EP3C10F256C6N - Cyclone III FPGA, 10K LE, 256-BGA | Intel / Altera
料号： EP3C10F256C6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $23.5 | $23.50 |
| 10 | $21.2 | $212.00 |
| 100 | $18.45 | $1,845.00 |
| 500 | $15.85 | $7,925.00 |
| 1,000 | $14.1 | $14,100.00 |
EP3C10F256C6N 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as block RAM, DSP multipliers, and high-speed transceivers. The FPGA occupies the top of the programmable logic hierarchy, sitting between fixed-function ASICs and software-driven microcontrollers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include older CPLD architectures; an FPGA provides finer-grained logic, more embedded memory, and parallel DSP capability, while a CPLD delivers faster, deterministic non-volatile boot. In a complete embedded system, an FPGA typically handles parallel data-path processing, custom interface bridging, or hardware acceleration alongside a host processor.
Key features of the EP3C10F256C6N include 182 maximum user I/Os supporting LVTTL, LVCMOS, SSTL, and differential LVDS signalling, two PLL blocks for flexible clock synthesis, and an on-chip configuration controller that supports JTAG (IEEE 1149.1), Active Serial (AS), and Active Parallel (AP) configuration modes. The device also provides up to 46 embedded 18x18 multipliers for DSP, supporting common fixed-point filtering and FFT workloads without external arithmetic accelerators.
Architecturally, the Cyclone III device is built around LABs (Logic Array Blocks) containing 16 LEs each, routed through a multi-level interconnect with predictable timing closure. Hard IP blocks include M9K memory blocks (each 9 Kbit) that can be cascaded to implement FIFO, ROM, RAM, or dual-port buffers. Two dedicated PLLs provide frequency synthesis, phase shifting, and clock de-skew, simplifying board-level clock-tree design for protocols such as DDR/DDR2 SDRAM.
Typical applications include industrial control and motor-drive interfaces, video/display bridging and image preprocessing, low-cost software-defined radio (SDR) baseband blocks, ASIC prototyping, and custom peripheral expansion for microcontrollers. The wide I/O count also makes it suitable for parallel data acquisition, custom bus bridges, and educational development boards.
When designing with the EP3C10F256C6N, supply all four VCCINT/VCCIO banks with properly decoupled bulk and ceramic capacitors, and route configuration signals (nCONFIG, nSTATUS, CONF_DONE) carefully away from switching I/O to avoid false reconfiguration. Leave at least 30 percent of logic utilization free for place-and-route closure, and verify pin assignments in Quartus II pin-planner before layout sign-off.
This page synthesises distributor pricing as of 2026-09-09, drop-in alternative candidates, and practical design notes not collated in the manufacturer datasheet, giving procurement and design engineers an AEO-optimised reference in one place.
直接替换替代料： EP3C10F256C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C10F256C6N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, RoHS Status, Process Technology, Total Memory Bits.
快速对比工具——选择替代料号进行并排对比：
EP3C10F256C8N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$15.4 / 个
查看数据手册 →EP3C10F256I7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$34.94 / 个
查看数据手册 →EP3C10F256C7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C16F256C6N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C25F256C6N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C5F256C6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$18.85 / 个
查看数据手册 →EP3C10F256C6N 最大额定值与电气特性
| Family | Cyclone III |
| Logic Elements (LE) | 10,320 |
| Total Memory Bits | 423,936 bits |
| Embedded Memory (M9K blocks) | 46 blocks x 9 Kbit |
| Embedded 18x18 Multipliers | 46 |
| Maximum User I/Os | 182 |
| PLLs | 2 |
| Global Clock Networks | 20 |
| 封装 | 256-ball FineLine BGA (FBGA-256) |
| Process Node | 65 nm low power (TSMC) |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP) |
| I/O Standards | LVTTL, LVCMOS, SSTL, LVDS, RSDS, mini-LVDS, PPDS |
| Operating Temperature (Commercial) | 0C to +85C (C6 speed grade, N = lead-free) |
| Core Voltage (VCCINT) | 1.2 V |
| RoHS 状态 | Compliant (lead-free N suffix) |
