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产品（39,000+)

EP3C40F780I7N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel
EP3C40F780I7N

EP3C40F780I7N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel

The Intel (Altera) EP3C40F780I7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/O pins, housed in a 780-ball FineLine BGA package with 1.2 V core operation. It belongs to the Cyclone III family fabricated on a 65 nm TSMC low-power process, balancing logic density, DSP capability, and static power consumption for cost-sensitive embedded and industrial designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses configurable logic blocks (CLBs), programmable interconnects, and embedded memory/DSP blocks to implement arbitrary digital circuits after manufacturing. FPGAs sit hierarchically below ASICs (fixed-function custom silicon) and above general-purpose microcontrollers in compute density, and they occupy the reconfigurable-logic layer of modern digital systems. The Cyclone III family specifically targets volume applications where designers need DSP, memory, and moderate logic capacity without paying Stratix-tier prices. Key features include 126 embedded 18x18 multipliers (DSP blocks) for high-throughput arithmetic, four phase-locked loops (PLLs) for clock management, 39600 logic elements wired through a multi-level interconnect fabric, and 1,161,216 bits of embedded SRAM arranged in M9K blocks. The 780-pin FBGA (F780) package exposes 535 user I/Os and supports LVDS, LVCMOS, SSTL, and HSTL I/O standards, making it suitable for parallel memory buses and high-speed sensor interfaces. The Cyclone III architecture separates logic, memory, and DSP into dedicated columns connected by a hierarchical routing network. Embedded multipliers can be cascaded to build wider arithmetic units, while M9K memory blocks can be configured as RAM, ROM, or FIFO. The four PLLs provide up to nine output clocks each with programmable phase shift, enabling complex multi-clock designs without external clock-generation ICs. Typical applications include industrial motor control, video processing pipelines, communications protocol bridging, and embedded DSP for test and measurement. With 39.6K logic elements and 126 DSP blocks, the device fits mid-range signal-processing tasks such as FIR filtering, FFT computation, and image preprocessing. Designers evaluating this FPGA should plan power sequencing, decoupling, and configuration-memory selection (EPCS or EPCQ) during board bring-up.

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EP3C40F780I8N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel
EP3C40F780I8N

EP3C40F780I8N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel

The Intel EP3C40F780I8N is a member of the Cyclone III family of high-volume, low-cost, low-power Field Programmable Gate Arrays (FPGAs), featuring 39,600 logic elements organized into 2,475 Logic Array Blocks (LABs/CLBs), 1,161,216 bits of embedded memory, and 126 multipliers, housed in a 780-ball FBGA package with industrial temperature grade. The device operates from a nominal 1.2 V core supply (range 1.15 V to 1.25 V) and supports up to 4 PLLs with 4 dedicated clock pins per bank for flexible clock tree synthesis across up to 20 I/O banks. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets designers configure arbitrary digital logic through SRAM-based configuration cells. FPGAs sit at the intersection of ASIC efficiency and processor flexibility: they offer hardware parallelism and deterministic timing that microcontrollers cannot match, while allowing in-system reconfiguration that fixed-function ASICs cannot deliver. The Cyclone III family specifically targets cost-sensitive, power-constrained high-volume applications where designers need ASIC-class logic density without ASIC NRE cost, making it a workhorse for industrial control, video, and communications infrastructure. Key features of the EP3C40F780I8N include 39,600 logic elements, 1,161,216 bits of embedded SRAM (approximately 135 KBytes), 4 PLLs, 20 global clock networks, 535 user I/O pins, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 780-BGA package provides generous I/O count for high-pin-count parallel interfaces such as parallel video, RGMII, or PCI/PCI-X bus bridging, and the industrial temperature range (-40 °C to 100 °C) suits outdoor, factory-floor, and automotive-cabin deployments. The EP3C40F780I8N is fabricated in TSMC's low-power 65 nm process, which is the foundation of the Cyclone III family's industry-leading static power profile (typically under 100 mW quiescent). The device supports configuration via passive serial, active serial (EPCS), JTAG, and Fast Passive Parallel modes, enabling flexible boot from low-cost EPCS flash or microprocessor host. On-chip termination (OCT) calibration and LVDS signaling up to 875 Mbps simplify board design. Typical applications include industrial motor control and PLCs, broadcast video processing (HD-SDI/SDI bridges, LCD/TFT controllers), wireline telecom line cards, military/aerospace avionics, medical imaging pre-processing, and software-defined radio baseband. The combination of high logic density and large embedded memory makes it well suited for buffering full HD frames in video pipelines and for protocol adaptation in telecom backplanes. When designing with the EP3C40F780I8N, allocate configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) carefully and follow the Cyclone III pin connection guidelines for unused pins and bank VCCIO selection. Quartus II Web Edition (free) supports the full Cyclone III device family, but designers targeting high-utilization designs with timing closure benefit from the subscription edition's TimeQuest and Chip Planner. The 780-BGA's 1.0 mm ball pitch requires 4-layer minimum PCB stack-up with microvia-in-pad at HDI processes. This page synthesizes distributor pricing, real-time stock signals, drop-in alternatives from the same Cyclone III family, and practical board-level design notes not found in any single manufacturer datasheet.

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EP3C40Q240C8 - Cyclone III, 39.6K LE FPGA, 240-PQFP | Intel
EP3C40Q240C8

EP3C40Q240C8 - Cyclone III, 39.6K LE FPGA, 240-PQFP | Intel

The Intel (formerly Altera) EP3C40Q240C8 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP / 240-BFQFP) package. According to the distributor listings, the device integrates 39,600 logic elements, 1,161,216 bits of embedded memory (M9K blocks totaling 113,664 bytes per block), four phase-locked loops, 126 embedded 18x18 multipliers, and 128 maximum user I/O pins. The 'C8' speed grade corresponds to a commercial temperature rating of 0C to +85C with an 8 ns internal timing specification. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells can be programmed in-system to implement arbitrary digital circuits. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and microcontrollers, offering hardware parallelism, high I/O counts, and deterministic timing. The Cyclone III family specifically targets low static and dynamic power consumption, enabling FPGA adoption in cost- and power-sensitive applications such as video processing, motor control, and portable instrumentation that were previously dominated by microcontrollers or DSPs. The EP3C40Q240C8 leverages TSMC's 65 nm low-power process, achieving up to 70% lower power than the prior Cyclone II generation. The 240-PQFP package offers 128 usable I/O across eight I/O banks with support for multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS. The four PLLs provide robust clock management, while 4,608 Kbits of embedded RAM enable on-chip buffering and FIFO structures. Compared with other Cyclone III variants, the EP3C40Q240C8 strikes a balance between logic density, I/O count, and package cost. Typical applications include industrial control and factory automation, video surveillance and image processing, motor and servo control, software-defined radio front-ends, and high-volume consumer electronics. The Cyclone III architecture supports Nios II embedded processor cores, making the EP3C40Q240C8 suitable as a system-on-chip host for embedded designs that need deterministic hardware acceleration alongside firmware control. When designing with the EP3C40Q240C8, ensure that the Quartus II design tool supports the 'C8' speed grade and the Q240 package. The PQFP package is a through-hole-friendly surface-mount format; thermal performance is dominated by the 1.2V core supply and a separate PLL analog supply, both of which require multi-layer PCB decoupling. This page synthesizes distributor pricing, drop-in alternative FPGAs in the same QFP footprint, and practical design notes not duplicated from the manufacturer datasheet.

