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EP2SGX90EF35C5NGA - Stratix II GX FPGA 90K LE, 35mm BGA
EP2SGX90EF35C5NGA

EP2SGX90EF35C5NGA - Stratix II GX FPGA 90K LE, 35mm BGA

The Intel (formerly Altera) EP2SGX90EF35C5NGA is a high-density Stratix II GX FPGA from the Enhanced Configuration (EPC) device family, fabricated on a 90 nm process and offered in a 1152-pin FineLine BGA package. It integrates approximately 90,960 equivalent logic elements, 4.5 Mbits of embedded RAM, and 12 transceiver channels capable of multi-gigabit serial I/O up to 6.375 Gbps, making it suitable for high-speed serial interface and DSP-intensive designs. The 'C5' speed grade and 'N' suffix indicate a commercial-temperature device with lead-free / lead-bearing construction options; the 'GA' tail is a JTAG-related designator used for Altera/Intel configuration ordering. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, multipliers, and memory blocks. The 'Stratix' family sits in Intel's high-end FPGA portfolio, optimized for performance, density, and high-speed serial I/O. Within the taxonomy: FPGA -> programmable logic device -> ASIC-class reconfigurable logic -> semiconductor. FPGAs are used when time-to-market, hardware reconfigurability, or parallel processing throughput outweigh the per-unit cost advantages of a fixed-function ASIC. Key features of the EP2SGX90EF35C5NGA include up to 12 full-duplex transceiver channels supporting protocols such as PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G, 8 PLLs with on-chip termination calibration, and dedicated DSP blocks delivering up to 192 GMACS performance. The 1.2 V core supply with on-chip voltage regulation simplifies power-rail design, while the 1152-pin FineLine BGA (35 mm body) provides a thermally enhanced land pattern with a large exposed die paddle. Architecturally, the device combines a logic fabric built from adaptive logic modules (ALMs) with hard PCI Express, XAUI, and external memory interface IP, allowing engineers to drop in complete protocol controllers without consuming FPGA fabric. The 90 nm process and 1.2 V core offer a balance of static power and performance for telecom backplane and high-end test equipment applications. Typical applications include high-end test and measurement instrumentation, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and DSP co-processing cards. The integrated 6.375 Gbps transceivers make the device especially relevant for legacy 10 Gbps Ethernet and RapidIO line-card designs. When designing with this FPGA, ensure the PCB land pattern matches the 35 mm FineLine BGA recommended by Intel. Thermal management must account for the 1.2 V core current draw at high toggle rates; a minimum 8-layer stack-up with continuous ground and power planes is recommended. The EPC (Enhanced Configuration Device) classification in the part number indicates this device works with the legacy Altera EPC configuration memory family, so the companion configuration PROM must be ordered from the same product tree. This page synthesizes distributor inventory, Stratix II GX family context, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers evaluate drop-in variants and long-term supply risk.

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EP2SGX90F1152C3N - 90nm Stratix II GX FPGA, 1152-BGA | Altera
EP2SGX90F1152C3N

EP2SGX90F1152C3N - 90nm Stratix II GX FPGA, 1152-BGA | Altera

The Altera EP2SGX90F1152C3N is a high-density, 90nm Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 equivalent logic elements, 4,520,448 bits of embedded memory, and up to 12 multi-gigabit transceivers, housed in a 1152-ball FineLine BGA package. Operating at the C3 speed grade with industrial-temperature-grade silicon, the device targets high-speed serial I/O and digital signal processing (DSP) workloads in communications, broadcast, and defense end systems. The 1152-BGA package provides the largest pin-count option in the Stratix II GX family, enabling maximum user I/O and transceiver bandwidth. What is a Stratix II GX FPGA? The Stratix II GX family is Altera's mid-2000s generation of high-performance, signal-integrity-focused FPGAs built on a 90nm CMOS process with a redesigned adaptive logic module (ALM) architecture. Each ALM contains an 8-input fracturable lookup table (LUT), dedicated registers, and carry-chain logic. The 'GX' suffix denotes integrated multi-gigabit transceivers (MGTs) supporting serializer/deserializer (SerDes) protocols up to 6.375 Gbps. Within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX series bridges the gap between the original Stratix GX transceiver devices and later Stratix IV GX designs. Key features include 4,548 LABs (logic array blocks), 558 user I/O pins, embedded multiplier blocks for DSP, and dedicated high-speed transceivers with embedded 8B/10B encoding. The 1152-BGA package exposes 558 user I/Os while reserving the remaining balls for power, ground, configuration, and high-speed serial links. Tri-matrix memory blocks provide true dual-port RAM, simple dual-port RAM, and FIFO buffers. Architecturally, the EP2SGX90F1152C3N pairs an ALM-based logic fabric with a structured ASIC-like transceiver and DSP block array, allowing engineers to balance logic, memory, and high-speed serial bandwidth within a single device. The C3 speed grade reflects the slowest of three commercial speed tiers, prioritizing lower dynamic power over maximum Fmax. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer backplanes, HD-SDI video routing, radar and electronic-warfare DSP pipelines, and high-speed serial protocol bridging. The device is also commonly found in storage-area-network (SAN) controllers and proprietary chip-to-chip backplanes. Design consideration: the 1152-BGA requires a multi-layer PCB (typically 8 to 12 layers) with controlled-impedance routing for the MGT channels and matched-length differential pairs. Thermal management relies on the package's exposed-die land grid; a heatsink with thermal interface material is typically mandatory at industrial temperatures and full transceiver utilization. This page synthesizes distributor pricing, FPGA-family pin-compatible drop-in alternatives, and BGA layout guidance beyond what is found in the manufacturer's datasheet.

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EP2SGX90F1508 Stratix II GX FPGA | Altera | Embedded Processing
EP2SGX90F1508

EP2SGX90F1508 Stratix II GX FPGA | Altera | Embedded Processing

Altera EP2SGX90F1508 is a Stratix II GX field-programmable gate array (FPGA) identified as a 1508-BBGA, FCBGA device with 650 I/O and 90,960 logic elements. Verified distributor listings also identify the family with 4,548 logic array blocks and 4,520,448 bits of embedded memory. The exact ordering suffix EP2SGX90F1508 is presented in the source data without a separately verified speed, temperature, or package dimension specification. A field-programmable gate array is an integrated circuit containing configurable logic, routing resources, memory blocks, and I/O elements. Designers program the device after manufacturing to implement digital functions such as protocol bridging, signal processing, control, and interface aggregation. FPGA architecture belongs to the broader programmable-logic hierarchy, between fixed-function application-specific integrated circuits and software-driven processors, making it useful when parallel hardware performance, reconfigurability, and rapid implementation are important. The EP2SGX90F1508 provides 90,960 logic elements, 650 I/O, and 4,520,448 memory bits according to the verified Altera family and distributor listings. Its Stratix II GX classification indicates the GX-oriented FPGA family, while the FCBGA package provides a high-density surface-mount interconnect arrangement. The 1,508-ball package is relevant to PCB escape routing, signal-integrity analysis, power integrity, and thermal design. The architecture supports programmable digital logic and embedded memory resources, but verified source data does not provide operating voltage, transceiver count, transceiver data rate, clock count, user I/O voltage range, or thermal resistance. Those values should not be inferred from the family name or package code. Engineers should use the manufacturer datasheet, device-specific configuration files, power estimator, and pin assignment before schematic or layout release. Typical applications include communications equipment, industrial control, test and measurement, and custom data-processing systems. Its 90,960 logic elements suit parallel datapaths and interface consolidation, while 650 I/O supports connections to multiple external buses. Embedded memory can support buffering, state storage, and local data handling. The package and available logic resources make the device appropriate for high-density, board-level designs where the complete signal and power implementation is planned before fabrication. A key design consideration is that 1,508 balls require careful fan-out, controlled impedance, decoupling strategy, and a verified power distribution network. Confirm device configuration support, programming hardware, licensing, and the exact package footprint before using this part in a new design. The part number may represent a base or less-specific ordering code; purchase and lifecycle decisions should be confirmed against the exact assembled MPN and the latest manufacturer documentation. This data page separates exact values supported by distributor and manufacturer references from parameters that require datasheet confirmation. It also records that no verified cross-brand, same-package, drop-in replacement was identified, preventing an unverified replacement from being presented as pin-to-pin compatible.

