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EP3C25Q240I8N - Cyclone III FPGA, 25K LEs, 240-Pin PQFP | Intel (Altera)
EP3C25Q240I8N

EP3C25Q240I8N - Cyclone III FPGA, 25K LEs, 240-Pin PQFP | Intel (Altera)

The Intel (formerly Altera) EP3C25Q240I8N is a Cyclone III low-cost Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP / FQFP) package with gull-wing leads, offering 24,624 logic elements, 66,432 total registers, and 24624 logic cells organized into 1,539 Configurable Logic Blocks (CLBs). The device operates from a 1.2 V nominal core supply and is rated for the industrial temperature range of -40C to +100C, making it well suited to factory-floor, outdoor, and ruggedized embedded applications. As a member of the Cyclone III family, the EP3C25 occupies the low-power, low-cost tier of Altera's 65 nm FPGA portfolio, balancing logic density, on-chip memory, and DSP block count at a price point optimized for volume production. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hardware blocks such as multipliers and block RAM into a single semiconductor IC. Within the broader taxonomy, FPGAs sit alongside microcontrollers and ASICs as flexible compute substrates: an FPGA is more power-efficient than a CPU at fixed parallel workloads, and faster to deploy than an ASIC at low-to-medium volumes. Cyclone III devices specifically target cost-sensitive applications such as industrial control, video bridging, and consumer electronics where designers need hardware-level parallelism without ASIC NRE cost. Key features of the EP3C25Q240I8N include 594 Kbits of embedded RAM distributed across M9K blocks, 66 embedded 18x18 multipliers for DSP operations, up to 148 maximum user I/O pins, and support for common configuration schemes including JTAG, Active Serial, and Passive Serial. The 240-pin PQFP body is surface-mountable but retains through-hole-style lead footprints, simplifying prototyping on 2-layer boards and hand-rework for low-volume builds. The Cyclone III architecture also embeds PLLs for clock management and supports LVDS, LVTTL, SSTL, and other I/O standards directly from the core without external transceivers. Typical applications include industrial motor control, video processing and image aggregation, low-cost software defined radio front-ends, factory automation backplanes, and bridge logic between legacy microcontrollers and modern high-speed buses. The combination of 24K logic elements with on-chip DSP multipliers is enough to implement H.264 encoding engines, multi-channel UART bridges, or a soft RISC-V core alongside customer-specific glue logic. Industrial -40C to +100C rating and the easy-to-solder PQFP package make this device attractive for long-life industrial designs. When designing with the EP3C25Q240I8N, allocate at least four PCB layers for proper power-plane decoupling of the 1.2V VCCINT rail, and use a JTAG header for in-system programming. Pair the device with an Altera/Intel EPCS serial configuration flash such as EPCS16 or EPCS64, and always include a dual-footprint option for migration to the larger Cyclone III variants if design requirements grow. This page consolidates distributor pricing, drop-in alternatives, and design notes not found on the bare datasheet.

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EP3C25U256C6 - 24,624 LEs Cyclone III FPGA | Intel
EP3C25U256C6

EP3C25U256C6 - 24,624 LEs Cyclone III FPGA | Intel

The Intel EP3C25U256C6 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of embedded memory, 156 I/O, a 1.2 V supply requirement, and a maximum stated clock frequency of 472.5 MHz. It is packaged in a 256-ball LFBGA measuring approximately 14 mm by 14 mm with a 0.80 mm ball pitch. A field-programmable gate array, or FPGA, is a programmable semiconductor in which digital logic is configured after fabrication. An FPGA belongs to the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Cyclone III devices combine configurable logic blocks, embedded RAM, programmable input/output resources, and dedicated clock and power-management circuitry, allowing one package to implement control, interface, signal-processing, or communications functions. Key device attributes include 24,624 logic cells, 156 I/O, and 608,256 embedded-memory bits. The 156 I/O support board-level connections to external memory, interfaces, converters, and digital control signals. The 256-LFBGA package provides dense PCB routing and adequate clearance for high-speed design work, although its fine 0.80 mm pitch demands careful fanout, assembly planning, and inspection. The EP3C25U256C6 operates from a 1.2 V supply and is identified with a C6 speed designation. Its stated maximum clock frequency is 472.5 MHz, while the operating temperature shown in product information reaches 85°C. These figures make the device suitable for designs requiring substantial programmable logic and memory in a single compact package. Designers must still evaluate timing closure, power integrity, thermal behavior, and I/O standards for the target system. Typical applications include industrial control systems, communications infrastructure, video and image processing, embedded instrumentation, and general-purpose digital signal processing. In each case, designers select the device based on logic capacity, pin availability, memory requirements, clock targets, supported interfaces, and the toolchain needed to implement and verify the design. A critical implementation consideration is the dense 256-ball land pattern. Route power and ground with low-impedance planes, keep sensitive clock and configuration paths short, follow the manufacturer’s pin-connection and decoupling guidance, and verify the assembled board for shorts and assembly defects before programming. This product record combines the device’s principal electrical, logical, packaging, and thermal characteristics with application guidance, same-family migration options, and practical PCB considerations. It supports faster initial part screening while directing final selection work toward the manufacturer datasheet and the specific system requirements.

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EP3C25U256C7 - 24,624-LE 437.5MHz Cyclone III FPGA | Altera
EP3C25U256C7

EP3C25U256C7 - 24,624-LE 437.5MHz Cyclone III FPGA | Altera

Altera EP3C25U256C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 156 I/O pins, 608,256 bits of memory, a 437.5 MHz maximum operating frequency, and a 256-LFBGA package. Designed around a 65 nm process and 1.2 V core supply, the device combines programmable logic, embedded memory, and general-purpose I/O in a surface-mount FPGA package. A field-programmable gate array, or FPGA, is a programmable-logic semiconductor whose digital circuits are defined through a configuration bitstream rather than a fixed mask set. Within the device hierarchy, the EP3C25U256C7 belongs to the Cyclone III FPGA family, the logic-device segment of programmable semiconductors. Its 24,624 logic elements provide substantially more configurable logic than small CPLDs, while the 256-LFBGA package supports dense board layouts in communication, control, instrumentation, and embedded-processing systems. The principal device characteristics include 24,624 logic cells, 156 I/O pins, and 608,256 bits of embedded memory. The reported 437.5 MHz operating frequency provides a useful indication of the device's high-speed logic capability, although final system timing depends on the selected speed grade, design constraints, I/O standards, and external timing paths. The 65 nm fabrication process and 1.2 V supply identify the device as a low-voltage Cyclone III implementation. The EP3C25U256C7 integrates programmable logic blocks, embedded RAM, dedicated PLL resources, and general-purpose I/O into one device. Its 156 I/O pins can be assigned according to the board-level interface requirements, while its embedded memory supports buffering, packet handling, data acquisition, and control-plane storage. Configuration data establishes the implemented circuit after power-up, allowing one physical board design to support multiple logic configurations and field upgrades. Typical applications include industrial automation, communications infrastructure, test and measurement, embedded control, and general-purpose digital signal processing. In an industrial controller, the FPGA could combine parallel sensor interfaces, protocol conversion, and real-time control logic. For communications equipment, its 156 I/O and 608,256 bits of memory can support data framing, buffering, and interface management. In instrumentation, multiple parallel channels can be synchronized while programmable logic handles acquisition and preprocessing. The most important design consideration is that FPGA replacement is not limited to matching package dimensions. A drop-in candidate must also match the voltage configuration, speed grade, temperature grade, configuration scheme, supported I/O standards, and power-supply requirements. The 256-LFBGA package also requires a land pattern capable of supporting its fine-pitch balls, careful power and ground distribution, and thermal-aware PCB layout. This page consolidates the verified EP3C25U256C7 specifications, distributor pricing, same-family drop-in candidates, and practical selection guidance. It also separates documented values from information that remains unavailable in the supplied source data, allowing engineers to verify every critical design constraint before procurement or schematic approval.