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EP3C40Q240C8N - Cyclone III FPGA, 39.6K LEs, 240-BFQFP | Intel
EP3C40Q240C8N

EP3C40Q240C8N - Cyclone III FPGA, 39.6K LEs, 240-BFQFP | Intel

The Intel (formerly Altera) EP3C40Q240C8N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements (LEs), 1,161,216 bits of embedded memory (1134 Kb), and 126 embedded 18 x 18 multipliers, housed in a 240-pin Plastic Enhanced Quad Flat Pack (240-BFQFP) package with 128 user I/Os. The device operates from a 1.15 V to 1.25 V core supply and is specified for the commercial 0 C to 85 C temperature range (speed grade 8). A Cyclone III FPGA is a programmable logic device built on a TSMC 65 nm low-power process that combines lookup tables (LUTs), embedded memory blocks (M9K), embedded multipliers, and a flexible I/O ring into a single fabric. Cyclone III sits within Intel's FPGA hierarchy below Cyclone IV and Cyclone V, optimized for cost-sensitive, power-sensitive applications such as industrial control, video processing, and communication bridging. The fabric is configured at power-up from an external flash memory or via JTAG. Key features include 4 phase-locked loops (PLLs) for flexible clock synthesis, support for multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), and 20 global clock networks. The Cyclone III family emphasizes low static and dynamic power compared with Cyclone II while maintaining a comparable logic density. The 240-BFQFP package enables conventional surface-mount assembly with no fine-pitch BGA handling, simplifying prototyping and low-volume manufacturing. Typical applications include industrial motor control, video surveillance and image processing pipelines, automotive infotainment pre-production prototypes, low-cost software-defined radio front-ends, and protocol bridging between legacy and modern serial interfaces. The combination of 126 hardware multipliers and 1134 Kb of block RAM makes the EP3C40 well suited to DSP-style filtering and buffering tasks that would otherwise require a discrete DSP. Designers should plan for at least 4-layer PCB stack-up with dedicated power planes for VCCINT (1.2 V) and VCCIO (1.2 V to 3.3 V) to maintain signal integrity across the 128 user I/Os. Quartus II Web Edition (or later) is required for synthesis, place-and-route, and bitstream generation; configuration can be loaded via JTAG or through an Altera-compatible serial flash. This page synthesizes current distributor pricing, same-family Cyclone III drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3C40U484A7N - Cyclone III FPGA 39.6K LE | Intel | Automotive
EP3C40U484A7N

EP3C40U484A7N - Cyclone III FPGA 39.6K LE | Intel | Automotive

The Intel (formerly Altera) EP3C40U484A7N is a Cyclone III family Field-Programmable Gate Array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded SRAM, and 4 PLLs in a 484-ball Plastic Ultra-FineLine BGA (UFBGA) package. Built on a low-power 65 nm process, it supports a core voltage of 1.2 V and offers up to 331 user I/O pins with high-speed LVDS interfaces, making it suitable for cost-sensitive, power-aware applications. The part is graded for the automotive temperature range and targets applications requiring deterministic logic density and flexible DSP blocks. A Cyclone III FPGA is a reprogrammable semiconductor device based on an SRAM lookup-table architecture that allows engineers to implement arbitrary digital logic, DSP functions, memory controllers, and high-speed serial/parallel interfaces after PCB fabrication. The Cyclone III family is positioned in Intel's low-end FPGA portfolio, bridging the gap between fixed-logic ASICs and higher-density FPGAs such as Cyclone IV, Cyclone V, and Stratix families. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital IC hierarchy. Key features include 39,600 logic elements, 126 embedded multipliers (18x18), 4 general-purpose PLLs, 1.161 Mbits of embedded memory, and support for external memory interfaces including DDR, DDR2, SDRAM, and QDRII SRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration can be carried out via passive serial (PS), fast passive parallel (FPP), or JTAG, supporting in-system reprogrammability through Altera/Intel Quartus design software. From an architectural standpoint, Cyclone III devices use a logic-element fabric built around 4-input LUTs and dedicated carry chains, with embedded memory blocks distributed throughout the array. The 65 nm process delivers substantially lower static power than the prior Cyclone II generation while preserving deterministic timing closure. Each PLL provides up to nine output taps with independent frequency synthesis, useful for clock domain management across heterogeneous interfaces. Typical applications include automotive driver-assistance and infotainment pre-processing, industrial motor control, video surveillance and image processing, software-defined radio front ends, and portable test instrumentation. The UFBGA-484 package supports high I/O count designs while maintaining a compact board footprint suitable for space-constrained modules. The combination of logic density, embedded memory, and DSP blocks makes the EP3C40 suitable for mid-complexity digital signal pipelines. When designing with this device, plan I/O bank assignments carefully because the LVDS pairs and PLL clock inputs have fixed pin locations in the UFBGA package. Decoupling capacitance and PCB stack-up directly impact the integrity of DDR memory interfaces; consult the Cyclone III device handbook for board-design guidelines. Quartus Prime or Quartus II design software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design considerations not found in the standalone datasheet, giving engineers a faster path to sourcing and integrating the EP3C40U484A7N into production designs.

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EP3C40U484C6 - Cyclone III FPGA 39.6K LE 484-UBGA | Altera
EP3C40U484C6

EP3C40U484C6 - Cyclone III FPGA 39.6K LE 484-UBGA | Altera

The Altera (Intel) EP3C40U484C6 is a member of the Cyclone III family of low-power, high-volume Field-Programmable Gate Arrays (FPGAs), delivering 39,600 logic elements and 1,161,216 bits of embedded memory in a 484-ball UFBGA (UBGA) package with 0.8 mm ball pitch and 19 mm × 19 mm body. The device integrates 396 logic array blocks, 4 PLLs, 20 global clock networks, and 331 maximum user I/O pins, making it suitable for cost-sensitive, high-volume digital logic applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP blocks, and phase-locked loops (PLLs). FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher performance per watt than general-purpose microcontrollers for parallel DSP, video bridging, and custom interface work. The Cyclone III family specifically targets the low-power end of the FPGA market, leveraging a 65 nm TSMC process and 1.2 V core to optimize dollar-per-logic-element. Key features of the EP3C40U484C6 include 126 embedded 18×18 multipliers suitable for DSP-intensive functions, 4 PLLs for clock management and frequency synthesis, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device operates across a commercial temperature grade (the C6 suffix indicates a 6-speed grade), with a core supply of 1.15 V to 1.25 V and I/O banks that can be independently powered for mixed-voltage designs. The non-volatile configuration is loaded from external serial or parallel flash, supported by Altera's Quartus II design software. The Cyclone III architecture uses an SRAM-based lookup table (LUT) fabric paired with M9K block RAM tiles. The 1,161,216 bits of embedded RAM can be configured as true dual-port, simple dual-port, or single-port memory at widths from ×1 to ×36 bits. Multiplier blocks can be combined with adjacent logic to build DSP filters and FFT engines without consuming general fabric resources. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, and embedded prototyping platforms. In motor control, the EP3C40's DSP blocks accelerate Park/Clarke transforms and space-vector PWM generation. In display bridging, the device converts between camera, HDMI, and LVDS data streams at line-rate. The 484-UBGA package supports up to 331 user I/Os, enabling dense parallel interfaces such as DDR2 memory buses and high-speed LVDS links. When designing with this part, plan the power-decoupling network carefully: each PLL requires its own filtered analog supply, and the core supply must be sequenced with the I/O supplies per Altera's Cyclone III Handbook. The UFBGA-484 PCB footprint demands 0.8 mm-pitch via-in-pad or dog-bone fan-out, with controlled-impedance routing for LVDS and DDR2 interfaces. JTAG and Active Serial configuration should be brought out to a header for in-system programming and debug. This page synthesizes distributor pricing, drop-in alternatives, and engineering design guidance not found in the standalone manufacturer datasheet, including same-package same-family variants that share the 484-UBGA footprint.

