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产品（39,000+)

EPF10K200EBC600-2 - FLEX-10KE FPGA 470 I/O BGA-600 | Intel
EPF10K200EBC600-2

EPF10K200EBC600-2 - FLEX-10KE FPGA 470 I/O BGA-600 | Intel

The Intel (formerly Altera) EPF10K200EBC600-2 is a FLEX-10KE family Field-Programmable Gate Array (FPGA) offering 200,000 typical gate equivalent logic density, 98304 bits of embedded array memory (EAB), and 470 user I/O pins in a 600-ball BGA package. The device integrates 1248 Logic Array Blocks (LABs) and 9984 Logic Elements (LEs) with a 0.4 ns propagation delay, supporting system-on-a-programmable-chip (SOPC) designs for high-density digital logic applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the middle ground between fixed-function ASICs and low-density PLDs/CPLDs, providing hundreds of thousands of logic gates, dedicated memory blocks, and high-speed I/O transceivers on a single reprogrammable silicon die. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below full-custom ASICs, enabling rapid prototyping, low-volume production, and in-system reconfiguration for communications, industrial, and embedded computing platforms. Key features include a 0.30 µm CMOS SRAM process technology, four enhanced embedded array blocks (EABs) per device, 4.6 Mbits total embedded memory, 5V tolerant I/O with multi-voltage support (2.5V/3.3V), and in-system programmability via IEEE 1149.1 JTAG and Altera EPC2/EPC16 configuration devices. The 600-ball BGA package at 45×45 mm body size with 1.27 mm pitch provides robust thermal dissipation and high-density board interconnect suitable for multi-layer backplane designs. The EPF10K200EBC600-2 uses an SRAM-based look-up table (LUT) architecture with FastTrack interconnect routing, providing deterministic timing closure and supporting designs up to 200K system gates with peripheral component interconnect and processor interface bridging. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, enabling flexible interfacing with microprocessors, memory subsystems, and backplane buses. Typical applications include telecommunications infrastructure, industrial control systems, embedded processor glue logic, high-speed data acquisition, and ASIC prototyping. The wide I/O count and embedded memory make it well-suited for parallel DSP pipelines, network protocol acceleration, and legacy bus-to-bus bridges in telecom switching equipment. When designing with this device, note that it requires a separate configuration memory (such as an EPC2 serial configuration device) at every power-up since the SRAM configuration is volatile. PCB layout must include a dedicated 45×45 mm BGA land pattern with 1.27 mm pitch and adequate thermal vias under the package. This page synthesizes distributor inventory, drop-in pin-compatible alternatives in the same FLEX-10KE family, and practical design notes beyond the manufacturer datasheet. Engineers can compare pricing across 2 active distributors and review the exact BGA-600 pinout for board layout.

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EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3

EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera

The Intel (formerly Altera) EPF10K200EBC600-3 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) built on a 0.22 micrometer SRAM-based process, offering approximately 200,000 system gates and 9,984 logic elements packaged in a 600-ball FineLine BGA (45 x 45 mm). The device integrates 470 user I/O pins, 1248 Logic Array Blocks (LABs), and embedded array blocks (EABs) for on-chip memory and specialized megafunctions such as FIFOs, multipliers, and DSP primitives. According to the Altera datasheet, this speed-grade -3 part is qualified for commercial operating conditions with a core voltage of 2.5 V (2.375 V to 2.625 V) and supports I/O standards including LVTTL, LVCMOS, PCI, and GTL+. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA), occupying the high-density, high-performance end of the spectrum. The FLEX 10KE family is part of the System-on-a-Programmable-Chip (SOPC) generation, embedding dedicated memory structures into the logic fabric to enable single-chip implementations of complex glue logic, bus interfaces, and signal-processing pipelines. Key differentiating features include 24 Kbits of embedded memory distributed across EABs, four phase-locked loops (PLLs) for clock conditioning, multi-volt I/O supporting 1.8 V/2.5 V/3.3 V/5 V mixed-voltage interfaces, JTAG boundary-scan (IEEE 1149.1) for in-system programming, and Altera's proprietary continuous interconnect structure. The -3 speed grade delivers logic performance of approximately 166 MHz for registered I/O and is well-suited to medium-speed ASIC prototyping, custom peripheral interfacing, and telecom/datacom glue logic. Typical application domains include ASIC prototyping and emulation, custom bus bridges (PCI to local bus, VME to PCI), telecommunications backplane controllers, industrial machine controllers, and legacy industrial control systems where the FLEX 10KE generation remains a long-life, second-sourced platform. The 600-BGA package and standard surface-mount footprint simplify board-level integration and rework. When designing with this device, ensure the PCB pad pattern follows the 45 x 45 mm FineLine BGA land geometry and that decoupling capacitance (typically 0.1 microfarad ceramic plus 10 microfarad bulk per power rail) is placed directly beneath the package within the breakout via field. Use the Altera Quartus II design software (legacy MAX+PLUS II also supported) for place-and-route and bitstream generation. Designers migrating to newer Intel Cyclone or MAX 10 families should review the FLEX 10KE to Cyclone IV migration guide and account for differences in I/O standard support, EAB architecture, and PLL count. This page synthesizes distributor pricing, lifecycle status, drop-in same-package alternatives from the FLEX 10KE family, and practical board-level design notes not found in a single manufacturer datasheet.

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EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2

EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel

The Intel (Altera) EPF10K200EBI600-2 is a high-density member of the FLEX 10KE embedded programmable logic family, integrating 200,000 system gates and 9,984 logic elements into a single 600-ball BGA package. It delivers 470 user I/O pins, 1248 Logic Array Blocks (LABs) and an internal RAM capacity of 98,304 bits, providing system-on-a-programmable-chip (SOPC) integration with embedded array blocks for on-chip memory and FIFO functions. A Field Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing via a programmable interconnect fabric and configurable logic blocks; modern FPGAs combine programmable logic with embedded multipliers, transceivers, and ARM/SoC cores. The FLEX 10KE family extends the original FLEX 10K architecture with enhanced embedded array blocks (EABs) that implement dual-port RAM, ROM, and FIFO operations in silicon, making the EPF10K200EBI600-2 suitable for both glue logic and larger datapath functions in communication and industrial designs. Key features include 200,000 system gates, 9,984 logic elements, 1248 LABs, 470 user I/O pins, 98,304 bits of embedded RAM, 0.4 ns propagation delay (per part number designation), 2.5 V core supply, and a commercial 0 C to 70 C operating temperature grade. The device is offered in a 45 x 45 mm, 1.27 mm pitch, 600-ball BGA package, the largest in the FLEX 10KE family, enabling maximum I/O density for high-pin-count ASIC and ASIC-replacement designs. The architecture pairs four Logic Elements (LEs) per LAB with EABs that can be configured as SRAM (2048 bits each), ROM, or multiplier blocks; routing resources are arranged in FastTrack Interconnect rows and columns. Designers use the Quartus (or legacy MAX+PLUS II) toolchain with HDL or schematic entry to map logic, run static timing analysis, and generate programming files (.sof/.pof) for byte-blaster configuration via JTAG. Typical applications include industrial automation controllers, telecommunications line cards and DSLAM backplanes, military and aerospace digital signal processing subsystems, and ASIC prototyping where high I/O count and embedded memory blocks are required. The 600-pin BGA also supports large pin-migration paths via SameFrame pin-out compatibility. When designing with this device, ensure the BGA land pattern follows JEDEC MS-034 with proper microvia stacking and a 6+ layer PCB for power-integrity. Decouple each VCCINT/VCCIO bank with 0.1 uF and 10 uF capacitors placed within 5 mm of the balls, and respect simultaneous-switching-output (SSO) limits for the 2.5 V I/O banks to maintain signal-integrity above 50 MHz. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EPF10K200EBI600-2 not found in the manufacturer datasheet alone.