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EP3C25U256C8 - 24,624-LE 472.5 MHz FPGA | Intel
EP3C25U256C8

EP3C25U256C8 - 24,624-LE 472.5 MHz FPGA | Intel

The Intel/Altera EP3C25U256C8 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of memory, 156 I/O, and a 472.5 MHz operating frequency in a 256-ball UBGA package. It combines a programmable logic architecture, embedded memory, and digital interfaces on a single CMOS semiconductor device, making it suitable for industrial control, communications, signal processing, and embedded systems. An FPGA is a reconfigurable digital integrated circuit whose logic, memory, and interconnect resources can be programmed after manufacture. Within the semiconductor hierarchy, the EP3C25U256C8 belongs to the field-programmable gate array family, where an FPGA provides more flexible parallel logic density than a fixed-function application-specific integrated circuit. This flexibility supports design updates, product differentiation, and consolidated implementation of multiple digital functions on one device. Key device parameters include 24,624 logic elements, 608,256 bits of embedded memory, and 156 available I/O. The 472.5 MHz maximum operating frequency supports moderately high-speed digital logic, while the 256-ball package provides a compact surface-mount option for space-constrained boards. The commercial temperature range is 0°C to +85°C, and the JLCPCB listing identifies the device as RoHS compliant. The device supports 24,624 CLBs according to the distributor data and provides 608,256 bits of configuration memory. Its I/O count and package arrangement determine how many external signals can be routed between the FPGA and surrounding circuitry. Because a BGA package uses solder balls beneath the component, assembly requires appropriate board design, inspection, and thermal-management practices rather than conventional through-hole or leaded-solder handling. Typical uses include industrial automation, networking equipment, embedded control, video or image-processing pipelines, and digital interface consolidation. The 472.5 MHz operating frequency is appropriate for parallel datapaths, protocol bridging, control logic, and general-purpose programmable signal processing. The 156 I/O provide substantial connectivity for external memory, converters, transceivers, and control peripherals, subject to the device's bank-specific power and interface constraints. Designers should verify the exact pinout, supported I/O standards, configuration scheme, power-supply sequencing, and exposed-pad requirements against the manufacturer datasheet before layout. The BGA land pattern and ball assignments must be copied exactly, while power and ground distribution should minimize loop area and provide appropriate decoupling. Configuration storage and programming-device compatibility should also be validated early in the hardware schedule. This product record combines distributor specifications, package data, lifecycle observations, sourcing links, and explicit drop-in alternatives. It also distinguishes commercial, speed-grade, and industrial-temperature variants, providing engineering context that helps reduce the risk of selecting an electrically similar but mechanically unsuitable substitute.

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EP3C25U256I7 - 24624-Lcell Cyclone III FPGA | Altera
EP3C25U256I7

EP3C25U256I7 - 24624-Lcell Cyclone III FPGA | Altera

Altera EP3C25U256I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 156 user I/Os, a 437.5 MHz maximum operating frequency, and a 256-ball LFBGA package. The industrial-temperature device operates from a 1.2 V core supply and is manufactured on a 65 nm CMOS process. Its combination of programmable logic, embedded memory resources, and a 256-ball surface-mount package supports compact control, interface, signal-processing, and embedded-processing systems. A field-programmable gate array, or FPGA, is a programmable digital logic device whose interconnect and logic configuration can be loaded after manufacture. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic family of FPGA and CPLD devices. The Cyclone III family targets designs requiring more logic capacity than small CPLDs while maintaining a broad selection of embedded memory, general-purpose I/O, and dedicated resources for communications, control, and signal processing. The EP3C25U256I7 provides 24,624 logic elements, 156 user I/Os, and 608,256 configuration bits. Its listed maximum frequency is 437.5 MHz, although realized system performance depends on the selected logic architecture, memory interface, clocking scheme, I/O standard, timing constraints, and design utilization. The 1.2 V core voltage and 65 nm process place the device in a low-voltage, high-density programmable-logic class designed for efficient integration of digital control functions. The 256-LFBGA package provides a high ball-count interconnect suitable for boards requiring substantial I/O access. Unlike a leaded package, the LFBGA requires careful escape routing, short return paths, controlled reference planes, and assembly-process controls for thermal and electrical performance. Industrial-temperature grading makes the device relevant to equipment that must operate beyond commercial-temperature environments, but the exact minimum and maximum junction or ambient ratings must be taken from the manufacturer documentation before a production release. Typical applications include industrial automation, communications equipment, embedded control, test and measurement, and compact signal-processing modules. In these systems, the FPGA can implement parallel control logic, hardware state machines, interface bridges, protocol endpoints, and fixed-function datapaths that would otherwise require multiple programmable devices. Configuration storage, clock generation, power sequencing, and I/O voltage planning remain important parts of the surrounding circuit. A key design consideration is that the advertised 437.5 MHz figure should not be treated as a guaranteed system clock for every design. Timing closure depends on the selected speed grade and logic path. Engineers should use the Quartus design tools and the Cyclone III device documentation to obtain pin assignments, timing results, power estimates, and configuration requirements before releasing PCB source files. This product record combines the exact EP3C25U256I7 identifiers, package and architecture details, commercially focused buying guidance, replacement analysis, and practical implementation notes. It also distinguishes the verified drop-in option from family members that use different packages, helping engineers distinguish true PCB reuse from designs that require hardware changes.

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EP3C40F324C7N - Cyclone III FPGA, 39.6K LE, 324-FBGA | Intel
EP3C40F324C7N

