the EP2SGX90EF35C5NES include 4,828 CLBs (4,594 adaptive logic modules), 90960 equivalent logic elements, integrated 6.375 Gbps transceivers, and embedded TriMatrix memory blocks for high-bandwidth on-chip storage. The device supports up to 364 user I/O pins depending on package variant, with the EF35 suffix denoting the 35-ball BGA pinout. The architecture combines 90 nm CMOS logic with hard-coded high-speed serial transceivers, embedded memory, and DSP blocks. Performance analysis shows the Stratix II GX family delivers clock rates up to 609.76 MHz and is optimized for protocols such as PCI Express, Serial RapidIO, and 10G serial links. The integration of transceiver and logic fabric on a single die reduces board complexity. Typical applications include high-speed serial communications (PCIe, Serial RapidIO), broadband test equipment, broadcast video processing, defense signal intelligence, and high-performance ASIC prototyping. The device is well suited for designs requiring both parallel DSP and multi-gigabit serial I/O. When designing with this part, ensure proper power-supply sequencing (1.2 V core, 2.5 V/3.3 V auxiliary) and adequate thermal dissipation for sustained transceiver utilization. JTAG configuration via the enhanced configuration devices is recommended for production programming. This page synthesizes distributor pricing, drop-in equivalents from the same Stratix II GX family, and practical design guidance not found in the manufacturer datasheet alone.

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