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EP3C40U484C6N - 39.6KLE Cyclone III FPGA, 484-FBGA | Intel
EP3C40U484C6N

EP3C40U484C6N - 39.6KLE Cyclone III FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3C40U484C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, 126 embedded 18x18 multipliers, and 331 maximum user I/O pins, housed in a 484-ball FineLine BGA (UFBGA) package. It is built on a low-power 65 nm process, operates from a 1.2 V core supply, and is rated for the commercial 0 °C to +85 °C temperature range with -6 speed grade performance. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that belongs to the broader semiconductor category of integrated circuits. In the device hierarchy, an FPGA sits between a fixed-function Application-Specific Integrated Circuit (ASIC) and a general-purpose microprocessor: like an ASIC it implements custom digital logic, but unlike an ASIC its function is defined by a user-loadable configuration bitstream rather than at fabrication time. FPGAs contain configurable logic blocks (CLBs), programmable routing, embedded memory, DSP blocks, and I/O serdes, and they are used to prototype designs, accelerate parallel workloads, and ship low-to-mid volume products where ASIC NRE is uneconomical. Key features of the EP3C40U484C6N include support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), four general-purpose PLLs for clock management, up to 4 Mb of M9K embedded SRAM, and Cyclone III series static power approximately 50 % lower than Cyclone II. The device supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) interfaces using the industry-standard Altera/Intel configuration scheme. Architecturally, the Cyclone III device fabric comprises LABs (Logic Array Blocks) of 16 logic elements each, distributed M9K memory blocks, embedded multiplier blocks for DSP, and per-I/O bank supply pins for mixed-voltage interfacing. The -6 speed grade places this part in the mid-tier of the Cyclone III family, balancing timing margin against cost. Typical applications include industrial motor control, video processing pipelines, telecom baseband preprocessing, military/aerospace ruggedized subsystems, and ASIC prototyping for mid-complexity designs. Designers choose the U484 (484-pin FBGA) variant when their design requires the maximum 331 user I/O of the EP3C40 die, beyond what smaller packages expose. When designing with this part, observe the 484-ball BGA fan-out: route all 8 user-I/O bank supplies (VCCIO) and the 1.2 V core (VCCINT) with at least one decoupling capacitor per bank, place a 100 MHz or lower reference clock into a PLL-clean CLK pin, and use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis and place-and-route to guarantee timing closure. This page synthesizes distributor pricing, drop-in-compatible Cyclone III alternatives, and PCB layout guidance that the manufacturer datasheet alone does not consolidate in a single view.

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EP3C40U484C7 - Cyclone III FPGA 39.6K LEs 484-FBGA | Altera
EP3C40U484C7

EP3C40U484C7 - Cyclone III FPGA 39.6K LEs 484-FBGA | Altera

The Altera EP3C40U484C7 is a Cyclone III family Field-Programmable Gate Array (FPGA) IC with 39,600 logic elements, 1,161,216 bits of embedded memory, and 331 user I/O pins, packaged in a 484-ball FineLine BGA (UBGA). Built on a 65 nm TSMC low‑low power process, it operates from a 1.2 V core supply with industrial temperature grade support. The device integrates 126 embedded 18x18 multipliers, 4 PLLs, and a global clock network to support digital logic, DSP, and basic video bridging designs. A Cyclone III FPGA is a SRAM-based programmable logic device that allows designers to implement arbitrary digital logic, glue functions, and parallel processing through configurable logic blocks (LEs), dedicated DSP blocks, embedded memory blocks, and programmable I/O. Within the broader taxonomy, FPGAs sit in the programmable logic family between simple CPLDs and high-end SoC FPGAs. Cyclone III specifically targets low-static-power applications such as industrial control, video bridging, and cost-sensitive communications equipment. Key features include 39,600 logic elements, 1,161,216 bits (approximately 113 KBytes) of embedded RAM arranged in M9K blocks, 126 dedicated 18x18 multipliers providing up to approximately 21 GMACs DSP throughput, 4 phase-locked loops for clock management, and 331 single-ended user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm low-power process gives the family its hallmark sub-0.5 W static power consumption, far below previous Cyclone generations. Typical applications include industrial motor control, video surveillance IP cameras, video format converters, low-cost ASIC prototyping, embedded vision, point-of-sale terminals, and portable test equipment. The high multiplier count and large memory make it well matched to moderate-performance DSP pipelines and parallel sensor aggregation. When designing with the EP3C40U484C7, ensure that the Quartus II toolchain (13.0 or older) supports the device because later Quartus releases dropped legacy Cyclone III support. Plan JTAG/AS configuration circuitry, and respect the differential pair placement rules for LVDS channels.

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EP3C40U484C7N - Cyclone III FPGA, 39.6K LEs, 484-FBGA | Intel
EP3C40U484C7N