EP3C40F324C7N - Cyclone III FPGA, 39.6K LE, 324-FBGA | Intel

The Intel (formerly Altera) EP3C40F324C7N is a Cyclone III Field-Programmable Gate Array (FPGA) from the low-power, low-cost Cyclone III family built on a 65 nm TSMC process. The device integrates 39,600 logic elements (LEs), 1,161,216 bits of embedded memory (1161 Kb / 141.25 Kbytes per the FPGAkey listing), 195 user I/O pins, and 4 PLLs in a 324-pin FineLine BGA (FBGA) package with a 1.2 V core supply. The C7 speed grade targets commercial 0 to 85 °C operation at 437.5 MHz internal performance. A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based fabric, distributed and block RAM (M9K/M144K), DSP blocks, and PLL clock management in a single chip. In the broader taxonomy it sits under programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA -> semiconductor. The Cyclone III family introduced hard 3.125 Gbps transceivers-free design with significantly lower static and dynamic power than Cyclone II, making it a common choice for cost-sensitive, high-volume designs. Key differentiating features of the EP3C40F324C7N include 4 phase-locked loops for flexible clock synthesis, embedded multiplier blocks for moderate DSP workloads, support for external memory interfaces such as DDR/DDR2 SDRAM, QDRII SRAM, and single data-rate SRAM through dedicated DQS pins, and a MultiTrack interconnect optimized for high-utilization designs. The device supports serial configuration via EPCS or EPCQ devices as well as JTAG (IEEE 1149.1) and parallel passive/active configuration. Architecturally, the EP3C40F324C7N employs logic-array-block (LAB) tiles of 16 LEs each, with carry chains and register chains spanning LABs for efficient arithmetic. Logic is paired with M9K (9 Kbit) block RAM blocks and dedicated 18x18 hardware multipliers, giving designers a balanced fabric for control logic, FIFOs, and signal processing. Configuration data is stored in SRAM; an external configuration device (EPCS4/EPCS16/EPCQ16, etc.) or JTAG programmer loads the bitstream at power-up. Typical applications include industrial motor control, video surveillance and image processing pipelines, low-cost software-defined radio (SDR) front-end glue logic, telecom baseband glue logic and protocol bridging, prototyping of ASIC designs, and consumer display controllers. The 324-FBGA package's compact footprint suits space-constrained boards while retaining enough I/O for parallel external memory buses and high-speed LVDS pairs. When designing, treat the 1.2 V core and 2.5 V/3.3 V I/O rails as separate supply domains and decouple each with 0.1 µF and 10 µF capacitors near the balls. Configure PLL loop-bandwidth settings per the datasheet for jitter-sensitive applications, and verify FPGA timing with TimeQuest (Quartus Prime) against the chosen speed grade. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical PCB/power design notes not consolidated in any single manufacturer document.

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EP3C40F324C8 - 39600-Cell Cyclone III FPGA | Intel
EP3C40F324C8

EP3C40F324C8 - 39600-Cell Cyclone III FPGA | Intel

The Intel EP3C40F324C8 is a Cyclone III field-programmable gate array with 39,600 logic elements, a maximum stated operating frequency of 402 MHz, and a 1.2 V core supply in a 324-ball FBGA package. The device provides 195 I/O positions according to the manufacturer product listing, making it suitable for compact embedded systems that require substantial programmable logic, parallel interfaces, memory interfaces, and deterministic control functions within a single integrated circuit. An FPGA is a programmable semiconductor whose internal logic, interconnects, and input/output blocks are configured after manufacture. The FPGA and CPLD are branches of programmable logic devices, while the broader hierarchy includes digital logic ICs and semiconductors. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured for protocol bridging, signal processing, test instrumentation, communications, and embedded control applications. The EP3C40F324C8 belongs to Intel's Cyclone III device family. Its headline resource count is 39,600 logic elements, while the 402 MHz frequency represents the maximum operating frequency associated with the device listing rather than the performance of every embedded design. A 1.2 V core supply reduces the number of core rails commonly required by FPGA designs, although external interfaces still require correctly specified board-level power rails and termination. The 324-BGA package supports dense PCB integration and high I/O availability, but it also demands careful escape routing, via planning, thermal design, and assembly-process control. The listing identifies 195 I/O positions, package terminals as balls, and a square package form. Exact power, memory, I/O-standard, timing, and differential-capability details must be confirmed in the Cyclone III device documentation before schematic or PCB sign-off. Typical uses for this device include industrial data acquisition, parallel sensor and actuator interfaces, communications infrastructure, test and measurement systems, embedded signal processing, and general-purpose programmable control. Its 39,600 logic elements provide substantially more parallel hardware capability than a small microcontroller while retaining the flexibility of programmable logic. The 402 MHz device rate also makes time-domain logic and tightly pipelined interface functions practical. When laying out a board around the EP3C40F324C8, prioritize power-plane integrity, decoupling placement, clock routing, and BGA escape routing. Confirm the exact pinout and pin assignment in the manufacturer device documentation before assigning ball locations. Avoid treating the package ball count as the number of usable user I/O, because dedicated power, ground, configuration, clock, and reserved balls may be present. This product page consolidates the core device identity, package information, sourcing details, comparison criteria, and practical integration guidance into one engineering reference. It is intended to support initial design selection and procurement planning, while final timing, power, and compatibility decisions remain tied to the official Cyclone III documentation and the selected system design.

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EP3C40F324C8N - 39.6K LE Cyclone III FPGA, 324-FBGA | Intel
EP3C40F324C8N

EP3C40F324C8N - 39.6K LE Cyclone III FPGA, 324-FBGA | Intel

The Intel (formerly Altera) EP3C40F324C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory (approximately 1.16 Mbit), and 126 embedded 18x18 multipliers, housed in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a low-power 60 nm process and operates from a 1.2 V core supply with a maximum core clock frequency of 402 MHz in the speed grade 8 commercial temperature part. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic circuits through a configuration bitstream stored in SRAM. FPGAs sit in the broader taxonomy of programmable logic device -> programmable logic IC -> semiconductor. They are widely used to implement glue logic, high-speed parallel DSP, custom bus interfaces, and hardware-accelerated functions that would otherwise require multiple discrete logic ICs or an ASIC. The Cyclone III family specifically targets cost-sensitive, low-power applications that still need the parallel processing and DSP density of an FPGA. Key features of the EP3C40F324C8N include up to 215 user I/O pins (the 324-FBGA variant exposes the largest I/O count in the EP3C40 group), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. Each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic. Configuration is volatile (SRAM-based) so the bitstream must be reloaded from a flash or microcontroller on every power-up. Architecturally, the Cyclone III device uses a 60 nm TSMC low-power process with a 1.2 V core. The Logic Array Block (LAB) is composed of 16 LEs, and columns of embedded memory and DSP blocks are interleaved across the fabric to provide local high-bandwidth connectivity. The four PLLs support programmable frequency synthesis, phase shifting, and spread-spectrum clocking. This combination enables the EP3C40 to drive high-throughput parallel DSP pipelines, video processing, and protocol bridging at low static and dynamic power. Typical applications for the EP3C40F324C8N include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver-assistance prototypes, telecommunications line-card glue logic, low-cost software-defined radio front ends, and portable medical instrumentation. The 324-FBGA package makes the device suitable for board designs where maximum I/O count is required but a fine-pitch BGA assembly process is acceptable. When designing with this part, note that the 1.2 V core and the PLL analog supply both require decoupling - place 0.1 uF and 10 uF capacitors close to each supply pin and use a power-plane cutout beneath the BGA to control return-current paths. The BGA also requires a multi-layer PCB with microvia or via-in-pad technology to reliably route all 324 balls. Finally, because the configuration memory is SRAM-based, a boot source (EPCS flash, parallel flash, or microcontroller) must be present at every power-up. This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III EP3C family, and practical design notes not found in the manufacturer datasheet alone, giving a single reference for sourcing and engineering the EP3C40F324C8N.