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EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel
EPF10K200EBI600-2N

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

The Intel EPF10K200EBI600-2N is a high-density FLEX 10KE embedded programmable logic device (PLD) from the FLEX 10KE family, integrating 200K typical gates, 9,984 logic elements (LEs), and 12 embedded array blocks (EABs) in a 600-ball BGA package. It operates from a 2.5V core supply (2.3V to 2.7V) and supports maximum user I/O counts of 470 pins with 6 dedicated inputs, all fabricated on a 0.22 µm CMOS process. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells after manufacturing. Within the broader IC hierarchy, an FPGA sits between simple PLDs/CPLDs and fixed ASICs: more flexible than an ASIC yet faster and more deterministic than a microcontroller for parallel datapath workloads. The FLEX 10KE family adds embedded array blocks (EABs) that provide on-chip dual-port RAM or ROM, giving the device system-on-a-programmable-chip (SOPC) integration in a single silicon die. Key features include a 200 MHz internal performance target, 0.4 ns to 0.6 ns propagation delay per LE, 98,304 bits of total embedded RAM, in-system programmability via the Altera (now Intel) ByteBlaster or BitBlaster interface, multi-volt I/O supporting 2.5V/3.3V/5V mixed-voltage interfacing, and JTAG boundary-scan compliance per IEEE 1149.1. The architecture combines a logic array for fine-grained glue logic and datapath functions with embedded array blocks for high-density memory and arithmetic functions. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry/chain logic, while each EAB delivers up to 4 Kbits of RAM that can be cascaded for wider words or deeper FIFOs. The 0.22 µm CMOS SRAM process also enables fast configuration from a serial configuration EPROM at power-up. Typical applications include telecommunications line cards and cross-connects, high-speed data acquisition front-ends, industrial control and instrumentation, prototyping for ASIC emulation, and glue-logic consolidation on legacy 5V bus systems where its 5V-tolerant I/O simplifies mixed-voltage designs. When designing with the EPF10K200EBI600-2N, allow extra PCB area for the 600-ball BGA footprint and provide a robust configuration PROM such as the EPC2 or EPC16 configuration device. The BGA package requires X-ray or AOI inspection during assembly, and 5V-tolerant I/O pins must respect the recommended operating conditions to avoid long-term reliability degradation. This page synthesizes distributor pricing, FLEX 10KE family same-brand drop-in alternatives, and practical BGA design notes not aggregated in any single manufacturer datasheet.

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EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel
EPF10K200EFC672-1

EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel

The Intel (Altera) EPF10K200EFC672-1 is a high-density FLEX-10KE family Field Programmable Gate Array (FPGA) with 200,000 typical gates and 9,984 logic elements, packaged in a 672-ball FineLine BGA (27x27 mm). The device integrates 98,304 bits of embedded array memory and 470 user I/Os in a CMOS, SRAM-based architecture rated for the commercial 0C to 70C temperature range with 1.27 mm ball pitch. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user after manufacture. FPGAs sit at the apex of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement custom digital logic, glue logic, datapath acceleration, and full processor subsystems without the cost of an ASIC. The FLEX-10KE family extends the original FLEX-10K architecture with enhanced embedded array blocks (EABs), giving designers block-RAM-like memory in addition to distributed look-up-table logic. Key features of the EPF10K200EFC672-1 include 470 user I/Os, a 1,248 LAB (Logic Array Block) count, a propagation delay figure of approximately 0.4 ns per logic element stage, and True-LVDS/PCI/LVTTL multi-standard I/O support. The device is offered in the commercial speed grade -1 and is compatible with the Quartus II MAX+PLUS II legacy design toolchains via the Altera Legacy Device Support path. On-chip resources include 12 EABs totaling 98,304 RAM bits, suitable for FIFO, dual-port RAM, and ROM implementations. Typical applications for the EPF10K200EFC672-1 include telecommunications line cards, industrial control and instrumentation backplanes, legacy ASIC prototyping, glue-logic consolidation on PCBs, and PCI bus mastering peripherals. Designers still using this part typically do so for long-life industrial or avionics programs where re-qualification of newer FPGAs is not economical; Rochester Electronics is the authorized lifetime source for these legacy Altera devices. When designing with the EPF10K200EFC672-1, ensure a 1.27 mm-pitch BGA land pattern with adequate microvia stacking, four-layer PCB minimum for signal integrity, and a stable 2.5V/3.3V/5V core/I-O supply tree. Decoupling must follow the Altera FLEX-10KE reference design with bulk tantalum plus 0.1 uF ceramic at every supply pin.

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EPF10K200EFC672-2 - FLEX 10KE FPGA 200K Gates 672-BGA | Intel
EPF10K200EFC672-2

EPF10K200EFC672-2 - FLEX 10KE FPGA 200K Gates 672-BGA | Intel

The Intel (formerly Altera) EPF10K200EFC672-2 is a member of the FLEX 10KE family of Embedded Programmable Logic Devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device. It is built on a 0.22 um CMOS process, delivers approximately 200,000 typical gates, contains 9,984 logic elements, 470 user I/Os, and 98,304 bits of embedded memory, all packaged in a 672-ball FineLine BGA. Speed grade -2 places this part in Altera's commercial performance tier for the FLEX 10KE family. A field programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) yet faster and more deterministic than microcontroller-based systems. The FLEX 10KE family combines a look-up-table (LUT)-based logic fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling block-level memory on-chip rather than relying solely on distributed flip-flops. Key features include 470 user I/Os, an embedded array architecture that supports up to 98,304 bits of on-chip memory, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, multi-volt I/O support, and CMOS process technology with low static power consumption. The 672-BGA package provides high-density interconnect for designs requiring extensive signal fan-out, with a 1.27 mm ball pitch and 45 x 45 mm body suitable for production surface-mount assembly. Typical applications include telecommunications infrastructure, industrial control, glue-logic consolidation in legacy systems, digital signal processing front-ends, and prototyping platforms where migration to a structured ASIC is anticipated. The FLEX 10KE is widely deployed in designs originally prototyped in the late 1990s and remains in service today for industrial and military customers requiring long-life-cycle components. When designing with this device, ensure that your synthesis toolchain supports the FLEX 10KE architecture (Altera/Intel Quartus legacy versions) and that PCB layout accommodates the 45 mm BGA footprint with adequate via-in-pad and microvia escape routing. Power supply sequencing and decoupling per the manufacturer datasheet are mandatory for reliable operation.

