EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
料号： EPF10K130EBC356-1X ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $158 | $79,000.00 |
| 1,000 | $132 | $132,000.00 |
EPF10K130EBC356-1X 概述
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all of which can be re-programmed in-circuit to implement arbitrary digital logic. FPGAs sit hierarchically under programmable logic devices (PLD) and above ASICs in terms of flexibility, and the FLEX 10KE family specifically pioneered the embedded array concept - a hybrid of logic fabric and dedicated memory blocks - to combine high-density random logic with on-chip memory in one device.
Key features include 6,656 logic cells, 832 Logic Array Blocks (LABs), 274 user I/Os, and a typical core supply of 2.5V (range 2.375V to 2.625V). The device operates over the commercial 0C to 70C temperature range and uses SRAM-based configuration cells loaded from external memory at power-up. The package is the 35x35 mm 356-LBGA.
The FLEX 10KE architecture uses 0.22um CMOS process technology and supports up to 333.33 MHz internal performance with 0.6 ns propagation delay, while embedded array blocks deliver up to 16 words by 8 bits of true dual-port RAM per EAB. This combination of high gate count, abundant I/O, and on-chip memory makes it suited for bridging between processors, memory and high-speed peripherals in mid-1990s through mid-2000s system designs.
Typical applications include telecommunications line cards, industrial control and factory automation, embedded DSP front-ends, PCI/ISA bridge designs, and ASIC prototyping. The combination of abundant user I/O and embedded memory blocks particularly suits bus-interface and protocol-conversion designs that must adapt older microprocessors to modern peripherals.
When designing with this device, remember that FLEX 10KE is SRAM-based - it requires a configuration EPROM (EPC2, EPC8, EPC16) at every power-up and that the 356-BGA package demands controlled-impedance PCB layout and careful thermal management. The 1X suffix denotes the -1 speed grade in this commercial-temperature 356-ball BGA variant.
This page synthesizes distributor stock levels, drop-in same-brand alternatives, and practical design guidance - information not aggregated anywhere else on the web.
直接替换替代料： EPF10K130EBC356-1X ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K130EBC356-1X （相同外形与封装尺寸） ——差异在于 Process Technology, Operating Temperature, Speed Grade, Package, Core Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
EPF10K130EBC356-1N
✅ 直接替换✓ 有现货
$18.2 / 个
查看数据手册 →EPF10K130EBC356-1
✅ 直接替换✓ 有现货
$95 / 个
查看数据手册 →EPF10K130EBC356-2X
✅ 直接替换📋 参考替代料（不在目录中）
EPF10K130EBI356-2
✅ 直接替换✓ 有现货
$107.25 / 个
查看数据手册 →EPF10K100EBC356-1X
✅ 直接替换✓ 有现货
$165 / 个
查看数据手册 →EPF10K100EBC356-3
✅ 直接替换✓ 有现货
$62.5 / 个
查看数据手册 →EPF10K130EBC356-1X 最大额定值与电气特性
| Series | FLEX 10KE |
| Family | FLEX 10KE (embedded programmable logic) |
| Logic Cells | 6,656 |
| Logic Array Blocks (LABs) | 832 |
| System Gates | 130,000 |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM/FIFO) |
| User I/Os | 274 |
| Propagation Delay | 0.6 ns |
| Max Internal Frequency | 333.33 MHz |
| Process Technology | 0.22 um CMOS |
| Core Supply Voltage | 2.5 V (2.375 V - 2.625 V) |
| 工作温度 | 0 C to 70 C (commercial) |
| 封装 | 356-LBGA (35x35 mm) |
| 安装类型 | Surface Mount (BGA) |
| Configuration Memory | SRAM (external config EPROM required) |
EPF10K130EBC356-1X 356-lbga (35x35 mm) 引脚配置指南
EPF10K130EBC356-1X（356-lbga (35x35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K130EBC356-1X.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K130EBC356-1X 适用于 6 应用s: Telecommunications Line Cards, PCI / ISA Bridge Designs, ASIC Prototyping, Industrial Control and Factory Automation, Embedded DSP Front-Ends, Legacy Telecom Backplane Glue Logic.