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EP3C40F324I7N - Cyclone III FPGA, 39.6K LE, 324-BGA | Intel
EP3C40F324I7N

EP3C40F324I7N - Cyclone III FPGA, 39.6K LE, 324-BGA | Intel

The Intel (formerly Altera) EP3C40F324I7N is a Cyclone III low-cost, low-power field-programmable gate array (FPGA) offering 39,600 logic elements (39600 cells / 39600 4-input LUTs as logic resources), 1,161,216 bits of embedded memory, and 195 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package at 19 x 19 mm with 2.2 mm height. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened blocks such as embedded RAM, multipliers (DSP blocks), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design-flexibility vs. unit-cost spectrum. They are typically used to implement custom digital logic, high-speed parallel processing, glue logic, and hardware acceleration that would be too expensive, slow, or power-hungry on a CPU or MCU. The EP3C40F324I7N is fabricated on TSMC's low-power 65 nm process and operates from a 1.15 V to 1.25 V core supply (VCCINT), giving it the lowest static and dynamic power envelope of the Cyclone III family. It integrates 126 embedded 18 x 18 multipliers, 4 general-purpose PLLs, and supports configuration via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. Maximum internal clock frequency is 437.5 MHz and the maximum user I/O count is 195. Typical applications include industrial motor control and factory automation, video processing and display bridges, telecom line cards and baseband preprocessing, low-cost ASIC prototyping, and software-defined radio (SDR) front-end glue logic. The device's combination of logic density and DSP block count makes it well-suited for parallel signal-processing pipelines. When designing, ensure that the 324-ball FBGA land pattern meets JEDEC MS-034 tolerances and that at least four PCB layers are dedicated to GND/VCCINT planes for power integrity. JTAG chain ordering must place the FPGA before or after other JTAG devices without signal-integrity stubs to avoid boundary-scan failures. This page synthesizes distributor pricing as of 2026-09-09, same-package drop-in alternatives, and engineering design notes that are not aggregated in any single manufacturer datasheet.

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EP3C40F484C6 - 39,600 Logic Cell Cyclone III FPGA | Intel
EP3C40F484C6

EP3C40F484C6 - 39,600 Logic Cell Cyclone III FPGA | Intel

The Intel EP3C40F484C6 is a Cyclone III field-programmable gate array with 39,600 logic cells, 2,475 logic array blocks, and 535 I/Os in a 484-pin FBGA package. It operates from a 1.15 V to 1.25 V core supply and supports an operating temperature range from -40°C to 125°C. These characteristics place it in the low-cost FPGA category, where programmable logic implements digital control, interface, signal-processing, and system-integration functions without requiring a fixed application-specific integrated circuit. A field-programmable gate array is a semiconductor whose digital logic is configured after manufacture. Within the broader hierarchy, an FPGA is a programmable logic device, a reconfigurable digital integrated circuit, and a semiconductor. Its configuration memory and programmable interconnect allow one physical design to support multiple logic functions through a revised bitstream. Cyclone III devices combine embedded logic resources with configurable I/O blocks, making them suitable for industrial controls, communications equipment, embedded processors, and test systems. The EP3C40F484C6 provides 39,600 logic cells across 2,475 logic array blocks, a useful density level for designs that exceed basic programmable-logic devices while avoiding the resource requirements of much larger FPGAs. Its maximum operating frequency is listed as 315 MHz, although the achieved system clock also depends on the selected design, device speed grade, I/O path, external memory interface, timing constraints, and board implementation. The device uses a 1.15 V to 1.25 V operating supply range and is packaged in a 484-pin fine-pitch ball grid array. A large FBGA package supports a high pin count and dense board routing, but it also requires careful PCB layout, thermal analysis, and assembly planning. The manufacturer documentation describes the device as lead-free and moisture-sensitive, making controlled handling, dry storage, reflow-profile management, and solderability inspection important manufacturing considerations. Typical uses include industrial control logic, communication protocol conversion, embedded processing systems, instrumentation, and general-purpose digital prototyping. Engineers can implement parallel data paths, state machines, interfaces, memory controllers, and custom accelerators in the programmable fabric. The 535 I/O resources offer substantial connectivity, although actual usable I/O count depends on the power-supply arrangement, voltage standards, dedicated configuration pins, and selected device resources. The primary engineering consideration is that the 484-pin FBGA footprint makes PCB changes difficult once layout is committed. Confirm the exact ball assignments, voltage rails, configuration interface, clock requirements, decoupling, and pin-termination guidance in the manufacturer datasheet before release. Budget adequate copper and thermal spreading for the package, and validate signal integrity on every high-speed interface because external routing can determine whether a design closes timing successfully. This product page consolidates the device identity, package characteristics, technical-search coverage, related family members, and practical implementation guidance. It is intended to help engineers determine whether the EP3C40F484C6 fits a 484-pin Cyclone III design before moving into detailed datasheet review, Quartus design compilation, PCB validation, and prototype testing.

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EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera
EP3C40F484C6N

EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera

The Intel (formerly Altera) EP3C40F484C6N is a Cyclone III family low-cost FPGA delivering 39,600 logic elements in a 484-ball FineLine BGA (FBGA) package. Built on a 65 nm low-k dielectric process, the device integrates 1,161,216 bits of embedded memory, 4 PLLs, 396 embedded 18x18 multipliers, and up to 331 general-purpose user I/O pins. According to the Cyclone III Device Handbook, the part is offered in the commercial C6 speed grade targeting cost-sensitive high-volume applications. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs occupy a tier above general-purpose microcontrollers for parallel data processing and below ASICs for design flexibility, making them a core building block of digital logic design. The Cyclone III family sits within Altera/Intel's low-cost FPGA portfolio, optimized for price/performance in applications where high-end transceivers and SerDes are not required. The EP3C40F484C6N ships in the F484 package (23x23 mm, 1.0 mm ball pitch) and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through dedicated I/O banks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. Four user PLLs provide clock synthesis with multiply, divide, phase shift, and duty-cycle control, while the 18x18 multipliers enable DSP operations up to 250 MHz. The device operates from a 1.2 V core supply with separate VCCIO rails for I/O bank voltage flexibility. Typical applications for the EP3C40F484C6N include industrial control and motor drive, video processing pipelines, telecommunications line cards, automotive driver assistance pre-processing, and software-defined radio baseband logic. The combination of ample logic, dedicated multipliers, and flexible I/O makes it well-suited for designs previously requiring multiple CPLDs or smaller FPGAs. When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Intel's PCB layout guidelines for FBGA breakout. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting sourcing engineers and FPGA design teams in component selection.

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EP3C40F484C7 - 39,600-Cell Cyclone III FPGA | Altera
EP3C40F484C7

EP3C40F484C7 - 39,600-Cell Cyclone III FPGA | Altera

The Altera EP3C40F484C7 is a Cyclone III field-programmable gate array with 39,600 logic cells, 331 I/Os, a maximum frequency of 437.5 MHz, and a 484-pin FBGA package. The device uses 65 nm fabrication technology and operates from a 1.2 V core supply, combining programmable logic capacity with a high pin count in a surface-mount package. A field-programmable gate array, or FPGA, is a programmable logic device whose digital circuits can be configured after manufacture. An FPGA sits within the broader semiconductor and programmable-logic hierarchy, connecting general-purpose processors, fixed-function ASICs, and reconfigurable digital logic. Its combination of parallel processing, programmable I/O, and deterministic hardware behavior makes it useful for communications, control, signal processing, and embedded systems. The Cyclone III device provides 39,600 logic cells and 331 I/Os in the EP3C40F484C7 configuration. Its stated maximum frequency is 437.5 MHz, while its 65 nm process and 1.2 V core supply define the physical and electrical implementation. The 484-FBGA package supports dense board routing and is intended for surface-mount assembly rather than a through-hole installation. Because an FPGA implements its logic through a configurable fabric, designers can implement parallel datapaths, control functions, interface bridging, and fixed digital algorithms in one device. The 331 available I/Os allow the device to interface with external memory and multiple digital peripherals, although the usable signal count depends on the selected configuration, voltage standards, bank assignments, and power-management scheme. Typical applications include industrial control systems, communication interfaces, data acquisition, embedded video processing, test equipment, and digital signal-processing front ends. For designs requiring deterministic timing, parallel channels, or programmable logic, the device provides dedicated hardware rather than relying exclusively on sequential software execution. It can also be paired with external processors or transceivers when system-level partitioning is preferable to a single-device implementation. PCB implementation requires careful attention to the 484-ball FBGA escape routing, power delivery, and thermal management. The 1.2 V core rail should be decoupled according to the Cyclone III power-supply recommendations, while interface supplies should use suitable voltage-tolerant I/O banks. Ball-pitch routing should be checked against the manufacturer footprint before PCB release. This page combines the device’s programming, package, and ordering characteristics with application guidance, comparison parameters, and practical migration considerations. It is intended to help engineers confirm footprint compatibility, evaluate the 39,600-cell Cyclone III resource level, and plan power, routing, and configuration requirements before committing a board design.