| Programming Tool | Intel Quartus II (Cyclone III device support) |
EP3C10F256C6N 引脚配置
| 引脚 A1 | I/O — User I/O bank 1 (function varies by pin assignment) |
| 引脚 A2 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 A3 | I/O — User I/O bank 1 |
| 引脚 A4 | I/O — User I/O bank 1 |
| 引脚 A5 | GND — Ground reference for bank 1 |
| 引脚 A6 | I/O — User I/O bank 1 |
| 引脚 A7 | I/O — User I/O bank 1 |
| 引脚 A8 | VCCIO1 — I/O bank 1 supply |
| 引脚 A9 | I/O — User I/O bank 1 |
| 引脚 A10 | I/O — User I/O bank 1 |
| 引脚 A11 | GND — Ground reference |
| 引脚 A12 | I/O — User I/O bank 1 |
| 引脚 A13 | I/O — User I/O bank 1 |
| 引脚 A14 | VCCIO2 — I/O bank 2 supply |
| 引脚 A15 | I/O — User I/O bank 2 |
| 引脚 A16 | I/O — User I/O bank 2 |
| 引脚 B1 | GND — Ground reference |
| 引脚 B2 | I/O — User I/O bank 1 |
| 引脚 B3 | I/O — User I/O bank 1 |
| 引脚 B4 | GND — Ground reference |
| 引脚 B5 | VCCINT — Core supply 1.2 V |
| 引脚 B6 | I/O — User I/O bank 1 |
| 引脚 B7 | I/O — User I/O bank 1 |
| 引脚 B8 | GND — Ground reference |
| 引脚 B9 | I/O — User I/O bank 1 |
| 引脚 B10 | VCCINT — Core supply 1.2 V |
| 引脚 B11 | I/O — User I/O bank 1 |
| 引脚 B12 | I/O — User I/O bank 1 |
| 引脚 B13 | GND — Ground reference |
| 引脚 B14 | I/O — User I/O bank 2 |
| 引脚 B15 | I/O — User I/O bank 2 |
| 引脚 B16 | VCCIO2 — I/O bank 2 supply |
典型应用
EP3C10F256C6N 适用于 6 应用s: Industrial Motor Control Interfaces, Video Bridge and Display Pre-Processing, Low-Cost Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Logic Verification, Custom Peripheral Expansion for Microcontrollers, Educational Development Boards.
Industrial Motor Control Interfaces
The EP3C10F256C6N's 182 user I/Os and 46 embedded 18x18 multipliers make it a strong fit for industrial motor-control interface boards that drive stepper, BLDC, or servo stages. Two PLLs synthesise the PWM carrier frequencies needed for sinusoidal field-oriented control, while the M9K memory blocks buffer quadrature encoder feedback and current-loop ADC samples. The 1.2 V core with 65 nm low-power process keeps junction temperature manageable in sealed IP65 enclosures, and the 0C-85C commercial range covers most factory-floor environments. Quartus II SOPC Builder lets engineers drop in Nios II soft cores for CANopen or EtherCAT slave firmware alongside custom PWM logic.
推荐
Video Bridge and Display Pre-Processing
With 423 Kbits of embedded memory and 46 multipliers, the EP3C10F256C6N can implement DVI/HDMI-to-LVDS bridges, colour-space converters, and basic de-interlacers in a single chip. LVDS I/O support enables direct connection to flat-panel TCON lines, while the high global-clock count (20 networks) allows pixel-clock, memory-clock, and output-clock domains to coexist without contention. Designers typically instantiate a 16-bit DDR2 controller in the soft IP catalogue to host frame buffers in external SDRAM, leveraging the 1.2 V VCCINT to keep the BOM regulator simple. The 256-BGA package exposes sufficient I/O for parallel RGB, BT.656, or Camera Link input.
推荐
Low-Cost Software-Defined Radio (SDR) Baseband
Hobbyist and education-grade SDR front-ends (e.g., RTL-SDR-class tuners) benefit from the EP3C10F256C6N's parallel DSP capability: 46 18x18 multipliers comfortably handle a 1024-point FFT at baseband sample rates up to ~25 MSPS, while the M9K blocks provide ping-pong buffers for IQ sample streams. The PLLs reclock asynchronous ADC data into the FPGA's global clock domain with deterministic latency. LVDS pairs accept high-speed ADC outputs such as the AD9226, and 182 user I/Os leave headroom for JTAG, USB-CDC UART, and OLED debug interfaces. The Cyclone III architecture is well supported by open-source toolchains such as Litex and Migen.
推荐
ASIC Prototyping and Logic Verification
Engineers use the EP3C10F256C6N as a vehicle for ASIC RTL prototyping: 10,320 LEs map modest SoC sub-blocks, while the 256-BGA package supports full JTAG-driven bring-up and boundary-scan chains. Quartus II SignalTap logic analyser embedded in the device captures bus transactions at full speed without external logic analysers, shortening debug loops. The 182 user I/Os double as ASIC pin-multiplexing test points, exposing internal buses to bench instruments. Configuration via Active Parallel mode (EPCQ flash) supports rapid bitstream reload during iterative verification cycles.