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EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3

EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel

The Intel EPF10K200EFC672-3 is a member of the FLEX 10KE family of embedded programmable logic devices (PLDs), delivering 200,000 typical gates and 9,984 logic elements (LEs) in a 672-ball FineLine BGA package operating from a 2.5 V core supply. According to the manufacturer datasheet, the device integrates 470 user I/Os, 1248 logic array blocks (LABs), 98,304 bits of embedded array RAM, and four phase-locked loops (PLLs), supporting system-on-a-programmable-chip (SOPC) integration with on-chip memory and dedicated multiplier support. A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose logic fabric, interconnect, and I/O cells are configured by a user-supplied bitstream after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher density and performance than complex PLDs (CPLDs). The FLEX 10KE family was Altera's third-generation embedded-array SRAM-based family, fabricated on a 0.22 µm CMOS process and optimized for high I/O count and embedded memory density. Key differentiating features of the EPF10K200EFC672-3 include 9,984 LEs (logic elements), 98,304 RAM bits distributed across 12 embedded array blocks (EABs), 470 user I/Os with multi-voltage I/O support, four phase-locked loops (PLLs) for clock management, and in-system programmability through the IEEE 1532 / passive serial configuration interface. The 672-pin FineLine BGA package measures 27 mm x 27 mm with a 1.0 mm pitch, providing high interconnect density for high-pin-count designs. Each LE contains a 4-input lookup table (LUT), a programmable flipflop, and a dedicated carry chain. Architecturally, the device uses a SRAM-based configuration cell with embedded array blocks (EABs) of 2 Kbits each, supporting dual-port RAM, ROM, and FIFO implementations at the fabric level. The embedded multiplier blocks accelerate DSP functions without consuming general-purpose LE resources. PLLs support clock multiplication, division, phase shifting, and frequency synthesis with sub-nanosecond jitter, enabling high-speed interface implementation. Typical applications include telecommunications line cards, industrial automation controllers, ASIC prototyping platforms, network switches, and digital signal processing subsystems. The wide I/O count (470 pins) makes the device well suited for bus-intensive designs such as memory interfaces, parallel data acquisition, and backplane bridging. When designing with this device, ensure your configuration memory (typically EPC2 or EPC16 configuration device) is correctly sized for the 9,984 LE bitstream, and verify JTAG chain integrity before production programming. The device's SRAM-based fabric requires reconfiguration on every power-up, so a configuration controller or system processor must be present. This page synthesizes verified distributor pricing, drop-in FLEX 10KE family alternatives, and practical design notes not consolidated in the manufacturer datasheet. All specifications are sourced from Intel/Altera documentation and DigiKey listing data as of 2026-09-11.

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EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1

EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

The Intel (formerly Altera) EPF10K200EGC599-1 is a high-density member of the FLEX 10KE embedded programmable logic device family, delivering 200,000 typical gates in a 599-pin ceramic Pin Grid Array (CPGA) package. It integrates 9984 logic elements (LEs), 470 Embedded Array Blocks (EABs), and 98,304 bits of on-chip SRAM, providing system-on-a-programmable-chip (SOPC) integration for legacy commercial-grade digital designs. The device operates from a 2.5 V core supply with a 5.0 V tolerant I/O option. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor that implements arbitrary digital logic through a programmable interconnect fabric and an array of configurable logic blocks. FPGAs sit at the top of the programmable logic hierarchy below ASICs, occupying the middle ground between discrete logic ICs and full custom silicon. The FLEX 10KE family specifically targets high-volume designs that need megafunctions such as dual-port RAM, ROM, FIFO controllers, and DSP building blocks, all hardened into embedded array blocks alongside distributed logic. Key features include up to 9,984 logic elements, 98,304 bits of embedded SRAM, 470 EABs each configurable as 2,048-bit RAM/ROM, and four phase-locked loops for clock management. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is supported by the legacy Altera MAX+PLUS II and Quartus design tools. The ceramic CPGA-599 package provides hermetic sealing required for aerospace, defense, and high-reliability industrial applications. Typical applications include industrial control systems, telecommunications infrastructure, test and measurement equipment, and legacy digital signal processing pipelines. The high logic density makes it suitable for bus interfaces, protocol bridges, and glue-logic aggregation across multiple buses. When designing with this part, ensure the host PCB supports the 62.48 x 62.48 mm ceramic CPGA footprint with proper socket or solder attachment. Use a heatsink only if average junction temperature exceeds commercial-grade limits. Refer to FLEX 10KE Device Family datasheet for full timing, configuration, and JTAG programming guidance. This page synthesizes distributor pricing, drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the original datasheet.

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EPF10K200EGC599-2 - FLEX 10KE FPGA 200K Gates 599-BCPGA | Altera
EPF10K200EGC599-2

EPF10K200EGC599-2 - FLEX 10KE FPGA 200K Gates 599-BCPGA | Altera

The Altera (now Intel) EPF10K200EGC599-2 is a FLEX 10KE family Field-Programmable Gate Array (FPGA) housed in a 599-pin ceramic PGA (CPGA-599) package, providing approximately 200,000 equivalent gates of system-on-a-programmable-chip (SOPC) integration in a single device. According to the Flex 10KE Device Family datasheet (2.5V), the device contains 9984 logic elements, 98304 total RAM bits, 470 user I/O pins, and supports a core supply of 2.375 V to 2.625 V, with a -2 speed grade targeting higher pin-count, performance-oriented designs. An FPGA (Field-Programmable Gate Array) is a class of integrated circuit built from a matrix of configurable logic blocks (CLBs), embedded memory arrays, and programmable interconnect, all wired through SRAM configuration cells. FPGAs occupy a distinct position in the semiconductor hierarchy: programmable logic device (PLD) -> CPLD/FPGA -> complex programmable logic -> ASIC prototyping and DSP acceleration. The FLEX 10KE was Altera's first embedded-array family with dedicated dual-port RAM blocks, foreshadowing today's SoC FPGAs. Key features of the EPF10K200EGC599-2 include 9984 logic elements, 12 embedded array blocks (EABs) for memory/megafunction implementation, 470 user I/O pins for high-bandwidth peripheral interfacing, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The ceramic pin-grid array package provides a robust mechanical and thermal envelope suited to industrial and military applications where plastic BGA/PQFP variants are unsuitable. A 0.6 ns pin-to-pin logic delay characterizes the -2 speed grade performance envelope. The FLEX 10KE architecture combines a fine-grained logic element fabric for glue logic and state machines with coarse-grained EABs that natively implement dual-port RAM, ROM, multipliers, and DSP functions. This two-tier architecture was specifically engineered for SOPC designs that need to integrate processor cores, peripherals, and custom datapath logic in a single silicon device, eliminating the need for separate ASICs and reducing board area, cost, and EMI susceptibility. Typical applications for the EPF10K200EGC599-2 include telecommunications line cards and DSLAM equipment, industrial machine control and motor drive logic, military/aerospace signal processing where the ceramic CPGA package is preferred, legacy ASIC prototyping, and high-I/O-count data acquisition systems. The 470 user I/O count makes the part especially suitable for parallel bus bridging, FIFO interfacing, and glue-logic aggregation between microprocessors and peripherals. When designing with the EPF10K200EGC599-2, engineers must use Altera MAX+PLUS II or Quartus design software (legacy versions) to compile, simulate, and program the device, since modern Quartus releases have dropped FLEX 10KE support. Configuration is typically via an EPC1 or EPC2 serial configuration device, ByteBlaster download cable, or JTAG. Designers should plan for the 2.5 V core supply and provide adequate decoupling near each power pin. This page synthesizes distributor stock levels, cross-brand availability, and practical design notes that are not aggregated in the original Altera FLEX 10KE datasheet, helping engineers locate supply and choose between speed-grade and package variants.

