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EP2SGX90FF1508I4 - Stratix II GX 90K LEs, 4.5Mb, 1508-FCBGA | Intel
EP2SGX90FF1508I4

EP2SGX90FF1508I4 - Stratix II GX 90K LEs, 4.5Mb, 1508-FCBGA | Intel

The Intel (Altera) EP2SGX90FF1508I4 is a high-density Stratix II GX family FPGA integrating 90,960 logic elements, 4,520,448 bits of embedded memory, and embedded transceivers in a 1508-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 90 nm CMOS process with 1.2 V core supply and is offered in the industrial temperature grade (-40C to +100C case). According to the manufacturer datasheet, the device delivers up to 650 user I/Os and supports PCI Express, Gigabit Ethernet, Serial RapidIO, and other high-speed serial protocols through its embedded multi-gigabit transceivers. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture, allowing engineers to implement arbitrary digital circuits, DSP pipelines, and parallel processing structures without taping out a custom ASIC. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: faster than software, cheaper in low volumes than ASICs, and re-programmable in the field. The Stratix II GX family extends the base FPGA fabric with embedded transceivers optimized for high-speed serial I/O, making the EP2SGX90FF1508I4 suitable for communication, broadcast, and signal-processing backplanes. Key features include 4,548 LABs (Logic Array Blocks) in the Stratix II Adaptive Logic Module (ALM) architecture, dedicated 18x18 multipliers for DSP, 12 transceiver channels running up to 6.375 Gbps, eight phase-locked loops (PLLs), and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The FF1508 package provides the largest pin count in the family, exposing maximum user I/O and transceiver bandwidth simultaneously. Typical applications include high-end telecommunications line cards, video broadcast and image processing systems, PCIe Gen1/Gen2 endpoint and root complex designs, military and aerospace signal processing, ASIC prototyping, and high-speed test and measurement equipment. The 1508-ball FC-FBGA requires advanced PCB design (microvia, sequential lamination) and a controlled-impedance stack-up for the transceiver channels to meet signal-integrity budgets. When designing with the EP2SGX90FF1508I4, allocate transceiver channels to short, matched-length differential pairs with reference plane continuity, and use the Altera Quartus II design tool (or the later Intel Quartus Prime with Stratix II device support) for synthesis, place-and-route, and timing closure. Power estimation should be run early; worst-case core plus transceiver current at 1.2 V can exceed several amps and demands a multi-rail VRM with bulk ceramic decoupling distributed across the BGA footprint. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP2SGX90FF1508I4K - Stratix II GX FPGA, 90K LE, 1508-BGA | Intel
EP2SGX90FF1508I4K

EP2SGX90FF1508I4K - Stratix II GX FPGA, 90K LE, 1508-BGA | Intel

The Intel (formerly Altera) EP2SGX90FF1508I4K is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FCBGA) package, integrated with up to 12 embedded transceivers and 4 hard PCI Express controllers. Built on a 90 nm process, the device delivers 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and 252 embedded 18-bit x 18-bit multipliers, configured across 4,548 Logic Array Blocks (LABs) with 650 user I/O pins. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device whose logic, interconnects, I/O, and signal-processing blocks can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Stratix II GX specifically targets high-speed serial I/O and DSP-intensive applications, integrating multi-gigabit transceivers (MGTs) and dedicated PCIe hard IP that would consume thousands of LEs in a soft implementation. Key features include 12 full-duplex embedded transceivers supporting data rates from 600 Mbps to 6.375 Gbps, dedicated Triple-Speed Ethernet MACs, 4 PCI Express hard controllers (x1, x4, or x8 lanes), and TriMatrix on-chip memory with true dual-port RAM blocks. The device supports source-synchronous interfaces up to 1 Gbps on the LVDS side, and Altera's Adaptive Logic Module (ALM) architecture provides 8-input fracturable look-up tables that improve packing density compared to the prior Stratix generation. Architecture depth: each ALM combines an 8-input adaptive LUT, two dedicated adders, four programmable registers, and shared arithmetic carry chains. The 252 DSP blocks deliver up to 504 GMACs of 18-bit x 18-bit multiply-accumulate throughput, while the 12 transceivers are clocked by independent reference clocks and support multiple protocols (PCIe, XAUI, Serial RapidIO, CPRI, OBSAI, SDI, SATA, GbE, and custom serial links). Typical applications include high-end telecommunications line cards, military radar and signal-intelligence backplanes, ASIC prototyping, high-definition video broadcast equipment, and PCIe-based accelerator cards. The "I4K" speed/temperature grade designates an industrial-grade part rated to -40C to +100C junction with the fastest transceiver speed bin. Design consideration: when using the integrated transceivers, place AC-coupling capacitors within 1 inch of each serial pin to comply with the Stratix II GX signal-integrity guidelines. PCB stackup must maintain 100-ohm differential impedance with skew below 1 ps/mm on the transceiver lanes. This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX alternatives, and practical layout guidance not found in the manufacturer datasheet alone.

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EP2SGX90FF1508I4N - Stratix II GX FPGA, 90K LE, FBGA-1508 | Intel
EP2SGX90FF1508I4N

EP2SGX90FF1508I4N - Stratix II GX FPGA, 90K LE, FBGA-1508 | Intel

The Intel EP2SGX90FF1508I4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,548 LABs, and 4,520,448 bits of embedded memory, packaged in a 1508-ball flip-chip BGA (FCBGA) measuring 40 x 40 mm with a 1 mm ball pitch. The part operates across an industrial temperature range and integrates up to 12 transceivers and dedicated Multi-Gigabit Transceiver (MGT) blocks optimized for high-speed serial I/O, alongside 650 user I/O pins for parallel interfaces. It is fabricated on a 90 nm CMOS process and supports a maximum core clock frequency up to 717 MHz per the manufacturer datasheet. A Field Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full ASICs in cost-versus-flexibility trade-off, and are widely used in prototyping, low-volume production, and applications requiring hardware-level parallelism that microcontrollers cannot deliver. The Stratix II family specifically added adaptive logic modules (ALMs) and on-chip DSP blocks, making the part attractive for signal-processing pipelines. Key features of the EP2SGX90FF1508I4N include 12 high-speed transceivers supporting multi-gigabit serial protocols, on-chip TriMatrix memory with mixed-width blocks for distributed and buffering storage, dedicated DSP blocks for fixed- and floating-point arithmetic, and support for external memory interfaces such as DDR2 SDRAM. The device also includes Phase-Locked Loops (PLLs) for clock management, a configuration controller that supports multiple boot modes including JTAG and passive serial, and built-in CRC checking for configuration bitstream integrity. Architecturally, the Stratix II GX uses the ALM (Adaptive Logic Module) as its basic logic unit, replacing the older 4-input LUT of Stratix I. Each ALM contains an 8-input fracturable lookup table combined with dedicated adder and carry chains, which improves effective logic utilization to roughly 1.4x compared to the previous generation. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) logic, allowing direct connection to SERDES-based backplanes without external glue logic. Typical applications include high-speed serial backplane aggregation routers, baseband processing for wireless infrastructure, video broadcast and editing equipment, military signal-processing systems, and PCI Express endpoint implementations. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well-suited to data-path-intensive workloads that must be reconfigured per deployment. When designing with this device, ensure the PCB footprint accommodates the 40 x 40 mm FCBGA with controlled-impedance routing for the MGT lanes. Power budgeting must account for transceiver power, which scales linearly with line rate, and signal-integrity simulation is recommended above 3.125 Gbps. The part is part of a mature family with abundant reference designs but is generally considered legacy, so verify long-term availability against new design requirements. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP2SGX90FF1508I5 - Stratix II GX FPGA, 90.96k LEs, 622 MHz | Intel
EP2SGX90FF1508I5