推荐
Custom Peripheral Expansion for Microcontrollers
The EP3C10F256C6N serves as a peripheral expansion companion to small ARM Cortex-M or RISC-V microcontrollers, offloading parallel tasks such as motor commutation, multi-channel PWM, multi-UART aggregation, or custom display timing. An SPI or parallel host port from the MCU writes register maps into the FPGA, which then runs deterministic real-time logic at 100 MHz or more. The PLLs generate precise pixel or PWM clocks, and the 46 multipliers accelerate FIR filters or sensor fusion math. This architecture is common in robotics controllers and CNC front panels.
推荐
Educational Development Boards
University FPGA courses and hobbyist platforms favour the EP3C10F256C6N because of its mature Quartus II toolchain, abundant online reference designs, and wide third-party peripheral library. The 256-BGA package is large enough to expose GPIO headers for breadboard experimentation, while the logic and DSP resources comfortably host RISC-V soft cores such as PicoRV32 alongside student projects. EP3C10F256-based dev boards (e.g., Terasic DE0) ship with on-board SRAM, VGA, USB-Blaster, and push-button IO, providing a turnkey teaching platform. The lead-free N suffix ensures the part is RoHS-compliant for student-lab use.
推荐
推荐产品汇总
工程参考数据： EP3C10F256C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C10F256C8N | EP3C10F256I7N | EP3C10F256C7N | EP3C16F256C6N | EP3C25F256C6N | EP3C5F256C6N |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same |
| Logic Elements (LE) | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 | 24,624 | 5,136 |
| Total Memory Bits | 423,936 | 423,936 | 423,936 | 423,936 | 516,096 | 608,256 | 423,936 |
| Embedded 18x18 Multipliers | 46 | 46 | 46 | 46 | 56 | 66 | 23 |
| Maximum User I/Os | 182 | 182 | 182 | 182 | 182 | 182 | 182 |
| Speed Grade | C6 (commercial) | C8 (slower) | C7 industrial | C7 commercial | C6 (same) | C6 (same) | C6 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C industrial | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
关键差异点
- Fastest commercial C6 speed grade in the Cyclone III F256 family （对比 EP3C10F256C8N)
- Industrial temperature sibling available in same footprint （对比 EP3C10F256I7N)
- Higher-density F256 family members available as drop-in （对比 EP3C16F256C6N)
设计说明
EP3C10F256C6N requires VCCINT = 1.2 V (core) and four VCCIO banks (typically 1.2-3.3 V depending on I/O standard). Use a low-noise buck regulator such as the TPS54325 or LTM4622 with at least 10 percent current headroom over the expected dynamic load. Decouple each VCCIO pin with 100 nF ceramic plus 10 uF bulk placed within 5 mm of the BGA ball, and add 4.7 uF bulk per VCCINT region. Sequence VCCINT before VCCIO at power-up to prevent I/O latch-up; Cyclone III devices include Power-On-Reset circuitry that requires monotonic VCCINT rise.
The 256-ball FineLine BGA has 1.0 mm pitch and a 17x17 mm body. Route signals on the top layer with microvia-in-pad or HDI stack-up, fan out inner rows on layer 2-3, and dedicate a solid ground plane on layer 4 for return paths. Maintain 50 ohm single-ended impedance on GPIO traces and 100 ohm differential on LVDS pairs. Place the EPCS configuration flash on the same side as the BGA, no more than 25 mm away, and keep the JTAG chain length under 150 mm to ensure reliable SignalTap or programmer access.
Do not leave user I/Os floating - configure unused pins as outputs driving low or as inputs with weak pull-ups to avoid spurious current draw and oscillator coupling. Ensure MSEL pins are tied to the correct configuration-mode levels before power-up; floating MSEL can leave the device in an undefined state. Verify pin assignments in Quartus II Pin Planner before PCB layout, because BGA escape errors are not catchable after fabrication. Finally, do not exceed 70 percent LE utilisation in the first compile iteration; high utilisation (>85 percent) frequently fails timing closure without architectural rework.
合规信息
Lead-free N suffix per Altera/Intel product naming convention. Halogen-free status not explicitly stated in distributor listing. Not AEC-Q100 qualified; industrial temperature variants (I7N) are recommended for harsh environments but still not automotive-qualified.