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EP2SGX90F1508C3 - Stratix II GX FPGA 90k LEs, 4.5Mb, FC-FBGA-1508 | Intel
EP2SGX90F1508C3

EP2SGX90F1508C3 - Stratix II GX FPGA 90k LEs, 4.5Mb, FC-FBGA-1508 | Intel

The Intel (formerly Altera) EP2SGX90F1508C3 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) with 90,960 logic elements (LEs), 4,544 LABs/CLBs, 4,520,448 bits of embedded RAM, and integrated 6.375 Gbps transceivers, housed in a 1508-ball FC-FBGA package. It is fabricated on a 90 nm process and operates from a 1.2 V core supply, with a maximum internal clock frequency of approximately 816 MHz per the device datasheet. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory subsystems, and high-speed serial interfaces on a single die. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs, and are widely used as glue logic, co-processors, ASIC prototyping platforms, and high-bandwidth DSP engines. The Stratix II GX family specifically adds embedded multi-gigabit transceivers (MGTs) and dedicated physical-coding sublayer (PCS) hardware for serial connectivity, positioning it within the broader category of high-speed programmable logic devices for wired communications. Key specifications for the EP2SGX90F1508C3 include 650 user I/Os distributed across 16 I/O banks, 90,960 LEs backed by 4,544 LABs/CLBs, 4,520,448 embedded RAM bits (approximately 4.5 Mbit), and 252 embedded multipliers (18x18). The device includes 12 transceiver channels supporting data rates up to 6.375 Gbps, suitable for PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G links. Total RAM is approximately 4.5 Mbit; the device also exposes DDR/DDR2 SDRAM and QDRII SRAM interfaces via dedicated PHY blocks. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and shared register resources - giving roughly twice the logic density of the original Stratix family. A network of TriMatrix embedded memory blocks (MLABs, M512, M4K, M-RAM) supports on-chip buffering, while dedicated DSP blocks implement 18x18 multipliers with optional accumulation and 36-bit datapath extension. Twelve 6.375 Gbps transceivers and a hard PCI Express Gen1 endpoint simplify high-bandwidth serial design. Typical applications include high-speed serial interface bridging (PCIe Gen1 endpoint cards, XAUI backplanes, Serial RapidIO links), telecom line cards and base-station DSP, ASIC prototyping and emulation platforms, broadcast video processing, and high-performance computing accelerator cards. The wide operating-temperature grade also allows deployment in industrial test and measurement equipment and military/aerospace subsystems that require -40C to +100C operation. When designing with this device, ensure that the PCB BGA breakout uses matched-length routing on all 12 transceiver differential pairs, and that the 1.2 V core rail supplies at least 1.5 W per 100k LEs under typical utilization. Use the Quartus II design software (version 9.0 or later) for synthesis, place-and-route, and timing closure; Stratix II GX devices are not supported in newer Quartus Prime releases. Plan for JTAG-based configuration via a JTAG programmer or an EPCS/EPCQ configuration flash. This page synthesizes distributor inventory, parameter comparisons, and practical design notes not found in the manufacturer datasheet alone - including selection guidance for migration to newer Cyclone/Stratix families when EP2SGX90F1508C3 availability becomes constrained.

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EP2SGX90F1508C5N - 90K LE Stratix II GX FPGA, 1508-FBGA | Intel / Altera
EP2SGX90F1508C5N

EP2SGX90F1508C5N - 90K LE Stratix II GX FPGA, 1508-FBGA | Intel / Altera

The Intel (formerly Altera) EP2SGX90F1508C5N is a high-density Stratix II GX Field-Programmable Gate Array delivering 90,960 equivalent logic elements (LEs) and 4,520,448 RAM bits in a 1508-ball FineLine BGA (FBGA) package. The device integrates up to 20 full-duplex multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it a mainstream Altera solution for serial connectivity and high-bandwidth DSP backplanes. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, memory blocks, DSP blocks, and I/O are defined at power-up by a configuration bitstream. Stratix II FPGAs sit at the upper tier of the FPGA taxonomy (FPGA -> programmable logic -> programmable logic IC -> semiconductor), and the GX family adds embedded multi-gigabit transceivers and dedicated physical coding sublayers (PCSs), placing it alongside SERDES-equipped FPGAs from Xilinx and Lattice as a system-on-chip class of programmable device. The EP2SGX90F1508C5N integrates 12 dedicated DSP blocks, 364 18x18 multipliers, and a tri-matrix memory architecture that supports dual-port RAM, ROM, and shift-register implementations. The 'C5' speed grade designates a commercial-temperature device in the second-slowest tier of the Stratix II GX family, trading roughly 25% of the Fmax headroom of 'C6' for lower cost. Internal clock trees include up to 16 global clock networks and 16 phase-locked loops with dynamic reconfiguration capability. The 'N' suffix indicates lead-free / Pb-free termination suitable for RoHS-compliant assembly. The 1508-ball FBGA (40 x 40 mm, 1.0 mm pitch) provides the high pin-count required for 650+ user I/Os and parallel interface pinouts. Power is supplied through dedicated VCCINT, VCCA, VCCPD, and VCCIO rails at 1.2 V core and 1.5 V/1.8 V/2.5 V/3.3 V I/O voltages. Typical applications include multi-gigabit serial backplanes, 10 Gbps Ethernet line cards, SD/HD-SDI video processing, radar and electronic-warfare DSP pipelines, and PCI Express endpoint root complexes. Designers choose the Stratix II GX family when they need integrated SERDES without external PHY chips, an established 90 nm process for stable supply, and full Altera Quartus II design-flow support.

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EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3

EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel

The Intel (formerly Altera) EP2SGX90FE1152C3 is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) in the 1152-ball FineLine BGA package, integrating 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and up to 12 transceiver channels operating up to 6.375 Gbps. Built on a 90 nm CMOS process with a 1.2 V core supply, the device combines programmable logic fabric, dedicated DSP blocks, TriMatrix on-chip memory, and high-speed serial transceivers in a single monolithic die for wireline communication, video processing, and high-performance computing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, with hardened I/O, memory, and increasingly serial transceiver and DSP resources. Within the broader taxonomy, the EP2SGX90FE1152C3 is an FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Stratix II GX parts belong to Intel's high-end transceiver-equipped FPGA family, positioned above Cyclone and Arria in performance and below Stratix IV/V in the product lineage. Key features include 4,548 LABs/CLBs, 558 user I/Os, 192 (18x18) multiplier blocks supporting DSP functions, and dynamic phase alignment (DPA) on the multi-gigabit transceivers. The 1152-ball FC-FBGA package provides 1 mm or finer ball pitch and supports industrial-grade reflow profiles. Configuration is supported via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), fast passive parallel (FPP), and JTAG modes through the dedicated configuration pins. Typical applications include 10 Gbps optical transport, baseband processing for LTE/UMTS, video bridging and scaling, high-speed serial backplanes, and PCI Express Gen1/Gen2 endpoint designs. The combination of high logic density, abundant block RAM, and 6.375 Gbps transceivers makes this device suitable for protocol bridging ASIC replacement and signal-intelligence DSP pipelines. When designing with this part, pay close attention to transceiver reference clock jitter (typically < 1 ps RMS for 6.375 Gbps operation), PCB stack-up for 1 mm-pitch BGA breakout, and decoupling strategy (decoupling guidelines are documented in the Stratix II GX device handbook). Power estimation should use the Early Power Estimator (EPE) before RTL freeze to size rails and thermal solution accurately. Ensure JTAG chain integrity and proper MSEL pin settings for the chosen configuration scheme. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives, comparison data, and practical design notes for the EP2SGX90FE1152C3 in a single reference. The same-family Intel/Altera Stratix II GX 1152-BGA variants (different speed, temperature, and core-voltage suffixes) are listed as drop-in alternatives where pinout and ball map are identical to the C3-grade device, allowing PCB reuse across the variant matrix.