EP3C40U484C7N - Cyclone III FPGA, 39.6K LEs, 484-FBGA | Intel

The Intel EP3C40U484C7N is a low-power Cyclone® III field-programmable gate array (FPGA) housed in a 484-ball fine-pitch BGA (UBGA) package, providing 39,600 logic elements, 1,161,216 bits of embedded memory (RAM bits), 4 PLLs, and 331 maximum user I/O pins. Built on a 65 nm TSMC low-k process, it integrates up to 126 embedded multipliers (18x18) for DSP acceleration, making it suitable for cost-sensitive yet logic-rich applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks (lookup tables, flip-flops), programmable interconnect, and I/O pads that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: digital logic -> programmable logic -> FPGA -> programmable logic IC -> semiconductor. The Cyclone III family specifically targets low static and dynamic power consumption while offering high logic density for volume applications. Key features of the EP3C40U484C7N include 39,600 logic elements, 1,161,216 total RAM bits distributed across M9K memory blocks, 4 user PLLs for clock management, 20 global clock networks, 331 user I/O pins, and 126 dedicated 18x18 hardware multipliers. It supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and operates from a 1.2 V core supply with separate bank I/O voltages for mixed-voltage interfaces. The Cyclone III architecture uses an SRAM-based lookup-table logic element with a 4-input LUT architecture, optimized for high logic utilization at low power. Embedded M9K memory blocks can be configured as RAM, ROM, or FIFO with true dual-port operation, and the 18x18 hardware multipliers enable DSP functions without consuming general-purpose logic. Power management features include hot-socketing, power-on reset, and programmable power modes. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards, automotive driver assistance (body electronics, infotainment), military/aerospace signal processing, and consumer electronics requiring custom glue logic or DSP acceleration. The 484-UBGA package supports dense PCB layouts for space-constrained systems. When designing with this device, ensure proper decoupling of the 1.2 V core supply and each I/O bank supply. JTAG configuration via the dedicated AS or JTAG pins is required for programming; design must accommodate configuration mode selection and a valid configuration source (EPCS or JTAG). Thermal management must consider ambient temperature and total power consumption, with the U484 package having a measured theta-JA around 20 C/W. This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone, providing engineers a single reference for evaluation and sourcing.

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EP3C40U484C8 - Cyclone III FPGA 40K LE 484-FBGA | Intel
EP3C40U484C8

EP3C40U484C8 - Cyclone III FPGA 40K LE 484-FBGA | Intel

The Intel (formerly Altera) EP3C40U484C8 is a Cyclone III low-power field-programmable gate array (FPGA) with 39,600 logic elements housed in a 484-ball FineLine BGA package. It integrates 1,161,216 bits of embedded memory organized in 396 Kbits of M9K blocks and supports up to 331 general-purpose I/O pins. The device combines high logic density with a 65 nm process node optimized for low static and dynamic power consumption, making it well-suited for cost-sensitive, power-constrained designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic elements (LEs), embedded memory blocks, and programmable interconnect, all of which can be reconfigured by the end user after manufacturing. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose processors, offering hardware-level parallelism and post-production flexibility. Cyclone III specifically targets volume applications requiring moderate logic density, embedded multipliers, and low power. Standout features of the EP3C40U484C8 include 4 PLLs for clock management, 126 embedded 18x18 multipliers for DSP operations, and a commercial temperature grade (C8 speed grade denoting 8 ns core performance). The device supports common I/O standards such as LVDS, SSTL, and LVCMOS, and interfaces to external memories including DDR, DDR2, and QDRII SRAM. Configuration can be performed via JTAG, AS, or PS modes using Altera/Intel Quartus software. Typical applications include industrial motor control, video processing, automotive infotainment subsystems, telecommunications line cards, and consumer electronics requiring custom logic integration. Its combination of low power and high logic density makes it attractive for portable and battery-powered designs where ASIC NRE cost is prohibitive. When designing with the EP3C40U484C8, engineers should pay close attention to BGA fanout and PCB stack-up routing constraints, and verify thermal dissipation in space-limited enclosures. Quartus II / Quartus Prime provides synthesis, place-and-route, and timing analysis toolchains that fully support this device family. This page synthesizes distributor pricing, verified drop-in alternatives, and engineering design notes not found in the manufacturer datasheet alone.

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EP3C40U484C8N - Cyclone III FPGA 40K LE, 484-FBGA | Intel / Altera
EP3C40U484C8N

EP3C40U484C8N - Cyclone III FPGA 40K LE, 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C40U484C8N is a low-power Cyclone® III field-programmable gate array (FPGA) containing 39,600 logic elements, packaged in a 484-ball fine-pitch BGA (UBGA, 19x19 mm, 0.8 mm pitch). According to the verified distributor listings, the device provides 331 user I/O pins, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, making it one of the highest-density members of the Cyclone III family. The part number suffix decodes as: U = UBGA 484 package, C8 = commercial speed grade 8 (slower, lower-cost tier), N = lead-free / RoHS tray packaging, and the leading 'EP3C40' identifies the 40K-logic-element Cyclone III device. What is a Cyclone III FPGA? Cyclone III is a 65 nm SRAM-based low-power FPGA family from Intel/Altera targeting cost-sensitive, high-volume applications. In the broader taxonomy it sits below: FPGA -> programmable logic device (PLD) -> digital IC -> integrated circuit -> semiconductor. The family is known for low static and dynamic power, integrated transceivers on selected members, and a Quartus Prime / Quartus II toolchain that supports both HDL and IP-based design flows. Key features include 4 PLLs, 20 global clock networks, 39600 logic elements, 1161216 bits of RAM, 126 DSP (18x18) blocks, and operation from a 1.2 V core supply with hot-socketing support. The C8 speed grade targets cost-optimized designs where maximum Fmax is not critical. JTAG (IEEE 1149.1) configuration is supported alongside passive serial, fast passive parallel, and active serial modes via the dedicated configuration pins. Typical applications for the EP3C40U484C8N span industrial motor and motion control, video/image processing pipelines, software-defined radio front ends, telecom line-card glue logic, and embedded display controllers. The 484-ball package provides ample I/O and routing density for parallel memory buses (DDR/DDR2) and multiple high-speed serial interfaces. The -40C to +85C industrial temperature range supports factory-floor and outdoor deployments. When designing with this device, plan power sequencing carefully - the 1.2 V VCCINT must ramp monotonically. Use the Quartus PowerPlay analyzer to estimate junction temperature and apply thermal relief on inner BGA balls. The UBGA-484 footprint requires a 0.8 mm-pitch PCB land pattern with via-in-pad recommended for reliable assembly.

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EP3C40U484I7 - 40K LE Cyclone III FPGA, 484-FBGA | Intel / Altera
EP3C40U484I7

EP3C40U484I7 - 40K LE Cyclone III FPGA, 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C40U484I7 is a Cyclone III Field-Programmable Gate Array (FPGA) from the Cyclone® III family, integrating 39,600 logic elements, 1,161,216 bits of embedded RAM, and 331 user I/Os in a 484-ball FineLine BGA (UBGA) package. Housed in the 19x19 mm 484-FBGA, the device is specified for the industrial -40C to +100C junction temperature range, with the speed grade 7 (fastest commercial timing closure for this die in the U484 package option). A Cyclone III FPGA is a low-power, low-cost SRAM-based programmable logic device built on TSMC's 65 nm low-power process. It sits in the broader programmable-logic taxonomy above generic logic ICs and below ASICs, providing hardware-configurable parallel processing, flexible I/O, and on-chip memory blocks without the NRE cost of custom silicon. The 'U' in the part number denotes the UBGA (Ultra FineLine BGA) package, and 'I7' marks the industrial temperature grade combined with speed grade 7 internal timing. Key features include 39,600 logic elements (LEs), 113 M9K embedded memory blocks (1,161,216 total RAM bits), four general-purpose PLLs, 56 embedded 18x18 multipliers (suitable for DSP functions), and 8 clock networks per device quadrant. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, with per-pin dynamic slew-rate and programmable drive strength. Architecturally, Cyclone III FPGAs use a 4-input lookup table (LUT) logic element with an associated register, true-dual-port M9K memory blocks, and dedicated multiplier/adder blocks for DSP. The 65 nm process and on-chip decoupling deliver low static and dynamic power, while configuration is stored in external serial or parallel flash (active serial, active parallel, passive serial, or JTAG modes). Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, low-cost ASIC prototyping, and embedded vision systems. The combination of plentiful multipliers, abundant block RAM, and high I/O count also suits test-and-measurement and communications infrastructure designs. When designing with this part, pay close attention to the 484-FBGA breakout - it requires a 1.0 mm ball pitch PCB with HDI (microvia) stack-up. Power-decoupling requires multiple bulk + 0.1 uF + 0.01 uF caps per VCCINT/VCCIO region, and JTAG chain length must accommodate the configuration controller's TCK setup time. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes - including U484 vs F484 footprint trade-offs - that are not consolidated on any single manufacturer or distributor page.