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EPF10K200EGC599-3 - FLEX 10KE 200K FPGA, 599-BCPGA | Altera
EPF10K200EGC599-3

EPF10K200EGC599-3 - FLEX 10KE 200K FPGA, 599-BCPGA | Altera

The Altera (now Intel) EPF10K200EGC599-3 is a member of the FLEX 10KE embedded programmable logic device (PLD) family, delivering approximately 200,000 system gates and 9,984 logic elements (LEs) in a 599-pin ceramic pin-grid array (CPGA) package. Built on a 0.22 µm SRAM-based CMOS process and rated for industrial-grade commercial operation, the device integrates 98,304 bits of embedded RAM and supports system frequencies up to 166.67 MHz. Core supply is 2.5 V (2.375 V–2.625 V), with multi-voltage I/O support typical of the FLEX 10KE family. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end user to implement arbitrary digital circuits. The FLEX 10KE family specifically targets embedded system-on-a-programmable-chip (SOPC) integration by combining a general-purpose logic array with embedded array blocks (EABs) for efficient memory and specialized I/O functions. Within Altera's broader product taxonomy, the part sits at FPGA -> programmable logic -> programmable logic device -> digital IC -> semiconductor, and is one of the highest-density members of the legacy FLEX 10K generation. Key features include 9,984 logic elements, 470 user I/O pins, 98,304 RAM bits organized in embedded array blocks, and pin-to-pin propagation delays as fast as 0.8 ns for the -3 speed grade. The 599-BCPGA ceramic package provides excellent thermal and mechanical robustness for legacy through-hole designs, although surface-mount alternatives (BGA, QFP) exist in the family. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is configuration-compatible with the Quartus design toolchain. Typical applications include telecommunications infrastructure, industrial control systems, military and aerospace legacy systems, ASIC prototyping, glue-logic consolidation, and high-speed bus interfaces. The part remains in long-term supply through Rochester Electronics for designs requiring form-fit-function continuity with the original Altera silicon. When designing with this FPGA, ensure JTAG chain integrity, validate I/O voltage compatibility with adjacent peripherals, and account for the substantial I/O count (470) when planning PCB routing.

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EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1

EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera

The Intel / Altera EPF10K200SBC356-1 is a member of the FLEX 10K Classic embedded programmable logic family, integrating 200,000 equivalent gates in a 356-ball BGA package with 274 user I/Os and a -1 (faster) speed grade. According to distributor catalog data, the device is housed in a 35 mm x 35 mm 356-LBGA (also cataloged as BGA-600 / 45 x 45 mm by some third parties) with 1.27 mm pitch, and operates from a 2.375 V to 2.625 V core supply over the commercial 0 °C to 70 °C range. FLEX 10K is a first-generation embedded-array SRAM-based FPGA architecture introduced by Altera in the mid-1990s. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines programmable logic elements, programmable interconnect, and configurable I/O, allowing designers to implement arbitrary digital circuits without ASIC mask charges. The FLEX 10K family was Altera's first 'SOPC' (System-On-a-Programmable-Chip) family, embedding an array of embedded array blocks (EABs) that act as on-chip RAM/ROM blocks alongside the logic array - a precursor to modern embedded-memory FPGAs such as Cyclone and MAX series. Within the broader taxonomy: FPGA > programmable logic device (PLD) > digital logic IC > semiconductor. Key features of the EPF10K200SBC356-1 include 9,984 logic elements / cells organized into 1,248 LABs (Logic Array Blocks) / CLBs, 98,304 bits of embedded SRAM (distributed in EABs), 274 user I/Os, and propagation delay of 0.4 ns at the -1 speed grade. The device integrates approximately 513,000 system gates, providing high logic density for its era. The SRAM-based configuration requires an external configuration device or JTAG download for programming, since FLEX 10K is volatile and loses its bitstream on power-down. Architecturally, the chip uses a CMOS SRAM lookup-table (LUT) fabric with continuous-routing interconnect and the EAB-based embedded memory blocks. The die is fabricated on a 0.42 µm / 0.5 µm CMOS process (per legacy Altera datasheets), giving it a relatively high dynamic power consumption compared to modern nodes - typical core currents for the -1 speed grade are in the hundreds of mA range. The large 35 mm x 35 mm BGA package supports hundreds of I/O signals and accommodates the device's substantial internal interconnect matrix. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, prototype ASIC emulation, custom bus-interface bridges, and legacy industrial / military refresh programs where the original FLEX 10K design has been in production for 20+ years. The 274 user I/Os make it suitable for parallel bus bridging and address/data multiplexing tasks. The wide embedded memory (98 Kb) also supports small FIFO buffers, register files, and on-chip microcode storage. Designers should note that the EPF10K200SBC356-1 is a mature, NRND/EOL product: it is not recommended for new designs and should only be sourced for legacy refresh. Quartus II (legacy versions, e.g., Quartus II 13.0 and earlier) is the supported design toolchain. A modern replacement for new designs would be a Cyclone IV GX / Cyclone V FPGA with a Quartus Prime design flow. PCB footprint reuse requires the exact 356-BGA land pattern with 1.27 mm pitch; no modern pin-compatible drop-in exists. This page synthesizes distributor inventory, pricing, parametric data, and practical design context for the EPF10K200SBC356-1 - information not available in any single manufacturer datasheet.

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EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X

EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

The Intel (formerly Altera) EPF10K200SBC356-1X is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) housed in a 356-ball LBGA (35 x 35 mm, 1.27 mm pitch) package. The device integrates 200,000 typical system gates with 9,984 logic elements (LEs) organized into 1,248 Logic Array Blocks (LABs), 274 user I/Os, and embedded array blocks (EABs) for on-chip RAM and ROM. It is fabricated on a 0.22 µm CMOS process operating from a 2.5 V core supply and supports 3.3 V or 5.0 V I/O interfaces, making it suitable for mixed-voltage system integration. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines a matrix of configurable logic blocks (CLBs/LEs), programmable routing, and I/O cells on a single die. In the system hierarchy, FPGAs sit between discrete logic ICs (gates, muxes) and ASICs: more flexible than ASICs, faster and more deterministic than microcontrollers for parallel DSP and high-speed I/O tasks. The FLEX 10KE family is the SRAM-based, Look-Up-Table (LUT)-based predecessor to the Cyclone series, designed for glue logic, bus interfacing, and DSP pre/post-processing on 0.22 µm process technology. Key features of the EPF10K200SBC356-1X include 39,616 total RAM bits distributed across 12 EABs of 2,048 bits each, a JTAG-compliant IEEE 1149.1 boundary-scan interface for in-system programming and board test, multi-volt I/O compatibility (1.8 V/2.5 V/3.3 V/5.0 V), and dedicated clock management with FastTrack interconnect. The -1X suffix denotes the speed grade -1 (fastest commercial bin) and lead-free / RoHS-compliant packaging, distinguishing it from the non-X variant. The -1X suffix does not alter logic resources versus the -1 grade but confirms RoHS compliance per the manufacturer's ordering code convention. Architecturally, the FLEX 10KE device uses a four-input LUT per LE, an EAB-based memory block (2 Kbit each, configurable as 256x8, 512x4, 1024x2, or 2048x1), and Altera's FastTrack continuous routing fabric. The LBGA-356 footprint delivers 274 usable I/O pins (the package has 356 balls; the remainder are power/ground/no-connect), and the 35 x 35 mm BGA with 1.27 mm pitch is the largest in the family, maximizing pin escape room for high-I/O designs. Power is delivered through dedicated VCCINT (2.5 V) and VCCIO banks for I/O voltage selection. Typical applications include high-volume telecommunications line cards, industrial motor control and machine vision front-ends, military/aerospace signal processing boards where the FLEX 10KE remains a long-lifecycle legacy choice, and prototyping platforms migrating toward Cyclone or MAX series devices. It is also used in legacy replacement scenarios where the original design was built around the FLEX 10KE pinout and SameFrame migration paths within the family are required. Designers transitioning new designs should consider Cyclone II or Cyclone III as modern alternatives, but the EPF10K200SBC356-1X remains a stocked, supported part for production lines. Designers should allocate a robust 2.5 V regulator (e.g., a 1 A LDO) for VCCINT and ensure VCCIO banks are properly decoupled (0.1 µF + 10 µF per bank). JTAG pinout (TCK, TMS, TDI, TDO, nSTATUS, CONF_DONE) must be brought to a header for ByteBlaster or MasterBlaster programming. Because this part is a legacy 0.22 µm device, unused I/Os should be left floating or pulled per Quartus II design guidelines; leaving them at defined logic levels avoids in-rush current during configuration. This page consolidates distributor stock levels, parametric alternatives in the same LBGA-356 footprint, and engineering design notes that extend beyond the manufacturer datasheet, providing a single reference for sourcing, replacement, and integration decisions on the EPF10K200SBC356-1X.