EP2SGX90FF1508I5 - Stratix II GX FPGA, 90.96k LEs, 622 MHz | Intel

The Intel (formerly Altera) EP2SGX90FF1508I5 is a Stratix II GX Field Programmable Gate Array with 90,960 logic elements, 90,960 total logic cells, and embedded high-speed serial transceivers, packaged in a 1508-ball FineLine BGA. The device is rated for the industrial temperature range (-40°C to +85°C) and operates from a nominal 1.2 V core supply, with a maximum clock frequency of 622.08 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital circuits. Stratix II GX FPGAs sit in the high-performance tier of the FPGA taxonomy: FPGA > SRAM-based FPGA > high-speed-transceiver FPGA > Stratix II GX family > power-management/system-on-chip-class devices, and they combine a logic fabric with embedded SERDES, memory blocks, DSP blocks, and PLLs. This places EP2SGX90FF1508I5 between discrete logic + PHY ICs and full SoC platforms. Key features include up to 6.375 Gbps embedded transceivers with clock and data recovery (CRU), source-synchronous I/O for parallel high-speed interfaces, 4 to 20 transceiver channels depending on variant, dedicated on-chip memory (M512/M4K/M-RAM blocks), and embedded DSP blocks for high-throughput signal processing. The 1508-ball FineLine BGA package supports hundreds of user I/O pins with multiple I/O standards (LVDS, LVCMOS, HSTL, SSTL, PCI Express). Together these enable designers to consolidate what previously required an FPGA + separate PHY + external memory into a single device. Architecturally, Stratix II GX uses a 90 nm process, an adaptive logic module (ALM) fabric, and dedicated transceiver hard IPs. Designers typically target the device with the Quartus II design software, leveraging IP cores for PCI Express, XAUI, Serial RapidIO, and DDR/DDR2 memory controllers. Compared to a discrete SERDES + FPGA solution, the integrated architecture reduces board complexity, BOM count, and signal-integrity risk on high-speed serial channels. Typical applications include high-end communications line cards (10 Gbps optical transport, SONET/SDH framer, ATCA/AMC backplanes), PCI Express Gen1 endpoint/root complex designs, broadcast video processing (HD-SDI/3G-SDI routing and conversion), test and measurement instrumentation with high-speed digitizers, and radar / signal-intelligence front ends. The combination of logic density and 6.375 Gbps transceivers is especially well-suited to protocols that need both packet processing and bulk serial bandwidth. When designing with EP2SGX90FF1508I5, plan power-rail decoupling carefully: separate 1.2 V core, 2.5 V/3.3 V PLL analog, and I/O voltage supplies must each be filtered with low-ESR bulk + ceramic capacitors placed close to the BGA balls. Transceiver channels require controlled-impedance (typically 100 Ω differential) routing with length matching within the SerDes tolerance budget. Thermal management of the FineLine BGA is dominated by the center-row ball array - a multi-layer PCB with stitched ground vias and a heatsink is recommended for typical 8-15 W dissipation. This page synthesizes distributor availability, drop-in same-package alternatives, and practical layout guidance not all found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference.

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EP2SGX90FF1508I5N - Stratix II GX FPGA, 90,960 LEs, 622 MHz | Intel
EP2SGX90FF1508I5N

EP2SGX90FF1508I5N - Stratix II GX FPGA, 90,960 LEs, 622 MHz | Intel

The Intel (formerly Altera) EP2SGX90FF1508I5N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) that integrates 90,960 logic elements (LEs), 90,960 equivalent logic cells, and 4,520,448 bits of embedded memory in a 1508-ball flip-chip BGA (FC-FBGA) package. The device is built on a 1.2 V nominal CMOS process, supports a maximum clock frequency of 622.08 MHz, and is rated for the industrial temperature range from -40 °C to +85 °C. It belongs to the Stratix II GX family, which adds up to 20 embedded transceivers per device for multi-gigabit serial I/O. A Field-Programmable Gate Array (FPGA) is a programmable logic IC that combines configurable logic blocks, routing interconnect, and dedicated hard IP blocks (such as transceivers, memory controllers, multipliers, and PLLs). The user programs the FPGA after manufacturing via a configuration bitstream, which makes FPGAs ideal for ASIC prototyping, high-speed signal processing, network processing, and reconfigurable compute. FPGAs sit at the top of the programmable-logic hierarchy (CPLD -> FPGA -> SoC FPGA), and the Stratix II GX family is positioned for high-performance applications with embedded multi-gigabit transceivers. Key features of the EP2SGX90FF1508I5N include 90,960 LEs arranged in 4,548 logic array blocks (LABs), 152 18-bit x 18-bit multipliers, 4,520,448 bits of embedded SRAM organized as M4K and M-RAM blocks, four enhanced PLLs, eight fast PLLs, and a rich set of clock networks. The industrial-grade speed grade I5 places it in the moderate-speed, wide-temperature bin, while the 1508-ball FC-FBGA package provides 650 user I/O pins and an exposed thermal die for heat dissipation in dense PCB designs. Architecturally, Stratix II GX devices use a stretched-LUT approach where every LE contains a 7-input adaptive look-up table (ALUT) that can be partitioned into smaller LUTs for higher effective logic utilization. The embedded transceivers support standards such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI, and operate at data rates up to 6.375 Gbps per channel, making the EP2SGX90FF1508I5N suitable for high-bandwidth backplane and bridging applications. Typical applications for the EP2SGX90FF1508I5N include high-speed telecom and networking line cards, ASIC prototyping for protocol stacks, signal-processing front-ends for test and measurement, and military/aerospace signal intelligence platforms. The 622 MHz internal clock and abundant transceivers allow designers to consolidate what would otherwise require multiple discrete ASSPs. When designing with this part, pay close attention to power-rail sequencing: Stratix II GX devices require a specific power-up and power-down order for VCCINT, VCCIO, VCCA, and the transceiver supplies. Decoupling, thermal management, and configuration-bitstream storage on a flash or PROM must all be budgeted before PCB layout is committed. This page consolidates distributor pricing, industrial-grade drop-in alternatives, and Stratix II GX design notes in one place - giving engineers a faster starting point than searching the original datasheet.

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EP2SGX90FF40C3N - 90K LEs Stratix II GX FPGA | Intel | Altera
EP2SGX90FF40C3N

EP2SGX90FF40C3N - 90K LEs Stratix II GX FPGA | Intel | Altera

The Intel (formerly Altera) EP2SGX90FF40C3N is a high-density, high-performance Stratix II GX FPGA featuring 90,960 equivalent logic elements, 4,548 Logic Array Blocks (LABs), and 650 user I/O pins. Built on a 90 nm process, the device integrates up to 4.5 Mbits of embedded memory and 252 embedded 18-bit x 18-bit multipliers, all housed in a 1,508-ball FineLine BGA package. The "C3" speed grade and the lead-free (Pb-free) "N" suffix are explicitly part of the ordering code as supplied by Altera/Intel. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. The FPGA sits within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductor ICs, sitting alongside CPLDs and structured ASICs. Stratix II GX devices extend the Stratix II family by adding high-speed serial transceiver blocks, which is why this part is the "GX" variant - it targets protocols requiring multi-gigabit transceivers such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Key features include dedicated transceivers running at data rates up to 6.375 Gbps, 4 Phase-Locked Loops (PLLs) for clock management, 12 global clock networks, and on-chip termination (OCT) for high-speed signal integrity. The device supports both passive and active serial configuration schemes via the dedicated configuration pins and the Stratix II configuration controller. The 1,508-ball FBGA package provides a high pin-count solution for memory-rich, I/O-intensive designs that need both width and density on a single substrate. Typical applications include 10G/40G telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, high-speed serial protocol bridging, and high-performance digital signal processing (DSP) pipelines. The combination of embedded multipliers and high transceivers makes this family especially well-suited for wireless baseband prototyping and forward-error-correction engines. When designing with the EP2SGX90FF40C3N, careful attention must be paid to PCB layout for the FBGA substrate (use microvia stack-ups and matched-length routing for the transceiver channels), thermal management (the FBGA requires a thermal pad and well-designed via array), and power sequencing (the Stratix II GX family requires specific ramp rates on VCCINT and VCCA). Quartus II software is the primary design environment, and the device is supported from the Quartus II v6.0 through the latest Altera/Intel Quartus Prime legacy support flow. This page synthesizes distributor availability, verified Stratix II GX family specifications, drop-in alternatives from the Site MPN list, and practical design notes that go beyond a stock manufacturer datasheet summary.