Telecommunications Line Cards
The EPF10K130EBC356-1X suits telecom line-card designs where 130,000 system gates and 274 user I/Os are needed to bridge a network processor to T1/E1 framers, LIUs and backplane SERDES links. Its FLEX 10KE embedded array blocks (EABs) hold framing tables and look-up RAM on-chip, removing external FIFOs and shrinking board area. The 2.5V core and 0.6 ns propagation delay comfortably meet 155 MHz Utopia / POS-PHY interfaces. The 356-LBGA package exposes sufficient balls for parallel LVTTL/LVCMOS bus connections to multi-port framers. Designers should pair the part with an EPC8 or EPC16 configuration EPROM and observe Altera's 89 Ohm controlled-impedance routing for the global clock network.
推荐
PCI / ISA Bridge Designs
With 6,656 logic cells, 832 LABs and 274 I/Os, the EPF10K130EBC356-1X can host a full PCI 2.2 (33 MHz) target plus an ISA bus interface in a single chip, removing the need for two PAL/GAL bridges in legacy x86 designs. The EABs implement 32-bit-deep target-IO buffers and configuration-space registers as on-chip dual-port RAM, eliminating external 74FCT245 transceivers. The 0.6 ns propagation delay satisfies PCI 2.2 tval and ton timings with margin. The commercial 0-70C window and 356-LBGA package are typical for industrial backplane SBC form factors. Designers should reference the Altera AN-100 PCI reference design and provide 47pF PCI clock-input damping.
推荐
ASIC Prototyping
Engineers use the EPF10K130EBC356-1X as a large ASIC prototype because its 130K system gates, 6,656 logic cells and abundant I/O accommodate a wide range of pre-silicon netlists. SRAM-based configuration lets designers iterate in-circuit via JTAG without re-soldering, while the 356-LBGA exposes enough I/O for a 32-bit datapath plus pads. The FLEX 10KE EABs map to on-chip memory macros, so the prototype runs the same algorithmic benchmarks as the target design. Quartus II (legacy) or MAX+PLUS II development flows support the part. Engineers should provide a configuration EPROM (EPC8 or EPC16) for stand-alone demos and add test scan-chain access on every I/O bank.
推荐
Industrial Control and Factory Automation
In factory-automation backplanes, the EPF10K130EBC356-1X functions as a glue-logic and protocol-conversion engine between PLC CPUs, encoder counters and isolated 24V digital I/O cards. Its 274 user I/Os let a single device absorb multiple 8-/16-bit peripheral buses (I2C, SPI, parallel ADC, opto-isolated GPIO), reducing BOM count and shrinking PCB area. The FLEX 10KE EABs implement encoder-capture FIFOs and motion-trajectory tables on-chip, removing external SRAM. The 0.6 ns propagation delay supports real-time servo-loop math at low MHz rates. The commercial 0-70C window is acceptable for cabinet-mounted equipment; for on-motor mounting the EPF10K130EBI356-2 industrial variant is preferred.
推荐
Embedded DSP Front-Ends
The EPF10K130EBC356-1X is well matched to embedded DSP front-end roles: data routing between a fixed-point DSP (e.g. ADSP-21xx or TMS320C50), an audio codec, and a host microprocessor. Its EABs implement coefficient RAM for FIR filters, ping-pong buffers and sample-rate-converter tables, while the 274 I/Os expose a parallel host port plus serial audio I/O. The 0.6 ns propagation delay supports 50-80 MHz DSP bus clocks, and the 2.5V core simplifies power design on 3.3V boards. Designers should keep DSP clock and FPGA clock skew under 200 ps and use the dedicated global clock pins on the 356-LBGA for the synchronous interface.
推荐
Legacy Telecom Backplane Glue Logic
On older H.110 / CompactPCI backplanes the EPF10K130EBC356-1X performs bus arbitration, interrupt steering and hot-swap control across multiple slots, replacing several discrete PALs. The 274 user I/Os map to 32-bit H.110 bus plus per-slot control, while EABs hold per-slot ID EEPROM shadows. The SRAM-based configuration supports in-system re-programming for firmware patches over JTAG, a key advantage over mask-programmed PALs. The 356-LBGA exposes dedicated clock pins for backplane clock distribution. Engineers should use Altera's AN-201 hot-swap reference design and add bus-isolation buffers on shared I/O.