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EP3C40F484C7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel
EP3C40F484C7N

EP3C40F484C7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel

The Intel / Altera EP3C40F484C7N is a Cyclone III field-programmable gate array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 331 user I/Os in a 484-ball fine-pitch BGA (FBGA-484) package. It belongs to the Cyclone III family, built on a low-power 65 nm process, and is specified for commercial-grade operating temperatures with lead-free / RoHS-compliant packaging. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, multipliers, and I/O serdes. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below ASICs in terms of integration density, and they belong to the broader integrated-circuit / semiconductor category. Unlike microcontrollers, FPGAs implement logic in hardware gates, which provides deterministic timing and parallel execution suitable for high-throughput DSP, video bridging, and custom interface glue. Key features of the EP3C40F484C7N include 4 embedded PLL clock managers, 126 embedded 18x18 multipliers for DSP, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The 484-FBGA package offers a 1.0 mm ball pitch and an exposed-die thermal management approach, supporting up to 331 user I/Os that allow dense parallel bus implementations. Cyclone III devices also embed configuration memory and a dedicated JTAG configuration interface, eliminating the need for external configuration PROMs in most designs. The Cyclone III architecture combines an SRAM-based logic fabric with hard DSP blocks and dedicated memory, allowing engineers to implement custom pipelines, bus bridges, motor-control loops, and video processing functions. Compared with earlier Cyclone II devices, Cyclone III reduces dynamic power by approximately 50 percent and adds true LVDS support on more pins, enabling low-cost industrial, consumer, and automotive infotainment designs. Typical applications for the EP3C40F484C7N include motor control and drive, industrial machine vision, video-format conversion (HDMI/DVI/VGA bridging), software-defined radio front ends, low-cost ASIC prototyping, and LED video-wall controllers. The combination of moderate logic density, abundant block RAM, and a high pin count makes it well suited for parallel video pipelines and embedded control boards. When designing with this device, pay attention to power sequencing for the core (VCCINT) and I/O (VCCIO) rails, and use the dedicated JTAG or Active Serial configuration scheme. Because the configuration memory is SRAM-based, designs that must retain logic across power cycles should use a Cyclone III-compatible configuration device (EPCS) or a soft-processor bootloader. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III and Cyclone IV families, and practical design notes not found in the manufacturer datasheet alone.

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EP3C40F484C8 - Cyclone III FPGA, 39.6K LE, 484-BGA | Intel
EP3C40F484C8

EP3C40F484C8 - Cyclone III FPGA, 39.6K LE, 484-BGA | Intel

The Intel (formerly Altera) EP3C40F484C8 is a Cyclone III family Field-Programmable Gate Array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers into a 484-ball FineLine BGA package. It supports up to 331 user I/O pins and is built on a low-power 60-nm process, drawing as little as 0.25 W of dynamic power at typical operation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic functions after PCB fabrication. The Cyclone III FPGA belongs to the broader taxonomy of semiconductor devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs sit alongside microcontrollers and DSPs in the digital signal processing hierarchy, offering parallel hardware execution that microcontrollers cannot match. Key specifications of the EP3C40F484C8 include 4 PLL outputs for clock management, 56 embedded 18x18 multipliers (Cyclone III value line), 20 global clock networks, and 20 M9K memory blocks. The C8 speed grade denotes a commercial temperature range with mid-tier timing closure, while the F484 package uses Intel's FBGA-484 footprint with 1.0 mm ball pitch. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards for interfacing with DDR/DDR2 memory and high-speed parallel peripherals. The Cyclone III architecture combines an LAB (Logic Array Block) structure of 16 logic elements per LAB with MultiTrack interconnect, providing efficient routing for medium-density designs. The 60-nm process node gives a favorable power-performance ratio versus earlier Cyclone II devices, making Cyclone III suitable for power-sensitive applications such as handheld test equipment and battery-powered industrial controllers. Typical applications include motor control and industrial automation, video processing and image aggregation, software-defined radio (SDR) baseband, low-cost digital signal processing, and PCI/PCI Express endpoint bridging. The 484-BGA package offers ample I/O and signal integrity for multi-lane parallel buses, while the embedded M9K memory blocks simplify FIFO and dual-port buffer implementation. Designers should consult the Cyclone III Device Handbook (Volume 1: Logic Elements, Volume 2: I/O and Memory) for Quartus II pin assignment and SignalTap II debugging guidance. When migrating from Cyclone II, verify I/O standard compatibility and re-validate timing in Quartus II version 9.0 or later. This page synthesizes distributor pricing, drop-in same-package alternatives (EP3C16F484C8N, EP3C25F484C8N), and practical design notes not found in the manufacturer datasheet.

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EP3C40F484C8N - Cyclone III FPGA 39.6K LEs 484-FBGA | Intel
EP3C40F484C8N

EP3C40F484C8N - Cyclone III FPGA 39.6K LEs 484-FBGA | Intel

The Intel EP3C40F484C8N is a low-power 65nm Cyclone III FPGA integrating 39,600 logic elements, 1,161,216 bits of embedded memory (M9K blocks totaling 1134 Kbit × 9 = approximately 1.16 Mbit), 126 embedded 18×18 multipliers, and 331 user I/Os in a 484-ball FineLine BGA package. Speed grade 8 designates a commercial temperature-range device targeting -40C to +85C operation. Per the Altera/Intel Cyclone III Device Handbook, the device is built on a TSMC 65nm low-power process and supports core voltages of 1.15V–1.25V with multi-voltage I/O banks. A Cyclone III FPGA is a programmable logic device that allows hardware designers to implement arbitrary digital circuits - from glue logic and bus bridges to soft-core processors and DSP pipelines - on a single silicon die. FPGAs sit between fixed-function ASICs (Application-Specific Integrated Circuits) and microcontrollers in the digital design hierarchy: they offer higher integration density than discrete logic ICs but lower per-unit cost than full-custom ASICs at low-to-medium volumes. Cyclone III, released in 2007, is the third-generation low-cost Cyclone family and is widely used as a stepping stone between discrete logic and high-end FPGAs. Key features of the EP3C40F484C8N include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and dedicated LVDS pairs on every I/O pin with data rates up to 875 Mbps. The 484-FBGA (23×23 mm, 1.0 mm pitch) package provides ample routing density for memory-rich designs. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes with the dedicated EPCS serial configuration device family. Architecturally, the EP3C40F484C8N uses Altera's Logic Array Block (LAB) structure with each LAB containing 16 Logic Elements (LEs). Each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic. Embedded multiplier blocks support 18×18 signed or unsigned multiplication natively, enabling single-cycle DSP operations at speeds up to 260 MHz. The M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers with byte enables for parity/ECC support. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, and low-volume ASIC prototyping. Designers frequently pair the EP3C40 with external DDR/DDR2 SDRAM, EPCS configuration memory, and a 100 MHz LVCMOS clock source. The 484-BGA package is also suitable for designs migrating to Cyclone IV E (EP4CE40F484) via the Quartus II Cyclone III to Cyclone IV migration guide. When designing with this part, ensure proper bank voltage supply for each I/O group, keep VCCINT within 1.15V–1.25V with at least 4 bulk ceramic decoupling capacitors placed within 5 mm of the package, and verify signal-integrity on LVDS links since the 1.0 mm BGA pitch requires controlled-impedance routing on a 6+ layer PCB. Quartus II Web Edition (free) supports the EP3C40 with full synthesis, place-and-route, and timing analysis. This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives (same 484-FBGA footprint, including variants within the Cyclone III family and pin-compatible Cyclone IV E migrations), and practical hardware design notes not found in the manufacturer datasheet alone.