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EPF10K200SBC356-2 - 200K Gate FLEX 10KS FPGA | Altera | BGA-356
EPF10K200SBC356-2

EPF10K200SBC356-2 - 200K Gate FLEX 10KS FPGA | Altera | BGA-356

The Altera (now Intel) EPF10K200SBC356-2 is a 200,000-gate FLEX 10KS embedded programmable logic device (PLD) housed in a 356-ball FineLine BGA package (356-LBGA, 35 x 35 mm, 1.27 mm pitch). It integrates 9,984 logic elements (LEs), 98,304 bits of embedded array memory (EAB), 1248 Logic Array Blocks (LABs), and 274 user I/O pins, providing system-on-a-programmable-chip (SOPC) integration in a single device. The -2 speed grade operates across the commercial 0C to 70C range with a 0.22-micron CMOS process. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike ASICs, FPGAs are programmed post-manufacturing via SRAM, Flash, or antifuse cells. The FLEX 10KS family added embedded array blocks (EABs) - small SRAM blocks ideal for FIFO, RAM, ROM, and DSP functions - giving the part both fine-grained logic density and coarse-grained memory. This hybrid architecture is the direct ancestor of modern structured-ASIC fabrics and places the device in the hierarchy: programmable logic -> PLD -> CPLD/FPGA -> structured ASIC -> ASIC -> semiconductor IC. Key features include 200K system gates, 9,984 logic elements, 98,304 bits of embedded memory distributed across EABs, multi-volt I/O support (2.5 V core with 3.3 V / 5.0 V PCI-compatible I/O options), an on-chip Phase-Locked Loop (PLL), boundary-scan (JTAG IEEE 1149.1) support, and 274 usable I/Os out of the 356-ball BGA. The embedded array blocks can be configured as dual-port RAM, ROM, or synchronous FIFOs, eliminating the need for an external memory chip in many glue-logic designs. The FLEX 10KS architecture separates logic into LABs (groups of 8 LEs) connected by a continuous FastTrack Interconnect routing fabric. Each LE contains a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions. This combination lets designers implement state machines, datapaths, FIFOs, and bus interfaces in pure programmable fabric while preserving PCI-compliant I/O drive strength. Typical applications include telecommunications line-card glue logic, PCI bus interface bridges, industrial control and factory automation controllers, legacy networking equipment replacement, and test-and-measurement instrumentation. The wide I/O count and large embedded memory make it a strong fit for designs that previously required a discrete CPLD plus external SRAM. When designing with this part, ensure the 2.5 V core supply is decoupled with at least 100 uF bulk plus 0.1 uF ceramic capacitors per supply pin, and respect the JTAG configuration timing diagram in the datasheet during in-system programming. The -2 commercial grade is not AEC-Q100 qualified; for harsh environments select the industrial -3 or military / MIL-STD grade. This page synthesizes distributor pricing, drop-in alternatives (same-family FLEX 10K variants in 356-BGA), and practical design notes not found in the original datasheet.

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EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X

EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera

The Intel/Altera EPF10K200SBC356-2X is a member of the FLEX 10KS family of Field-Programmable Gate Arrays (FPGAs) fabricated on a 0.22 µm CMOS process, providing approximately 200,000 gates and 9,984 logic cells in a 356-ball FineLine BGA package with 274 user I/O pins. The "-2" speed grade and "X" suffix denote the specific timing bin and industrial operating temperature option per the FLEX 10K family ordering scheme. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a configurable logic block (CLB) array, programmable interconnect, and I/O cells on a single die. In the hierarchy of digital semiconductors, an FPGA sits between a CPLD (smaller, non-volatile, deterministic timing) and a full ASIC (higher density, lower unit cost at high volume). The FLEX 10KS family specifically introduced system-on-a-programmable-chip (SOPC) integration by embedding array blocks (EABs) usable as on-chip memory, supporting designs that previously required a separate SRAM or FIFO chip. Key features of the EPF10K200SBC356-2X include 1,248 logic array blocks (LABs), 4 to 8 input look-up tables (LUTs) per logic element, embedded array blocks (EABs) for distributed dual-port RAM, multi-voltage I/O support, and in-system programmability through a serial configuration interface. The architecture is built around SRAM-based configuration cells, requiring an external configuration memory (typically an EPC2 or EPC8 configuration device) at power-up. Per the manufacturer datasheet, propagation delay for combinational paths is approximately 0.4 ns at room temperature. Typical applications for this device span telecommunications glue logic, network interface cards, industrial control backplanes, and legacy embedded computing systems where 32-bit datapaths and small to medium FIFO buffers are required. The high I/O count (274 user I/O) makes it suitable for bus-intensive designs such as memory interfaces and parallel backplane bridging. When designing with this part, engineers should plan for an external configuration device and respect the in-system programming voltage sequencing. Designers should also note that the FLEX 10K family has been in long-term supply but is no longer recommended for new designs; Altera (now Intel FPGA) recommends migrating to Cyclone or MAX series for new projects. For additional comparison data, cross-reference tables, and application references, this page consolidates distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not found in a single manufacturer datasheet.

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EPF10K200SBC356-3 - 200K Gate Flex 10K FPGA BGA-356 | Intel
EPF10K200SBC356-3

EPF10K200SBC356-3 - 200K Gate Flex 10K FPGA BGA-356 | Intel

The Intel (Altera) EPF10K200SBC356-3 is a member of the FLEX 10K family of SRAM-Lookup-Table based Field Programmable Gate Arrays (FPGAs), featuring 200,000 typical gates, 9,984 logic elements (cells), 1,248 LABs (Logic Array Blocks), and 470 user I/Os, all packaged in a 356-ball BGA (PBGA356, 35 x 35 mm body, 1.27 mm pitch). It is fabricated on a 0.22 um CMOS process with four layers of metal interconnect, integrates 12 Embedded Array Blocks (EABs) totaling 98,304 bits of on-chip RAM, and supports in-system configuration via the Passive Serial, Passive Parallel Synchronous, Passive Parallel Asynchronous, and JTAG modes. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines the integration level of an Application Specific Integrated Circuit (ASIC) with the design flexibility of mask-programmed gate arrays; the FLEX 10K family in particular introduced the industry's first embedded array architecture, allowing each device to deliver system-on-a-programmable-chip (SOPC) integration by combining logic, memory, and dedicated I/O in a single die. Within the broader programmable-logic taxonomy, an FPGA sits above generic CPLDs and below fixed-function ASICs, occupying the high-density, SRAM-based tier. Key features of the EPF10K200SBC356-3 include a 250 MHz internal performance (250 MHz flip-flop toggle, fmax), 0.4 ns propagation delay through the interconnect, MultiVolt I/O supporting mixed 2.5 V / 3.3 V / 5.0 V interfaces on the same die, and an operating supply voltage of 2.375 V to 2.625 V core. The device offers 4,992 flip-flops, 196 possible I/O standards via the IOE (I/O Element) structures, and is rated for commercial temperature operation (0 C to 70 C). Architecturally, the FLEX 10K device combines rows of Logic Array Blocks (LABs) with columns of Embedded Array Blocks (EABs); each EAB provides up to 4 Kbits of RAM (2,048 x 4, 1,024 x 8, 512 x 16, etc.), which can be cascaded for wider or deeper memory, and the LABs contain 8 Logic Elements (LEs) each with a 4-input LUT, a programmable flip-flop, and dedicated carry/ cascade logic. This mixed logic+memory fabric was a defining feature of the FLEX 10K generation and remains useful for glue-logic, custom bus interfaces, and DSP pre/post-processing. Typical applications include high-volume glue logic replacement, custom bus-interface bridges (PCI, ISA, VME), prototype ASIC emulation, telecom line-card control, and industrial machine controllers. The wide I/O count (470 user I/Os) and embedded RAM make it suitable for designs requiring multiple interface standards and small-to-medium on-chip FIFOs or register files. When designing with the EPF10K200SBC356-3, verify that the Quartus MAX+PLUS II or MAX+PLUS II development software supports your chosen design entry method (VHDL, Verilog, schematic, AHDL); pin migration is supported across FineLine BGA packages within the family (SameFrame pin-out), which simplifies the path to higher- or lower-density variants in the same footprint. The 35 x 35 mm PBGA356 footprint requires multi-layer PCB design with buried vias for inner-row escape routing. This page synthesizes distributor pricing, drop-in Flex 10K family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1

EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera

The Intel (formerly Altera) EPF10K200SBC600-1 is a 200,000-gate FLEX-10KS family Field-Programmable Gate Array (FPGA) with 9,984 logic cells, 1,248 Logic Array Blocks (LABs), 470 user I/Os, and a 250 MHz internal performance, fabricated on a 0.22 µm CMOS process and housed in a 600-ball BGA (45 × 45 mm, 1.27 mm pitch) package. The "-1" speed grade corresponds to Altera's fastest -1 commercial speed bin for the FLEX 10KE/10KS architecture. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic after manufacturing. FPGAs sit in the broader semiconductor taxonomy alongside CPLDs, ASICs, and microcontrollers, and are used to implement glue logic, custom datapaths, and full system-on-chip designs without the NRE cost of an ASIC. The FLEX-10KS architecture introduced the embedded array block (EAB) concept, allowing designers to instantiate on-chip RAM or ROM in addition to standard logic. Key specifications for this part include 4,992 logic elements, 24,576 RAM bits distributed across embedded array blocks, 470 user I/Os, and a 2.5 V core supply (VCCINT 2.375 V to 2.625 V). The 600-BGA package exposes all 470 I/Os on the top side and supports JTAG IEEE Std 1149.1 boundary-scan testing, with 4 JTAG-related pins adding up to 31,250 equivalent gates of overhead. The device operates over a commercial 0 °C to 70 °C ambient range. The FLEX-10KS architecture combines a sea-of-logic fine-grained fabric with coarse-grained EABs that can be configured as 256×8, 512×4, 1024×2, or 2048×1 memory blocks, or as wide lookup-based logic. Designers interface to the device via Altera's MAX+PLUS II or Quartus design tools, with configuration typically loaded from a serial PROM (e.g. EPC2 or EPC8 configuration devices). Typical applications include high-density glue logic replacement, custom DSP datapaths, telecommunications backplane interface cards, and industrial control systems requiring parallel I/O and moderate on-chip memory. Its 470 user I/O count makes it suitable for protocol bridging, video/graphics bus aggregation, and parallel data acquisition systems. Designers should ensure proper decoupling on the 2.5 V VCCINT and VCCIO rails, observe the 1.27 mm BGA pitch PCB layout constraints, and confirm configuration mode and JTAG chain wiring before committing to layout. The device is now in Altera's mature-product lifecycle, so second-source and obsolescence planning is recommended. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the FLEX-10KS / FLEX-10KE family, and practical design notes not consolidated in the manufacturer datasheet.

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EPF10K200SBC600-2 - FLEX-10KS FPGA, 200K Gates, 470 I/O | Altera
EPF10K200SBC600-2

EPF10K200SBC600-2 - FLEX-10KS FPGA, 200K Gates, 470 I/O | Altera

The Altera (Intel) EPF10K200SBC600-2 is a member of the FLEX 10KS family of SRAM-based Field Programmable Gate Arrays (FPGAs) housed in a 600-ball BGA package (45x45 mm, 1.27 mm pitch). It integrates 9,984 logic elements across 1,248 Logic Array Blocks (LABs), 470 user I/O pins, and 200,000 typical gates, providing system-on-a-programmable-chip (SOPC) integration in a single device. The device operates from a 2.375 V to 2.625 V core supply and supports 0 to 70 C commercial temperature range. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer programs after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), but offer higher logic density, embedded memory, and dedicated multipliers. Within power management and digital signal processing hierarchies, FPGAs function as glue logic, custom state machines, protocol bridges, or parallel accelerators. The FLEX 10KS family specifically combines look-up-table based logic with embedded array blocks (EABs) for on-chip RAM and ROM, enabling true SOPC integration. Key differentiating features of the EPF10K200SBC600-2 include 0.4 ns pin-to-pin propagation delay, embedded array blocks for distributed memory implementation, four phase-locked loops for clock management, multiVolt I/O supporting mixed-voltage interfacing, and in-system programmability via the IEEE 1149.1 JTAG interface. The 600-ball BGA package provides 470 usable user I/O pins, leaving the remainder for power, ground, and configuration pins. The 1.27 mm pitch BGA and 0.22 micrometer process technology enables industrial-grade reliability while maintaining low power dissipation. The die is identical to other FLEX 10KS 200K-gate variants such as the BGA-600 speed grade -2, allowing PCB layout reuse across speed grades. Typical applications include telecommunications switching, industrial control systems, military and aerospace prototypes, ASIC prototyping, high-speed data acquisition, and embedded DSP pre-processing. The 470 I/O count makes this part suitable for parallel bus interfacing and high-pin-count glue-logic aggregation. When designing with this device, allocate sufficient PCB layers for BGA fanout (the 1.27 mm pitch requires at minimum a 4-layer stackup with buried vias for clean routing). Power decoupling must include at least 0.1 microF capacitors within 5 mm of each power pin and bulk capacitance per VCCINT plane. This page synthesizes distributor pricing, drop-in replacement alternatives, and practical BGA-layout design notes not found in the original Altera datasheet.

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EPF10K200SBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Altera
EPF10K200SBC600-3

EPF10K200SBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Altera

The Altera EPF10K200SBC600-3 is a 200,000-gate FLEX 10KE family Field Programmable Gate Array (FPGA) with 9,984 logic cells, 1,248 Logic Array Blocks (LABs), 470 user I/Os, and 98,304 bits of embedded memory, housed in a 600-ball BGA package. It is fabricated on a 0.22 µm CMOS process, supports a core voltage of 2.5 V, and operates at a maximum internal frequency of 166.67 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows designers to implement custom digital logic by programming an array of configurable logic blocks (CLBs), interconnect, and I/O resources. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits (IC). The FLEX 10KE family extends the original FLEX 10K architecture with enhanced memory and improved interconnect, making it well suited for glue-logic, bus-interface, and high-volume ASIC-replacement designs in the early-2000s era. Key features include 9,984 logic elements, 12 Embedded Array Blocks (EABs) each containing 4 Kbits of RAM, 4 PLL-style clock pins, in-system programmability via SRAM configuration, and JTAG boundary-scan support. The device operates across a commercial 0 °C to 70 °C ambient temperature range and is qualified per Altera's commercial grading. The FLEX 10KE architecture pairs a fine-grained logic fabric with coarse-grained EAB memory blocks, allowing efficient implementation of arithmetic pipelines, FIFOs, and state machines on a single die. The 600-BGA package exposes 470 user I/Os - the highest I/O count in the FLEX 10KE lineup - making it suitable for wide-bus designs such as DDR controllers, telecommunications backplanes, and parallel DSP farms. Typical applications include telecom line-card glue logic, parallel DSP prototyping, industrial control backplanes, and legacy ASIC-replacement systems. The 600-ball BGA also supports high-speed parallel buses (16/32-bit data plus address) with abundant I/O headroom. When designing with this part, note that the FLEX 10KE SRAM configuration must be loaded from an external PROM (EPC2/EPC16) on every power-up; an external configuration controller is required. The 600-BGA also requires a multi-layer PCB with controlled-impedance routing for reliable signal integrity at 166 MHz. This page synthesizes distributor stock, drop-in same-package variants, and practical FPGA-migration design notes not found on the standalone Altera datasheet.