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EP2SGX90FF40C3NES - Stratix II GX FPGA 90K LE FC-FBGA | Intel
EP2SGX90FF40C3NES

EP2SGX90FF40C3NES - Stratix II GX FPGA 90K LE FC-FBGA | Intel

The Intel (formerly Altera) EP2SGX90FF40C3NES is a high-performance field-programmable gate array (FPGA) from the Stratix II GX family, integrating 90,960 logic elements, 4,828 logic array blocks (LABs)/configurable logic blocks (CLBs), embedded transceivers, and on-chip memory in a 1,508-pin flip-chip fine-pitch ball-grid-array (FC-FBGA) package. What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, with embedded hard IP such as block RAM, DSP blocks, PLLs, and (in the Stratix II GX family) multi-gigabit transceivers. FPGAs occupy a tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they deliver ASIC-class parallelism and data-path throughput while remaining reconfigurable in the field, making them the workhorse of high-speed serial I/O, digital signal processing, and prototyping for ASIC emulation. Key features of the EP2SGX90FF40C3NES include a 1.2 V core supply, 816.9 MHz maximum internal operating frequency, 90 nm process technology, integrated PCI Express hard IP, and up to 12 transceivers supporting data rates up to 6.375 Gbps. The device also provides dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic and embedded TriMatrix memory blocks for low-latency on-chip storage. Architecturally, the Stratix II GX combines a logic fabric based on adaptive logic modules (ALMs) with embedded transceivers hardened for serializer-deserializer (SerDes) protocols. The hard PCI Express and 10-Gbps Ethernet intellectual property eliminates the need to consume FPGA fabric for these interfaces, freeing logic for the user application and reducing timing closure risk in high-speed designs. Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, military radar signal processing, ASIC prototyping, broadcast video processing, and test and measurement equipment. The integrated transceivers make the part especially suitable for designs requiring multi-gigabit serial links such as Serial RapidIO, XAUI, SATA, and PCI Express. When designing with this device, ensure the FC-FBGA-1508 PCB land pattern matches the Intel reference footprint exactly, and that the power distribution network uses the recommended decoupling scheme to limit core supply ripple under high SerDes switching activity. Thermal management must account for the device's commercial extended temperature grade (0 °C to 85 °C). This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, drawing on Stratix II GX family collateral and XAIPART internal cross-reference data.

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EP2SGX90FF40C4N - 90nm Stratix II GX FPGA 90,960 LEs | Altera
EP2SGX90FF40C4N

EP2SGX90FF40C4N - 90nm Stratix II GX FPGA 90,960 LEs | Altera

The Altera (now Intel) EP2SGX90FF40C4N is a Stratix II GX family field-programmable gate array (FPGA) manufactured on a 90 nm process node, integrating 90,960 logic elements, up to 4.5 Mbits of embedded memory, and 12 transceivers operating at up to 6.375 Gbps. Housed in a 1,508-ball flip-chip BGA package with a 1.2 V core supply, the device targets high-speed serial I/O and DSP-intensive applications. What is an FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing, hard IP blocks (transceivers, memory, DSP slices), and I/O cells that the designer programs after manufacture. FPGAs sit above microcontrollers and ASICs in the reconfigurable-logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Stratix II GX devices specifically add multi-gigabit transceivers to position the part as a wire-speed bridge between ASICs/ASSPs and high-speed serial links such as PCIe, Serial RapidIO, XAUI, and Custom ASIC/ASSP protocols. Key specifications include 4.5 Mbits of M512/M4K/M-RAM block memory, 192 18x18-bit hardware multipliers for DSP, 12 embedded transceivers with 6.375 Gbps maximum data rate, and 8 PLLs for clock management. The Enhanced Configuration Devices scheme supports fast passive serial, passive parallel, and JTAG configuration modes, with configuration via EPC devices or a microprocessor. The device integrates a flexible hi-speed serial interface that complies with PCIe 1.0a, Serial RapidIO 1.2, XAUI, and CEI-6G standards. Typical applications include high-speed serial backplanes (XAUI, PCIe), DSP co-processing for wireless baseband, HD-SDI video interfaces, and storage area network bridges. Compared to an MCU, the Stratix II GX delivers deterministic parallel datapaths and hardware multipliers; compared to a general-purpose Stratix II, it adds multi-gigabit transceivers. When designing with this device, dedicate four dedicated SERDES reference-clock inputs and follow Altera's Stratix II GX pin connection guidelines for unused transceiver channels. Maintain the 1.2 V core rail within ±5% and provide a clean 2.5 V PLL analog supply, as PLL noise directly impacts jitter performance. This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Site MPN list, and practical design notes that supplement the manufacturer datasheet.

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EP2SGX90FF40C4NES - Stratix II GX FPGA, 90k LE, 6.375Gbps | Intel (Altera)
EP2SGX90FF40C4NES

EP2SGX90FF40C4NES - Stratix II GX FPGA, 90k LE, 6.375Gbps | Intel (Altera)

The Intel (formerly Altera) EP2SGX90FF40C4NES is a high-density Stratix II GX FPGA from the Stratix II GX family, integrating 90,960 logic elements, embedded SERDES transceivers, and on-chip memory in a 1508-pin FC-FBGA package. The device is built on a 90nm CMOS process and operates from a 1.2V core supply with commercial-extended temperature grading. It includes 4 to 20 high-speed transceiver channels featuring embedded CDR (clock/data recovery) and SERDES capable of data rates up to 6.375 Gbps per channel. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement a wide variety of digital logic functions. FPGAs combine the programmability of a CPLD with the high logic density and performance of an ASIC, placing them in the hierarchy: programmable logic -> semiconductor IC -> logic device. The Stratix II GX extends this by adding multi-gigabit transceivers, positioning it as a platform for high-speed serial I/O applications such as backplanes, bridging, and protocol acceleration. Key differentiating features include up to 4,828 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, on-chip TriMatrix memory with multiple block sizes, and up to 12 transceivers supporting PCI Express, Gigabit Ethernet, Serial RapidIO, XAUI, and other serial protocols. Configuration is supported via JTAG boundary-scan and active serial/parallel configuration schemes, allowing flexible in-system programming for prototyping and production. The architecture pairs a high-performance logic fabric with embedded transceivers operating up to 6.375 Gbps, deterministic latency PLLs, and rich clock networks. On-chip memory and DSP density make it suitable for parallel data-path processing alongside serial I/O aggregation. The 1508-pin FC-FBGA package exposes the full I/O and transceiver count needed for high-bandwidth designs. Typical applications include high-speed serial interface bridging (PCIe, XAUI, Serial RapidIO), telecom backplane aggregation, broadcast video processing, military radar signal processing, ASIC prototyping, and high-end test & measurement instrumentation. Designers frequently use this device when multi-gigabit transceivers and large logic capacity must coexist on a single silicon. When designing with the EP2SGX90FF40C4NES, plan power architecture carefully because the 1.2V core and multiple transceiver/auxiliary rails can exceed 20W under full load. Quartus II is the primary design toolchain, and proper PCB stackup with controlled-impedance lanes is mandatory for transceiver signal integrity. This page synthesizes verified distributor stock, Stratix II GX drop-in equivalents, and Quartus II design considerations not collected in any single vendor datasheet.