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EP3C40F484I7 - 39.6K Logic Elements Cyclone III FPGA | Intel | 484-FBGA
EP3C40F484I7

EP3C40F484I7 - 39.6K Logic Elements Cyclone III FPGA | Intel | 484-FBGA

The Intel (formerly Altera) EP3C40F484I7 is a low-power Cyclone III FPGA with 39,600 logic elements, 1,161,216 bits of embedded memory and 331 user I/Os, housed in a 484-ball FineLine BGA (FBGA-484) package. Fabricated on a 65 nm CMOS process and operating from a 1.2 V core supply, this device targets cost-sensitive, high-volume applications that require moderate logic density and a generous I/O count without the power penalty of higher-end families. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks and PLLs. FPGAs are reprogrammable, allowing engineers to implement custom digital logic, glue functions, parallel processing pipelines, and high-speed I/O protocols. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They complement microcontrollers and ASICs by trading unit cost for flexibility, parallelism and time-to-market. Key features of the EP3C40F484I7 include 4 PLLs, 126 multipliers (18 x 18 hardware multipliers for DSP), support for LVDS, LVTTL, LVCMOS, SSTL and HSTL I/O standards, and a configurable Logic Array Block (LAB) architecture of 2,475 LABs. The device operates over the industrial -40C to +125C temperature range, making it suitable for harsh-environment and industrial designs. Cyclone III devices use a low-k, 65 nm process and a small die footprint relative to logic capacity, delivering one of the lowest static power profiles in the FPGA market at the time of release. Designers typically pair the FPGA with DDR/DDR2 SDRAM memory controllers (using the dedicated DQS pins) and external configuration memory (such as EPCS or EPCQ serial flash). Configuration is loaded via JTAG or the active/passive serial (AS/PS) scheme. Typical applications include industrial motor control and automation, video processing pipelines, software-defined radio (SDR) baseband, test and measurement front-ends, and protocol bridging cards (PCI Express, Ethernet MACs, custom LVDS links). The 484-FBGA footprint provides enough I/O for memory buses, high-speed transceivers-like interfaces (via LVDS), and parallel expansion connectors. When designing with this FPGA, ensure that the JTAG chain and configuration mode pins (MSEL[3..0]) are correctly strapped, and verify that the chosen I/O bank voltages match the logic levels of connected peripherals. The Quartus Prime (or legacy Quartus II) toolchain is required for synthesis, place-and-route, and bitstream generation. Use the Altera/Intel PowerPlay early power estimator before PCB layout to size decoupling, planes, and any required thermal management. This page synthesizes distributor pricing, verified same-family drop-in alternatives and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers make an informed second-source decision.

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EP3C40F484I7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel / Altera
EP3C40F484I7N

EP3C40F484I7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C40F484I7N is a low-cost Cyclone® III Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA package. It operates from a 1.2 V core supply and supports I/O standards including LVDS, LVCMOS, SSTL, and HSTL through eight I/O banks. The device targets cost-sensitive high-volume applications while delivering 437.5 MHz maximum core performance. What is a Cyclone III FPGA? The Cyclone III family is a low-power, low-cost SRAM-based programmable logic family from Altera (now Intel FPGA) that sits in the broader hierarchy of programmable logic devices (PLD) between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices are built on a TSMC 65 nm low-power process and integrate logic, multipliers, memory, PLLs, and high-speed I/O into a single device, making them suitable for I/O expansion, glue-logic replacement, parallel DSP, and mid-density state-machine designs. Key features of the EP3C40F484I7N include 4 PLLs, 331 user I/O pins distributed across 8 banks, 1.161 Mbit of RAM, and full industrial temperature range support from -40 °C to +125 °C (the I7N speed/temperature grade). The device supports up to 1 Gbps LVDS with external serializer/deserializer logic, provides 2.5 Gbps external memory interfaces, and includes dedicated DDR/DDR2/QDRII memory controller hard IP. Configuration is supported through passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes using industry-standard Altera/Intel EPCS or EPCQ configuration flash devices. Typical applications for the EP3C40F484I7N span industrial motor control, video processing and image aggregation, automotive infotainment controllers, software-defined radio baseband, low-density ASIC prototyping, and consumer display controllers. The 484-FBGA package offers 1.0 mm ball pitch and excellent signal integrity for high-speed LVDS and DDR2 interfaces, while the industrial temperature grade suits factory automation and outdoor deployments. When designing with this device, ensure proper decoupling (100 nF + 10 µF bulk per bank) and follow Intel's Cyclone III pin connection guidelines for unused pins. Configuration flash selection is critical — pair with an EPCS16 or EPCQ16 for typical 39.6 K LE designs. The QFP-484 BGA requires X-ray inspection in production, so design for manufacturability with clear pad geometry.

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EP3C40F780C6 - Cyclone III FPGA 39.6K LE 780-BGA | Altera
EP3C40F780C6

EP3C40F780C6 - Cyclone III FPGA 39.6K LE 780-BGA | Altera

The Altera EP3C40F780C6 is a Cyclone III Field-Programmable Gate Array (FPGA) housed in a 780-pin FineLine BGA package, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/O pins. Built on a low-power 60 nm process, the Cyclone III family targets cost-sensitive, high-volume applications where designers need FPGA density without the power budget of high-end FPGAs. The 'C6' speed grade places it in the mid-speed bin of the family, and the 'F' package descriptor indicates a leaded, RoHS-compliant FineLine BGA. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device whose logic fabric, routing, and I/O behavior are defined after manufacture through a configuration bitstream. FPGAs sit between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices) in the programmable-logic taxonomy: ASIC > FPGA > CPLD > SPLD > standard logic. Cyclone III is positioned as a low-cost, low-power alternative to Stratix within Altera's portfolio, and is a direct competitor to Xilinx Spartan-6 and Lattice ECP3 families. Key features include 4 embedded 18x18 hardware multipliers (DSP blocks), up to 4 PLLs per device for clock management, and 396 Kbits of M9K embedded SRAM. The 780-BGA package provides 535 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, with 8 transceiver channels (where present) and dedicated global clock networks. Cyclone III supports configuration through AS, PS, JTAG, and Fast Passive Parallel modes, and integrates the Altera Cyclone III Configuration scheme. Architecturally, the EP3C40F780C6 uses a logic-element (LE) fabric of 4-input look-up tables (LUTs) and dedicated carry chains, surrounded by a perimeter I/O ring and column-based M9K memory blocks. The four embedded multipliers enable single-clock-cycle 18x18 signed multiplications, while the PLL blocks provide frequency synthesis, phase shifting, and clock deskew. Compared to its predecessor Cyclone II, the Cyclone III family roughly doubles logic density and adds DSP blocks at a lower static power budget. Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive driver assistance, and low-cost prototyping. The combination of high I/O count and embedded multipliers makes the EP3C40F780C6 well suited for parallel sensor aggregation, custom peripheral bridging, and image preprocessing tasks. When designing with this device, allocate sufficient PCB area for the 29 mm x 29 mm 780-BGA with 1.0 mm pitch; layer stackup with buried vias and at least 6 layers is recommended to fan out the package. Confirm Quartus II software support for the C6 speed grade before final timing closure. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not consolidated in any single manufacturer or distributor listing.