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EP3C40U484I7N - Cyclone III FPGA 39.6K LE 484-UBGA | Intel
EP3C40U484I7N

EP3C40U484I7N - Cyclone III FPGA 39.6K LE 484-UBGA | Intel

The Intel (formerly Altera) EP3C40U484I7N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 484-pin Ultra FineLine BGA (UBGA) package. It supports 331 maximum user I/O pins and operates across an industrial temperature range of -40C to +100C. The device is built on a 65 nm low-power process and is offered in both 1.2 V core and 3.3 V/2.5 V/1.8 V/1.5 V I/O bank supply variants. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing hardware designers to implement arbitrary digital circuits. FPGAs sit in the semiconductor hierarchy between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: more flexible than an ASIC and far more parallel than a microcontroller. Cyclone III sits in Intel's low-cost, low-power FPGA tier - designed for high-volume, cost-sensitive applications where ASIC NRE cost is unjustified. Key features include up to 4 PLL blocks per device, dedicated DDR/DDR2/QDRII memory interfaces with 200 MHz performance, and 1.2 V core voltage operation. The 65 nm process combined with internal voltage regulation reduces static power significantly compared with the Cyclone II generation. The 484-UBGA package offers a 1.0 mm ball pitch and supports up to 331 user I/O pins for high-density parallel interfaces. The Cyclone III architecture uses four-input look-up tables (LUTs), 9-Kbit M9K memory blocks, and 18x18-bit hardware multipliers arranged in columns adjacent to the M9K blocks. This column-based layout enables efficient DSP pipelines because multipliers and memory can be co-located with logic. Embedded multipliers can also be configured as 9x9 multipliers when higher precision is not required, doubling the available multiplier count. Typical applications include industrial motor control, video processing, automotive driver assistance, telecommunications infrastructure, and embedded digital signal processing. The combination of high logic density, embedded memory, and hardware multipliers makes Cyclone III well suited to mid-range DSP and parallel data acquisition designs. When designing with this device, ensure your I/O bank voltage plan is consistent with the peripherals you connect; mixed-voltage I/O banks must not exceed the absolute maximum ratings. Use the Quartus II (or later) design toolchain for synthesis, place-and-route, and timing closure - Cyclone III support is included in current Quartus versions. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3C55F484C6 - 55K LE Cyclone III FPGA 484-FBGA | Intel / Altera
EP3C55F484C6

EP3C55F484C6 - 55K LE Cyclone III FPGA 484-FBGA | Intel / Altera

The Intel (formerly Altera) Cyclone III EP3C55F484C6 is a low-power, high-volume Field Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/O pins, housed in a 484-ball FineLine BGA package. Built on a 65 nm low-power process, the device is offered in the commercial speed grade 6 variant and operates from a 1.2 V core supply with multi-voltage I/O support. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing an array of programmable logic blocks, embedded memory blocks, and programmable interconnect that engineers can customize after manufacturing. Cyclone III belongs to the low-cost FPGA family within Intel's programmable logic hierarchy (FPGA -> programmable logic -> programmable logic device -> semiconductor). It is positioned below higher-end Stratix families and above legacy Cyclone II in power efficiency and density, targeting cost-sensitive volume applications. Key features of the EP3C55F484C6 include 55,856 logic elements for moderate-complexity digital designs, 2,396,160 bits (approximately 2.4 Mbit) of embedded SRAM organized as M9K blocks, 4 PLLs for clock management, 20 global clock networks, and 56 embedded 18x18 hardware multipliers that accelerate DSP operations. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and the F484 package exposes 327 user I/O balls for high pin-count applications. Architecturally, Cyclone III FPGAs use a 65 nm TSMC low-power process with static core power of approximately 100 mW at 1.2 V, combined with on-chip voltage regulation and hot-socketing support. The four PLLs support frequency synthesis, phase shifting, and clock deskew across the 20 global networks, while the 18x18 multipliers enable DSP building blocks without consuming general logic resources. Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment prototypes, communications infrastructure line cards, and consumer display controllers. The combination of moderate density, low power, and a high-I/O BGA package makes the EP3C55 well suited for designs that require substantial user I/O but do not justify the cost of a high-end Stratix device. When designing with this device, plan I/O bank assignments carefully because the 484-FBGA provides 8 I/O banks with separate VCCIO rails. Decoupling must follow the Quartus II Pin Planner guidelines, and unused pins should be configured as inputs with weak pull-up to avoid floating inputs. JTAG configuration via the EPCS serial configuration device is recommended for volume production. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select between Cyclone III variants and migration paths within the Intel FPGA portfolio.

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EP3C55F484C6N - Cyclone III FPGA, 55K LE, 327 I/O | Altera
EP3C55F484C6N

EP3C55F484C6N - Cyclone III FPGA, 55K LE, 327 I/O | Altera

The Altera EP3C55F484C6N is a Cyclone III Field Programmable Gate Array (FPGA) with 55,856 logic elements, 327 user I/O pins and 2,396,160 RAM bits, housed in a 484-ball FBGA package with 1 mm pitch and 23 × 23 mm body. It operates from a 1.2 V core supply and supports up to 472 MHz internal clock frequency, making it a versatile mid-capacity programmable logic device for industrial, communications, and video applications. An FPGA (Field-Programmable Gate Array) is an integrated circuit whose logic fabric can be electrically reprogrammed in the field to implement arbitrary digital hardware. Unlike fixed-function ASICs, FPGAs contain programmable look-up tables, flip-flops, block RAM, multiplier blocks, and configurable I/O buffers connected by programmable routing. In the component taxonomy, an FPGA sits under Programmable Logic Device (PLD) and Integrated Circuit (IC); it is chosen when hardware flexibility, low non-recurring engineering cost, or massive parallel data processing is required. The EP3C55F484C6N provides 2,396,160 bits of embedded SRAM for FIFOs and soft-core processor memory, supports 327 user I/O pins on multiple I/O banks, and includes embedded 18×18 multiplier resources for DSP tasks. The -6 speed grade is the highest-performance commercial timing grade in the Cyclone III family, while the N suffix denotes a lead-free, RoHS-compliant package. The FBGA-484 package is 23 mm × 23 mm, 2.60 mm maximum height, 1 mm ball pitch, and is designed for surface-mount assembly. The device is built on a 65-nm low-power process and requires a 1.2 V VCCINT core supply, which reduces dynamic power compared to earlier 1.5 V/1.8 V FPGA families. Cyclone III architecture includes a hierarchical clock network and PLL-based clock management to distribute low-skew clocks across the device. I/O banks can be powered at different voltages to interface with a range of single-ended and differential standards. The C6N ordering code indicates commercial temperature operation from 0 °C to +85 °C. Typical end applications include industrial motor control, medical diagnostic imaging, broadcast video processing, communications infrastructure, and multi-channel test instrumentation. The combination of 55K logic elements and 327 I/O pins allows implementation of soft processors, high-speed data acquisition interfaces, and custom protocol controllers in a single programmable device. Designers using the EP3C55F484C6N must pay careful attention to power-supply decoupling on the 1.2 V VCC rails, correctly configure MSEL pins for the desired configuration scheme, and validate I/O assignments against the Cyclone III pin-out files before placing the part on a board. This XAIPART page synthesizes distributor inventory data, representative current pricing, same-package drop-in speed and temperature variants, and practical PCB notes that supplement Intel/Altera's official product documentation with actionable procurement and design guidance.