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EP2SGX90FF40C5N - Stratix II GX FPGA 90K LE, 40Gbps Tranceivers | Altera
EP2SGX90FF40C5N

EP2SGX90FF40C5N - Stratix II GX FPGA 90K LE, 40Gbps Tranceivers | Altera

The Altera (now Intel) EP2SGX90FF40C5N is a high-density Stratix II GX FPGA delivering 90,960 logic elements, 4,548 LABs, and embedded 6.375 Gbps multi-gigabit transceivers, housed in a 1,508-ball FineLine BGA package with 1.00 mm ball pitch. It features 650 maximum user I/O pins and operates across industrial-grade temperature ranges with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include simple CPLDs. Modern FPGAs like the Stratix II GX integrate hard IP cores (transceivers, memory controllers, DSP blocks, processors) alongside the programmable fabric, allowing system designers to implement custom digital logic, high-speed serial protocols, and parallel processing pipelines on a single chip. Key features of the EP2SGX90FF40C5N include up to 6.375 Gbps embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G; dedicated DSP blocks for high-throughput signal processing; TriMatrix memory with up to ~4.5 Mbits of block RAM; and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also integrates a hard PCIe endpoint and supports up to four PCIe lanes at Gen1 rates. Architecturally, the Stratix II GX uses a 90 nm process node and an ALM-based logic fabric that delivers improved performance and lower power compared to first-generation Stratix. The 6.375 Gbps transceivers feature adaptive equalization and pre-emphasis, enabling reliable serial link operation across backplanes and across long FR-4 PCB traces. Hard IP for PCI Express eliminates the need for soft IP licensing for that interface. Typical applications include 10 Gbps networking line cards, telecom baseband processing, high-speed serial interface bridging (PCIe to SRIO, XAUI conversion), military radar signal processing, and broadcast video transport. Designers also use the EP2SGX90 family for ASIC prototyping where high logic density and large memory bandwidth are required. When designing with this device, pay close attention to PCB BGA breakout routing, decoupling network placement, and transceiver channel utilization. The 1.00 mm ball pitch is workable but still demands 6-8 layer stackup with microvia or via-in-pad technology for clean signal integrity above 5 Gbps. This page synthesizes distributor pricing, drop-in alternatives within the Stratix II GX family, and practical design notes not found in the manufacturer datasheet.

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EP2SGX90FF40C5NES - 90nm Stratix II GX FPGA 90,960 Cells | Altera
EP2SGX90FF40C5NES

EP2SGX90FF40C5NES - 90nm Stratix II GX FPGA 90,960 Cells | Altera

The Altera (now Intel) EP2SGX90FF40C5NES is a high-density Stratix II GX Field-Programmable Gate Array built on a 90 nm CMOS process, integrating 90,960 logic cells (4,828 Configurable Logic Blocks) with embedded transceivers and 1.2 V core operation in a 1,508-pin flip-chip BGA (FC-FBGA) package. It targets high-speed serial I/O and DSP-intensive applications, delivering up to 609.76 MHz core performance, multi-gigabit transceivers, and on-chip memory suitable for wireline, wireless backhaul, and high-end ASIC prototyping designs. The 1.2 V core supply, together with dedicated PLL and I/O banks, allows deterministic performance for clock-sensitive data-path logic. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined at design-time by the user's bitstream rather than at wafer fab. Within the broader programmable-logic hierarchy, the Stratix II GX family sits in the high-performance transceiver-enabled tier: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The 'GX' suffix denotes integrated multi-gigabit transceivers, distinguishing the family from transceiver-less Stratix II 'E' variants and positioning the device above CPLD and low-density FPGA families such as Cyclone II in both logic capacity and serial bandwidth. Key features include 90,960 equivalent logic elements, 4,828 CLBs, embedded transceiver channels capable of multi-gigabit serial rates, dedicated DSP blocks for high-throughput arithmetic, and 90 nm process technology. The Stratix II GX architecture introduces an 'adaptive logic module' (ALM) that combines adaptive LUT and register structures, giving roughly 50 percent greater logic efficiency than previous-generation ALMs. The 1,508-pin FC-FBGA package provides high signal and power-pin density, which is essential for routing the parallel I/O, transceiver lanes, clock tree, and power rails without compromising signal integrity. Architecturally, the device combines a logic fabric of ALMs, embedded M512/M4K/M-RAM memory blocks, and DSP blocks arranged in columns. Multi-gigabit transceivers (CMU channels) sit on the periphery, supporting standard serial protocols and reference-clock forwarding, while PLLs generate the on-chip clocking backbone. The 90 nm process enables higher integration and lower dynamic power per MHz than older 130 nm or 180 nm nodes, although static power at 1.2 V core is non-negligible in dense designs. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, Fibre Channel), wireless baseband signal processing, high-definition video processing, and ASIC prototyping. It is also widely used in telecom line cards, military/aerospace signal processing, and test-and-measurement instrumentation where reconfigurable logic with on-chip transceivers reduces bill of materials. When designing with this device, plan for a robust multi-rail power architecture: 1.2 V core, dedicated PLL analog supply, transceiver supply, and reference-clock supply each require low-noise LDOs and decoupling. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure, and consult the Stratix II GX Device Handbook for transceiver PCB layout guidelines. This page consolidates distributor pricing, package-level information, and design guidance for engineers evaluating the EP2SGX90FF40C5NES, including drop-in alternatives from the Stratix II GX family and comparable high-density FPGAs.

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EP2SGX90GF1020 - Stratix II GX FPGA, 90K LE, 1020-Pin FCBGA | Altera
EP2SGX90GF1020

EP2SGX90GF1020 - Stratix II GX FPGA, 90K LE, 1020-Pin FCBGA | Altera

The Altera (now Intel) EP2SGX90GF1020 is a high-density Stratix II GX FPGA with approximately 90,560 logic elements, up to 4.5 Mbits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 1020-ball FineLine BGA (FCBGA) package. It is built on a 90 nm process and features adaptive logic modules (ALMs) that replace the older 4-input LUT architecture, delivering finer-grained logic packing and higher effective logic density per die area. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing programmable logic blocks, routing interconnect, and embedded hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit within the semiconductor hierarchy as programmable logic devices -> reconfigurable digital ICs -> integrated circuits, and are used for prototyping, signal processing, and ASIC replacement where high parallelism, deterministic latency, or post-fabrication design changes are required. Key features of the EP2SGX90GF1020 include up to 12 transceiver channels at 3.125 Gbps, dedicated hardware multipliers for DSP, support for external memory interfaces including DDR/DDR2/QDRII, and a flexible phase-locked loop (PLL) network with up to 12 PLLs. The Stratix II GX family targets high-speed serial I/O applications such as backplane transceivers, chip-to-chip links, and protocol bridging. Architecture-wise the device uses an ALM-based fabric with eight-input fracturable lookup tables, embedded RAM blocks (M512/M4K/M-RAM tiers), and hard IP for PCI Express (x1/x4) and Gigabit Ethernet MAC. The transceiver blocks include built-in serializer/deserializer (SERDES), 8B/10B encoding, and word alignment, eliminating the need for external physical-layer chips on common protocols. Typical applications include high-speed serial protocol bridging, communications backplane aggregation, military/aerospace signal processing, test and measurement equipment, and video broadcast infrastructure. The integrated transceivers make it especially suitable for Serial RapidIO, XAUI, PCIe, and custom proprietary links. When designing with the EP2SGX90GF1020, plan for a multi-layer PCB (typically 8-12 layers) with controlled-impedance 100-ohm differential traces for transceiver channels and a solid ground reference plane; power decoupling requires multiple bulk and ceramic capacitors placed close to each ball grid array region per Stratix II GX handbook guidance. This page synthesizes distributor pricing tiers, drop-in same-package alternatives, and practical layout notes that are not consolidated in the manufacturer handbook, providing a single reference for engineers evaluating the EP2SGX90GF1020 for new designs or legacy board sustainment.