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EP3C40F780C6N - Cyclone III FPGA 39.6K LE 780-FBGA | Intel (Altera)
EP3C40F780C6N

EP3C40F780C6N - Cyclone III FPGA 39.6K LE 780-FBGA | Intel (Altera)

The Altera (now Intel) EP3C40F780C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 maximum user I/O pins, housed in a 780-ball FineLine BGA package with 1.0 mm pitch. Operating at a core speed grade of -6 (commercial), it is fabricated on a 60 nm low-power CMOS process and is targeted at cost-sensitive, high-volume designs that previously required ASICs. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O behavior after PCB fabrication, in contrast to an Application-Specific Integrated Circuit (ASIC) which is fixed at mask production. FPGAs occupy the IC hierarchy at programmable logic -> logic IC -> integrated circuit -> semiconductor. The Cyclone III family specifically targets the cost/performance sweet spot, offering ASIC-level density at FPGA-level flexibility for applications like motor control, video processing, and telecommunications line cards. Key specifications include 39,600 logic elements distributed across 4,065 Logic Array Blocks (LABs) and 126 M9K embedded memory blocks totaling 1,161,216 bits (113 Kbytes of true SRAM). The device integrates 4 phase-locked loops (PLLs) for clock synthesis, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on its 535 user I/O pins, and provides up to 4 integrated hard memory controllers plus a wide range of soft IP cores from Altera/Intel. The Cyclone III architecture uses 60 nm process technology with a 1.2 V core supply and hot-socketing support, achieving typical power consumption of roughly 0.4 W to 1.5 W depending on design utilization. Its SRAM-based configuration requires external flash or a configuration device, while the built-in Cyclic Redundancy Check (CRC) circuitry catches configuration bitstream errors. The device also supports partial reconfiguration for in-field updates without system downtime. Typical applications include industrial motor control, LED display controllers, machine vision and video bridging, automotive infotainment, and low-cost telecommunications line cards. The 535 I/O count and 780-FBGA footprint make it suitable for medium-density designs requiring many parallel interfaces such as LVDS or DDR2 memory. Designers should evaluate the 780-ball FBGA routing complexity and use a minimum 6-layer PCB with controlled-impedance traces. The 1.0 mm pitch keeps the BGA manageable for standard assembly, but X-ray inspection after reflow is mandatory. JTAG programming via USB-Blaster is the standard configuration path. This page synthesizes distributor pricing, drop-in alternative FPGAs, and practical PCB/design notes not aggregated in any single Altera datasheet or distributor listing.

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EP3C40F780C7 - Cyclone III FPGA 39.6K LE 780-FBGA | Intel
EP3C40F780C7

EP3C40F780C7 - Cyclone III FPGA 39.6K LE 780-FBGA | Intel

The Intel (formerly Altera) Cyclone III EP3C40F780C7 is a low-power, high-volume FPGA fabricated on a 60 nm TSMC process, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers in a 780-ball fine-pitch BGA package. The device operates with a core voltage of 1.2 V and supports I/O standards from 1.2 V to 3.3 V through eight I/O banks that deliver up to 535 user I/O pins. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements custom digital logic through configurable logic blocks (CLBs), routing interconnect, and dedicated hardware such as block RAM and DSP blocks. FPGAs sit within the hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-defined microcontrollers, and are widely used in parallel processing, hardware acceleration, and rapid-prototyping applications. Key features of the EP3C40F780C7 include support for high-speed external memory interfaces such as DDR2, DDR, QDRII, and SDRAM, four phase-locked loops (PLLs) for clock management, and Cyclone III's proprietary low-power architecture that reduces dynamic power consumption versus earlier Cyclone generations. The 780-FBGA package (29 x 29 mm, 1.0 mm pitch) supports commercial temperature grades (0C to +85C) and is rated for the C7 speed grade, balancing timing margin and cost. The Cyclone III family targets cost-sensitive high-volume applications such as industrial automation, video processing, and telecommunications. With 39,600 logic elements and ample DSP and memory resources, the EP3C40F780C7 supports medium-complexity algorithmic implementations, multiple soft processor cores, and rich memory buffering for streaming data pipelines. Typical applications include motor control and industrial networking, HD video bridging, software-defined radio (SDR) front ends, machine vision, and PCI Express endpoint bridging. The wide I/O count and embedded multipliers also make it suitable for custom display controllers and ASIC prototyping. When designing with this device, designers must respect the 1.0 mm BGA pitch constraint and apply standard JTAG-based configuration via the Altera/Intel Quartus Prime design suite. Power sequencing of VCCINT (1.2 V) and VCCIO banks is required to avoid inrush damage; the device supports both active serial and passive parallel configuration schemes. This page combines Intel/Altera datasheet parameters, distributor pricing, and drop-in same-package alternatives into a single reference - information not consolidated in any single source. Engineers seeking a Cyclone III device with 39.6K logic elements, 1.16 Mbit of embedded memory, and 535 user I/Os in a 780-FBGA will find the EP3C40F780C7 datasheet, pinout, and pricing summary below.

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EP3C40F780C7N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel
EP3C40F780C7N

EP3C40F780C7N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3C40F780C7N is a Cyclone III family Field-Programmable Gate Array (FPGA) containing 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/Os, housed in a 780-ball FineLine BGA package with industrial temperature grade support. The trailing 'C7' in the part number designates the 7 speed grade at commercial operating conditions, while 'N' indicates a lead-free / RoHS-compliant package finish. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit at the apex of digital logic integration, bridging the gap between fixed-function ASICs and software-driven microcontrollers. Cyclone III specifically targets low-power, high-volume applications where designers need substantial logic density without the power and cost penalty of high-end FPGAs. The Cyclone III family is built on a 65 nm TSMC low-power process, enabling static power as low as a few milliwatts in standby and a typical power reduction of more than 50% compared to the prior-generation Cyclone II. The 780-FBGA package supports the largest Cyclone III device with 535 user I/Os, providing ample connectivity for parallel data buses, memory interfaces, and high-speed peripherals. Embedded memory totals 1,161,216 bits (RAM bits) distributed across M9K blocks, and 126 embedded 18x18 multipliers serve DSP workloads. The device is supported by the Altera / Intel Quartus II / Quartus Prime design suite, with free Web Edition license entry points. Designers can leverage IP cores for DDR/DDR2 memory controllers, Ethernet MACs, PCIe (soft IP), and common serial protocols. Configuration is typically via JTAG or active/passive serial flash, with built-in decompression and encryption options for secure bitstream handling. Typical applications include industrial machine vision, factory automation controllers, video processing pipelines, motor control, test and measurement equipment, and as a glue-logic aggregator in telecom line cards. The 535 I/Os make the device attractive for high-pin-count bridging designs, including LCD/OLED display controllers and multi-port memory hubs. The combination of low power, high I/O count, and large logic capacity makes it a long-running favorite for cost-sensitive embedded platforms. When designing with this FPGA, pay close attention to power architecture: even at modest toggle rates the 780-FBGA can draw several watts, so a multi-rail supply with proper decoupling and a thermally-aware PCB layout are essential. Use Quartus Prime PowerPlay early estimates to size your regulators and copper pours before layout, and verify signal-integrity on the high-speed LVDS pairs using IBIS models. The N-variant of the package finish is lead-free, so JEDEC J-STD-020 MSL3 handling is mandatory at assembly.