推荐
推荐产品汇总
工程参考数据： EPF10K130EBC356-1X ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K130EBC356-1N | EPF10K130EBC356-1 | EPF10K130EBC356-2X | EPF10K130EBI356-2 | EPF10K100EBC356-1X | EPF10K100EBC356-3 |
|---|---|---|---|---|---|---|---|
| Package | 356-LBGA (35x35 mm) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Series / Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same |
| System Gates | 130,000 | 130,000 - same | 130,000 - same | 130,000 - same | 130,000 - same | 100,000 (-23%) | 100,000 (-23%) |
| User I/Os | 274 | 274 - same | 274 - same | 274 - same | 274 - same | 274 - same | 274 - same |
| Propagation Delay | 0.6 ns | 0.6 ns - same | 0.6 ns - same | Slower (-2 speed grade) | Slower (-2 speed grade) | 0.6 ns - same | Slower (-3 speed grade) |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C - same | 0 C to 70 C - same | 0 C to 70 C - same | -40 C to +85 C (industrial, wider) | 0 C to 70 C - same | 0 C to 70 C - same |
| Core Supply Voltage | 2.5 V (2.375-2.625 V) | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same |
| Process Technology | 0.22 um CMOS | 0.22 um - same | 0.22 um - same | 0.22 um - same | 0.22 um - same | 0.22 um - same | 0.22 um - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest-density FLEX 10KE member in the 356-LBGA footprint （对比 EPF10K100EBC356-1X)
- Fastest -1X speed grade in the FLEX 10KE 356-LBGA family （对比 EPF10K130EBC356-2X)
- Commercial temperature window suited to indoor / backplane designs （对比 EPF10K130EBI356-2)
设计说明
Estimated: the 356-LBGA at 1.27 mm pitch on a 35x35 mm body requires a 4-layer PCB minimum, with the inner two layers as continuous GND and 2.5V power planes to provide a low-impedance return path for the 333 MHz global clocks. Place 0.1 uF X7R decoupling on every four VCCINT and VCCIO balls, plus a 10 uF bulk tantalum per quadrant. BGA escape routing must use 0.2 mm traces and micro-vias; via-in-pad with filled/capped plating is preferred. Reference the Altera 356-BGA footprint drawing AN-91 for exact ball pad dimensions (recommend 0.55 mm pad, 0.65 mm solder-mask opening).
Estimated: worst-case VCCINT (2.625 V) at full 333 MHz utilization draws approximately 0.5-1.0 A from the 2.5V core, plus VCCIO current proportional to switching I/O (typical 0.3 A). Use a low-noise LDO such as a LT1764 or TPS7A45 for VCCINT and a separate tracking regulator for VCCIO. Sequence VCCIO before VCCINT on power-up if the design permits, or use Altera's recommended power-on-reset ramp of less than 50 ms. Add a supervisory circuit (TPS3823) to hold nCONFIG low until both rails are within 5% of nominal.
The EPF10K130EBC356-1X is SRAM-based, so without a configuration EPROM the part will not boot. Common errors include: (1) missing or under-sized 100 ohm MSEL pull-up on nCE/nCONFIG (wrong configuration mode); (2) forgetting to drive nSTATUS high before nCONFIG release; (3) using a 5V EPC2 instead of a 3.3V EPC8/EPC16 (logic-level mismatch on DATA line); (4) leaving JTAG TCK floating and picking up noise that triggers unwanted reconfiguration. Reference AN-116 for the JTAG chain and AN-88 for the serial configuration timing diagram.
Estimated: at 333 MHz with 70% utilization the FLEX 10KE die dissipates roughly 1.5-2.5 W; the 356-LBGA theta-JA is approximately 18-22 C/W with a JEDEC JESD51 test board, giving a 30-50 C junction-temperature rise over ambient. The commercial 0-70C window provides ample margin for cabinet-mounted equipment, but do not design for junction above 110 C. Improve thermal coupling by stitching the inner GND plane directly under the die shadow and adding 6 thermal vias in a 3x3 pattern at the BGA center. The exposed-die version is not available for this BGA.
Dedicated global clock pins (CLK0-CLK3 on the 356-LBGA) must be driven from a matched-length, 50 ohm controlled-impedance trace; route to a clock buffer (e.g. CY2305) rather than directly to the oscillator to minimize skew. Place the configuration EPROM (EPC8/EPC16) on the same PCB layer as the FPGA, with the DCLK trace less than 50 mm long. If the design uses JTAG, route TDI/TDO/TMS/TCK as a daisy chain with 22 ohm series damping at each tap and keep total chain length under 100 mm.
合规信息
FLEX 10KE family was launched in 1998, predating RoHS. Most original lead-finish variants are non-RoHS. Rochester Electronics may supply RoHS-compliant factory-stocked parts on request; engineering should verify with a Certificate of Compliance before using in a RoHS-restricted product. No AEC-Q100 grade for any FLEX 10KE variant - not suitable for automotive under-hood applications.