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EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
EP3C55F484C7

EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3C55F484C7 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/Os, housed in a 484-ball FineLine BGA (FBGA-484) package measuring 23 mm × 23 mm with 1.0 mm ball pitch. Built on a 65 nm TSMC low-k process, this industrial-grade device supports an internal clock frequency of up to 472 MHz and integrates 156 embedded 18 × 18 multipliers for DSP workloads, making it suitable for cost-sensitive parallel processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, signal processing pipelines, or interface bridges. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behaviour) and ASICs (custom silicon, fixed hardware) - offering hardware-timed parallelism with no NRE mask cost and rapid design iteration. The Cyclone III family specifically targets low-static-power applications and is a subclass of SRAM-based FPGAs, where configuration is loaded from an external flash at every power-up. Key features of the EP3C55F484C7 include support for up to 4 PLLs, embedded multiplier blocks for DSP operations, dedicated DDR/DDR2 SDRAM memory interfaces with dedicated DQS pins, and configurable I/O standards including LVDS, SSTL, and HSTL. The device is configured via serial or parallel flash using industry-standard JTAG or Active Serial (AS) modes. Its 484-ball FineLine BGA package provides ample I/O headroom and excellent signal-integrity performance for parallel buses and high-speed memory interfaces. Typical applications include industrial motor control, video surveillance IP cameras, automotive infotainment subsystems, programmable logic controllers (PLCs), embedded vision and machine-vision pipelines, and low-power software-defined radio front-end pre-processing. The large logic capacity also makes it suitable for telecom protocol bridging and ASIC prototyping in mid-volume production. When designing with this part, ensure the PCB has a clean multi-layer stack-up with continuous ground planes under the BGA to maintain signal integrity for DDR2 interfaces. Use the Altera/Intel Quartus II design suite (or the maintained Quartus Prime 13.0sp1 legacy branch) for synthesis, place-and-route, and timing closure.

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EP3C55F484C7N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
EP3C55F484C7N

EP3C55F484C7N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3C55F484C7N is a Cyclone III Field-Programmable Gate Array (FPGA) featuring 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/O pins in a 484-ball FineLine BGA (FBGA) package. It belongs to the lowest-cost, lowest-power Cyclone III family fabricated on a 60 nm process, with a commercial speed grade 7 device operating from 0C to 85C ambient. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable logic hierarchy: microcontrollers run sequential firmware, ASICs are hard-wired for one function, while FPGAs deliver hardware-level parallelism and can be reconfigured in-system to implement custom digital signal processing, glue logic, control planes, and high-speed bus interfaces. The Cyclone III family is positioned by Intel as the lowest-power FPGA family of its generation, optimized for cost-sensitive, high-volume applications. Key features of the EP3C55F484C7N include 4 transceivers absent (no high-speed serial transceivers - digital I/O only), 156 embedded 18x18 multipliers for DSP blocks, dedicated hardware for memory controllers and PLL clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The device is built on TSMC's low-power 60 nm process, achieving substantially lower static and dynamic power than the prior Cyclone II generation. Embedded RAM is distributed as true dual-port M9K blocks totalling 2.4 Mbits, ideal for FIFO buffers, register files, and small lookup tables. The Cyclone III architecture provides DSP blocks, embedded multipliers, and dual-port block RAM tightly coupled to the logic array, enabling efficient implementation of video processing pipelines, motor control loops, and protocol bridging. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes with built-in decompression and decryption using AES-256. The device is supported by the Quartus II design toolchain. Typical applications include industrial motor control and PLC logic, video surveillance image processing, machine vision front-ends, telecom protocol bridging, low-cost ASIC prototyping, and embedded display controllers. Designers choose Cyclone III when they need FPGA-class logic density and DSP performance at a unit cost below larger families such as Stratix, while still benefiting from hardened memory controllers and PLL. When designing with the EP3C55F484C7N, allocate dedicated VCCINT, VCCA, VCCD_PLL, and VCCIO bank supplies with sufficient decoupling - each bank can operate at a different I/O standard voltage (1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.3V LVTTL/LVCMOS). A multi-rail power-on sequence (VCCINT first, then VCCA, then VCCIO) is recommended for in-system programming reliability. This page consolidates current distributor pricing, drop-in FPGA alternatives in the 484-FBGA footprint, and practical design notes beyond the manufacturer datasheet to accelerate Cyclone III part selection and supply chain decisions.

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EP3C55F484C8 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel
EP3C55F484C8

EP3C55F484C8 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel

The Intel (formerly Altera) EP3C55F484C8 is a Cyclone® III Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 user I/Os in a 484-ball FineLine BGA package. It is built on a low-power 65-nm process and operates with a core logic frequency up to 472.5 MHz, making it a workhorse device for cost-sensitive, high-volume digital designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP blocks that can be reconfigured by the end user. FPGAs sit at the top of the digital IC hierarchy: programmable logic -> programmable logic device -> digital IC -> semiconductor. Cyclone III FPGAs specifically target applications that need abundant logic, moderate DSP, and low static power consumption without the cost of high-end transceivers or hardcore processors. Key features of the EP3C55F484C8 include 55,856 logic elements (LEs), 312 embedded 18x18 multipliers (DSP blocks), 2,396,160 bits of embedded SRAM, four phase-locked loops (PLLs), 20 global clock networks, and 327 general-purpose I/Os that support LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, and is supported by Intel Quartus® Prime / Quartus II design software. Architecturally, the Cyclone III family uses a low-k 65-nm process that lowers dynamic and static power versus Cyclone II by up to 50 percent. The 484-pin FBGA (23 x 23 mm body, 1.0 mm ball pitch, 2.60 mm height) provides dense board integration with lead-free Pb-free terminations, and the commercial speed grade -8 corresponds to a tighter timing margin than -7 or -6 variants. Typical applications include industrial motor control and machine vision, video processing and display bridging, communications protocol bridging, test and measurement equipment, and embedded control with soft-core processors such as Nios II. The 484-FBGA footprint and abundant I/O count make this specific variant well suited to designs requiring many parallel buses or LVDS channels. When designing with this part, verify that the Quartus II / Quartus Prime device support file for Cyclone III EP3C55 is installed. Because Cyclone III is a mature, mature product family, engineers should confirm long-term availability through Intel's product lifecycle documents or authorized distributors before committing to high-volume production. This page synthesizes distributor pricing, drop-in-compatible alternatives (same-brand and cross-brand), and practical design notes beyond what is in the manufacturer datasheet, giving engineers a single reference for selection and procurement.