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EP3C10E144C7 - 10K LLE Cyclone III FPGA | Altera Corporation
EP3C10E144C7

EP3C10E144C7 - 10K LLE Cyclone III FPGA | Altera Corporation

The Altera Corporation EP3C10E144C7 is a Cyclone III field-programmable gate array with 10,320 logic elements, 94 user I/O, 423,936 embedded-memory bits, and a 144-LQFP exposed-pad package. It combines programmable digital logic, embedded memory, PLL support, DSP-oriented embedded multipliers, and serial connectivity in a low-power FPGA platform for industrial, communications, and embedded control systems. The EP3C10E144C7 is programmed through the Quartus II design environment and supports the DSP Builder workflow for designs interfacing with MathWorks Simulink and MATLAB. A field-programmable gate array, or FPGA, is a programmable semiconductor whose digital logic and interconnect resources can be configured after manufacture. An FPGA belongs to the broader logic-device hierarchy and can function as a configurable parallel processor, interface controller, data acquisition engine, or embedded signal-processing system. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic, memory interfaces, and peripheral behavior to be updated by loading a configuration bitstream. The supplied manufacturer and distributor records identify 10,320 logic elements, 94 I/O, 423,936 embedded-memory bits, and the 144-LQFP exposed-pad package as the principal device characteristics. The exposed pad provides a direct thermal path from the FPGA to the PCB copper when the package is properly assembled. Its 94 I/O support connections to external memory, sensors, communications transceivers, converters, and control peripherals, while the embedded multipliers accelerate suitable DSP operations. Cyclone III devices combine configurable logic with on-chip memory resources and dedicated clock-management functions. PLL specifications are described in the Cyclone III device documentation, while the embedded multipliers support DSP applications. Programmable logic allows engineers to implement parallel data acquisition, protocol conversion, state machines, filtering, and control functions in one device instead of combining several fixed-function components. Typical uses include industrial automation, communications infrastructure, embedded instrumentation, video and image processing, digital signal processing, and control systems. The same EP3C10E144C7 can serve as a controller beside external DDR memory, as an interface between sensors and a host processor, or as a dedicated DSP accelerator. Quartus II and DSP Builder provide the design, compilation, and simulation workflow for these systems. A critical implementation consideration is exposed-pad soldering and thermal design. The pad should be connected to a grounded copper area using the manufacturer-recommended land pattern and assembly process. Signal integrity also depends on controlled-impedance routing for external memories and high-speed interfaces, with input/output placement and clock planning performed in the FPGA design tools. This page combines the verified distributor specification, the manufacturer datasheet link, sourcing information, drop-in family comparisons, and practical FPGA implementation guidance. It distinguishes confirmed EP3C10E144C7 data from parameters that require confirmation in the manufacturer device documentation before schematic release or production procurement.

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EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel
EP3C10E144C7N

EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel

The Intel (formerly Altera) EP3C10E144C7N is a low-power, low-cost Cyclone® III Field-Programmable Gate Array (FPGA) delivering 10,320 logic elements, 414 Kbits of embedded memory, and 23 embedded 18x18 multipliers, packaged in a 144-pin LQFP with exposed thermal pad (EQFP-144). It supports up to 94 user I/O pins with four general-purpose PLLs and operates from a 1.15 V to 1.25 V core supply, achieving up to 437.5 MHz internal clock performance. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, signal processing, and interconnect functions through a configurable array of logic elements (LEs), embedded multipliers, block RAM (BRAM), and programmable I/O. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering higher density than CPLDs and far lower NRE cost than ASICs - making them ideal for low- to mid-volume designs, prototyping, and time-to-market-critical applications. Key Cyclone III features include low static and dynamic power (TSMC 65 nm process), support for DDR/DDR2/QDRII memory interfaces, up to four PLLs for clock management, hot-socketing capability, and built-in configuration via JTAG, Active Serial, or Active Parallel modes. The EQFP-144 package supports up to 94 LVDS/LVCMOS user I/Os and a dedicated clock input pin structure. Architecturally, the EP3C10E144C7N combines a fabric of 10,320 LEs organized into Logic Array Blocks (LABs), 23 hardware 18x18 multipliers suited for DSP workloads (FIR, FFT, convolutions), 414 Kbits of M9K block RAM, and 4 PLLs for frequency synthesis and phase shifting. The 65 nm low-power process keeps quiescent current low, making it suitable for thermally constrained or battery-fed systems. Typical applications include industrial motor control, video processing bridges, communication protocol bridging (SPI/I2C/UART to parallel buses), low-density DSP accelerators, embedded controller glue logic, and educational/hobbyist digital-design platforms. The wide package, low price, and free Quartus Prime toolchain make it a popular choice for prototype and small-volume production. When designing with this device, allocate I/O bank voltages carefully (each bank has independent VCCIO rails supporting 1.2V/1.5V/1.8V/2.5V/3.3V), use the dedicated MSEL[3:0] pins to select configuration mode, and follow Intel's power-sequencing recommendations to prevent latch-up. The exposed pad must be soldered to the PCB ground plane for thermal dissipation. This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in replacement analysis from same-brand Cyclone III speed/pinout variants, and practical design notes not consolidated on any single manufacturer or distributor page.

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EP3C10E144C8 - 10K-Cell Cyclone III FPGA | Altera | 144-Lead
EP3C10E144C8

EP3C10E144C8 - 10K-Cell Cyclone III FPGA | Altera | 144-Lead

Altera EP3C10E144C8 is a Cyclone III FPGA with 10,320 logic elements, 94 user I/O, and a 144-lead exposed-pad LQFP package. The device is manufactured on a 65 nm CMOS process and is designed for low-power, cost-sensitive embedded applications requiring programmable logic, parallel interfaces, control, and moderate signal-processing capability. The verified distributor information identifies the EP3C10E144C8 as a Cyclone III Field Programmable Gate Array in a 144-LQFP Exposed Pad package, with 10,320 logic cells and 94 I/O. One distributor listing reports an operating frequency of 472.5 MHz, while another technical listing reports 402 MHz; the available data does not establish the exact speed-grade context for each figure. A field-programmable gate array is a semiconductor whose digital logic and connectivity are configured after fabrication. FPGAs belong to the programmable-logic device hierarchy, combining configurable logic elements, programmable interconnect, memory resources, and user I/O in one device. Compared with a fixed-function microcontroller, the EP3C10E144C8 allows hardware parallelism, custom interface timing, and logic behavior to be changed without changing the PCB. Compared with an application-specific integrated circuit, it offers a shorter path to a customized implementation for prototypes and moderate-volume products. The Cyclone III family combines 10,320 logic elements with a package offering 94 user I/O according to the verified distributor specification. The EP3C10E144C8 includes an exposed thermal pad in the 144-lead package, which requires attention to PCB thermal design and soldering. The device uses 65 nm CMOS technology and is specified as an FPGA with 10,320 cells. Its performance and I/O characteristics make it appropriate for industrial control, communications, instrumentation, consumer electronics, and embedded processing systems. Typical uses include programmable control logic, data acquisition, protocol bridging, sensor aggregation, motor and machine control, and low-cost embedded systems. The parallel structure of an FPGA can reduce dependency on multiple discrete logic devices and can simplify timing-constrained interface designs. Designers should select the correct Cyclone III device, pin assignment, configuration source, and I/O standard for the target board. The key design consideration is that replacing an FPGA is not automatically a drop-in substitution. A candidate must use the same physical package and meet the voltage, configuration, I/O, timing, and pin-mapping requirements of the original design. The EP3C10E144C8 should therefore be evaluated as a board-level device, not merely by logic-cell count. Verify the exact pinout, exposed-pad layout, power rails, decoupling, and configuration scheme against the manufacturer documentation before layout release. This product page consolidates verified distributor specifications, source links, package details, pricing observations, and practical replacement criteria. It also distinguishes confirmed EP3C10 family candidates from candidates whose resource count or grade differs, helping engineers narrow a drop-in replacement without overlooking FPGA-specific compatibility constraints.