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EP2SGX90FF1152 - 90K LE Stratix II GX FPGA, 1152-BGA | Altera
EP2SGX90FF1152

EP2SGX90FF1152 - 90K LE Stratix II GX FPGA, 1152-BGA | Altera

The Altera (Intel) EP2SGX90FF1152 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded memory, and 558 user I/Os with up to 20 multi-gigabit transceivers in a 1152-ball flip-chip BGA (FC-FBGA) package. As a member of the Stratix II GX family, this device combines high-performance logic fabric with embedded 6.375 Gbps transceivers, making it suited for high-speed serial I/O and DSP-intensive applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Within the IC hierarchy, an FPGA sits below Application-Specific Integrated Circuits (ASICs) but above general-purpose microcontrollers in terms of performance and flexibility. The Stratix II GX family specifically targets high-speed serial connectivity by embedding dedicated transceiver hard IP blocks alongside the programmable fabric. Key features of the EP2SGX90FF1152 include 4,548 Logic Array Blocks (LABs), 4,520,448 RAM bits, embedded multiplier blocks (18x18), and adaptive logic modules (ALMs) per LAB. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL/SSTL for memory interfacing. Transceivers operate up to 6.375 Gbps, supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without external PHY devices. Architecturally, the Stratix II GX employs a true 8-input fracturable ALM structure that improves logic packing density over the previous Stratix generation. Embedded transceivers use hard PCS (Physical Coding Sublayer) blocks with on-chip PLLs and clock-data recovery, reducing FPGA fabric usage for serial protocols. The 1.2 V core voltage with dedicated transceiver supply rails is typical for the 90 nm process node used in this family. Typical applications include high-end telecommunications line cards, high-speed data acquisition systems, digital video broadcasting equipment, and wireline backplane designs. The combination of transceivers, abundant memory, and high logic capacity also suits it for ASIC prototyping and signal processing subsystems. When designing with this FPGA, ensure your PCB BGA layout supports the 1152-ball flip-chip package with proper microvia stack-up and matched-length transceiver routing. Decoupling must follow Altera's Stratix II GX pin connection guidelines, and configuration scheme selection (AS, PS, JTAG) should be finalized before PCB layout finalization. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design considerations beyond the datasheet to help engineers select and source this mature FPGA for long-lifecycle designs.

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EP2SGX90FF1152C3 - Stratix II GX FPGA 90K LE | Intel | Altera
EP2SGX90FF1152C3

EP2SGX90FF1152C3 - Stratix II GX FPGA 90K LE | Intel | Altera

The Altera EP2SGX90FF1152C3 is a high-density Stratix II GX FPGA built on a 90-nm process, integrating 90960 logic elements and 4,520,448 RAM bits in a 1152-ball fine-pitch BGA (FF1152) package. It combines a 4.5 Mb embedded memory, 252 18x18 multipliers, and 4 enhanced PLLs with 16 global clock networks. The 'C3' speed grade and 'F' package prefix indicate a 1152-pin flip-chip BGA suitable for high-I/O-count designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, routing, and I/O can be reconfigured after manufacturing. FPGAs sit hierarchically between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest performance) in the digital IC taxonomy. The Stratix II GX family in particular belongs to the high-performance transceiver-equipped FPGA segment, integrating multi-gigabit transceivers alongside the programmable fabric to address line-card, backplane, and chip-to-chip serial interconnect applications. Key features of the EP2SGX90FF1152C3 include 4.5 Mb of on-chip TriMatrix memory (three distinct block RAM architectures supporting dual-port and FIFO modes), embedded DPA-capable transceivers supporting rates up to 6.375 Gbps, 4 enhanced PLLs plus 8 fast PLLs, and 558 maximum user I/O pins. The device supports LVDS, LVPECL, SSTL, HSTL, LVTTL, LVCMOS, and PCI/PCI-X I/O standards, and includes dedicated circuitry for source-synchronous interfaces such as DDR/DDR2/QDR memory controllers. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - an 8-input fracturable LUT that can implement any 6-input LUT function plus extra logic, allowing finer-grained logic packing than earlier Stratix families. Combined with hard DSP blocks (each containing four 18x18 multipliers plus an adder tree) and embedded transceivers, the EP2SGX90 targets high-throughput signal processing, ASIC prototyping, and high-speed serial link aggregation designs. Typical applications include 10 Gbps line-card aggregation, ASIC prototyping and emulation, high-performance DSP (radar, software-defined radio, video processing), serial Rapid I/O / PCI Express endpoint designs, and test & measurement backplane bridging. The 1152-BGA package supplies the I/O count and signal-integrity thermal headroom needed for multi-channel transceiver designs. Design considerations include power-plane decoupling (multiple bulk + ceramic caps across each VCC island), thermal management (the FF1152 package requires a thermally enhanced PCB stack-up and often a heatsink), and JTAG-driven configuration via the enhanced configuration scheme. Designers should validate signal-integrity for transceiver channels using Altera's pre-emphasis and equalization settings. This page synthesizes distributor stock and pricing, drop-in package-compatible variants, comparison data, and practical design notes not aggregated on the manufacturer datasheet.

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EP2SGX90FF1508 - 90,960 Cells FPGA | Altera | High-Speed Systems
EP2SGX90FF1508

EP2SGX90FF1508 - 90,960 Cells FPGA | Altera | High-Speed Systems

Altera EP2SGX90FF1508 is a high-density Stratix II GX field-programmable gate array with 90,960 logic elements, 650 user I/O, and 4,520,448 RAM bits in a 1508-ball FCBGA package. The supplied source data identifies a 1.2 V supply and a listed Arrow frequency of 816.9 MHz, while Ampheo lists a related speed-grade listing at 717 MHz. The exact configuration suffix and the governing ordering-code table must therefore be checked before treating either number as a guaranteed operating limit. EP2SGX90FF1508 is intended for complex, high-speed digital systems requiring substantial programmable logic, embedded memory, and dense I/O. A field-programmable gate array is a semiconductor device whose logic functions, interconnects, and I/O behavior can be programmed after manufacturing. Within the hierarchy, EP2SGX90FF1508 is a FPGA, then a programmable logic device, then an integrated circuit, and ultimately a configurable digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA supports design changes without a new mask set. Its configurable architecture is useful when interface standards, protocol processing, timing requirements, or product variants evolve. The principal resources are 90,960 logic elements and 4,520,448 RAM bits. DigiKey describes 650 user I/O for the EP2SGX90FF1508C3N ordering variant, and Mouser describes 4,548 LABs. These resources allow parallel datapaths, memory-intensive packet processing, and multiple interface controllers to coexist. The 1508-ball FCBGA package supports a large pin count on a compact BGA footprint, but demands controlled impedance, high-quality multilayer routing, and careful power delivery. The supplied Arrow listing states 1.2 V, 816.9 MHz, and 90,960 cells for the EP2SGX90FF1508C3N. A related Ampheo listing gives 717 MHz for EP2SGX90FF1508C4N, showing why speed grade and ordering code matter. The target base MPN does not contain a visible speed-grade suffix in the provided text, so design decisions must use the exact ordered part and its manufacturer handbook. The device belongs to a high-speed family suited to demanding logic and memory configurations rather than low-cost control-only implementations. Typical applications include high-throughput communications equipment, network packet processing, and test or imaging systems with parallel I/O. For communications systems, the programmable fabric can implement protocol-specific datapaths while 650 listed I/O support numerous external connections. For test equipment, 90,960 logic elements can implement real-time processing, capture control, and high-speed interfaces. These examples depend on final pin assignments, transceiver capability, power integrity, and timing closure in the exact configuration. Designers should first resolve the complete ordering code and download the applicable Stratix II GX device documentation. Validate the intended 1.2 V rail, speed-grade timing, supported I/O standards, configuration scheme, clock resources, junction temperature, and exact 1508-ball pinout. BGA assembly requires appropriate via-in-pad or via construction, escape routing, solder-paste geometry, and package warpage controls. Use the exact ordering-code table rather than assigning a frequency solely from a related speed grade. This product page combines verified distributor facts, explicit uncertainty markers, application context, package constraints, and sourcing information. It distinguishes exact base-MPN facts from suffix-specific listings and does not infer a guaranteed frequency where the verified data conflicts. Engineers should use the page to frame procurement and architecture decisions, then confirm implementation against the official Intel or Altera documentation and the exact purchased MPN.

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EP2SGX90FF150834 - Stratix II GX FPGA, 90K LE, 12x GXB | Altera
EP2SGX90FF150834

EP2SGX90FF150834 - Stratix II GX FPGA, 90K LE, 12x GXB | Altera

The Altera EP2SGX90FF150834 is a high-density Stratix II GX FPGA from the mature Altera (now Intel) Stratix II GX family, featuring approximately 90,000 equivalent logic elements, 4.5 Mbits of embedded memory, and 12 full-duplex multi-gigabit transceiver (GXB) channels. Housed in a 1508-ball FineLine BGA (FF) package, the device is built on a 90 nm process with 1.2 V core operation and integrates dedicated hardware multipliers, structured ASIC blocks, and a high-performance adaptive logic module (ALM) fabric. The 12 GXB transceivers support data rates up to 6.375 Gbps per channel, enabling protocols such as PCI Express Gen1, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. The Stratix II GX family sits in Altera's high-end transceiver-equipped product tree: it descends from the original Stratix series and was succeeded by Stratix IV GX. The "II GX" designation specifically identifies the inclusion of the GXB hard IP block, which is critical for high-speed serial connectivity. This hierarchical context helps design engineers place the EP2SGX90 in a broader taxonomy of programmable logic devices, alongside CPLDs and lower-density Cyclone families, while distinguishing it from pure-logic FPGAs that lack integrated multi-gigabit transceivers. Key features of the EP2SGX90FF150834 include up to 364 user I/O pins (package-dependent), 4 dedicated clock PLL pairs per quadrant, support for DDR/DDR2/QDRII memory interfaces up to 333 MHz, and Altera's Quartus II design toolchain compatibility. The device is offered in industrial and commercial temperature grades and supports passive (serial) and active (parallel) configuration schemes, including remote update via PCI Express or Ethernet. The FF1508 package uses a 1.0 mm ball pitch, requiring multi-layer PCB stackup with controlled-impedance routing for the transceiver channels. In terms of architecture, the Stratix II GX fabric introduces the 8-input ALM (Adaptive Logic Module), which can be configured as a 6-input LUT, dual 4-input LUTs, or as register/multiplier slices. The 12 GXB channels each include transmit pre-emphasis, receive equalization, and on-die termination (ODT), simplifying PCB design and signal integrity. Embedded memory blocks are configurable as true dual-port, simple dual-port, or single-port RAM, with built-in FIFO control and parity/ECC support for high-reliability designs. Typical applications include high-speed serial protocol bridging (e.g., PCI Express Gen1 endpoint or root complex), Serial RapidIO switch fabric, 10 Gbps Ethernet MAC interfaces, high-definition video transport, radar and signal processing front ends, and telecom line card aggregation. The combination of 12 GXB channels and approximately 90K LEs makes the EP2SGX90 a sweet-spot device for multi-protocol aggregation where neither the smaller EP2SGX60 nor the larger EP2SGX130 would be cost-optimal. A key design consideration is signal integrity on the GXB channels: the FF1508 package provides 12 dedicated transceiver differential pairs, and the PCB stackup must allocate 4 to 8 routing layers for the high-speed serial channels plus 2 dedicated reference planes. Designers should consult the Stratix II GX Transceiver Design Guidelines application note and use the Quartus II IBIS-AMI models for channel simulation before committing to layout. Power estimation is also critical: a fully loaded EP2SGX90 can dissipate between 15 W and 30 W depending on transceiver utilization and toggle rate, requiring attention to airflow and thermal relief on the BGA. This page consolidates distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes that extend beyond the manufacturer datasheet to support sourcing, replacement, and PCB bring-up decisions.

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EP2SGX90FF150834N - Stratix II GX FPGA, 1508-BGA | Intel / Altera
EP2SGX90FF150834N

EP2SGX90FF150834N - Stratix II GX FPGA, 1508-BGA | Intel / Altera

The Intel / Altera (formerly Altera Corporation) EP2SGX90FF150834N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with approximately 90,960 logic elements and 4,520,448 bits of embedded memory, packaged in a 1508-ball FineLine BGA (FCBGA) and rated for the commercial speed grade 8 with an extended temperature screening option. The part carries the legacy Altera ordering code 'FF1508' for the 1508-pin BGA package and the '34N' suffix indicates a speed/temperature grade with Pb-free (lead-free) lead finish. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceiver slices that the designer can reconfigure after manufacture. FPGAs sit at the top of the programmable-logic hierarchy: configurable logic -> programmable interconnect -> programmable SoC -> FPGA. Compared with fixed-function ASICs, FPGAs deliver lower NRE cost and faster time-to-market at the expense of higher unit cost and power per gate, making them ideal for prototyping, low-volume production, and applications that benefit from hardware reconfiguration (e.g., evolving communication standards). Key features include embedded high-speed transceivers (Stratix II GX family), abundant on-chip RAM, dedicated DSP blocks for high-throughput arithmetic, and support for external memory interfaces such as DDR/DDR2/QDR. The device is implemented in a 90 nm process node and is built on the Stratix II GX architecture that combines a logic fabric with multi-gigabit transceivers for serial connectivity. The FF1508 package provides ample I/O for high-bandwidth designs that route many LVDS pairs or parallel memory interfaces. Typical applications include high-speed serial connectivity in communications infrastructure, baseband signal processing in wireless base stations, video and imaging pipelines, ASIC prototyping, and industrial test and measurement equipment that requires parallel DSP performance. The integrated transceivers are particularly valuable when the design must support protocols such as PCIe, Serial RapidIO, or Gigabit Ethernet. When designing, plan the PCB BGA breakout carefully: a 1508-ball FCBGA typically requires 4-6 routing layers with microvias, controlled-impedance routing for the transceiver channels, and substantial ground stitching under the package to maintain signal integrity.

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EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3

EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel

The Intel (formerly Altera) EP2SGX90FF1508C3 is a high-density Stratix II GX FPGA built on a 90nm process, delivering 90,960 logic elements and 4,520,448 bits of embedded memory in a 1508-ball FC-FBGA package. The device integrates up to 4 transceiver channels capable of multi-gigabit serial I/O and is qualified for commercial temperature operation with a -3 speed grade targeting higher internal performance. Core logic operates at 1.2V with separate VCCIO banks supporting multiple I/O standards, while dedicated PLL and DLL resources simplify high-speed clock synthesis and data recovery across the design. A Stratix II GX FPGA is a field-programmable gate array that combines a programmable logic fabric, embedded memory blocks, DSP blocks, and high-speed serial transceivers on a single die. It belongs to the broader semiconductor category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of reconfigurable digital ICs used for glue logic, prototyping, ASIC replacement, and high-bandwidth signal processing. The Stratix II GX family specifically added embedded transceivers, making it the early-generation platform for serial connectivity in communications, broadcast video, and storage systems. Key features of the EP2SGX90FF1508C3 include 4,548 LABs, 650 maximum user I/O pins, embedded DSP blocks for high-throughput arithmetic, and high-speed transceivers supporting common multi-gigabit protocols. The 1508-ball FC-FBGA package (40 x 40 mm, 1.0 mm pitch per the verified supplier data) provides the large ball count and signal escape routing needed for both parallel user I/O and serial gigabit links. Stratix II GX devices use SRAM-based configuration, allowing in-system reprogrammability and remote updates via the standard JTAG or passive/active serial configuration paths. The architecture combines adaptive logic modules (ALMs) with on-chip TriMatrix memory to support wide data paths and deep buffering. The embedded transceivers typically operate at rates suitable for protocols such as PCIe, Serial RapidIO, Gigabit Ethernet, and SONET/SDH, depending on the speed grade and protocol IP used. Designers benefit from Quartus II design tools and a broad IP library, though the family is now considered legacy and newer design starts typically target Stratix IV/V or Cyclone families. Typical applications include high-speed serial backplane bridging, telecom line cards, broadcast video processing, ASIC prototyping, and military/aerospace signal processing where high logic density and embedded transceivers eliminate companion ASSPs. Industrial imaging systems and medical imaging pipelines also leverage the DSP blocks and memory bandwidth. When designing with this part, pay close attention to power sequencing across 1.2V core, 2.5V/3.3V auxiliary and VCCIO rails, and the transceiver PLLs. Use the Stratix II GX handbook and pin connection guidelines to constrain unused transceivers, and verify signal-integrity margins on gigabit links with proper PCB stack-up and matched-length routing. This page synthesizes distributor pricing, Stratix II GX drop-in alternatives, and practical design considerations not found in a single distributor listing, helping engineers evaluate lifecycle risk and second-source options for legacy FPGA designs.

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EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES

EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel

The Intel (formerly Altera) EP2SGX90FF1508C3ES is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and embedded 3.125 Gbps multi-gigabit transceivers in a 1508-ball Flip-Chip FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm CMOS process with a 1.2 V core supply and operates up to 816.9 MHz internal logic frequency. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), programmable interconnect, and dedicated hard-IP blocks such as DSP slices, embedded RAM (TriMatrix memory), PLLs, and high-speed transceivers. FPGAs occupy a mid-point between general-purpose microcontrollers and fixed-function ASICs, allowing hardware engineers to implement arbitrary digital logic, signal-processing pipelines, and interface protocols that can be re-flashed in the field. The Stratix II GX family specifically targets high-speed serial I/O, embedded processing, and DSP-intensive designs in communications, broadcast, and defense segments. Key features of the EP2SGX90FF1508C3ES include 4,828 Logic Array Blocks (LABs), a TriMatrix memory architecture supporting true dual-port RAM and FIFO buffers at up to 550 MHz, dedicated DSP blocks for high-speed multiplication, up to 16 global clock networks plus 32 regional clock networks per device region, and JTAG boundary-scan support for in-system programming and verification. The integrated transceivers support multiple protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The architecture pairs a fine-grained ALM (Adaptive Logic Module) fabric with dedicated hard IP to deliver deterministic timing closure and high DSP throughput per watt. The 90 nm process node balances logic density with power consumption, while the 1.0 mm pitch FC-FBGA package enables high I/O density for board-level designs that demand hundreds of signal pins plus multiple transceiver channels. Typical applications include high-speed serial interface bridging, wireless baseband processing, software-defined radio (SDR) front ends, video broadcast and image processing systems, military secure communications, and ASIC prototyping. The combination of embedded transceivers, abundant DSP blocks, and TriMatrix memory makes the device a single-chip solution for protocol aggregation and signal-processing pipelines. When designing with this FPGA, provide multiple decoupling capacitor values (0.1 µF, 0.01 µF, and 0.001 µF) near each power pin and follow the Stratix II GX pin connection guidelines for unused transceiver and clock pins. Configuration via JTAG or supported EPCS serial flash must be planned alongside POR sequencing to ensure deterministic board bring-up. This page synthesizes distributor pricing, same-brand drop-in alternatives from the Stratix II GX family, and practical design notes not consolidated in the original Altera datasheet, giving procurement and engineering teams a single reference for the EP2SGX90FF1508C3ES.

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EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
EP2SGX90FF1508C3N

EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera

The Intel / Altera EP2SGX90FF1508C3N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) with 90,960 logic elements, 4,520,448 RAM bits, and 650 user I/Os, housed in a 1508-ball FC-FBGA (FCBGA) package operating at 1.2V core with 90nm process technology. According to the manufacturer datasheet, it integrates up to 12 transceivers capable of multi-gigabit serial I/O and 4548 LABs/CLBs, making it one of the highest-density members of the Stratix II GX family. The 'FF' package code designates the 40 x 40 mm FC-FBGA with 1.0 mm pitch (1508-pin) variant. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and structured ASICs, and Stratix II GX specifically targets high-bandwidth serial I/O, DSP, and embedded-processing applications. The 'GX' suffix indicates hardened multi-gigabit transceivers (MGTs) - in Stratix II GX, the transceiver blocks reach data rates up to 6.375 Gbps, allowing the device to bridge parallel logic fabrics to high-speed serial links such as PCIe, Serial RapidIO, XAUI, and custom backplanes. Key features of the EP2SGX90FF1508C3N include 90,960 logic elements (LEs), 4,520,448 bits of embedded block RAM, 384 (18x18) multipliers for DSP operations, 12 transceiver channels, 8 PLLs (4 fast + 4 enhanced), and 650 user I/Os distributed across 12 I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The device operates across industrial temperature grades with commercial ('C') speed grade 3 silicon, balancing timing margin and cost for mainstream prototyping. Architecturally, the Stratix II GX fabric uses Altera's adaptive logic module (ALM), which packs eight inputs into a LUT-based structure with associated arithmetic and register resources, delivering higher effective logic density than the classic 4-input LUT. The transceiver blocks embed physical coding sublayer (PCS) hard IP including 8B/10B encoding, rate matching, and word alignment, which is critical for protocol bridging. Clock management is built around hierarchical PLLs feeding a global clock network. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2 endpoint, XAUI, Serial RapidIO), telecom backplane aggregation, prototype ASIC verification, DSP co-processing for wireless baseband, and high-performance test-and-measurement equipment. The 'C3' speed grade (slower corner) and 1508-ball package make it the typical choice for cost-sensitive prototyping rather than production timing closure. When designing with this part, ensure your PCB can handle the 40 x 40 mm FC-FBGA BGA land pattern with 1.0 mm pitch - this typically requires 6-8 layer stack-ups with microvia or via-in-pad technology. Decoupling must follow the Stratix II GX PDN guidance, with hundreds of ceramic capacitors distributed under and around the package. Because this is a 90nm, 1.2V-core legacy device from Altera (now Intel FPGA), plan for thermal management and verify long-term supply through franchised distributors.

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EP2SGX90FF1508C4 - 90K LE Stratix II GX FPGA, 650 I/O FBGA-1508 | Intel
EP2SGX90FF1508C4

EP2SGX90FF1508C4 - 90K LE Stratix II GX FPGA, 650 I/O FBGA-1508 | Intel

The Intel EP2SGX90FF1508C4 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) featuring 90,960 logic elements (LEs) packaged in a 1508-ball FineLine BGA (FBGA-1508) measuring 40 x 40 mm with 1 mm pitch. It integrates 4,548 LABs/CLBs and 650 user I/Os, with an internal clock frequency of 717 MHz. The 'GX' suffix denotes integrated high-speed transceivers, making this device well suited for serial connectivity and high-bandwidth data path applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, I/O cells, and embedded hardware resources such as RAM blocks, DSP blocks, and transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within digital logic ICs, occupying the high-performance tier above CPLDs. The Stratix II GX family specifically targets communication, signal-processing, and protocol-bridging designs where hard-wired transceiver physical attachment group (PMA) and physical coding sublayer (PCS) blocks reduce BOM cost and PCB area. Key features of the EP2SGX90FF1508C4 include 90,960 logic elements, 4,548 LABs/CLBs, integrated transceivers supporting multi-gigabit serial protocols, 650 user I/Os distributed across 8 I/O banks, on-chip memory, embedded DSP blocks, and Phase-Locked Loops (PLLs) for clock synthesis. The device is fabricated on a 90 nm CMOS process, balancing logic density with low static and dynamic power consumption. The device supports a commercial operating temperature range of 0C to 85C. It is supplied in a surface-mount FBGA-1508 package. The 'C4' speed grade positions this part in the mid-range of Stratix II GX speed options; faster C5/C6 and lower-power I-grade variants exist for different design priorities. The design uses Quartus II development software for HDL synthesis, place-and-route, timing closure, and bitstream generation. Typical applications include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), telecom baseband processing, ASIC prototyping, and high-performance digital signal processing systems. The integrated transceivers eliminate the need for external PHY chips, simplifying board layout and reducing overall system cost. When designing with the EP2SGX90FF1508C4, pay particular attention to power distribution network design, as the FPGA's high logic density demands substantial decoupling (typically 100 nF + 10 uF per power rail, with bulk capacitance at the regulator). Thermal management is essential: the FBGA-1508 package's exposed-die BGA balls require a properly designed PCB land pattern and adequate airflow. Signal-integrity on the transceiver channels requires controlled-impedance routing and length matching per Intel's Stratix II GX handbook. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical PCB-layout notes not present in the standalone datasheet, enabling faster design-in and sourcing decisions.

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EP2SGX90FF1508C4ES - Stratix II GX FPGA 90K LE 1508-FBGA | Intel
EP2SGX90FF1508C4ES

EP2SGX90FF1508C4ES - Stratix II GX FPGA 90K LE 1508-FBGA | Intel

The Intel EP2SGX90FF1508C4ES is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) from the Intel Programmable Solutions Group (formerly Altera) delivering 90,960 logic elements (90960 logic cells) at up to 717 MHz internal frequency, housed in a 1508-ball flip-chip FineLine BGA package (FC-FBGA-1508) measuring 40 mm x 40 mm with 1 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined by the user after manufacturing, rather than being fixed at the fab. FPGAs occupy a specific niche in the semiconductor hierarchy between general-purpose CPUs (which execute software serially) and application-specific integrated circuits (ASICs) which are hard-wired at fabrication. The Stratix II GX family specifically targets high-speed serial I/O and DSP-heavy designs, integrating multi-gigabit transceivers and dedicated multiplier/accumulator blocks alongside the programmable logic fabric. Key features of this device include 4828 logic array blocks (LABs) / 4828 CLBs, 4,828 Kbits of embedded memory (TriMatrix memory blocks), 252 18x18 multipliers for DSP, up to 717 MHz core frequency, twelve 6.375 Gbps transceivers for high-speed serial, and a 1.2 V core supply (1.15 V to 1.25 V tolerance). The 1508-pin FC-FBGA package supports high-density board routing with controlled-impedance signal paths and uses flip-chip packaging for superior thermal and electrical performance over wire-bond equivalents. The device is fabricated on a 90 nm CMOS process and includes on-chip 8B/10B encoding/decoding, clock data recovery (CDR), and dynamic phase alignment (DPA) for serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. Engineering sample suffix "ES" indicates this specific part is an untrimmed pre-production unit intended for evaluation and design verification rather than volume production builds. Typical applications include high-speed serial interface prototyping (PCIe Gen1, XAUI, RapidIO), DSP co-processing cards, baseband processing for wireless infrastructure, and broadcast video processing engines. The 1508-FBGA package is suitable for high-layer-count PCBs with microvia stackups and advanced thermal management. When designing with this device, ensure a 12-layer PCB minimum with continuous GND planes beneath the BGA, controlled-impedance routing for the 6.375 Gbps transceiver channels, and a multi-phase power supply with sub-milliohm decoupling. Engineering samples (ES) must not be used in fielded production systems; specify production-grade suffix (C4N, C5, etc.) for volume builds. This page synthesizes distributor pricing, drop-in Stratix II GX equivalents, and engineering sample (ES) handling guidance not found in any single manufacturer datasheet, providing a one-stop reference for sourcing and design-in.

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EP2SGX90FF1508C4N - 90k LE Stratix II GX FPGA 1508-FCBGA | Intel
EP2SGX90FF1508C4N

EP2SGX90FF1508C4N - 90k LE Stratix II GX FPGA 1508-FCBGA | Intel

The Intel (formerly Altera) EP2SGX90FF1508C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 4,520,448 bits of embedded memory in a 1508-ball flip-chip BGA package. It combines a 90 nm Stratix II logic fabric with embedded transceivers and dedicated DSP blocks, delivering 4548 LABs/CLBs and 650 user I/Os for high-throughput serial and parallel signal processing. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells. FPGAs occupy the position of ASIC-class parallel processing engines in the broader digital IC hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are defined by a hardware description language (HDL) bitstream that configures on-chip SRAM at every power-up, making them ideal for design iteration, low-volume production, and time-to-market-critical applications. Key features include 4,548 LABs/CLBs, 4,520,448 bits of embedded RAM, dedicated DSP blocks for fixed- and floating-point math, embedded high-speed serial transceivers, and 650 general-purpose I/O pins. The device operates across industrial temperature grades and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL for mixed-voltage board integration. Architecture-wise, the Stratix II GX fabric uses adaptive logic modules (ALMs) that pack combinational and registered logic into 8-input fracturable look-up tables, achieving higher logic density than the preceding Stratix family. Transceivers support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom serial links up to 6.375 Gbps, making the part well-suited to wired communications infrastructure. Typical applications include wired communications line cards (multi-gigabit transceivers for backplanes and SFP+ interfaces), high-end test and measurement instrumentation, radar and signal-processing front ends, ASIC prototyping, and DSP accelerator cards. The 1508-FCBGA package supplies the pin density required for the 650 I/Os plus dedicated transceiver and supply balls. When designing with this device, follow the Stratix II GX pin connection guidelines for unused transceiver channels (tie to defined reference voltages) and provide sufficient decoupling on every VCC rail. Bitstream security should be enabled via the AES-128 programming file option for production systems to prevent unauthorized configuration readback.

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EP2SGX90FF1508C5 - 90K LE Stratix II GX FPGA 1.2V FC-FBGA-1508
EP2SGX90FF1508C5

EP2SGX90FF1508C5 - 90K LE Stratix II GX FPGA 1.2V FC-FBGA-1508

The Intel EP2SGX90FF1508C5 is a high-density Stratix II GX field-programmable gate array (FPGA) with 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process and operating from a 1.15V–1.25V core supply (1.2V nominal), the device is rated commercial (0 °C to +85 °C junction) and offers up to 609.76 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor belonging to the programmable logic device family, sitting hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the embedded IC taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). FPGAs integrate configurable logic blocks, programmable interconnect, dedicated hard IP (memory controllers, transceivers, DSP blocks), and I/O cells on a single die. The Stratix II GX family specifically targets high-speed serial connectivity by embedding multi-gigabit transceivers alongside logic fabric, replacing multi-chip FPGA + PHY designs with a single component. Key features of the EP2SGX90FF1508C5 include 4,548 LABs (logic array blocks), 650 user I/Os, embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, and on-chip memory suitable for packet buffering. The flip-chip FC-FBGA-1508 package provides a high pin count and short die-to-package interconnect for signal-integrity-critical serial links at multi-gigabit data rates. Architecturally, the Stratix II GX uses an ALM (Adaptive Logic Module) based logic fabric combined with TriMatrix embedded memory blocks and DSP blocks, with dedicated PMA (Physical Medium Attachment) and PCS (Physical Coding Sublayer) hard IP per transceiver channel. Designers configure the device using the Quartus II design suite, which has been the de-facto toolchain for this generation of Intel/Altera FPGAs. Typical applications include high-end communication line cards, multi-gigabit serial backplanes, base-station signal processing, test and measurement equipment with high-speed serial I/O, and protocol bridging cards. The integration of transceivers, memory, and 90K logic elements in one package makes it well suited to system-level designs that previously required a discrete PHY plus a separate FPGA. When designing with the EP2SGX90FF1508C5, use Quartus II (legacy) or Quartus Prime for synthesis, place-and-route, and timing closure. Pay close attention to the FC-FBGA-1508 PCB land pattern, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. The commercial speed grade (C5) is the most widely available bin; review Altera's device handbook for transceiver channel-placement rules to avoid signal-integrity issues. This page synthesizes distributor inventory, drop-in compatible same-package alternatives from the same Stratix II GX family, and practical Quartus-based design notes that complement the official datasheet.