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EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera
EP3C55F484C8N

EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C55F484C8N is a Cyclone III low-cost, low-power Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 327 user I/O pins, and 2,396,160 bits of embedded memory, packaged in a 484-ball FineLine BGA (FBGA) measuring 23 x 23 mm with 1.0 mm pitch. Operating from a 1.2 V core supply, the device supports up to 472 MHz internal operation per the Alldatasheet specification and is qualified for commercial temperature range (0 to +85 C). A Cyclone III FPGA is a SRAM-configurable logic device positioned in the low-cost FPGA tier, below the Stratix and Arria families. Cyclone III belongs to the broader FPGA hierarchy: programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA. The family targets cost-sensitive applications such as industrial control, video processing, and communications infrastructure where Stratix-class performance is unnecessary but a true programmable fabric is still required. Key features include 55856 logic elements, 2396160 embedded memory bits distributed across M9K blocks, 4 PLLs for clock management, and 343 multiplier blocks (18x18) enabling DSP functions without external multipliers. Per the Alldatasheet entry the package is described as 23 x 23 mm FBGA-484 with 2.60 mm height and 1 mm pitch, lead-free, and the device is RoHS compliant. The Cyclone III family uses a 65 nm TSMC process that delivers significantly lower static and dynamic power than the prior Cyclone II generation while preserving pin compatibility in many footprints. Typical applications span industrial motor and machine control, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, automotive infotainment ECUs, and consumer display controllers. The 327 I/O and rich DSP blocks also make the part a frequent choice for educational FPGA development kits and university digital logic labs. When designing with the EP3C55F484C8N, place all VCCINT and VCCA decoupling capacitors within a few millimetres of the balls, use at least 4 signal layers to escape the dense 1.0 mm pitch BGA, and respect the Quartus II / Quartus Prime JTAG configuration sequence including nCONFIG, nSTATUS, and CONF_DONE handshakes. Power sequencing must bring VCCINT up before VCCA per the Cyclone III Device Handbook.

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EP3C55F484I7 - 55K LE Cyclone III FPGA 484-BGA | Intel / Altera
EP3C55F484I7

EP3C55F484I7 - 55K LE Cyclone III FPGA 484-BGA | Intel / Altera

The Intel (formerly Altera) EP3C55F484I7 is a low-power, high-volume Cyclone® III Field Programmable Gate Array delivering 55,856 logic elements, 327 user I/O, and 2,396,160 bits of embedded memory in a 484-ball FineLine BGA package. The device operates from an internal maximum frequency of 472.5 MHz across a 1.2 V core supply, with industrial temperature grade (-40 °C to +100 °C) and lead-free / RoHS-compliant assembly per the verified distributor listings. The 'F484' suffix designates the 23 × 23 mm, 1.0 mm-pitch FBGA-484 package with 327 maximum user I/O pins. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. Unlike a fixed ASIC, an FPGA is reprogrammed in-system via a configuration bitstream, making it the platform of choice for design prototyping, low-volume production, and applications requiring late-stage hardware changes. Key Cyclone III features include up to 4 Mbits of embedded memory, up to 156 embedded 18 × 18 multipliers, and 20 global clock networks with up to 4 PLLs per device. The EP3C55 variant specifically offers 55,856 logic elements (3,491 ALMs), 2,340 Kbits of RAM, 156 multipliers, and 4 PLLs. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, allowing flexible boot from EPCS configuration devices or external microprocessors. Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive infotainment prototypes, and cost-sensitive DSP front-ends. The 484-BGA package provides ample signal integrity margin for DDR/DDR2 memory interfaces and LVDS signaling commonly required in display and image-processing designs. When designing with this device, plan power sequencing for the 1.2 V core and the I/O bank supplies independently, and follow Altera's decoupling guidelines (typically 0.1 µF + bulk decoupling per VCC pin group). The 1.0 mm-pitch FBGA-484 requires 4–6 layer PCB with microvia or via-in-pad for reliable assembly. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations beyond the Altera Cyclone III handbook.

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EP3C55F484I7N - Cyclone III FPGA 55K LE 484-FBGA | Altera
EP3C55F484I7N

EP3C55F484I7N - Cyclone III FPGA 55K LE 484-FBGA | Altera

The Altera (Intel) EP3C55F484I7N is a Cyclone III family Field Programmable Gate Array (FPGA) built on a 65 nm low-power CMOS process, integrating 55,856 logic elements (LEs), 327 user I/Os, and 2,396,160 bits of embedded memory in a 484-ball FineLine BGA (FBGA-484) package measuring 23 x 23 mm with a 1.0 mm ball pitch. According to the manufacturer datasheet and distributor listings, this part operates from a nominal 1.2 V core supply, supports up to four independent PLLs, and delivers internal clock frequencies up to 472.5 MHz at speed grade 7, making it one of the highest-density Cyclone III devices for cost-sensitive, high-volume applications. A field-programmable gate array (FPGA) is a reconfigurable semiconductor that engineers program post-fabrication to implement arbitrary digital logic, glue logic, and parallel processing pipelines. Within the system hierarchy, an FPGA sits between microcontrollers (fixed-function, firmware-defined) and ASICs (custom-silicon, NRE-defined); FPGAs dominate prototyping, low-volume production, and design flows that demand hardware parallelism without silicon re-spin costs. The Cyclone III family targets cost-sensitive, high-volume applications and integrates DSP blocks, embedded multipliers, and M9K memory blocks alongside the logic fabric. Key features include 312 M9K memory blocks totaling 2.49 Mbits of embedded RAM (some listings cite 2.29 Mbits), 4 PLLs supporting frequency synthesis and clock-tree management, 18-bit embedded multipliers for DSP operations, and LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports hot-socketing and configuration via JTAG, Active Serial, or Passive Serial modes, with built-in decompression for bitstream storage reduction. From an architectural perspective, the Cyclone III LE is built around a 4-input look-up table (LUT), a dedicated adder chain for arithmetic, and a register, interconnected by Altera's MultiTrack routing fabric. The 1.2 V core and a separate I/O bank voltage allow mixed-voltage interfacing on the same die, while the 65 nm process delivers low static power (typically less than 0.5 W quiescent) compared to older 90 nm Cyclone II generations. Typical applications include industrial motor control and factory automation, video processing and surveillance, automotive infotainment and driver assistance, software-defined radio front-ends, and embedded vision pipelines. The wide logic capacity also suits ASIC prototyping, low-cost DSP implementations, and reconfigurable I/O expansion for embedded processors. When designing with this device, ensure the PCB provides a clean, multi-rail power distribution network (1.2 V core, separate VCCPD and VCCIO per I/O bank) and a configuration mode selection circuit. Thermal management is generally light at typical industrial loads, but a copper pour directly under the FBGA improves both thermal dissipation and signal integrity for high-speed LVDS pairs. This page synthesizes distributor pricing, drop-in compatible Cyclone III alternatives, and PCB design guidance that is not aggregated in the manufacturer datasheet alone.