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EP3C10E144C8N - 10K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
EP3C10E144C8N

EP3C10E144C8N - 10K LE Cyclone III FPGA, 144-LQFP | Intel / Altera

The Intel / Altera EP3C10E144C8N is a low-cost, low-power Cyclone III Field-Programmable Gate Array (FPGA) providing 10,320 logic elements, 423,936 bits of embedded memory, and 94 user I/O in a 144-pin LQFP Exposed Pad package. Operating at the commercial speed grade 8 with a commercial (0C to +85C) junction temperature rating, this device leverages a 65 nm TSMC process and targets cost-sensitive, high-volume designs where board space, power budget, and unit cost dominate the trade-off matrix. The 'C8' suffix denotes the speed grade, while the 'N' indicates a lead-free, RoHS-compliant package finish, and the '144' prefix specifies the LQFP-144 pin count. Cyclone III FPGAs occupy the entry-to-mid tier of the Altera/Intel programmable logic family hierarchy, sitting below the Cyclone IV and Cyclone V families in process node and absolute performance, but offering an unusually competitive dollar-per-logic-element ratio. The EP3C10E144C8N specifically is positioned for glue logic, custom peripheral interfacing, LED and video signal conditioning, motor control coprocessors, and mid-complexity DSP pipelines. Its built-in 18x18 multipliers, embedded RAM blocks, and PLL-based clock management make it well suited to small signal-processing farms where the flexibility of an FPGA outperforms a fixed-function MCU. The 144-pin LQFP with exposed pad provides a robust thermal path for the device's sub-watt typical power envelope and supports hand-solderable prototyping on 0.5 mm-pitch PCBs. Integrated features include 66 (7 for 9-bit) embedded 18x18 multipliers, two PLLs, and up to 414 Kbits of M9K block RAM distributed across the fabric. Designers benefit from Quartus II / Quartus Prime support, a mature IP library, and reference designs covering Nios II soft-core integration. Typical applications include industrial control and machine vision front-ends, low-cost video processing (e.g., LCD timing controllers and HDMI bridge boards), consumer electronics requiring custom I/O expansion, low-bandwidth software-defined radio front-ends, and educational / university FPGA training platforms. The exposed-pad LQFP package is especially useful for designs that need a 1.0 mm-pitch SMT footprint without the routing complexity of fine-pitch BGA alternatives. When designing with this part, allocate adequate copper area under the exposed pad for thermal dissipation and ensure I/O bank voltages match the 1.2 V / 2.5 V / 3.3 V supported standards. Engineers migrating from Cyclone II should note the 65 nm process change and updated configuration scheme, which requires a fresh Quartus project compilation. According to the Altera Cyclone III Device Handbook, configuration is supported via JTAG, Active Serial (EPCS), or Passive Serial modes, with dedicated MSEL[3:0] strap pins selecting the mode at power-up.

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EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
EP3C10E144I7

EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel

The Intel (formerly Altera) EP3C10E144I7 is a low-cost Cyclone III FPGA delivering 10,320 logic elements, 423,936 bits of embedded memory, and 23 embedded 18x18 multipliers in a 144-pin EQFP/LQFP-Exposed-Pad package. Built on a 65nm process and rated for the industrial temperature range (-40C to +100C), the device targets cost-sensitive high-volume applications where FPGAs were previously uneconomical. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the programmable logic domain, which itself belongs to the larger class of logic ICs and integrated circuits. Cyclone III devices specifically position the FPGA as a low-power, low-cost alternative to ASICs for volume production in industrial, consumer, and automotive subsystems. Key features of the EP3C10E144I7 include 10,320 logic elements, 46 M9K memory blocks totaling 414 Kbits, 23 dedicated 18x18 hardware multipliers for DSP workloads, and 94 user I/O pins with support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI. The device includes four phase-locked loops (PLLs) for clock management and supports configuration via JTAG, Active Serial, or Active Parallel modes. The 144-LQFP package with exposed pad provides a thermal path for moderate-power dissipation and is suitable for both hand-soldered prototypes and automated SMT assembly. Cyclone III architecture uses a four-input LUT-based logic element, embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO, and dedicated multiplier blocks for high-performance DSP pipelines. The device supports Nios II embedded processor soft cores, enabling fully integrated microcontroller-plus-custom-logic solutions on a single chip. Fabric routing is implemented in a hierarchical interconnect optimized for the 65nm process node, providing a balance of speed and density at very low static power. Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (PCI to local bus, UART to memory), consumer display controllers, and education/DIY development platforms. The Cyclone III family is also widely used as a prototyping vehicle before migrating designs to lower-cost Cyclone IV or Cyclone V derivatives, or to HardCopy III structured ASICs for high-volume production. When designing with the EP3C10E144I7, ensure proper decoupling (100nF plus 10uF bulk per supply rail) and that the exposed thermal pad is soldered to a sufficiently large copper pour to achieve the rated thermal performance. Plan configuration mode pins (MSEL) and JTAG chain ahead of PCB layout, since re-spinning a 144-pin LQFP is significantly more expensive than addressing configuration issues during schematic capture. This page synthesizes distributor pricing, drop-in FPGA alternatives (e.g., EP3C10E144C7N, EP3C10E144C8N), practical design notes, and pinout references not consolidated in the manufacturer datasheet alone.

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EP3C10E144I7N - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
EP3C10E144I7N

EP3C10E144I7N - Cyclone III FPGA, 10K LE, 144-LQFP | Intel

The Intel (formerly Altera) EP3C10E144I7N is a low-power, low-cost Cyclone® III Field Programmable Gate Array (FPGA) built on a 65nm CMOS process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 66 (9x9) multipliers, housed in a 144-pin LQFP package with exposed thermal pad. Key features include 94 user I/O pins, two general-purpose PLLs, 23 embedded 18x18 multipliers, 46 M9K memory blocks, and a core supply of 1.2V with I/O supply supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates at a maximum internal clock frequency of approximately 472.5 MHz, supported by Cyclone III's low static and dynamic power architecture. The Cyclone III family (EP3C family) is a programmable logic device sitting in the broader hierarchy of FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks (CLBs/LEs), programmable interconnect, embedded memory, and dedicated hardware such as PLLs and multipliers, enabling parallel hardware acceleration, custom peripheral interfacing, and glue-logic integration. The Cyclone III family in particular targets cost-sensitive, power-sensitive applications where higher-end Stratix devices are over-specified. This specific variant EP3C10E144I7N is the 144-LQFP / EQFP-144 commercial-grade option, with the 'I7' suffix indicating the industrial temperature range (-40°C to +100°C junction), and the 'N' suffix denoting lead-free / RoHS-compliant packaging. The 144-LQFP footprint enables low-cost PCB assembly using standard SMT lines, making it attractive for industrial control, motor drive, video processing, and consumer designs. Typical applications include industrial motor control (using the embedded multipliers for FOC algorithms), video surveillance image processing, automotive infotainment prototyping, low-cost software-defined radio front-ends, and display controllers for industrial HMMIs. The device's embedded M9K memory blocks efficiently buffer video line storage, while the PLLs synthesize the pixel clock from an external reference. When designing with this FPGA, pay attention to the bank-by-bank I/O supply voltage configuration, use the Quartus II (or newer Quartus Prime) toolchain for synthesis, place decoupling capacitors near each VCCINT/VCCIO supply pin, and follow the exposed-pad PCB layout guideline for the EPAD thermal dissipation pad. Consider migrating to the Cyclone IV E (EP4CE10) family for new designs because Cyclone III is approaching end-of-life. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that complement - but do not duplicate - the manufacturer datasheet.