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EP2SGX90FF1508C5ES - Stratix II GX 90K LE FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C5ES

EP2SGX90FF1508C5ES - Stratix II GX 90K LE FPGA, 1508-FCBGA | Intel

The Intel (formerly Altera) EP2SGX90FF1508C5ES is a Stratix II GX family field-programmable gate array (FPGA) integrating 90,960 logic elements (LEs), 4,494,720 bits of embedded memory, and 12 transceiver channels at up to 6.375 Gbps, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package rated for commercial extended temperature. It is built on a 90 nm process, operates at a 1.2 V core supply, and is specified for a maximum core clock of 609.76 MHz in the speed grade 5 commercial device. The 1508-pin FC-FBGA (FF1508) package exposes up to 650 user I/O pins across 12 I/O banks and 4 DPA blocks. The Stratix II GX is a high-density, transceiver-equipped programmable logic device that extends the Stratix II architecture with multi-gigabit transceivers. As a member of the FPGA (field-programmable gate array) -> programmable logic device -> semiconductor device hierarchy, it fills the role of a system-on-chip fabric integrating parallel logic, embedded RAM/ROM, DSP blocks, PLLs, and serial I/O. Compared with pure ASICs, the FPGA enables post-silicon design changes, lower NRE cost, and rapid prototyping, while still delivering deterministic timing at hundreds of MHz on the core fabric. Key features include twelve 3.125 Gbps (upgradeable to 6.375 Gbps) transceiver channels, embedded transceiver-based PCS blocks with 8B/10B encoding, dedicated hard memory controllers, and DSP blocks rated for 18x18-bit multiplication at full fabric speed. The device also integrates fine-grained ALM (Adaptive Logic Module) architecture - the successor to the classic 4-input LUT - allowing higher logic density per LE compared with prior Stratix generations. Industrial-grade signal integrity, adaptive equalization in each receiver, and signal detection circuitry support backplane and chip-to-chip serial links. Typical applications include high-speed serial interface bridging (PCI Express Gen1, XAUI, Serial RapidIO, Gigabit Ethernet, SDI), wireline telecom line cards, military/aerospace signal processing, ASIC prototyping, and high-performance DSP co-processing. The EP2SGX90FF1508C5ES is particularly suited to designs that need multi-gigabit serial I/O plus substantial parallel DSP bandwidth in a single device, with sufficient logic headroom for system-on-chip integration. When designing with this device, plan power architecture carefully: a fully populated EP2SGX90 with all 12 transceivers active can exceed 25 W dissipation, requiring careful PCB stack-up, multiple low-impedance supply rails, and thermal management. Designers must use the Quartus II design tool (version 7.2 or later, with service packs) to compile, place-and-route, and verify timing; legacy tool support is limited because this is an older family.

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EP2SGX90FF1508C5N - Stratix II GX FPGA, 90K LE, FCBGA-1508 | Intel
EP2SGX90FF1508C5N

EP2SGX90FF1508C5N - Stratix II GX FPGA, 90K LE, FCBGA-1508 | Intel

The Intel (formerly Altera) EP2SGX90FF1508C5N is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,548 LABs (Logic Array Blocks), and 4,520,448 bits of embedded memory in a 1,508-ball FCBGA (Flip-Chip Ball Grid Array) package measuring 40 x 40 mm with 1 mm ball pitch. The device belongs to the Stratix II GX family, which adds up to 20 full-duplex transceiver channels operating up to 6.375 Gbps for high-speed serial I/O. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: they offer ASIC-class parallelism and throughput while remaining fully re-programmable in the field, making them ideal for prototyping, low-volume production, and applications whose algorithms evolve over the product lifetime. Key features of the EP2SGX90FF1508C5N include 90,960 logic elements (LEs), 4,548 LABs, 4,520,448 RAM bits, 650 user I/O pins, and integrated high-speed transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, CEI-6G, and Gigabit Ethernet. The part uses a 1.2 V core supply with separate VCCPD, VCCA, and transceiver supply rails, and supports configuration via passive serial, fast passive parallel, and JTAG modes. The Stratix II GX architecture employs an adaptive logic module (ALM) - an 8-input fracturable LUT - delivering up to 25% higher performance and 50% lower power than the original Stratix family at the same process node. Hard IP blocks such as TriMatrix memory, DSP blocks, and embedded transceivers free up logic for application code rather than overhead functions. Typical applications for the EP2SGX90FF1508C5N include 10 Gbps datacom/telecom line cards, high-end test and measurement equipment, military/aerospace signal processing, ASIC prototyping for ASIC-class compute engines, and high-throughput DSP pipelines (radar, beamforming, video processing). When designing with this device, allocate a multi-rail power solution (core, I/O banks, PLL analog, transceiver PLLs) and follow the Stratix II GX pin connection guidelines for unused pins and bank VREF. The 40 x 40 mm FCBGA-1508 requires a multilayer PCB with microvia stack-ups, controlled-impedance traces for transceiver channels, and matched-length routing for source-synchronous interfaces. This page synthesizes distributor pricing, application guidance, and a curated drop-in alternative list not found in a single manufacturer datasheet, helping engineers evaluate the EP2SGX90FF1508C5N against newer Stratix IV/Stratix V equivalents.

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EP2SGX90FF1508C6 - Stratix II GX 90K LE FPGA | Altera / Intel
EP2SGX90FF1508C6

EP2SGX90FF1508C6 - Stratix II GX 90K LE FPGA | Altera / Intel

The Altera / Intel EP2SGX90FF1508C6 is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) that combines high-density logic, embedded memory, and up to 20 transceivers delivering multi-gigabit serial I/O on a single die. According to Intel / Altera catalog references, the EP2SGX90FF1508C6 provides 90,960 equivalent logic elements (LEs), 4,520,448 RAM bits, and is housed in a 1508-ball flip-chip BGA (FCBGA) package. The 'C6' speed grade is the commercial-temperature (0 C to +85 C) tier with the slowest static timing among Stratix II GX grades, offering the lowest cost point. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O cells can be configured by the customer after manufacture, in contrast to an ASIC whose function is fixed at tape-out. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit at the top of the hierarchy: PLD -> CPLD -> FPGA. The Stratix II GX family specifically targets high-throughput serial connectivity and DSP-heavy designs, blending logic fabric with embedded transceivers that support protocols such as PCI Express, Serial RapidIO, XAUI, and Gbit Ethernet without external PHY ICs. Key features of the EP2SGX90FF1508C6 include the adaptive logic module (ALM) architecture that packs more logic per area than the prior Stratix generation, on-chip tri-matrix memory (MLAB + M4K + M-RAM blocks) totaling 4.52 Mbits, and DSP blocks supporting 9x9, 18x18, and 36x36 signed multiplication. The 1508-ball FCBGA package exposes up to 650 user I/O pins, providing wide parallel buses for memory and external interfaces alongside the serial transceivers. The EP2SGX90FF1508C6 is typically used in wired-telecom line cards, broadcast video processing, software-defined radio (SDR), radar signal processing, and high-end test & measurement backplanes where both DSP throughput and multi-gigabit serial links are required in the same silicon. Its 65 nm process node balances performance and power, while the FCBGA package offers controlled-impedance signal-integrity paths for the transceivers. When designing with this device, plan the PCB stack-up around the 1508-ball FCBGA land pattern and provide sufficient decoupling for the multi-rail core and transceiver supplies. Designers should also confirm Quartus II software support for the 'C6' speed grade when targeting timing closure. This page synthesizes authorized-distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not aggregated on any single manufacturer page.

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EP2SGX90FF1508C7 - 90K LE Stratix II GX FPGA, 8 Transceivers, F1508 | Altera
EP2SGX90FF1508C7

EP2SGX90FF1508C7 - 90K LE Stratix II GX FPGA, 8 Transceivers, F1508 | Altera

The Altera (now Intel) EP2SGX90FF1508C7 is a high-density, high-performance Stratix II GX FPGA delivering 90,720 equivalent logic elements (LEs), 4.5 Mbits of embedded memory, and up to 364 embedded 18x18 multipliers. Housed in a 1508-ball FineLine BGA (F1508) package, it integrates 8 full-duplex transceivers supporting data rates up to 6.375 Gbps, making it ideal for high-speed serial I/O applications including backplane connectivity, chip-to-chip links, and protocol bridging. The device operates with a core voltage of 1.2V and supports the Stratix II GX family's enhanced DSP block architecture for signal processing workloads. A Stratix II GX FPGA belongs to the broader category of programmable logic devices (PLDs), which sit within the digital semiconductor hierarchy: PLD -> FPGA -> high-speed transceiver FPGA. These devices combine configurable logic fabric with hard intellectual-property (IP) blocks such as transceivers, PLLs, and DSP slices, allowing system designers to implement custom digital logic, high-speed interfaces, and parallel arithmetic without an ASIC development cycle. The Stratix II GX family specifically targets applications requiring multi-gigabit serial connectivity. Key features of the EP2SGX90FF1508C7 include 8 transceiver channels at up to 6.375 Gbps, support for PCI Express, Serial RapidIO, XAUI, and other serial protocols via hard IP, up to 488 Kbits of M4K memory blocks, and a dedicated clock management infrastructure with up to 12 PLLs. The 1508-ball FineLine BGA package exposes the full transceiver and I/O count required for high-pin-count designs. It is fabricated in a 90 nm CMOS process with 1.2V core operation. The architecture combines adaptive logic modules (ALMs) with a row- and column-based interconnect, optimized for timing closure in high-utilization designs. Hard multipliers and DSP blocks accelerate FIR filters, FFTs, and other arithmetic kernels. The transceiver tiles integrate serializer/deserializer (SerDes), clock-data recovery (CDR), and physical coding sublayer (PCS) functions on-chip, eliminating external PHY chips in many configurations. Typical applications include high-end telecommunications line cards, broadcast video processing equipment, radar and signal-intelligence systems, and high-performance computing accelerators. The 8 transceiver channels are well matched to multi-lane backplane links such as PCI Express x4 or x8, Serial RapidIO, and 10G Ethernet aggregation. Designers choose this device when protocol-rich serial I/O and dense logic fabric must coexist on a single die. When designing with the EP2SGX90FF1508C7, ensure the PCB has matched-length routing for each transceiver lane, controlled-impedance differential pairs (typically 100 ohm differential), and an AC-coupled link per the Altera reference design. Decoupling must follow the Stratix II GX power distribution network (PDN) guide, with bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as practical to each supply pin. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a faster path from selection to layout-ready BOM.

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EP2SGX90FF1508I3 - 90K LEs, 6.375G Transceiver FPGA | Altera
EP2SGX90FF1508I3

EP2SGX90FF1508I3 - 90K LEs, 6.375G Transceiver FPGA | Altera

The Altera EP2SGX90FF1508I3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 90,960 logic cells, embedded SERDES transceivers, and 4.5 Mbits of embedded memory in a 1508-ball FineLine BGA package. It supports transceiver data rates up to 6.375 Gbps and a maximum user clock frequency of 622.08 MHz, operating from a 1.15 V to 1.25 V core supply. What is a Stratix II GX FPGA? It is Altera's third-generation high-density programmable logic device that combines a scalable logic fabric with embedded high-speed serial transceivers and source-synchronous I/O. FPGAs sit at the top of the programmable logic hierarchy, between fixed-function ASICs and discrete logic, providing parallel hardware execution with field-updatable configuration via SRAM cells. Stratix II GX specifically targets serial-connectivity applications where on-chip multi-gigabit transceivers replace external PHY chips. Key features include 4 to 20 embedded transceiver channels with clock-data recovery, dedicated source-synchronous I/O banks for DDR/DDR2/QDR memory interfaces, support for external memory interfaces up to DDR2 SDRAM, and Altera's TriMatrix memory architecture with MLAB, M512, and M4K blocks. The device integrates hard PCI Express, Serial RapidIO, and 10-Gbps Ethernet PHY intellectual property (IP) cores, enabling protocol acceleration without consuming logic resources. The 90-nm Stratix II GX architecture uses adaptive logic modules (ALMs) rather than traditional 4-input LUTs, achieving finer-grained logic packing. Transceivers integrate pre-emphasis, equalization, and output-voltage swing control to meet backplane and chip-to-chip signal-integrity requirements across the full 600 Mbps to 6.375 Gbps operating range. Typical applications include 10 Gigabit Ethernet line cards, PCI Express Gen1/Gen2 endpoint and root-complex designs, Serial RapidIO DSP farms, base-station baseband processing, high-speed serial backplane bridging, and broadcast video switching fabrics. Industrial-grade parts in the FF1508 FineLine BGA are specified from -40 °C to +100 °C ambient for telecom and industrial operating environments. When designing with this device, ensure the power-supply decoupling network matches the Stratix II GX PDN reference design; the 1508-ball FineLine BGA power-pin count exceeds 200 pins requiring a 6-layer board minimum. Use the Quartus II design software (version 9.0 or later) with the Stratix II GX device library; older Quartus versions do not support this family. This page synthesizes distributor pricing, drop-in alternative ordering codes, and practical Quartus design notes not found in the Altera datasheet, helping engineers evaluate the EP2SGX90FF1508I3 against newer Stratix IV/V variants for legacy board reuse.

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EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel
EP2SGX90FF1508I3N

EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel

The Intel EP2SGX90FF1508I3N is a high-density Stratix II GX Field-Programmable Gate Array from the Stratix II GX family, integrating 90,960 logic elements and 90,960 Configurable Logic Blocks (CLBs) in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process technology and operating from a 1.2V core supply, the device delivers up to 816.9 MHz internal clock performance and is qualified to the industrial temperature grade, supporting -40C to +100C ambient operation. The I3N speed grade balances logic throughput against dynamic power, making the part well suited for high-throughput DSP pipelines, multi-gigabit serial protocol bridging, and ASIC prototyping workloads. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, interconnect, and I/O blocks are configured by an end-user after manufacture, allowing hardware-level customization without a photomask cycle. Within the programmable-logic taxonomy, FPGAs sit between standard microcontrollers (software-configured, fixed architecture) and full custom ASICs (hardware-configured, fixed function), combining high parallelism with low non-recurring engineering cost. The Stratix II GX family further extends the FPGA hypernym with up to 20 embedded transceivers, embedded multipliers, and TriMatrix memory blocks, positioning the device family as a heterogeneous compute platform. Key features of the EP2SGX90FF1508I3N include 4,520,448 bits of embedded memory, embedded 18x18 multipliers for DSP operations, and dedicated multi-gigabit transceiver (MGT) channels supporting common serial standards such as PCIe, Serial RapidIO, and Gigabit Ethernet. The device supports several I/O standards including LVDS, LVTTL, LVCMOS, and SSTL for direct interface to DDR/DDR2 memory, while configuration is performed through the EPC family enhanced configuration devices or JTAG. Internal pull-ups, on-chip termination, and dynamic phase alignment simplify board-level design. The Stratix II GX architecture introduces an adaptive logic module (ALM) that combines look-up tables, adders, and registers in an 8-input structure, achieving higher effective logic density per LE than the prior Stratix generation. On the silicon side, the 90nm process enables transistor-level scaling that drives down dynamic power per MHz while preserving routing flexibility; designers using the Altera/Intel Quartus II design suite can target the device with industry-standard HDL flows and IP libraries. Typical applications include high-performance DSP for radar, baseband processing in software-defined radio, multi-gigabit serial backplane bridging, ASIC prototyping and emulation, and high-speed data-acquisition front-ends. The device is also used in industrial imaging and medical-imaging pipelines that require parallel pixel processing at line rate. The combination of transceivers, embedded multipliers, and a large logic budget makes the EP2SGX90FF1508I3N a frequent choice for communications infrastructure and defense electronics where a second-source FPGA must remain pin-compatible with the broader Stratix II GX family. A key design consideration is signal integrity on the FC-FBGA-1508 land pattern: microvia and via-in-pad PCB processes are typically required for reliable assembly, and at least six PCB layers with continuous power planes are recommended for the 1.2V core and 3.3V/2.5V auxiliary rails. Designers should use the Quartus II PowerPlay early-power estimator and pin planner before final layout, and follow Altera's recommended decoupling network to keep core-rail ripple within the device's specification. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.

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