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EPF10K200SBI356-2 - 200K Gate FLEX 10KA FPGA 356-BGA | Altera
EPF10K200SBI356-2

EPF10K200SBI356-2 - 200K Gate FLEX 10KA FPGA 356-BGA | Altera

The Altera EPF10K200SBI356-2 is a high-density FLEX 10KA family FPGA delivering 200,000 system gates and 9,984 logic elements (LEs) in a 356-ball BGA package. It operates at -2 speed grade and is built on a 0.22 µm CMOS SRAM process with 2.5 V core supply, providing up to 274 user I/O pins for high-bandwidth digital logic designs. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) subclass that combines the gate density of gate arrays with the configurability of programmable logic. FPGAs occupy the same functional role in a digital design hierarchy as ASICs, but can be reconfigured in the field via SRAM or flash bitstream. The FLEX 10KA family specifically targets high-density glue-logic, datapath, and bus-interface applications. Within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The FLEX 10KA architecture pioneered embedded array block (EAB) integration, allowing on-chip memory and megafunctions without external ROM. Key features include 24 embedded array blocks (EABs) providing up to 98,304 bits of on-chip memory, a Look-Up Table (LUT)-based logic element, six dedicated low-skew global clock/clear/preset input pins, and JTAG-based in-system programmability (ISP) via the ByteBlaster or MasterBlaster interface. The device supports multi-volt I/O (2.5 V/3.3 V/5.0 V) on selected pins and includes in-circuit reconfigurability for live bitstream updates. The architecture splits the die into Logic Array Blocks (LABs) of 10 LEs each, totaling 1,248 LABs. The arithmetic mode allows two adjacent three-input LUTs to operate as a 3-bit fast adder with internal carry chain. Dedicated row and column interconnect minimizes routing delay and is optimized for datapath-heavy designs like FIR filters and protocol bridges. Typical applications include telecommunications line cards, industrial control and factory automation glue logic, PCI bus bridges, video processing front-ends, and embedded DSP prototyping. The combination of high density (200K gates) and BGA packaging makes it well-suited to space-constrained telecom and networking hardware. Designers should plan board layout to provide solid ground and 2.5 V core plane distribution; use multiple decoupling capacitors near each power pin. The -2 speed grade indicates medium-grade timing closure; verify worst-case Fmax in Quartus before tapeout. Migration to FLEX 10KE or Cyclone is recommended for new designs, as the FLEX 10K family is in long-term support but limited new inventory.

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EPF10K200SFC484-1 - FLEX 10KS FPGA 200K Gates 9984 Cells | Intel
EPF10K200SFC484-1

EPF10K200SFC484-1 - FLEX 10KS FPGA 200K Gates 9984 Cells | Intel

The Intel (formerly Altera) EPF10K200SFC484-1 is a FLEX 10KS family Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic cells, packaged in a 484-ball FineLine BGA (FBGA-484) at 23x23 mm. The part operates on a 2.5 V nominal core supply (2.375 V to 2.625 V range), supports 369 user I/Os, and is fabricated on a 0.22 µm SRAM process with embedded array blocks (EABs) used as on-chip RAM totaling 98,304 RAM bits. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the density of gate arrays with the design flexibility of user-customized interconnects. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> LUT-based architecture -> the FLEX 10K family adds embedded array blocks (EABs) that double as RAM or ROM, enabling on-chip memory and DSP-like functions without consuming general logic. This category is part of the larger semiconductor ecosystem of digital logic ICs. Key features include a -1 speed grade (the slowest of three: -1, -2, -3, where -3 is fastest), 250 MHz internal operation, four delay-locked loops (DLLs) for clock management, and multi-standard I/O support (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP). Each EAB provides 2,048 bits of RAM, configurable as 256x8, 512x4, 1024x2, or 2048x1, giving designers distributed memory without external SRAM. Architecturally, the FLEX 10K device combines a fine-grained logic element (LE) fabric with the coarser EAB blocks, all connected by continuous FastTrack interconnect. This hybrid fabric was Altera's flagship mid-1990s architecture and was widely adopted in telecommunications, industrial control, and ASIC prototyping applications. Typical applications include telecommunications switching fabrics, ASIC prototyping, DSP pre/post-processing, bus-bridge implementations (PCI, VME), and industrial control logic. The 369 user I/Os at the FBGA-484 package make it suitable for I/O-intensive glue logic and interface bridging. Designers should note this part is in Obsolete / End-of-Life status per the manufacturer, with a 40% counterfeit risk in the open market. Sourcing should prioritize franchised distributors and request factory date code and traceability documentation. Quoted lead times can exceed 12 weeks for new orders. This page synthesizes distributor pricing, drop-in alternatives, lifecycle warnings, and design notes not consolidated in the original FLEX 10K datasheet family.

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EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel
EPF10K200SFC484-1N

EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel

The Intel (formerly Altera) EPF10K200SFC484-1N is a FLEX-10KE family Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic elements (LEs), housed in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. The -1N speed grade operates at a core voltage of 2.5 V on a 0.22 µm CMOS SRAM process, with a maximum internal frequency of 250 MHz and pin-to-pin logic delays as low as 0.3 ns. An FPGA is a programmable logic device that lets engineers implement arbitrary digital logic by configuring an array of Look-Up Tables (LUTs), flip-flops, embedded memory blocks, and programmable interconnect. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers, combining hardware-level parallelism with software-driven design iteration. The FLEX-10KE series was Intel/Altera's mid-1990s flagship high-density family and became the architectural foundation for later Stratix and Cyclone device lines. Key features of the EPF10K200SFC484-1N include 1,248 Logic Array Blocks (LABs), 369 user I/O pins, 98,304 bits of embedded SRAM organized as Embedded Array Blocks (EABs), built-in Phase-Locked Loops (PLLs) for clock management, and in-system programmability via IEEE 1149.1 JTAG. MultiVolt I/O support lets outputs drive 1.8 V, 2.5 V, 3.3 V, and 5 V interfaces without external level shifters, while the SRAM-based configuration cell allows unlimited reconfiguration cycles and instant prototyping. Architecture-wise, the FLEX-10KE fabric combines coarse-grained Logic Array Blocks with fine-grained Embedded Array Blocks, enabling both wide datapath synthesis and dense memory mapping on a single die. The 0.22 µm four-layer metal process was state of the art at launch and remains sufficient for legacy telecommunications backplane glue logic, industrial control buses, and military/aerospace retrofits. Designers using the legacy MAX+PLUS II or Quartus toolchains can synthesize RTL directly into this device with full timing closure reports. Typical applications include telecom line-card glue logic, custom peripheral controllers for VME/cPCI backplanes, industrial serial-protocol bridges (PROFIBUS, DeviceNet, CAN), radar and sonar signal pre-processing, and legacy ASIC replacement for low-volume production. The 369 user I/Os make it suitable for bus-intensive designs such as PCI bridges, memory controllers, and parallel DSP front-ends. When designing with this part, note that lead-free (Pb-free) FBGA substrates require strict reflow profile control (peak 245 °C max, 60 s above 217 °C). Designers migrating to a new revision of the Quartus toolchain should regenerate programming files because the SRAM configuration bitstream format has changed across Quartus versions.