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EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel
EP3C10F256C6

EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel

The Intel (Altera) EP3C10F256C6 is a low-cost, low-power Cyclone III FPGA delivering 10,320 logic elements, 423,936 bits of embedded memory, and 182 user I/Os in a 256-ball FineLine BGA (FBGA-256) package. It is built on a 60 nm process and is targeted at cost-sensitive applications where the high transceiver count and transceiver rate of mid-range Cyclone IV/V devices are unnecessary, but where a flexible programmable fabric is still required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure the device's logic blocks, routing, and I/O behavior after manufacture. Within the programmable logic hierarchy, FPGAs sit at the top, above CPLDs (Complex Programmable Logic Devices), and are used to implement everything from simple glue logic to complete processor subsystems, DSP pipelines, and high-speed interface bridges. Key features of the EP3C10F256C6 include 23 embedded 18x18 multipliers, 2 PLLs for clock management, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and a core voltage range that enables operation from typical 1.15 V to 1.25 V supplies with I/O voltages scalable to 3.3 V. It uses SRAM-based configuration, requiring an external configuration memory such as the EPCS4 or EPCS16 serial flash, and supports JTAG and Active Serial (AS) configuration modes. The device is fabricated on TSMC's 60 nm low-power process and consumes approximately 120 mW of static power under typical conditions, with dynamic power scaling with toggle rate and design utilization. Designers can use the free Quartus II Web Edition (and later Intel Quartus Prime Lite) toolchain to synthesize, place-and-route, and program the device using Verilog HDL or VHDL. Typical applications include industrial motor control, video processing bridges, low-cost I/O expansion, custom interface converters (UART to parallel, SPI to LVDS), test and measurement instrumentation, and educational or prototyping boards. The 256-FBGA package offers sufficient I/O density for mid-complexity designs while remaining hand-reworkable with proper hot-air rework equipment. When designing with this part, pay careful attention to decoupling: place 100 nF and 10 uF capacitors within 5 mm of every VCCINT and VCCIO pin pair, and follow Altera's Cyclone III hardware design guide for the PCB footprint. The configuration scheme (AS vs JTAG) must be selected via MSEL[3:0] pins during board bring-up. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Quartus II design notes that complement - rather than duplicate - the manufacturer datasheet.

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EP3C10F256C6N - Cyclone III FPGA, 10K LE, 256-BGA | Intel / Altera
EP3C10F256C6N

EP3C10F256C6N - Cyclone III FPGA, 10K LE, 256-BGA | Intel / Altera

The Intel (formerly Altera) EP3C10F256C6N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine BGA package. It integrates 10,320 logic elements (LEs), 423,936 bits of embedded memory, and 182 user I/O pins, delivering a balanced logic/memory ratio for cost-sensitive programmable logic designs. The device is fabricated on TSMC's 65 nm low-power process and targets static power consumption roughly 25 percent lower than the previous Cyclone II generation, making it well suited to thermally constrained embedded systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as block RAM, DSP multipliers, and high-speed transceivers. The FPGA occupies the top of the programmable logic hierarchy, sitting between fixed-function ASICs and software-driven microcontrollers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include older CPLD architectures; an FPGA provides finer-grained logic, more embedded memory, and parallel DSP capability, while a CPLD delivers faster, deterministic non-volatile boot. In a complete embedded system, an FPGA typically handles parallel data-path processing, custom interface bridging, or hardware acceleration alongside a host processor. Key features of the EP3C10F256C6N include 182 maximum user I/Os supporting LVTTL, LVCMOS, SSTL, and differential LVDS signalling, two PLL blocks for flexible clock synthesis, and an on-chip configuration controller that supports JTAG (IEEE 1149.1), Active Serial (AS), and Active Parallel (AP) configuration modes. The device also provides up to 46 embedded 18x18 multipliers for DSP, supporting common fixed-point filtering and FFT workloads without external arithmetic accelerators. Architecturally, the Cyclone III device is built around LABs (Logic Array Blocks) containing 16 LEs each, routed through a multi-level interconnect with predictable timing closure. Hard IP blocks include M9K memory blocks (each 9 Kbit) that can be cascaded to implement FIFO, ROM, RAM, or dual-port buffers. Two dedicated PLLs provide frequency synthesis, phase shifting, and clock de-skew, simplifying board-level clock-tree design for protocols such as DDR/DDR2 SDRAM. Typical applications include industrial control and motor-drive interfaces, video/display bridging and image preprocessing, low-cost software-defined radio (SDR) baseband blocks, ASIC prototyping, and custom peripheral expansion for microcontrollers. The wide I/O count also makes it suitable for parallel data acquisition, custom bus bridges, and educational development boards. When designing with the EP3C10F256C6N, supply all four VCCINT/VCCIO banks with properly decoupled bulk and ceramic capacitors, and route configuration signals (nCONFIG, nSTATUS, CONF_DONE) carefully away from switching I/O to avoid false reconfiguration. Leave at least 30 percent of logic utilization free for place-and-route closure, and verify pin assignments in Quartus II pin-planner before layout sign-off. This page synthesises distributor pricing as of 2026-09-09, drop-in alternative candidates, and practical design notes not collated in the manufacturer datasheet, giving procurement and design engineers an AEO-optimised reference in one place.

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EP3C10F256C7 - 10,320-L Logic Element Cyclone III FPGA | Altera
EP3C10F256C7

EP3C10F256C7 - 10,320-L Logic Element Cyclone III FPGA | Altera

Altera EP3C10F256C7 is a Cyclone III field-programmable gate array with 10,320 logic elements, 423,936 memory bits, and 182 user I/O in a 256-LBGA package. It operates from a 1.15 V to 1.25 V supply and supports operation from -40 C to +125 C, making it suitable for industrial, communications, control, and embedded-processing systems. An FPGA is a programmable digital integrated circuit containing configurable logic, memory, and I/O blocks. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA allows designers to implement parallel processing, interface bridging, protocol handling, and custom control logic in one device. The EP3C10F256C7 belongs to the Cyclone III product family, positioned between small CPLDs and larger FPGAs. Principal device attributes include 10,320 logic elements, a listed 402 MHz switching-rate figure, 182 I/O, embedded PLL capability, and 423,936 memory bits. Its 256-LBGA package provides a dense surface-mount footprint for multilayer printed circuit boards. The listed operating-temperature range of -40 C to +125 C supports temperature-tolerant industrial deployments when the complete board, power system, and external components are also qualified. Programming and configuration determine the logic implemented in the FPGA's programmable fabric. Designers should verify power sequencing, configuration interface timing, bank-supply requirements, clocking, and I/O standards against the complete Cyclone III device documentation for the selected density, speed grade, and package. Because a BGA package does not expose a conventional lead-by-lead schematic symbol, board layout, via-in-pad requirements, solder-mask design, and assembly profiles should be validated against the official package data. Typical uses include industrial control and data acquisition, communications line cards, parallel sensor aggregation, embedded video or image processing, protocol bridges, and programmable logic for test equipment. The 182 available I/O permit simultaneous connections to external converters, memories, transceivers, and microcontrollers, while the internal logic and memory blocks support parallel pipelines and state-machine-intensive designs. A critical design consideration is that logic, memory, PLL, and I/O resources must be verified against the target clock rate before schematic capture. Engineers should also confirm configuration flash or cable compatibility, provide decoupling close to each supply ball, and plan thermal and via routing for the 256-ball footprint. This product page consolidates verified distributor specifications, source-linked pricing, same-package replacement candidates, and practical FPGA integration considerations that are not presented together in a single manufacturer datasheet.

