EP2SGX90EF1152C4ES - Stratix II GX 90K LE FPGA, 558 I/O, 1152-FBGA
料号： EP2SGX90EF1152C4ES ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
EP2SGX90EF1152C4ES 概述
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, and DSP pipelines on a silicon fabric that is configured after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs trade raw per-gate efficiency for design flexibility and rapid time-to-market, and they are commonly used for prototyping, low-volume production, and applications where standards or algorithms evolve frequently.
Key features of the EP2SGX90EF1152C4ES include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded DSP blocks for high-speed multiply-accumulate operations, dedicated serializer/deserializer (SERDES) channels supporting multi-gigabit serial protocols, and 558 user I/O pins compliant with multiple single-ended and differential I/O standards. The device supports configuration via passive serial, fast passive parallel, and JTAG modes, and includes on-chip PLLs for clock management.
The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with embedded transceivers capable of multi-gigabit serial interfaces such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 90 nm process node and dedicated hard IP blocks deliver deterministic latency for serial connectivity, while the TriMatrix memory subsystem allows wide, high-throughput on-chip data buffers for packet processing and DSP.
Typical applications for this part include high-speed serial interface bridging, telecommunications backplane aggregation, military and aerospace signal processing, industrial imaging pipelines, ASIC prototyping, and test and measurement instrumentation. The wide I/O count and embedded multi-gigabit transceivers make it particularly well-suited to designs that require both rich parallel connectivity and high-speed serial links on a single device.
When designing with this FPGA, ensure that the 1152-ball FC-FBGA land pattern and ball-attach process match the manufacturer's recommended reflow profile, and that the PCB stack-up provides sufficient microvia and via-in-pad capacity for the BGA escape routing. Power-rail sequencing and decoupling must follow the Stratix II GX pin connection guidelines, and the device requires a configuration device or JTAG programmer for first-time bitstream load.
This page synthesizes distributor stock levels, drop-in alternatives from the same Stratix II GX family, and practical design notes that complement the manufacturer datasheet for the EP2SGX90EF1152C4ES.
直接替换替代料： EP2SGX90EF1152C4ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX90EF1152C4ES （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Total RAM Bits, Core Voltage, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP2SGX90EF1152C4
✅ 直接替换✓ 有现货
$890 / 个
查看数据手册 →EP2SGX90EF1152C3N
✅ 直接替换✓ 有现货
$1280 / 个
查看数据手册 →EP2SGX90EF1152C3ES
✅ 直接替换✓ 有现货
$2050 / 个
查看数据手册 →EP2SGX90EF1152C3
✅ 直接替换✓ 有现货
$1180 / 个
查看数据手册 →EP2SGX90EF1152C4ES 最大额定值与电气特性
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix II GX |
| Logic Elements | 90960 |
| Total RAM Bits | 4520448 |
| Number of I/O | 558 |
| Voltage - Supply (Core) | 1.2 V |
| Process Technology | 90 nm |
| Maximum Operating Frequency | 732.1 MHz |
| 封装 / 外壳 | 1152-BBGA, FCBGA |
| 安装类型 | Surface Mount |
| 工作温度 | Commercial Extended |
| RoHS 状态 | Non-compliant (per one distributor listing) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
| Embedded Transceivers | Multi-gigabit SERDES (per Stratix II GX family) |
| Embedded DSP Blocks | Yes (per Stratix II GX family) |
EP2SGX90EF1152C4ES 1152-bbga, fcbga 引脚配置指南
EP2SGX90EF1152C4ES（1152-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2SGX90EF1152C4ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2SGX90EF1152C4ES 适用于 6 应用s: Telecommunications Backplane Aggregation, ASIC Prototyping and Emulation, High-Speed Serial Interface Bridging, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military and Aerospace Signal Processing.
Telecommunications Backplane Aggregation
The EP2SGX90EF1152C4ES suits telecom backplane aggregation designs that require high-density parallel interfaces plus multi-gigabit serial links. With 558 user I/O pins, designers can connect multiple SFP/SFP+ cages or backplane SERDES channels while the embedded DSP blocks handle packet-header classification. The 4,520,448 RAM bits provide deep on-chip buffering for queue management, reducing external memory accesses. At 732.1 MHz fabric performance and 90 nm process, the part delivers deterministic latency required for line-card forwarding. The 1.2 V core rail simplifies power tree design when paired with standard POL converters.
推荐
ASIC Prototyping and Emulation
For ASIC prototyping and emulation, the EP2SGX90EF1152C4ES offers 90,960 logic elements that can map large blocks of an ASIC RTL onto a single device. The TriMatrix memory architecture with 4,520,448 embedded RAM bits allows high-fidelity modeling of ASIC SRAM macros without external memory. 558 user I/O pins enable full visibility into internal ASIC nodes via test pins, and the multi-gigabit transceivers model high-speed serial interfaces on the ASIC. Quartus II synthesis flow supports incremental compile, which matches ASIC-style block-based design methodologies. Designers typically place the FPGA on an emulation board with socket or BGA-to-BGA interposers.