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EP3C55F484I8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
EP3C55F484I8N

EP3C55F484I8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3C55F484I8N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) integrating 55,856 logic elements organized into 3,491 Logic Array Blocks (LABs), housed in a 484-ball FineLine BGA (FBGA) package measuring 23 mm square. The device is built on a TSMC low-power 65 nm CMOS process and operates from a 1.2 V core supply (1.15 V to 1.25 V), making it one of the lowest-power FPGAs of its generation. It exposes 327 user I/O pins through eight I/O banks, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL interfaces at up to 640 Mbps LVDS performance. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs belong to the broader class of programmable logic devices (PLDs), sitting above simple PLDs (SPLDs) and complex PLDs (CPLDs) in capability but below ASICs in per-unit cost. Cyclone III devices in particular target the volume-cost end of the FPGA market and are positioned in the hierarchy as: Cyclone III FPGA -> mid-range FPGA family -> programmable logic -> integrated circuit. FPGAs are typically used when designs must ship in volume but still require hardware-level parallelism, custom timing, or post-production field upgrades. The EP3C55F484I8N provides 2,396,160 bits of embedded RAM (approximately 234 Kbytes), 312 dedicated 18 x 18 hardware multipliers for DSP operations such as FIR filters and FFTs, and four general-purpose PLLs for clock synthesis and skew management. Per-device configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. The industrial temperature grade (-40 C to +100 C junction) suffix "I8" and Pb-free / RoHS-compliant "N" suffix make the EP3C55F484I8N suitable for harsh-environment designs, while the speed grade "8" denotes the slowest commercial timing bin, traded for lower dynamic power. Architecture-wise, Cyclone III uses an SRAM-based lookup table (LUT) fabric with 16 logic elements per LAB, a fine-grained M4K memory block primitive, and dedicated routing channels. Each LAB contains control logic and 16 LEs, and signal integrity is maintained by per-bank VCCIO supplies that can be set independently between 1.2 V and 3.3 V, simplifying mixed-voltage designs where the FPGA bridges 3.3 V peripherals to 1.2 V core logic. Typical applications for EP3C55F484I8N include industrial motor control and machine vision, low-cost video bridging and display controllers, software-defined radio (SDR) front-ends, telecom line cards, and embedded control boards where a microprocessor plus FPGA pair replaces a higher-cost DSP or ASIC. It is also widely used in university and prototyping labs as a general-purpose programmable platform. When designing with this device, plan power sequencing carefully: the 1.2 V VCCINT rail must rise before or simultaneously with the VCCAUX (2.5 V) and VCCIO rails to avoid internal latch-up. Use the Altera (Intel) Quartus II design suite, which provides timing-driven place-and-route, power estimation, and SignalTap II logic analyzer support for in-system debug. This page synthesizes current distributor pricing, drop-in same-package alternatives drawn from the Cyclone III EP3C55 family, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten selection cycles.

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EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)
EP3C55F780C6

EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)

The Intel (formerly Altera) EP3C55F780C6 is a Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 18x18 hardware multipliers, housed in a 780-ball fine-pitch BGA package with 377 user I/Os. Built on a low-power 65nm process, the Cyclone III family delivers a balance of logic density, memory, and DSP capability at a fraction of the static power of competing 90nm FPGAs. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. FPGAs sit in the programmable-logic tier of the digital semiconductor hierarchy: ASIC < structured ASIC < FPGA < CPLD < microcontroller. Designers use HDL (Verilog or VHDL) to describe the desired digital function, then synthesize, place, and route the design with vendor tools (Quartus II for the Cyclone III family). Unlike fixed-function ASICs, FPGAs allow in-system reconfiguration, making them ideal for prototyping, low-volume production, and designs that must evolve in the field. Key features of the EP3C55F780C6 include a 4-Mbit embedded memory subsystem, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on user I/Os. The 'C6' speed grade offers a -6 speed rating for internal logic, and the 'C' prefix denotes the commercial temperature grade of 0C to +85C. Static power consumption is significantly reduced compared to Cyclone II, enabling fan-less operation in cost-sensitive applications. From an architectural perspective, the Cyclone III device family uses 4-input look-up tables (LUTs) per logic element, M9K block RAM tiles, and 18x18 multiplier blocks optimized for DSP. The 780-FBGA package provides high I/O density suitable for memory-bus bridging, video processing pipelines, and parallel sensor aggregation. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes via the dedicated configuration pins. Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, low-cost ASIC prototyping, and embedded vision systems. The combination of DSP blocks and on-chip memory is particularly suited to digital filtering, FFT computation, and image pre-processing. Designers transitioning from older Cyclone II designs will find pin-compatible migration options within the family. When designing with this device, ensure the PCB BGA layout meets the 1.0mm ball pitch clearance rules of the 780-FBGA package and that the Quartus II power-play analysis is run early in the design cycle. Decoupling must follow the reference design guidance in the Cyclone III Device Handbook. This page synthesizes distributor pricing, drop-in Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right Cyclone III variant for their application.

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EP3C55F780C6N - Cyclone III FPGA 55K LE 780-BGA | Intel (Altera)
EP3C55F780C6N

EP3C55F780C6N - Cyclone III FPGA 55K LE 780-BGA | Intel (Altera)

The Intel (formerly Altera) EP3C55F780C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, delivering 55,856 logic elements, 2,396,160 bits of embedded memory and 377 maximum user I/O pins in a cost-optimized 65nm process. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that belongs to the broader category of integrated circuits and sits in the digital semiconductor hierarchy: FPGA > programmable logic > logic IC > integrated circuit. Cyclone III is positioned in the low-power, cost-sensitive segment of Intel's FPGA portfolio, targeting volume production in industrial, communications and consumer applications where Stratix-class performance is unnecessary. Key features of this device include 55,856 logic elements, 312 embedded 18x18 multipliers, 2,396,160 bits (approximately 234 Kbits) of RAM, 4 PLLs and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL and PCI through 377 user I/O pins. The 'C6' speed grade and commercial temperature rating (0C to +85C) suit typical indoor and laboratory environments rather than extended industrial or automotive conditions. From an architectural standpoint, the Cyclone III family uses a 65nm low-power process with on-chip termination, dedicated DSP blocks and embedded memory arranged in M9K blocks. The 780-FBGA package provides high I/O density suitable for parallel bus interfaces, video bridging and multi-channel data acquisition subsystems. Typical applications include industrial motor control, video processing and bridging, software-defined radio, factory automation controllers, and test and measurement equipment where deterministic parallel logic and embedded DSP are required at low total system cost. When migrating designs between Cyclone III variants, verify pin compatibility because the F780 (780-pin FBGA) footprint differs from F484 and F324 package options within the same family.

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