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EP3C10F256C8 - 10,320-Cell FPGA, 182 I/O | Intel | Industrial
EP3C10F256C8

EP3C10F256C8 - 10,320-Cell FPGA, 182 I/O | Intel | Industrial

The Intel EP3C10F256C8 is a Cyclone III field-programmable gate array (FPGA) with 10,320 logic elements, 182 user I/O, and a 256-LBGA package. It is manufactured on 65 nm technology and is associated with a 402 MHz device performance figure and a 1.2 V core supply in the verified comparison data. A field-programmable gate array is a reconfigurable digital semiconductor that belongs to the FPGA family of programmable logic devices. An FPGA sits within the broader hierarchy of programmable logic ICs, semiconductor integrated circuits, and digital logic devices. Unlike a fixed application-specific integrated circuit, an FPGA allows engineers to implement digital logic, interfaces, and parallel processing functions through a programmable configuration rather than a custom ASIC layout. The EP3C10F256C8 combines 10,320 logic elements with 182 I/O in a compact 256-LBGA package. These figures make it suitable for systems requiring a substantial programmable-logic resource count without moving to a larger FPGA. The 65 nm process generation reflects the Cyclone III family’s emphasis on power efficiency and moderate system cost. The listed 402 MHz performance and 1.2 V core voltage provide concrete references for clocking and power-design planning. The 182-I/O configuration is particularly useful for parallel buses, data converters, memory interfaces, industrial control logic, and communication peripherals. Because the device is supplied in a ball-grid-array package, PCB layout must include escape routing, via-in-pad considerations, and thermal analysis. Its 256 terminals provide the physical connection density required by a high-I/O device, although the exact function assigned to each ball is determined by the completed design and pin assignment. Typical Cyclone III FPGA applications include industrial automation, embedded control, networking infrastructure, communications equipment, and test-and-measurement systems. The device can consolidate control logic, interface adaptation, and parallel processing that might otherwise require several programmable or fixed-function devices. Engineers must still confirm whether a specific protocol, memory interface, clocking arrangement, and I/O standard are supported by the selected Cyclone III variant. A key design consideration is that the 1.2 V core requirement must be separated from any external interface supplies required by the board. Decoupling, clock jitter, I/O standards, configuration storage, and thermal performance should be validated against the manufacturer datasheet before layout release. Because the verified data does not provide a complete pricing table, detailed timing grades, or the complete 256-ball pin map, those values should be confirmed with the manufacturer or an authorized distributor before procurement.

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EP3C10F256C8N - 10K LEs, 182 I/O Cyclone III FPGA | Altera/Intel
EP3C10F256C8N

EP3C10F256C8N - 10K LEs, 182 I/O Cyclone III FPGA | Altera/Intel

The Altera (now Intel) EP3C10F256C8N is a Cyclone III family low-power FPGA with 10,320 logic elements, 423,936 bits of embedded RAM, 182 user I/Os, and 645 logic array blocks (LABs), housed in a 256-pin FineLine BGA package measuring 17 mm x 17 mm x 1.8 mm. It supports a 1.15 V to 1.25 V core supply (1.2 V nominal) and a maximum internal operating frequency of 402 MHz, targeting cost-sensitive high-volume applications. What is a Cyclone III FPGA? Cyclone III is the third-generation low-power FPGA family from Altera/Intel fabricated on a 60 nm process, sitting in the broader taxonomy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> low-power FPGA -> SRAM-based FPGA -> semiconductor IC. It is engineered specifically for low static and dynamic power dissipation while integrating sufficient logic, memory and DSP resources to displace ASICs and ASSPs in volume production. Key features of the EP3C10F256C8N include 23 embedded 18 x 18 multipliers (about 0.5 M Gates of equivalent logic), support for external memory interfaces such as DDR/DDR2/QDRII SRAM, embedded PLL-based clock management, Nios II soft-core processor compatibility, and the standard Altera Quartus II design flow. The device is RoHS-compliant, lead-free, and operates over the commercial 0 C to 85 C junction temperature range. Technically, the EP3C10F256C8N integrates 10,320 logic elements organized into 645 LABs, 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18 x 18 multipliers for DSP, and four PLLs. The 256-pin FineLine BGA provides 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL and other single-ended and differential I/O standards with hot-socketing capability and configurable drive strength. Typical applications include industrial motor control, video processing and display bridges, automotive infotainment (non-safety), consumer electronics control planes, communications line cards, and cost-optimized ASIC replacement. Its low power and high logic density at sub-$30 unit pricing make it suitable for both prototyping and volume production. When designing with this part, plan the power distribution network around the 1.2 V core and per-bank I/O supplies, and use the Altera Quartus II development environment for synthesis, place-and-route, and timing closure. Ensure the PCB BGA layout follows Intel's recommended 1 mm pitch escape routing and that decoupling capacitors are placed as close to the package as possible. This page synthesizes distributor pricing, verified cross-references within the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a faster path to selection.

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EP3C10F256I7 - 10,320 LCE 256-LBGA FPGA | Intel
EP3C10F256I7

EP3C10F256I7 - 10,320 LCE 256-LBGA FPGA | Intel

Intel EP3C10F256I7 is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O pins, and 423,936 embedded memory bits in a 256-LBGA package. The device is supplied in an industrial temperature grade covering -40°C to +125°C and uses a lead-free surface-mount configuration. It combines programmable logic, embedded RAM, and configurable I/O in one package for compact digital control, communications, signal processing, and embedded-system designs. An FPGA is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. In the product hierarchy, the EP3C10F256I7 belongs to the FPGA and CPLD class, combines with programmable logic and fixed-function blocks to form a programmable digital IC, and ultimately falls within the broader semiconductor category. Cyclone III devices support parallel hardware implementation for designs that require deterministic operation, flexible pin assignment, and field-updatable configurations. The principal verified features of this device are its 10,320 logic cells, 182 available I/O pins, 423,936 embedded memory bits, and 256-LBGA package. The industrial temperature range supports operation from -40°C through +125°C. Its 256-ball grid supports dense PCB routing while providing 182 external I/O connections. The lead-free construction and surface-mount form also align the part with modern electronics manufacturing requirements, although complete environmental and qualification declarations must be confirmed from current manufacturer documentation. Architecturally, the part consolidates combinational and sequential programmable logic with embedded memory resources. This allows designers to implement parallel datapaths, control logic, protocol bridges, and fixed-function digital blocks without relying exclusively on a microcontroller. Compared with a soft processor implemented entirely in programmable logic, the dedicated 10,320 logic-cell and 182-I/O resource set allows the FPGA fabric to be allocated according to the target workload. Typical applications include industrial automation controllers, communications infrastructure, sensor and motion-control systems, embedded video processing, and general-purpose digital prototyping. The 182-I/O count is particularly useful for designs requiring multiple buses, parallel data acquisition, or mixed control and communication interfaces. The -40°C to +125°C industrial grade also makes the device suitable for temperature-ruggedized equipment where appropriate system-level qualification is performed. Design planning must include PCB layout for all 256 package balls even though the verified device specification identifies 182 I/O pins. Signal-integrity review, decoupling, power-supply sequencing, configuration-data implementation, and thermal analysis should follow the relevant Cyclone III hardware guidance. Confirm the exact power rails, supported I/O standards, configuration requirements, and absolute maximum ratings in the current Intel datasheet before schematic release. This product record consolidates verified distributor and manufacturer-page information with package, procurement, and engineering-selection context. It also highlights where additional data is required so engineers can distinguish confirmed EP3C10F256I7 characteristics from parameters that still require validation against the applicable device documentation.

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