推荐
High-Speed Serial Interface Bridging
The Stratix II GX architecture integrates dedicated multi-gigabit transceivers that support protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY devices. The EP2SGX90EF1152C4ES uses these hard SERDES blocks to bridge between legacy parallel buses and modern serial links, eliminating discrete transceiver ICs and saving board area. Designers can implement protocol conversion (for example, Parallel RapidIO to Serial RapidIO) entirely in FPGA fabric, while the 558 user I/O pins maintain access to legacy control interfaces.
推荐
Industrial Imaging and Video Processing
Industrial imaging systems benefit from the EP2SGX90EF1152C4ES combination of high logic density, 558 user I/O pins for parallel image-sensor interfaces, and embedded DSP blocks for real-time pixel processing. At 732.1 MHz fabric performance, the FPGA can sustain multiple video pipelines operating in parallel. The 4,520,448 embedded RAM bits provide line and frame buffers, and the multi-gigabit transceivers enable uncompressed video transport over coaxial links using protocols such as SDI or DisplayPort. The commercial-extended temperature rating supports factory-floor deployments.
推荐
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol exercisers, and high-speed data-acquisition cards map naturally onto the EP2SGX90EF1152C4ES. The 558 I/O pins capture or drive wide parallel buses, while the integrated multi-gigabit transceivers generate and analyze serial protocols up to multi-gigabit rates. The 4,520,448 RAM bits store deep capture buffers on-chip, simplifying time-correlated measurements. Quartus II design entry with on-chip SignalTap logic analyzer provides non-intrusive internal-node visibility, reducing external probe requirements during validation.
推荐
Military and Aerospace Signal Processing
Military and aerospace signal-processing applications leverage the EP2SGX90EF1152C4ES for radar, electronic-warfare, and secure-communications functions. The 90K logic elements plus embedded DSP blocks implement wide-bandwidth FFTs and pulse-Doppler processing on the FPGA fabric. The integrated multi-gigabit transceivers simplify inter-board connectivity in OpenVPX and VME chassis, while the 1152-ball FC-BGA package is compatible with ruggedized PCB processes used in defense electronics. Designers must verify lot-level screening and radiation-hardness requirements with the supplier, as commercial-extended parts may need additional qualification.
推荐
推荐产品汇总
工程参考数据： EP2SGX90EF1152C4ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX90EF1152C4 | EP2SGX90EF1152C3N | EP2SGX90EF1152C3ES | EP2SGX90EF1152C3 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1152-BBGA FCBGA | 1152-BBGA FCBGA - same | 1152-BBGA FCBGA - same | 1152-BBGA FCBGA - same | 1152-BBGA FCBGA - same |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 |
| Total RAM Bits | 4520448 | 4520448 | 4520448 | 4520448 | 4520448 |
| User I/O Count | 558 | 558 | 558 | 558 | 558 |
| Speed Grade | C4 | C4 (same) | C3 (slower) | C3 (slower, ES suffix) | C3 (slower) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Ordering Code Suffix | C4ES | C4 (production) | C3N (slower, lead-free) | C3ES (slower, ES) | C3 (slower) |
关键差异点
- C4 speed grade variant within same die （对比 EP2SGX90EF1152C3N)
- Identical silicon, ES ordering code only （对比 EP2SGX90EF1152C4)
- High I/O count for parallel interfaces （对比 EP2SGX60EF1152C4)
设计说明
The EP2SGX90EF1152C4ES requires multiple supply rails: VCCINT (1.2 V core), VCCIO (per-bank I/O voltage), VCCPD, VCCPGM, and PLL analog VCC. Power-rail sequencing must follow the Stratix II GX pin connection guidelines in the manufacturer datasheet to prevent latch-up. Estimated: at full fabric utilization with 558 active LVCMOS25 I/O, total power consumption can exceed 15 W; thermal design must include a heatsink or chassis conduction path because the FC-BGA package does not expose a top-side thermal pad.
The 1152-ball FC-BGA requires a high-density PCB stack-up, typically 8+ layers with microvia and via-in-pad construction for the inner ball rows. Escape routing should follow the manufacturer's break-out pattern to avoid signal-integrity degradation on the multi-gigabit transceiver channels. Differential pairs from the embedded SERDES must be length-matched within the tolerance specified in the Stratix II GX handbook (typically less than 5 mil mismatch for sub-multi-gigabit rates).
Do not assume the ES (engineering sample) suffix on EP2SGX90EF1152C4ES means non-functional silicon - the part is fully pin-compatible with production EP2SGX90EF1152C4 but may have unrevised mask sets. For RoHS-restricted designs, request lot-level compliance verification from the distributor; at least one listing reports non-compliant RoHS status for some C4ES date codes. Configuration mode selection (PS, FPP, JTAG) must match the chosen configuration device, and unused transceiver channels should be powered down via Quartus II software to reduce quiescent power.
合规信息
At least one distributor listing (ic7300.com) reports EP2SGX90EF1152C4ES as RoHS non-compliant. Other compliance fields were not confirmed in the verified web data; treat as unknown until verified with the supplier lot documentation. AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC.