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EPF10K130EBC356-1 - FLEX 10KE FPGA, 130K Gates, 356-BGA | Altera
EPF10K130EBC356-1

EPF10K130EBC356-1 - FLEX 10KE FPGA, 130K Gates, 356-BGA | Altera

The Altera (now Intel) EPF10K130EBC356-1 is a FLEX-10KE family Field-Programmable Gate Array (FPGA) integrating 130,000 typical gates, 6,656 logic elements (LEs), and 65,536 bits of embedded SRAM in a 356-ball LBGA package with 274 user I/O pins. It is built on a 0.22 µm CMOS SRAM process and operates from a 2.5 V core supply, supporting I/O voltages of 3.3 V with 5 V tolerance. An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit. The FLEX 10KE family pioneered embedded array blocks (EABs) combining look-up-table based logic with embedded memory, enabling System-on-a-Programmable-Chip (SOPC) integration. The 'E' variant doubled logic capacity versus the original FLEX 10K while keeping the same EAB-based embedded memory architecture. Key features include 832 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing 65,536 bits (8 Kbyte) of dual-port RAM, a maximum internal operating frequency of 333 MHz, propagation delay of approximately 0.6 ns, and 274 user I/Os. The device supports in-system programmability via an IEEE 1149.1 JTAG interface and configuration via passive serial, passive parallel asynchronous, and synchronous modes, plus multi-device configuration chains. Typical applications include high-throughput digital signal processing glue logic, telecom line-card interface controllers, industrial motor control state machines, video format conversion pipelines, and prototyping platforms that later migrate to a HardCopy ASIC. The 356-LBGA package provides robust thermal performance and signal integrity for high-density PCB designs. Design considerations for the FLEX 10KE include providing clean 2.5 V core and 3.3 V I/O rails with proper sequencing, placing decoupling capacitors adjacent to each power pin, and selecting I/O banks carefully to mix 3.3 V and 5 V-tolerant signals in the same design. Engineers should consult the FLEX 10KE Device Family Data Sheet for the full configuration scheme and DC characteristics.

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EPF10K130EBC356-1N - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera
EPF10K130EBC356-1N

EPF10K130EBC356-1N - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera

The Altera (now Intel) EPF10K130EBC356-1N is a member of the FLEX 10KE embedded programmable logic device family, providing 130,000 typical gates, 6,656 logic elements (LEs), and 65536 embedded RAM bits in a 356-ball LBGA package. Built on a 0.22 µm CMOS process with a 2.5 V core supply and 3.3 V I/O, this -1N speed grade device targets commercial-temperature (0 °C to 70 °C) designs with embedded array blocks (EABs) for true System-on-a-Programmable-Chip (SOPC) integration. A field-programmable gate array (FPGA) is a reconfigurable logic IC that combines programmable logic fabric with optional embedded memory, multipliers, and high-speed transceivers, allowing digital designers to implement custom parallel datapaths, glue logic, and protocol bridges without spinning an ASIC. FPGAs occupy a tier above discrete logic and below custom silicon in the digital design hierarchy: FPGA -> programmable logic -> PLD -> semiconductor. The FLEX 10KE family was Altera's first embedded PLD line, embedding EAB RAM alongside the logic fabric so that designers can mix FIFO/dual-port memory with state machines on a single chip. Key features of the EPF10K130EBC356-1N include 274 user I/O pins, 0.6 ns propagation delay, 333.33 MHz internal operation, IEEE Std. 1149.1-1990 JTAG boundary-scan support, and PCI Local Bus Specification Revision 2.2 compliance at 33 MHz or 66 MHz for 3.3 V operation. The embedded array blocks deliver 24,576 to 49,152 RAM bits depending on configuration, enabling on-chip buffering for communication pipelines. JTAG BST is built-in, consuming no additional logic resources, which simplifies board-level test. Architecturally, the device combines a symmetrical logic-element array, column-based EAB RAM, and continuous routing channels with predictable delay. The -1 speed grade specifies timing closure at the slower end of the family envelope, simplifying static timing analysis at the cost of Fmax. PCI compliance at 33/66 MHz means the device meets the AC and DC requirements of Revision 2.2 of the PCI Local Bus Specification for both 3.3 V and 5.0 V signaling environments. Typical applications include PCI interface bridges, industrial control glue logic, telecommunications backplane controllers, and embedded prototyping platforms where a high pin count and on-chip dual-port memory are valuable. The wide 274-I/O fan-out is well-suited to bus-intensive designs such as memory controllers and parallel data acquisition front-ends. When designing with this device, ensure your board layout honors the LBGA-356 footprint's 1.0 mm ball pitch, route the JTAG chain to accessible test points, and verify that the Quartus II (or MAX+PLUS II) toolchain supports the -1N device ID before committing to the design. Consider the EAB-based memory architecture if you plan to instantiate large FIFOs or dual-port buffers. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes for legacy FLEX 10KE designs - information not consolidated on the manufacturer datasheet alone.

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EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
EPF10K130EBC356-1X

EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera

The Intel (formerly Altera) EPF10K130EBC356-1X is a member of the FLEX 10KE embedded programmable logic family, delivering 130,000 system gates in a 356-ball LBGA package with 274 user I/Os. It integrates an embedded array block (EAB) architecture that allows on-chip implementation of RAM, ROM, FIFO and DSP functions, providing System-on-a-Programmable-Chip (SOPC) integration for high-density glue-logic, bus-interface and telecom designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all of which can be re-programmed in-circuit to implement arbitrary digital logic. FPGAs sit hierarchically under programmable logic devices (PLD) and above ASICs in terms of flexibility, and the FLEX 10KE family specifically pioneered the embedded array concept - a hybrid of logic fabric and dedicated memory blocks - to combine high-density random logic with on-chip memory in one device. Key features include 6,656 logic cells, 832 Logic Array Blocks (LABs), 274 user I/Os, and a typical core supply of 2.5V (range 2.375V to 2.625V). The device operates over the commercial 0C to 70C temperature range and uses SRAM-based configuration cells loaded from external memory at power-up. The package is the 35x35 mm 356-LBGA. The FLEX 10KE architecture uses 0.22um CMOS process technology and supports up to 333.33 MHz internal performance with 0.6 ns propagation delay, while embedded array blocks deliver up to 16 words by 8 bits of true dual-port RAM per EAB. This combination of high gate count, abundant I/O, and on-chip memory makes it suited for bridging between processors, memory and high-speed peripherals in mid-1990s through mid-2000s system designs. Typical applications include telecommunications line cards, industrial control and factory automation, embedded DSP front-ends, PCI/ISA bridge designs, and ASIC prototyping. The combination of abundant user I/O and embedded memory blocks particularly suits bus-interface and protocol-conversion designs that must adapt older microprocessors to modern peripherals. When designing with this device, remember that FLEX 10KE is SRAM-based - it requires a configuration EPROM (EPC2, EPC8, EPC16) at every power-up and that the 356-BGA package demands controlled-impedance PCB layout and careful thermal management. The 1X suffix denotes the -1 speed grade in this commercial-temperature 356-ball BGA variant. This page synthesizes distributor stock levels, drop-in same-brand alternatives, and practical design guidance - information not aggregated anywhere else on the web.

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EPF10K130EBC356-2 - FLEX 10KE FPGA, 130K Gates, 356-BGA | Altera
EPF10K130EBC356-2

EPF10K130EBC356-2 - FLEX 10KE FPGA, 130K Gates, 356-BGA | Altera

The Altera EPF10K130EBC356-2 is a member of the FLEX 10KE family of FPGAs, delivering 130K equivalent gates and 6,656 logic elements in a 356-ball LBGA package. It integrates an embedded array block for implementing megafunctions such as SRAM, DRAM, FIFO, and DSP primitives, combined with a logic array block (LAB) fabric of 832 LABs / 6,656 logic cells. The device operates from a 2.375 V to 2.625 V core supply (with 3.3 V I/O capability per the FLEX 10KE architecture) and provides 274 user I/Os. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells, allowing engineers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, an FPGA belongs to the hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> semiconductor. The FLEX 10KE family was Altera's first embedded programmable logic platform, providing System-on-a-Programmable-Chip (SOPC) integration through embedded array blocks. Key features include 0.22 um CMOS process technology, 333.33 MHz internal performance, 0.6 ns propagation delay, embedded SRAM bits in the Embedded Array Blocks (EABs), MultiVolt I/O support, JTAG-compliant boundary-scan testing (IEEE 1149.1), and in-system programmability via EPROM, EEPROM, or SRAM configuration schemes. The device is offered in commercial (0C to 70C) operating temperature and uses a 1.0 ns speed grade (the '-2' suffix). The architecture combines 832 LABs, each with 8 logic elements, interconnected through FastTrack Interconnect routing. Embedded Array Blocks (EABs) provide up to 16 Kbits of dual-port RAM each, totaling 128 Kbits of embedded memory. The I/O structure supports 3.3 V PCI compliance and 5.0 V tolerant inputs on selected pins, configured via Altera's MAX+PLUS II or Quartus development software. Typical applications include telecommunications line cards, glue logic in industrial control systems, ASIC prototyping, low-volume production replacement of gate arrays, DSP front-end preprocessing, and bus-interface bridging. The high gate count and embedded memory make it suitable for designs that previously required multiple discrete PLDs. When designing with this device, ensure proper decoupling (0.1 uF + 10 uF per VCC pin group), use at least four PCB routing layers for signal integrity on the 356-BGA package, and configure the device using Altera's Quartus Prime (or legacy MAX+PLUS II) toolchain with the appropriate FLEX 10KE device library. This page synthesizes distributor inventory, drop-in same-package alternatives, lifecycle observation, and practical design notes for the FLEX 10KE family - not a copy of the manufacturer datasheet.

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EPF10K130EBC356-3 - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera
EPF10K130EBC356-3

EPF10K130EBC356-3 - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera

The Altera (Intel) EPF10K130EBC356-3 is a FLEX-10KE family Field Programmable Gate Array (FPGA) with 130,000 typical gates, 832 Logic Array Blocks (LABs), and 274 user I/Os, housed in a 356-ball LBGA package measuring 35x35 mm. Built on a 0.22 µm CMOS process with embedded array blocks, it operates from a 2.375 V to 2.625 V core supply and supports 3.3 V I/O, making it a System-on-a-Programmable-Chip (SOPC) integration platform for commercial-temperature designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and I/O cells that the designer programs after manufacturing. FPGAs sit in the digital logic hierarchy above general-purpose microcontrollers and below Application-Specific Integrated Circuits (ASICs), offering hardware-level parallelism with on-the-fly reconfigurability. The FLEX-10KE family specifically pioneered the "embedded array" concept by integrating dedicated RAM blocks (EABs) alongside the general logic fabric, enabling System-on-a-Programmable-Chip implementations before the modern SoC FPGA era. Key features include 130,000 typical gates, 8,192 logic elements, 274 maximum user I/O pins, 12 embedded array blocks (EABs) for memory, and PCI-compliant I/O support. The device offers 0.6 ns pin-to-pin propagation delay in the -3 speed grade, multiVolt I/O supporting 2.5 V/3.3 V/5.0 V mixed-voltage interfaces, and in-system programmability via IEEE 1149.1 (JTAG) boundary-scan. The 356-LBGA package provides high-density interconnect for memory-rich and bus-intensive designs. The FLEX-10KE architecture combines a fine-grained logic fabric optimized for register-intensive datapaths with coarse-grained EABs (Embedded Array Blocks) that can be configured as 2 Kbit RAM, ROM, or FIFO. The lookup-table (LUT) based logic element, FastTrack interconnect, and continuous routing architecture deliver predictable timing closure. The -3 speed grade is the fastest of the FLEX-10KE family, targeting timing-critical applications such as PCI bus interfaces and high-speed glue logic. Typical applications include telecommunications line cards, industrial control and automation, PCI bridge logic, video processing and display controllers, and legacy ASIC prototyping. The high I/O count and embedded memory make it especially suitable for data-path bridging and protocol conversion in telecom and industrial systems. When designing with this FPGA, ensure the 2.5 V core rail is decoupled with 0.1 µF + 10 µF bulk capacitors near each supply pin, and route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) away from switching I/O to avoid in-system programming glitches. Thermal management is straightforward thanks to the LBGA thermal pad; a minimum 4-layer PCB with a thermal via array under the exposed pad is recommended. This page synthesizes distributor pricing, same-brand speed-grade and density alternatives, lifecycle status, and practical design notes not found in a single manufacturer datasheet — supporting both new designs and long-lifecycle maintenance of legacy FLEX-10KE systems.

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EPF10K130EBC600-2 - 130K Gate FLEX-10KE FPGA | Altera | 600-BGA
EPF10K130EBC600-2

EPF10K130EBC600-2 - 130K Gate FLEX-10KE FPGA | Altera | 600-BGA

The Altera (Intel) EPF10K130EBC600-2 is a high-density FLEX-10KE family Field Programmable Gate Array delivering 130,000 typical gates in a 600-ball BGA package with 424 user I/Os. It is built on SRAM-based CMOS technology, integrates 832 Logic Array Blocks (LABs) and 4 kbit of embedded memory, and supports a -2 speed grade operating at core voltage 2.5 V with 0.5 ns pin-to-pin logic delay. What is an FPGA? An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that designers can wire to implement arbitrary digital logic, signal processing, or interface protocols. FPGAs sit between fixed-function ASICs and software-driven processors: they offer hardware-level parallelism and deterministic timing without the NRE cost of an ASIC, and are typically used for prototyping, low-volume production, glue logic, and compute acceleration. The FLEX-10KE family, introduced in 1998, was an early high-volume SRAM-based FPGA family that influenced later Cyclone architectures. Key features of the EPF10K130EBC600-2 include 130,000 typical gates, 832 LABs and 424 user I/Os - the highest I/O count of the FLEX-10KE line. The part uses a 2.5 V core (VCCINT 2.375 V to 2.625 V) with MultiVolt I/O support, allowing interfacing with 3.3 V, 2.5 V and 1.8 V devices. Configuration is loaded via serial or parallel PROM or via JTAG, and the die supports live in-system reconfigurability. The device is commercial grade, 0 to 70 C, and is supplied in a 45 x 45 mm 600-BGA package. Architecture-wise, the FLEX-10KE family combines an Embedded Array Block (EAB) memory fabric with LABs; designers can realize either pure logic, distributed memory, or a mix. The -2 speed grade gives 0.5 ns pin-to-pin delays at moderate loading, making the device suitable for 66 MHz PCI bus interfaces, 100 MHz datapaths, and legacy telecom backplane designs. Typical applications include telecommunications line cards, industrial control, PCI bridge glue logic, ASIC prototyping, military/aerospace retrofits (with proper screening), and embedded DSP pre-processing. It is also used in long-life-cycle industrial automation where later-generation FPGAs would force a full board redesign. Design consideration: Because the FLEX-10KE is a mature 1998-era part on 250 nm process, designers should confirm long-term availability with authorized distributors and check the Altera PCN/PDN database before committing to new designs. Power estimation should use the Quartus PowerPlay estimator with the correct device file. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX-10KE family, and practical design notes that are not collected in any single manufacturer datasheet.

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EPF10K130EBI356-2 - 130K Gates FLEX 10KE FPGA 356-BGA | Altera
EPF10K130EBI356-2

EPF10K130EBI356-2 - 130K Gates FLEX 10KE FPGA 356-BGA | Altera

The Altera (now Intel) EPF10K130EBI356-2 is a member of the FLEX 10KE embedded programmable logic family, delivering 130,000 system gates and 6,656 logic elements in a 356-ball FineLine BGA package with 274 user I/Os. The "I" suffix designates an industrial-grade temperature rating and the "-2" speed grade places it in the mid-speed bin of the FLEX 10KE family. What is a FLEX 10KE FPGA? The FLEX 10KE is an SRAM-based field programmable gate array (FPGA) family that combines a logic array with an embedded array, allowing implementation of both fine-grained random logic and wide datapath or memory functions on a single die. As an FPGA, it belongs to the broader hierarchy of programmable logic devices (PLDs), sitting alongside CPLDs and structured ASICs as a re-configurable silicon platform used for glue logic, state machines, datapath processing, and System-on-a-Programmable-Chip (SOPC) integration. Key features of the EPF10K130EBI356-2 include 65,536 bits of embedded SRAM (EAB blocks), 6,656 logic cells distributed across 832 LABs (Logic Array Blocks), a maximum toggle frequency of 333.33 MHz, CMOS 0.22 micron process technology, and a 2.5 V core supply. Per the Altera datasheet, the device supports IEEE 1149.1 boundary-scan test, in-system programmability via the serial configuration device interface, and multi-voltage I/O banks for interfacing with 3.3 V, 2.5 V, and 1.8 V logic. Architecturally, each LAB contains 8 logic elements (LEs), each LE comprising a 4-input look-up table, a programmable register, and a carry chain for arithmetic acceleration. The embedded array blocks (EABs) implement true dual-port or single-port RAM, ROM, and FIFO functions up to 4,096 bits per block, enabling on-chip memory consolidation that previously required several discrete SRAM chips. Typical applications for the EPF10K130EBI356-2 span industrial control, telecom backplane glue logic, legacy PCI bus bridges, and DSP datapath co-processing in video broadcast equipment. Its 274 user I/Os make it well suited for designs requiring large parallel bus aggregation, while the 130K gate capacity targets mid-complexity state machines and protocol conversion tasks. When designing with this part, pay particular attention to power-plane decoupling on the FineLine BGA, use all available GND/VCCINT balls for thermal dissipation, and follow the Altera SameFrame pin-migration rules when porting to a different FLEX 10KE density in the same 356-BGA footprint. JTAG configuration via ByteBlaster or MasterBlaster download cables is the standard programming flow. This page synthesizes distributor pricing, FLEX 10KE family drop-in alternatives, and practical design notes that supplement the manufacturer datasheet for engineers evaluating a 356-ball BGA migration path.

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EPF10K130EFC484-1 - FLEX-10KE FPGA 130K Gates 484-BGA | Intel / Altera
EPF10K130EFC484-1

EPF10K130EFC484-1 - FLEX-10KE FPGA 130K Gates 484-BGA | Intel / Altera

The Intel (formerly Altera) EPF10K130EFC484-1 is a FLEX-10KE family Field-Programmable Gate Array (FPGA) delivering 130,000 typical gates and 6,656 logic elements in a 484-ball FineLine BGA (FBGA-484) package, operating at speeds up to 333 MHz with a 2.5 V core supply. The -1 speed grade designates the slowest commercial-grade speed bin in this family, optimized for cost-sensitive designs where moderate performance is acceptable. A FLEX-10KE FPGA is an SRAM-based programmable logic device (PLD) that belongs to the broader category of field-programmable gate arrays (FPGAs) within the programmable logic device (PLD) family hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The FLEX-10KE series was Altera's first embedded programmable logic family offering System-on-a-Programmable-Chip (SOPC) integration via its embedded array blocks (EABs), which combine lookup-table (LUT) logic with dedicated dual-port RAM, allowing designers to implement memory and logic on a single die. Key features of the EPF10K130EFC484-1 include 832 logic array blocks (LABs), 65,536 bits of embedded memory (64 Kbits), 369 user I/O pins, and built-in support for MultiVolt I/O (3.3 V, 2.5 V, 1.8 V, and 5.0 V tolerant). The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG interface and IEEE 1532 configuration protocols, allowing field upgrades without removing the part from the board. Architecturally, the FLEX-10KE family uses a continuous routing architecture called the FastTrack Interconnect, which provides predictable timing across all logic and routing paths. The 6,656 logic elements can implement combinational and registered logic, while the embedded array blocks provide 4096-bit RAM blocks for FIFO buffers, register files, and small look-up tables. The FineLine BGA-484 package measures 23 x 23 mm with a 1.0 mm ball pitch, enabling compact high-density designs. Typical applications include industrial control systems, telecommunications line cards, PCI bus interfaces, custom ASIC prototyping, and legacy digital signal processing designs that required moderate logic capacity in the late 1990s and early 2000s. The wide I/O count (369 pins) makes it particularly well suited for parallel bus architectures and high-bandwidth glue logic. When designing with this part, ensure your configuration scheme (PS, PPS, JTAG) matches the board's pull-up topology. The 2.5 V core supply requires separate regulation from the I/O rail; design the decoupling network with 0.1 uF ceramic capacitors as close to each supply pin as possible, plus a 33 uF bulk capacitor near the package. This page synthesizes distributor pricing, SameFrame pin-compatible migration paths, and practical design notes not consolidated in the original manufacturer datasheet.

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EPF10K130EFC484-2 - FLEX 10KE 130K Gates FPGA | Altera | 484-FBGA
EPF10K130EFC484-2

EPF10K130EFC484-2 - FLEX 10KE 130K Gates FPGA | Altera | 484-FBGA

The Altera (Intel) EPF10K130EFC484-2 is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs) offering 130,000 gates and 6,656 logic elements (LEs) in a 484-pin Fine-Pitch Ball Grid Array (FineLine BGA) package. It operates from a 2.5 V core supply and is fabricated on a 0.22 µm CMOS process technology, with a maximum internal clock frequency of 333.33 MHz. The device includes 65,536 bits of embedded memory and provides up to 369 user I/O pins, making it a high-density programmable logic solution for telecom, networking, and embedded computing designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be reconfigured by the end user after manufacture. The FLEX 10KE architecture belongs to the broader hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. FPGAs occupy a unique position between fixed-function ASICs (high NRE, low unit cost at volume) and discrete logic (low cost, fixed function), offering hardware-level parallelism with software-driven design flexibility. Key differentiating features of the EPF10K130EFC484-2 include embedded array blocks (EABs) for on-chip SRAM implementation, multi-volt I/O support for interfacing with 2.5 V and 3.3 V logic, and SameFrame pin migration compatibility across the FLEX 10KE BGA family. The -2 speed grade indicates a balance between performance and power consumption, suitable for cost-sensitive volume production. Typical applications for the EPF10K130EFC484-2 include telecommunications infrastructure (DSLAM, SONET/SDH framer, ATM switches), network routers and switches, glue logic replacement, bus interface bridging (PCI, UTOPIA, POS-PHY), and DSP co-processing. Its embedded memory blocks make it well-suited for packet buffering, lookup tables, and FIFO implementations. When designing with this part, verify PCB footprint compatibility using Altera's SameFrame pin-out guide; ensure 2.5 V core and proper I/O bank voltages; and configure the device via the Altera Quartus/MAX+PLUS II toolchain. Note that the FLEX 10KE family is mature and approaching EOL status—long-term availability should be confirmed before new designs. This page synthesizes distributor pricing, drop-in same-package alternatives within the FLEX 10KE BGA family, and practical design notes not found in a single manufacturer datasheet.

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EPF10K130EFC484-2N - 130K-Gate FPGA, 484-BBGA | Altera
EPF10K130EFC484-2N

EPF10K130EFC484-2N - 130K-Gate FPGA, 484-BBGA | Altera

Altera EPF10K130EFC484-2N is a 130,000-gate FLEX-10KE field-programmable gate array with 6,656 logic cells, 65,536 bits of embedded memory, and 369 user I/Os. The target operates from a 2.5 V supply spanning 2.375 V to 2.625 V and is housed in a 484-ball fine-pitch BGA package measuring 23 mm by 23 mm. Verified distributor data also lists a commercial operating-temperature range of 0 °C to 70 °C. An FPGA is a field-programmable gate array: a semiconductor device containing programmable logic elements, routing resources, and configurable I/O that engineers can program after manufacturing. FPGAs occupy the programmable-logic tier between fixed-function application-specific integrated circuits and software-controlled processors. They implement digital datapaths, control logic, interfaces, and state machines in configurable hardware, while the FLEX-10KE family combines embedded programmable logic with embedded memory for system-on-a-programmable-chip designs. The defining capability is 130,000 gates supported by 6,656 cells, which gives the device meaningful capacity for multi-interface glue logic and moderate digital systems. Its 65,536 RAM bits support buffers, state storage, lookup tables, and small FIFOs. A 369-I/O budget accommodates many external buses and peripheral interfaces, while 0.22 µm CMOS technology and a listed 333.33 MHz frequency reflect the device family and fabrication generation represented in the verified source data. The architecture is based on logic-array blocks and programmable interconnects rather than fixed execution instructions. Configuration data determines logic functions and signal routing, so changes can be implemented through FPGA design software without replacing the IC. The embedded memory is distributed within this programmable fabric, allowing compact implementations that might otherwise require external memory devices for small storage or queue functions. Typical uses include industrial control and automation, communications-interface bridging, test and measurement equipment, and legacy digital systems requiring a dense programmable BGA device. The 369 available I/Os are especially useful when aggregating parallel buses, memory interfaces, counters, and protocol adapters. The 23 mm by 23 mm FBGA package is intended for space-conscious boards but requires appropriate BGA assembly, inspection, routing, and thermal design capabilities. Designers should verify all configuration, clock, power, signal-integrity, and ball-assignment details against the manufacturer datasheet before release. They should also validate timing at the selected speed grade and supply condition rather than assuming the listed family frequency applies to every implemented circuit. BGA escape routing, contiguous ground references, decoupling placement, and manufacturing-process controls are central to reliable operation. This page consolidates verified distributor specifications, package information, sourcing evidence, application guidance, and drop-in comparison limits. The cross-reference data identifies closely related family and speed-grade candidates, but only candidates with defensible same-package, pin-to-pin evidence are treated as drop-in alternatives.

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EPF10K130EFC484-3 - 130K Gates FLEX 10KE FPGA, 484-BGA | Altera
EPF10K130EFC484-3

EPF10K130EFC484-3 - 130K Gates FLEX 10KE FPGA, 484-BGA | Altera

The Intel (formerly Altera) EPF10K130EFC484-3 is a high-density member of the FLEX 10KE embedded programmable logic family, providing approximately 130,000 system gates and 6,656 logic elements (LEs) housed in a 484-pin FineLine Ball-Grid Array (FBGA) package. It offers 369 user I/O pins, 65,536 bits of embedded SRAM, and 832 Logic Array Blocks (LABs) operating on a 3.3 V core supply with multi-voltage I/O support. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing through configuration memory; FPGAs are widely used as glue logic, prototyping vehicles, and short-to-medium-volume custom compute blocks. The FLEX 10KE family in particular introduced an embedded array block concept that pairs distributed logic with dedicated RAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration by combining microprocessor cores, custom datapath logic, and on-chip memory in a single device. Key features include 6,656 logic elements, 832 LABs each containing 8 LEs, 65,536 bits of embedded array SRAM organized as 16 EABs (Embedded Array Blocks) of 4,096 bits each, a propagation delay of approximately 0.6 ns per LE, and 369 user I/Os. The device supports in-system programmability via serial or parallel configuration and operates across the commercial 0 C to 70 C temperature range with a -3 speed grade denoting the slowest of three performance bins. The architecture combines a fine-grained logic fabric with course-grained EABs that can implement RAM, ROM, FIFO, or multiplier functions. Multivolt I/O pins support 5.0 V, 3.3 V, and 2.5 V interfaces, allowing direct bridging between legacy TTL/CMOS peripherals and modern low-voltage ASICs without external level shifters. The 484-FBGA package offers high I/O density with a controlled-impedance substrate suitable for high-speed parallel buses and DDR memory interfaces. Typical applications include telecommunications line cards and crosspoint switches, industrial motor-control and machine-vision front ends, ASIC prototyping, military/aerospace signal processing (with the military-grade screening variant), and embedded DSP glue logic between microprocessors and peripherals. The wide I/O count makes the EPF10K130EFC484-3 particularly attractive for parallel bus aggregation in legacy replacement designs. When designing with this part, allocate at least one configuration device (EPC2 or compatible) or a microprocessor-driven configuration scheme, since the FLEX 10KE is SRAM-based and reconfigures on every power-up. Ensure controlled-impedance routing for all clocks and high-speed I/O, and verify that the FBGA land pattern matches your PCB manufacturer's BGA process capability. This page synthesizes distributor pricing snapshots, same-package alternatives, and practical design guidance not assembled in the original FLEX 10KE datasheet, providing a single reference for engineers evaluating end-of-life FLEX 10KE designs against current alternatives.

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EPF10K130EFC484-3N - 130K Gates FLEX-10KE FPGA | Intel | 484-BGA
EPF10K130EFC484-3N

EPF10K130EFC484-3N - 130K Gates FLEX-10KE FPGA | Intel | 484-BGA

The Intel (Altera) EPF10K130EFC484-3N is a high-density member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs), integrating 6656 logic elements (LEs) and 65536 bits of embedded SRAM in a 484-ball FineLine BGA package with 369 user I/O pins. The "-3N" speed grade denotes a commercial-temperature, faster-than-3 timing bin optimized for higher system clock frequencies in cost-sensitive, non-industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric. Modern FPGAs also embed hard IP such as block RAM, PLLs, and high-speed transceivers. Positioned in the broader programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA), FPGAs deliver the highest logic density and are used when ASIC-like performance is required but design flexibility must be preserved. Key features of the EPF10K130EFC484-3N include 6,656 logic elements, 65,536 bits of embedded SRAM, 72 embedded array blocks (EABs) for memory-intensive functions, and 369 maximum user I/O. The device is built on a 0.22 µm CMOS process and operates from a 2.5 V core supply with multi-voltage I/O support. The 484-ball FineLine BGA (23 × 23 mm, 1.0 mm pitch) provides ample signal breakout for high-pin-count designs while remaining compatible with conventional PCB assembly. Architecturally, the FLEX 10KE family combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can implement RAM, ROM, or multiplier functions, giving designers a balanced mix of distributed and block memory. The 2.5 V core with hot-socketing-capable I/O simplifies multi-voltage interfacing, and the in-system programmability via SRAM configuration cells allows rapid design iteration without rework. Typical applications include telecom line-card glue logic, industrial control and instrumentation, prototype ASIC verification, and high-density data-path implementation such as image processing and protocol bridging. The combination of 130 K typical gates and 369 user I/O also makes it suitable for legacy designs migrating from older Altera FLEX 8000 devices that need higher I/O and memory bandwidth. When designing with the EPF10K130EFC484-3N, ensure the configuration scheme (PS, PPS, JTAG, or Altera serial) is selected early in the design cycle, since the configuration pins are multiplexed with user I/O and require careful Quartus II fitter planning. The 484-BGA package also demands controlled-impedance PCB layout and thermal vias under the die for reliable operation in space-constrained boards. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EPF10K130EFC672-1X - FLEX 10KE FPGA 130K Gates 672-FBGA | Intel
EPF10K130EFC672-1X

EPF10K130EFC672-1X - FLEX 10KE FPGA 130K Gates 672-FBGA | Intel

The Intel (formerly Altera) EPF10K130EFC672-1X is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs), delivering 130,000 typical gates and 6,656 logic elements (LEs) in a 672-ball FineLine BGA package. Built on a 0.22 µm CMOS process, it operates from a 2.5 V core supply (2.375 V to 2.625 V) and provides 413 user I/Os with multi-volt I/O support, making it suitable for high-density glue logic, bus bridging, and ASIC prototyping in industrial and telecom designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined by an SRAM configuration bitstream rather than fixed mask interconnect. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and integrate programmable logic fabric, dedicated memory blocks, and I/O cells into a single die. Within this taxonomy, the FLEX 10KE family represents the high-density, embedded-memory generation that preceded the Cyclone series, providing distributed Look-Up Table (LUT) logic with embedded array blocks (EABs) usable as RAM, ROM, or FIFO buffers. Key features include 65,536 bits of embedded SRAM, 832 Logic Array Blocks (LABs), support for 333.33 MHz internal operation, JTAG-compliant IEEE Std 1149.1 boundary-scan test, in-system reconfigurability via the passive serial or ByteBlaster interfaces, and a 4.6 ns pin-to-pin logic delay class typical of the family. The -1X speed grade and commercial temperature grade (0 °C to +70 °C) are explicitly marked on the device top-side per the Altera ordering scheme. Architecturally, the EPF10K130E integrates a continuous, fine-grained logic fabric of 4-input LUTs and 8-LAB clusters, interconnected via a multi-level routing network called the FastTrack Interconnect. Each LAB contains ten LEs and local interconnect; embedded array blocks (EABs) provide 2 Kbit blocks of dual-port RAM for FIFOs, ROM, or look-up-table coefficient storage. This combination enabled designers to implement DSP-style datapath functions without external memory. Typical applications include telecommunications line-card glue logic, industrial control backplanes, ASIC prototyping for medium-complexity designs, and legacy PCI/ISA bridge implementations. Designers migrating from FLEX 10K to FLEX 10KE typically retain their original pin-out footprints while gaining faster I/O registers and additional embedded memory. When designing with this device, note that configuration data is volatile - the bitstream must be reloaded at every power-up from a serial PROM, flash, or micro-controller. The 672-FBGA package is a 27 mm × 27 mm body with 1.0 mm ball pitch; PCB land pattern and reflow profile must conform to JEDEC J-STD-020 moisture sensitivity level handling requirements for large BGAs. This page synthesizes distributor pricing, supply-chain alternatives, and practical engineering guidance not assembled in the original Altera datasheet, including verified availability across Rochester Electronics, DigiKey, and Mouser channels as of 2026-09-11.

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EPF10K130EFC672-2 - 130K Gates FLEX 10KE FPGA | Altera | 672-BGA
EPF10K130EFC672-2

EPF10K130EFC672-2 - 130K Gates FLEX 10KE FPGA | Altera | 672-BGA

The Altera EPF10K130EFC672-2 is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs), delivering approximately 130,000 gates with 6,656 logic elements and 65,536 bits of embedded memory in a 672-pin FineLine BGA package. Built on a 0.22 µm CMOS SRAM process, this device operates from a 2.5 V core supply and provides 413 user I/Os with internal propagation delays on the order of 0.6 ns, enabling high-performance glue-logic, bus-interface, and DSP pre-processing designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the integrated-circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The FLEX 10KE family combines a fine-grained Look-Up Table (LUT)-based logic array with an embedded array block (EAB) that can be configured as memory, multipliers, or specialized logic, allowing a single chip to replace dozens of discrete 74-series logic parts. Key features include 832 Logic Array Blocks (LABs), 413 maximum user I/Os, 65,536 RAM bits, dedicated carry and cascade chains for fast arithmetic, and built-in JTAG (IEEE 1149.1) boundary-scan support. The 672-ball FineLine BGA package exposes a large number of general-purpose I/Os that are 5 V-tolerant on input, simplifying interfacing with legacy TTL/CMOS peripherals without external level shifters. Operating temperature range is 0 °C to +70 °C (commercial grade), with the speed grade -2 placing the device in a balanced performance tier of the family. Typical applications include high-density glue logic, telecommunications backplane interfaces, ASIC prototyping, image and video pre-processing pipelines, industrial control boards, and legacy system upgrades that require large numbers of I/O channels and configurable logic. The EPF10K130EFC672-2 is widely deployed in long-lifecycle industrial and defense systems where the proven FLEX 10KE tool flow (Quartus II or MAX+PLUS II) remains in active use. When designing with this device, pay close attention to power-rail decoupling: each VCCINT and VCCIO bank should have its own 0.1 µF and 10 µF ceramic capacitor pair placed within 5 mm of the BGA balls. The 672-pin BGA package requires careful PCB stack-up planning to fan out all signals without exceeding manufacturability limits on via-in-pad and microvia density. This page synthesizes distributor stock data, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to support engineers maintaining FLEX 10KE designs.

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EPF10K130EFC672-2X - FLEX 10KE FPGA, 6656 LEs, 672-BGA | Intel
EPF10K130EFC672-2X

EPF10K130EFC672-2X - FLEX 10KE FPGA, 6656 LEs, 672-BGA | Intel

The Intel (formerly Altera) EPF10K130EFC672-2X is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) with 6656 logic elements (LEs), 65536 embedded RAM bits, and 413 user I/Os, housed in a 672-ball FineLine BGA package (672-FBGA, 27x27 mm). The -2X speed grade designation indicates an industrial-grade operating temperature range with the second-tier speed performance offered by the FLEX 10KE series. The device is built on a 0.22 μm CMOS SRAM process and operates from a 2.5 V core supply with 3.3 V I/O tolerance. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/Os on a single die. Within the broader semiconductor taxonomy, an FPGA sits below custom ASICs in NRE cost and above fixed-function CPLDs in logic capacity. The FLEX 10KE family introduced the industry's first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration with an embedded array block (EAB) usable as on-chip RAM, ROM, or product-term logic. Key features of the EPF10K130EFC672-2X include 832 Logic Array Blocks (LABs) each containing 8 LEs for a total of 6656 LEs, four Delay-Locked Loops (DLLs) for clock skew management, MultiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V logic families, and JTAG-compliant IEEE 1149.1 boundary-scan test capability. The 65536-bit embedded array block (EAB) can be configured as RAM, ROM, or FIFO without consuming logic resources. The 672-FBGA FineLine BGA package provides a 27x27 mm footprint with 1.0 mm ball pitch and a 1.27 mm ball spacing, enabling high-density board routing. The device supports in-system configuration via the serial configuration device interface, allowing field upgrades without removing the board from its system. The FLEX 10KE architecture is widely documented in legacy Altera reference designs and is supported by the legacy MAX+PLUS II and Quartus II design tools. Typical applications for the EPF10K130EFC672-2X include telecommunications glue logic, industrial control and instrumentation, legacy PCI/ISA bus interface bridges, prototyping and emulation platforms, and replacement of multiple discrete logic devices in legacy telecom and test equipment. The 65536-bit embedded RAM and 413 user I/Os make the part well suited for system-level integration in mid-to-late-1990s and early-2000s equipment designs. When designing with this device, engineers should note that the FLEX 10KE series is a mature product line. The Intel/Altera Quartus II toolchain (version 13.1 and earlier) and MAX+PLUS II legacy toolchain provide full synthesis and place-and-route support. New designs targeting modern high-speed SERDES, DSP blocks, or transceivers should consider the Cyclone or Arria device families instead. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the standard datasheet cover page.

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EPF10K130EFI484-2 - 130K Gates FLEX 10KE FPGA | Intel | BGA-484
EPF10K130EFI484-2

EPF10K130EFI484-2 - 130K Gates FLEX 10KE FPGA | Intel | BGA-484

The Intel (formerly Altera) EPF10K130EFI484-2 is a 130,000-gate FLEX 10KE family Field Programmable Gate Array (FPGA) with 6,656 logic cells and 274 user I/Os, housed in a 484-ball FineLine BGA package. The part is built on a 0.22 µm CMOS process, supports a 2.5 V core supply, operates from 0 °C to 70 °C, and is rated for a 333.33 MHz internal clock with a 0.6 ns propagation delay at the I/O register. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the designer after manufacturing to implement arbitrary digital logic. FPGAs occupy a place in the broader semiconductor hierarchy between ASICs (Application-Specific Integrated Circuits, which are fixed at fabrication) and general-purpose processors (which execute software sequentially). The FLEX 10KE family was Altera's first embedded programmable logic family to combine a logic array block (LAB) fabric with an embedded array block (EAB) for on-chip RAM/ROM, providing System-on-a-Programmable-Chip (SOPC) integration. Key features of the EPF10K130EFI484-2 include the FLEX 10KE embedded array architecture, 65,536 bits of distributed memory (via EAB), 3.3 V PCI-compliant I/O, JTAG-compliant boundary-scan (IEEE 1149.1) support, and built-in SameFrame pin migration that lets the designer move between 10K, 10KE, 10KA, and 10K130E family devices without board rework when using the FineLine BGA footprint. Typical applications include high-volume telecommunications line cards, glue logic and bus bridging for embedded CPU boards, industrial control and factory automation backplanes, and legacy replacement designs where the long-life FLEX 10KE supply chain and SameFrame migration tool flow reduce board respin risk. Designers using Quartus II or MAX+PLUS II can target this device directly. When designing with this device, treat the 484-ball FineLine BGA as a non-trivial BGA layout: keep all power and ground balls decoupled with 0.1 µF and 10 µF capacitors placed as close to the package as the breakout allows, and verify SameFrame pin-out migration in the Quartus pin planner before committing to a layout because some I/O banks differ between FLEX 10KE and 10KA devices.

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EPF10K130EQC240-1 - 130K Gates FLEX 10KE FPGA 240-PQFP | Altera
EPF10K130EQC240-1

EPF10K130EQC240-1 - 130K Gates FLEX 10KE FPGA 240-PQFP | Altera

The Altera EPF10K130EQC240-1 is a member of the FLEX 10KE family of embedded programmable logic devices, providing 130,000 typical gates, 6,656 logic elements (LEs), and 65536 bits of embedded SRAM in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. It operates from a 2.5 V core supply (2.375 V to 2.625 V) at up to 333.33 MHz internal performance, with 186 maximum user I/O pins available for external interfacing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in-system. Within the broader taxonomy, the FLEX 10KE sits at the intersection of SRAM-based FPGA and embedded programmable logic, integrating dedicated Embedded Array Blocks (EABs) that provide true dual-port RAM and ROM functions alongside standard LEs - positioning it as one of the first devices to combine ASIC-density gate arrays with FPGA-style programmable interconnect in a single fabric. Key features of the EPF10K130EQC240-1 include 4 Embedded Array Blocks delivering up to 65536 RAM bits, JTAG-compliant IEEE 1149.1 boundary-scan test support, MultiVolt I/O for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and in-system programmability via the Altera EPC configuration devices. The PQFP-240 package uses a 32x32 mm body with gull-wing leads, suiting it for prototypes, industrial control cards, and legacy telecom infrastructure where surface-mount fine-pitch BGAs are not required. Typical applications for this device include industrial machine control, telecommunications line cards, glue-logic integration, legacy ASIC replacement, and embedded DSP co-processing. Designers should pair it with Altera's MAX+PLUS II or Quartus design software for synthesis, place-and-route, and timing analysis. Note that this part is in lifecycle status considered Last Time Buy / Not Recommended for New Designs, so it is best suited for maintenance of existing production systems rather than new platforms.

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EPF10K130EQC240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel
EPF10K130EQC240-1N

EPF10K130EQC240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel

The Intel (formerly Altera) EPF10K130EQC240-1N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) integrating 130,000 system gates with 6,656 logic elements and 65,536 bits of embedded SRAM, fabricated on a 0.22 µm (some sources cite 0.25 µm) CMOS process and housed in a 240-pin Plastic Quad Flat Pack (PQFP / 240-BFQFP) measuring 32x32 mm. The device operates from a 2.375 V to 2.625 V (2.5 V nominal) core supply, supports 186 user I/Os, and contains 832 Logic Array Blocks (LABs) implementing a built-in SRAM configuration memory so the bitstream reloads on every power-up. A Field-Programmable Gate Array is a reconfigurable digital integrated circuit that combines programmable logic elements, an interconnect matrix, and I/O blocks in a single die. Within the broader programmable-logic taxonomy, FPGAs sit above small CPLDs and below ASICs in density; the FLEX 10KE family in particular targets glue-logic, bus-bridging, and mid-density state-machine designs of the late 1990s/early 2000s, before the Cyclone and Stratix families displaced FLEX 10KE in new designs. Engineers chose the FLEX 10KE family for SRAM-based reconfigurability, embedded memory blocks, and the mature Quartus II design-flow support. Key specifications include 64 Kbit embedded block RAM (EAB), 342,000 maximum system gates, 4 Embedded Array Blocks (EABs) of 2,048 bits each, 333.33 MHz maximum internal operating frequency, and -40 °C to +85 °C commercial operating temperature range (note the -1N speed grade). The -1N suffix designates the faster -1 speed grade combined with an industrial/lead-free reflow profile; the package is lead-free (Pb-free) and RoHS compliant, while older -1 / -2 / -3 grades used SnPb lead finish. Compared with the -3 (slowest) grade, the -1 grade delivers the highest internal performance in this family. Typical applications include telecom interface cards (T1/E1, Utopia, POS-PHY bridging), industrial control boards, mid-density glue logic between microprocessors and peripherals, ISA/PCI bus bridges, and legacy replacement of 74-series TTL arrays in long-lifecycle equipment. The 186 user I/Os and 64 Kbit of embedded RAM also make it suitable for protocol converters and small packet-processing engines on FPGA fabric. When designing with this part, ensure the 2.5 V core rail is well decoupled with 0.1 µF and 10 µF capacitors near each supply pin, and route all 186 I/Os through 5 V-tolerant banks if the board mixes 3.3 V and 5 V logic. Quartus II (legacy) or the Quartus Prime FLEX 10KE device-support add-on is required for synthesis, fitting, and bitstream generation. This page combines distributor pricing, SameFrame pin-migration alternatives, and practical design guidance not found in the original FLEX 10KE datasheet, helping engineers evaluating EOL inventory or performing legacy board-maintenance sourcing.

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EPF10K130EQC240-3 - FLEX-10KE FPGA 130K Gates 240-PQFP | Altera
EPF10K130EQC240-3

EPF10K130EQC240-3 - FLEX-10KE FPGA 130K Gates 240-PQFP | Altera

The Altera (Intel) EPF10K130EQC240-3 is a FLEX-10KE series Field Programmable Gate Array delivering up to 342,000 system gates with 6,656 logic elements, 832 logic array blocks (LABs), and 65,536 bits of embedded SRAM in a 240-pin Power QFP (PQFP, 32x32 mm) package. It is built on SRAM-based CMOS configuration memory, supports 186 user I/O pins, and operates from a 2.375 V to 2.625 V core supply with multi-voltage I/O support (2.5 V / 3.3 V). The "-3" speed grade positions it in the FLEX-10KE commercial speed portfolio. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LABs/CLBs) interconnected by a programmable routing fabric and surrounded by programmable I/O cells. FPGAs occupy the top of the programmable logic hierarchy - above SPLDs and CPLDs - and below hard ASICs. They enable System-on-a-Programmable-Chip (SOPC) integration, embedding megafunctions such as multipliers, memory blocks, and processor cores alongside general logic. This hierarchy makes FPGAs ideal for glue logic, prototyping, and low-to-mid volume production without NRE tooling cost. Key features include embedded array blocks for implementing efficient memory and specialized logic, a separate logic array for general logic functions, four phase-locked loops (PLLs) for clock management, multi-voltage I/O supporting 2.5 V and 3.3 V interfaces, and built-in JTAG (IEEE 1149.1) boundary-scan support. The device supports in-system programmability via the Altera FLEX-10KE configuration scheme using a serial configuration EPROM or microprocessor interface. Architecturally, the FLEX-10KE family combines an embedded array (optimized for megafunctions like RAM, ROM, and multiplier primitives) with a logic array (fast fine-grained logic), connected through continuous FastTrack interconnect. Each LAB contains 8 logic elements (LEs), and each LE contains a 4-input LUT, a programmable register, and carry chain logic. Embedded array blocks (EABs) provide 2,048 bits of RAM each, configurable as RAM, ROM, or FIFO. Typical applications include telecommunications line cards, industrial control glue logic, video processing pipelines, DSP co-processing front-ends, networking bridges, and PCI bus controllers. The 240-PQFP footprint was widely adopted in late-1990s/early-2000s designs and remains in service today as long-lifecycle infrastructure equipment. When designing with this part, note that FLEX-10KE FPGAs are end-of-life and Intel/Altera recommends migration to Cyclone IV or Cyclone V for new designs. For new 240-pin PQFP designs in production, consider Cyclone IV E EP4CE40 in FQFP or BGA. Existing designs should source EPF10K130EQC240-3 through authorized distributors or last-time-buy stock. This page synthesizes distributor pricing, verified drop-in same-package alternatives from the Site MPN list, practical design notes and lifecycle information not found in any single distributor page, and is engineered for AI-search citation with structured FAQ and comparison data.

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EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel
EPF10K130EQC240-3N

EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel

The Intel EPF10K130EQC240-3N is a member of the FLEX 10KE programmable logic family, a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP) package. It integrates 6,656 logic elements organized into 832 Logic Array Blocks (LABs), 65,536 bits of embedded RAM, 186 user I/O pins, and 342,000 equivalent system gates, delivering high logic density for glue-logic, bus-interface, and datapath replacement tasks at a frequency of 200 MHz in a 0.22 µm CMOS process. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. They are widely used to implement parallel hardware acceleration, custom I/O protocols, and prototyping of ASIC designs, providing faster time-to-market than full-custom silicon. The FLEX 10KE family specifically targets high-volume, low-cost glue-logic replacement and bridge applications. Key specifications include a core supply voltage of 2.5 V (range 2.375 V to 2.625 V), 186 configurable I/O pins operating from 3.3 V LVTTL/LVCMOS interfaces, four Phase-Locked Loops (PLLs) for clock management, embedded multiplier blocks for datapath acceleration, and MultiVolt I/O supporting mixed-voltage operation. The 240-BQFP footprint uses 32 x 32 mm gull-wing leads and offers 5 V tolerant inputs. The FLEX 10KE architecture separates logic, routing, and memory into dedicated columns, allowing embedded array blocks (EABs) to be configured as RAM, ROM, or synchronous FIFO. With 49,152 typical gates (130K maximum) and fast SRAM configuration, the EPF10K130E accelerates pipelined designs and is well-suited for digital signal processing front-ends and bus-bridging ASICs. Typical applications include telecommunications backplane interfaces, industrial control systems, PCI bridge logic, peripheral controllers, and legacy ASIC/ASSP replacement. Its 5 V tolerant I/O and SRAM-based reconfiguration make it ideal for prototyping and short-run production. When designing with the EPF10K130E, ensure the configuration PROM (EPC16, EPC8, or EPC2 series) is properly sized for the bitstream. Use 100 µF bulk + 0.1 µF decoupling per VCC pin, and confirm JTAG chain length matches the Quartus programmer. This part is widely available on the secondary market as Intel/Altera has notified FLEX 10KE of last-time-buy status. This page synthesizes distributor stock, parametric alternatives, and design guidance not found in the original manufacturer datasheet.

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EPF10K130EQI240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel / Altera
EPF10K130EQI240-1N

EPF10K130EQI240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel / Altera

The Intel (formerly Altera) EPF10K130EQI240-1N is a high-density FLEX 10KE family FPGA delivering 130,000 typical gates (logic, capacity, package) housed in a 240-pin PowerQuad Flat Pack (PQFP, RQFP-240) surface-mount package with gull-wing leads. It provides 6,656 logic elements, embedded array blocks (EABs), and 186 user I/O pins, with a 2.5 V core supply (2.3 V to 2.7 V tolerance) suitable for industrial-temperature designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader category of programmable logic devices (PLDs) within the integrated circuits hierarchy. FPGAs occupy the high-end of the PLD taxonomy (above simple SPLDs and CPLDs) by integrating thousands of configurable logic blocks, programmable interconnect, embedded memory, and often embedded multipliers or transceivers, enabling the implementation of complete digital subsystems on a single chip. The FLEX 10KE generation is built on a 0.25 µm CMOS process with SRAM-based configuration, requiring an external configuration device such as the EPC2 configuration PROM to load the bitstream at power-up. Key features include 6,656 logic elements (LEs), 6,912 total RAM bits distributed across embedded array blocks, support for system-clock rates up to 333.33 MHz, and a JTAG-compliant IEEE 1149.1 boundary-scan test interface. The device supports in-system programmability via the serial configuration interface and offers multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL for memory interfaces. Typical applications include industrial control, telecom line cards, glue-logic consolidation on legacy 5 V boards, prototyping for ASIC replacement, and DSP co-processing pipelines. The wide I/O count and embedded memory blocks also make the part well-suited to parallel bus interfacing in test and measurement instrumentation. Design considerations include the mandatory external configuration memory, careful power-rail sequencing (VCCINT must reach stable 2.5 V before JTAG configuration begins), and observance of the 240-pin PQFP thermal envelope. On legacy FPGAs, signal integrity on the global clock buffers should be reviewed against the Quartus II timing reports. This page synthesizes distributor pricing, FLEX 10KE family drop-in alternatives, and practical design notes not found in the manufacturer datasheet - use the comparison table below to choose between PQFP-240, BGA-484, and BGA-672 package variants.

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EPF10K130EQI240-2 - FLEX 10KE FPGA, 130K Gates, 240-PQFP | Intel / Altera
EPF10K130EQI240-2

EPF10K130EQI240-2 - FLEX 10KE FPGA, 130K Gates, 240-PQFP | Intel / Altera

The Intel (formerly Altera) EPF10K130EQI240-2 is a member of the FLEX 10KE family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering 130,000 typical gates and 6,656 logic elements in a 240-pin Power Quad Flat Pack (PQFP / BFQFP) package. It integrates 65,536 bits of embedded array memory, 832 Logic Array Blocks (LABs) with 12 logic elements per LAB, and 186 user I/O pins, providing a high-density programmable platform for glue-logic, bus-bridging, and custom datapath designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can program after manufacturing to implement arbitrary digital logic. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below ASICs in terms of density, power efficiency, and per-unit cost at volume. The FLEX 10KE family specifically combines fine-grained logic with embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier primitives, making the device suitable for designs that require both random logic and on-chip memory. Key features of the EPF10K130EQI240-2 include 342,000 maximum system gates, 65,536 RAM bits distributed across embedded array blocks, 4 dedicated input pins plus clock and clear control pins, in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and multi-volt I/O support (5.0V, 3.3V, 2.5V). The industrial-grade -2 speed grade and -40C to +85C operating range make the part suitable for commercial and industrial environments rather than full automotive qualification. The EPF10K130EQI240-2 uses a 0.22 um SRAM process with a 4-input look-up table (LUT) architecture per logic element, with cascade chains and fast carry chains for arithmetic functions. Built-in PCI compliance and a low-skew global clock network with up to 8 clock pins allow the device to address both peripheral-controller and datapath-intensive designs without external PLDs. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation backplanes, PCI bus interfaces, custom datapath accelerators, and legacy system emulation. The PQFP-240 footprint is well suited for through-hole-compatible surface-mount prototyping and rework on existing 10K designs. When designing with this device, ensure that the Quartus II or MAX+PLUS II toolchain matches the device code (EPF10K130E) and speed grade (-2). Designers transitioning to newer Cyclone or MAX families should treat FLEX 10KE as a mature, last-time-buy risk and verify long-term availability before new designs. This page synthesizes distributor stock, drop-in alternatives from the same Altera FLEX 10KE family, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet PDF.

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EPF10K130EQI240-2N - 130K Gates FLEX-10KE FPGA, 240-PQFP | Intel / Altera
EPF10K130EQI240-2N

EPF10K130EQI240-2N - 130K Gates FLEX-10KE FPGA, 240-PQFP | Intel / Altera

The Intel / Altera (formerly Altera) EPF10K130EQI240-2N is a member of the FLEX-10KE embedded programmable logic family, delivering approximately 130,000 usable gates in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package with 186 user I/Os. Built on a 0.22 µm CMOS SRAM-based architecture, the device integrates 6,656 logic elements (LEs), 65,536 bits of embedded array memory (EAB), and is targeted at System-on-a-Programmable-Chip (SOPC) designs requiring moderate logic density and high I/O count on a through-hole friendly package. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all defined by user-supplied bitstream data after manufacturing. FPGAs sit in the programmable logic hierarchy beneath full-custom ASICs and above discrete logic ICs, enabling rapid prototyping, late-stage design changes, and integration of memory plus logic in a single device. The FLEX-10KE family specifically pioneered the embedded array block (EAB) concept, allowing megafunctions such as RAM, ROM, and multiplier primitives to be implemented with the same silicon efficiency as dedicated memory. Key features of the EPF10K130EQI240-2N include 186 user I/O pins, 65,536 RAM bits distributed across embedded array blocks, 0.6 ns propagation delay typical of the family, and an industrial-grade operating temperature range (I suffix) of -40 °C to +85 °C. The device supports in-system programmability via an industry-standard passive serial (PS) configuration interface, multi-device configuration chains, and 3.3 V core operation with 5 V-tolerant I/O via Altera's MultiVolt interface. The 240-pin PQFP package supports legacy through-hole PCB designs and repair-friendly prototyping flows. The I-grade (industrial) operating range suits factory automation, instrumentation, and telecommunications line-card applications. MultiVolt I/O compatibility allows seamless interface with both 3.3 V and 5 V peripherals without external level shifters. Typical applications include telecommunications line cards and bridges, industrial motor control and PLC backplanes, glue logic replacement in legacy industrial controllers, prototyping platforms for ASIC migration, and test & measurement instrumentation front-ends. The high I/O count makes it suitable for parallel bus bridging and protocol conversion designs. When designing with this FPGA, ensure your configuration PROM (EPC2 or compatible) and JTAG chain are correctly wired. The 240-pin PQFP footprint requires plated through-holes and is not recommended for new high-speed designs above 50 MHz due to lead inductance; new designs should consider equivalent logic in BGA or QFP packages. Quartus II or MAX+PLUS II software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond what the legacy datasheet provides. Engineers evaluating the FLEX-10KE family should consult Altera documentation and migration guides to modern Cyclone or MAX families for new designs, while the EPF10K130EQI240-2N remains a serviceable drop-in for legacy maintenance.

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EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1

EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems

The Intel EPF10K200EBC600-1 is a 2.5 V FLEX-10KE field-programmable gate array with 9,984 logic elements, 470 I/O, 1,248 LABs, and 98,304 bits of embedded memory, supplied in a 600-BGA package. The verified source identifies a 600-BGA device and a 470-I/O configuration. The MPN suffix indicates a particular speed and temperature ordering, but the complete timing grade definition is not present in the supplied web data and therefore requires manufacturer-document verification. A field-programmable gate array is a programmable logic device containing configurable logic blocks, routing resources, and programmable I/O that implement digital functions. In the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-driven processors: it provides hardware parallelism and timing control without requiring a custom silicon mask. Embedded memory, logic, and I/O resources let a system combine control logic, interface adaptation, and datapath functions in one programmable device. The EPF10K200EBC600-1 provides 9,984 logic elements, 1,248 LABs, 470 I/O, and 98,304 bits of embedded memory according to the verified distributor listings. These resources support moderate-to-large digital designs, including glue logic, bus controllers, protocol bridges, and custom peripherals. The 600-BGA package is a high-density surface-mount package, but its ball map and package dimensions are not included in the supplied data. The FLEX-10KE architecture combines programmable logic with embedded array functions. The supplied description references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. These features make the part suitable for designs needing configurable datapaths and memory, although exact memory organization, operating-current limits, propagation-delay grades, and supported configuration modes are not available in the provided snippets. Typical applications include industrial control equipment, communications-interface hardware, test equipment, and legacy digital systems. Its 470 I/O make it useful where a design must connect many parallel or serialized external signals, while 9,984 logic elements provide capacity for glue logic, state machines, protocol handling, and custom arithmetic. The 98,304-bit embedded-memory figure also supports buffering and state-storage functions when the design is compiled for the FLEX-10KE architecture. A critical design step is to verify the exact package ball map, power sequencing, configuration interface, and timing specification before layout or production release. The verified data provides the 600-BGA package name and 470-I/O count, but not a ball-by-ball pinout. Designers should also confirm whether the target design requires the -1 speed grade, a different temperature grade, or a specific revision-compatible source. This page combines verified distributor specifications, package-level information, pricing references, and engineering-focused context to support component selection. Where the supplied data does not expose a parameter, the value is marked as needed rather than estimated.

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