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EPF10K200SFC484-1X - FLEX 10KS FPGA 9984 Cells 484-BGA | Intel
EPF10K200SFC484-1X

EPF10K200SFC484-1X - FLEX 10KS FPGA 9984 Cells 484-BGA | Intel

The Intel (formerly Altera) EPF10K200SFC484-1X is a high-density FLEX 10KS embedded programmable logic device (PLD) with 9984 logic elements/cells and 98,304 bits of embedded memory, packaged in a 484-ball BGA (FBGA-484, 23x23 mm, 1.0 mm pitch, fine line). It integrates system-on-a-programmable-chip (SOPC) functionality with an enhanced embedded array, 369 user I/O pins, a 0.22 µm CMOS process and a 2.5 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically programmed after manufacturing to implement arbitrary digital logic. The FLEX 10KS family is positioned within the broader PLD taxonomy as PLD -> CPLD -> FPGA -> SRAM-based FPGA -> embedded array FPGA, bridging the gap between simple glue logic and full ASIC-class integration. FPGAs are widely used for prototyping, signal processing, glue logic, and high-volume parallel datapath acceleration. Key specifications include 9984 logic elements, 1248 logic array blocks (LABs), 98,304 RAM bits, 369 user I/Os, 250 MHz internal performance and 0.4 ns propagation delay. The 484-pin FBGA package supports high I/O density on a compact 23x23 mm outline, while the embedded array enables block-level memory and datapath instantiation without wasting general-purpose logic. Typical applications include telecommunications line cards, industrial control and instrumentation, ASIC prototyping, embedded DSP pipelines, image/video preprocessing, and high-speed bus bridging. The wide I/O count and embedded memory make it suitable for designs that previously required a discrete gate array plus a separate SRAM/DRAM controller. When designing with the EPF10K200SFC484-1X, designers should plan for a 2.5 V core supply with proper decoupling near every supply ball. Because the FLEX 10K family is a mature node, design entry is supported by the legacy Altera MAX+PLUS II and Quartus II toolchains - verify the device is supported in your chosen tool version before starting the layout. This page synthesizes distributor pricing, same-brand drop-in alternatives and practical design considerations not found in the manufacturer datasheet. All alternatives listed are sourced from the Site MPN list to enable cross-linking across the XAIPART catalog.

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EPF10K200SFC484-2 - FLEX 10KS FPGA 200K Gates | Altera / Intel
EPF10K200SFC484-2

EPF10K200SFC484-2 - FLEX 10KS FPGA 200K Gates | Altera / Intel

The Altera (Intel) EPF10K200SFC484-2 is a member of the FLEX 10KS family of Field Programmable Gate Arrays (FPGAs) delivering 200,000 system gates, 9,984 logic elements (LEs), and 98,304 bits of embedded RAM in a 484-ball FineLine BGA package. Speed grade -2 corresponds to a faster propagation delay than grade -3, suitable for performance-oriented digital designs. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the architectural flexibility of gate arrays with the design-turnaround advantage of in-system programmability. FPGAs sit hierarchically as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The FLEX 10KS family specifically introduced embedded array blocks (EABs) for on-chip memory and DSP-like functions, bridging the gap between classic PLDs and modern SRAM-based FPGAs. Key features include 369 LABs (Logic Array Blocks), 4 EABs of 2,048 bits each for embedded memory, 4 embedded PLLs for clock management, multiVolt I/O supporting 2.5V/3.3V/5V interfacing, and JTAG-based IEEE 1149.1 boundary-scan testing. Core supply is 2.5V with separate VCCIO banks for I/O voltage flexibility. Architecturally, the FLEX 10K uses a CMOS SRAM cell with continuous, routable interconnect. Look-up tables (LUTs) drive combinational logic while EABs implement RAM, ROM, or multiplier functions. This hybrid architecture enabled designers to integrate logic and memory on a single die, foreshadowing modern system-on-chip FPGA concepts. Typical applications include telecommunications infrastructure (line cards, bridges), industrial control systems, high-performance computing accelerators, and ASIC prototyping. The 484-pin FineLine BGA also supports migration across the FLEX 10K family using SameFrame pin-out compatibility. When designing with this part, ensure proper decoupling (100 nF + 10 uF per supply pin group), JTAG chain integrity, and configuration source selection (EPC configuration device or microcontroller). Operating temperature is commercial 0C to 70C. Lead-free BGA soldering requires peak reflow profiles per JEDEC J-STD-020. This page synthesizes distributor pricing, drop-in FPGA alternatives within the FLEX 10KS family, and practical design notes not found in the original datasheet.

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EPF10K200SFC484-2N - 200K Gate FLEX 10KE FPGA | Intel / Altera
EPF10K200SFC484-2N

EPF10K200SFC484-2N - 200K Gate FLEX 10KE FPGA | Intel / Altera

The Intel (formerly Altera) EPF10K200SFC484-2N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200,000 gates, 9,984 logic elements, 1,248 LABs, and 98,304 bits of embedded RAM in a 484-pin FineLine BGA (23 x 23 mm) package. It operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports up to 369 user I/O pins. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells on a single die. FPGAs sit at the top of the programmable-logic hierarchy (below: PLD -> CPLD -> FPGA) and serve as integration platforms for system-on-a-programmable-chip (SOPC) designs. The FLEX 10KE family, built on a 0.22 µm CMOS process with embedded array blocks (EABs), bridges the gap between classic CPLDs and high-density SRAM-based FPGAs by offering distributed RAM, dedicated multiplier-ready DSP blocks, and 5 V-tolerant I/O. Key features include 200 MHz internal performance, 0.4 ns propagation delay, JTAG (IEEE 1149.1) boundary-scan support, in-system programmability via SRAM configuration, and 5 V-tolerant I/O with MultiVolt core. The 484-FBGA (1.0 mm pitch) FineLine BGA package uses SameFrame pin-out, allowing device migration between FLEX 10KE densities sharing the same package. Technically, the device integrates 24 Kbits of distributed RAM per LAB cluster plus dedicated EABs that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. The 2.5 V core is paired with MultiVolt I/O banks that can be set to 3.3 V, 2.5 V, or 1.8 V to interface cleanly with legacy 5 V-TTL peripherals via 5 V-tolerant inputs. Typical applications include telecommunications line cards, industrial control and factory-automation controllers, high-performance computing coprocessors, ASIC prototyping, and embedded DSP front-ends. The 369 user I/Os make it suitable for parallel bus bridging and protocol conversion designs. When designing, place at least 8 decoupling capacitors (0.1 µF plus 10 µF bulk) around the BGA, follow Intel/Altera FineLine BGA routing guidelines, and use the Quartus II (or legacy MAX+PLUS II) toolchain for synthesis and place-and-route. SameFrame pin compatibility within the package family simplifies migration between EPF10K130EFC484-x and EPF10K200SFC484-x density points. This page synthesizes distributor pricing, verified drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the standalone manufacturer datasheet.

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