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EP3C40F780C8 - Cyclone III FPGA, 40K LEs, 780-FBGA | Intel
EP3C40F780C8

EP3C40F780C8 - Cyclone III FPGA, 40K LEs, 780-FBGA | Intel

The Intel (formerly Altera) EP3C40F780C8 is a Cyclone III low-power Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 780-ball FineLine BGA (FBGA) package with 535 user I/O pins. Built on a 65 nm low-power process, the device targets cost- and power-sensitive high-volume applications while delivering DSP-rich programmable logic. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory blocks, multipliers, PLLs, and high-speed transceivers. Within the broader taxonomy, the EP3C40F780C8 sits in the low-power, low-cost segment (Cyclone family) of the programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> semiconductor. The 'drop-in' family pedigree lets designers add parallel processing, custom I/O protocols, and hardware-accelerated DSP without an ASIC redesign. Key features of the EP3C40F780C8 include four general-purpose PLLs, 20 global clock networks, and support for external memory interfaces such as DDR/DDR2/QDRII SRAM via dedicated PHY blocks. The 780-FBGA package enables 535 user I/O for high pin-count glue-logic, motor-control, and video/display bridging designs. The Cyclone III architecture lowers static and dynamic power compared with earlier Cyclone generations, making the part well-suited to thermally constrained embedded systems. The Cyclone III fabric combines LUT-based logic with embedded M9K memory blocks and 18x18 multipliers, allowing efficient implementation of finite impulse response (FIR) filters, FFT engines, and Nios II embedded processor subsystems. The high I/O count (535) is a strong fit for parallel buses, camera/display interfaces, and industrial control planes that need many LVCMOS/LVDS lanes. Typical applications include industrial motor control and factory automation, video surveillance image processing, automotive infotainment prototypes, low-cost software-defined radio front ends, and embedded vision/display bridges. The combination of DSP blocks and abundant logic resources also suits medical imaging pre-processing and portable test and measurement equipment. Designers should plan thermal management around the 780-FBGA and use Intel's Quartus Prime design software (with the Cyclone III device support installed) for synthesis, place-and-route, and timing closure. A multi-layer PCB with continuous power and ground planes plus proper decoupling is mandatory for signal-integrity on high-toggle-rate pins. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not collected in the manufacturer datasheet, giving engineers a single, citable reference for the EP3C40F780C8.

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EP3C40F780C8N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel
EP3C40F780C8N

EP3C40F780C8N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3C40F780C8N is a low-power Cyclone® III Field Programmable Gate Array (FPGA) delivering 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/Os in a 780-ball FineLine Ball-Grid Array (FBGA) package. It operates from a 1.15V to 1.25V core supply with commercial 0°C to +85°C temperature grade and a speed grade 8 (C8) timing bin, targeting cost-sensitive high-volume applications. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can re-program in the field to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven processors: unlike ASICs they require no fabrication mask, and unlike microcontrollers they execute logic in dedicated hardware rather than sequential firmware. Cyclone III belongs to Intel's low-cost, low-power FPGA family, succeeding Cyclone II with a 65nm process that drops static power roughly 50% and dynamic core power roughly 25%, while adding hardware multipliers and a richer memory hierarchy. Key features include 126 embedded 18x18 multipliers (up to 396 9x9 multipliers), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The device offers 20 global clock networks, 535 maximum user I/Os arranged in 9 I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, plus configuration via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. Architecturally the EP3C40F780C8N uses a 65nm TSMC low-power process, an M9K memory block tile of 9 Kbit each (with parity), and dedicated hardware multiplier blocks routed through adjacent logic array blocks (LABs) of 16 LEs each. The C8 speed bin is the slowest commercial Cyclone III grade and trades fMAX for cost reduction in non-timing-critical designs. Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, automotive infotainment subsystems, low-cost software-defined radio front-ends, and consumer display controllers. The combination of hardware multipliers and embedded memory makes it well suited to digital signal processing (DSP) and protocol bridging tasks. When designing with the EP3C40F780C8N, ensure 1.15V-1.25V core and 2.5V/3.3V I/O supplies are properly decoupled with 100nF + 10uF ceramic caps near each supply pin, route all global clocks through PLL outputs where possible, and confirm PCB BGA escape routing supports 1.0mm ball pitch microvia stacks. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/IV family, and practical design notes not consolidated in the manufacturer datasheet.

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EP3C40F780I7 - 39.6K LEs Cyclone III FPGA 780-BGA | Intel
EP3C40F780I7

EP3C40F780I7 - 39.6K LEs Cyclone III FPGA 780-BGA | Intel

The Intel (formerly Altera) EP3C40F780I7 is a Cyclone® III family Field-Programmable Gate Array (FPGA) housing 39,600 logic elements (LEs) in a 780-ball FineLine BGA package with industrial temperature grade (-40C to +100C). The device integrates 1,161,216 bits of embedded RAM (234 M9K blocks of 9 Kbits each plus 112,500 bits of MLAB) and 535 (9-bit) multipliers, giving it roughly 1.1 Mbit of on-chip memory and ~172 GMAC/s of DSP throughput at a maximum internal clock of 472.5 MHz. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the engineer programs after manufacture, making the FPGA a re-programmable equivalent of an application-specific integrated circuit (ASIC). FPGAs sit hierarchically between general-purpose microcontrollers and hard-wired ASICs: microcontrollers run software sequentially, while FPGAs execute parallel custom logic in hardware. The Cyclone III family specifically targets cost-sensitive, high-volume applications such as industrial control, video processing, and communications line cards where the engineer needs true parallelism at a fraction of the cost and power of high-end FPGAs. Key features of the EP3C40F780I7 include 4 PLLs for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII SRAM, dedicated LVDS pairs for high-speed differential signaling, and a 1.2 V core voltage (VCCINT) with separate VCCIO banks for mixed-voltage I/O. The F780 package provides 780 balls on a 29x29 mm FineLine BGA substrate suitable for high-density SMT assembly. The Cyclone III architecture is built on a low-power 65 nm process with a 1.2 V core that minimizes dynamic power; the 'I7' suffix indicates the industrial temperature range. Typical applications include motor control, video bridging, industrial Ethernet, software-defined radio (SDR), and low-cost ASIC prototyping. When designing with this device, pay close attention to bank-based VCCIO planning, decoupling strategy for VCCINT/VCCPLL, and the JTAG configuration pinout; the Quartus II / Quartus Prime toolchain is required for synthesis and place-and-route. The 780-BGA package is large but the industrial temperature grade and abundant DSP blocks make this part well-suited to factory automation and outdoor telecom equipment.

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