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产品（39,000+)

EPF10K200SFC484-2X - FLEX 10K FPGA, 200K Gates, 484-BGA | Intel
EPF10K200SFC484-2X

EPF10K200SFC484-2X - FLEX 10K FPGA, 200K Gates, 484-BGA | Intel

The Intel (Altera) EPF10K200SFC484-2X is a high-density FLEX 10KS Field Programmable Gate Array (FPGA) with 200,000 typical gates, 9,984 logic elements (cells), and 98,304 RAM bits, housed in a 484-ball FineLine BGA package (23 x 23 mm, 1.0 mm pitch). It operates from a 2.375 V to 2.625 V core supply and supports 369 user I/O pins across the device boundary, making it one of the largest members of the legacy FLEX 10K family. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated memory blocks that can be re-programmed to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and the FLEX 10K family pioneered embedded array block (EAB) integration of SRAM memory with logic fabric - the conceptual ancestor of modern System-on-Chip FPGAs. The EPF10K200SFC484-2X therefore occupies the role of a glue-logic and co-processing accelerator in legacy industrial, telecom, and test-and-measurement systems. Key features include 1,248 Logic Array Blocks (LABs), 9,984 logic elements, four-phase on-chip PLL (where equipped in the family), built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std 1149.1-1990, and in-system programmability via SRAM configuration cells. The -2X speed grade offers approximately 250 MHz internal operation. The 5.0-V tolerant I/O bank supports PCI and other legacy bus signaling through level translation. The device utilizes a CMOS SRAM-based configuration cell, allowing unlimited re-programmability and rapid prototyping. Embedded Array Blocks (EABs) provide dedicated dual-port SRAM that can be configured as 256 x 8, 512 x 4, 1024 x 2, or 2048 x 1 memory blocks. Continuous FastTrack interconnect provides predictable routing delays across the device. Typical applications include industrial control systems, telecommunications infrastructure, ASIC prototyping, custom DSP pipelines, and legacy PCI / ISA bus interface designs where the device serves as a programmable bus controller or protocol bridge. The 369 user I/Os and large memory complement suit it to multi-channel data acquisition front-ends. Designers should plan for external configuration memory (EPC2 or compatible serial configuration device), multi-bank I/O voltage reference decoupling, and thermal management through the BGA thermal pad. The device is now mature (NRND/EOL) and supply is increasingly restricted to franchised distributors and authorized aftermarket channels such as Rochester Electronics. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet.

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EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
EPF10K200SFC484-3

EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera

The Intel (formerly Altera) EPF10K200SFC484-3 is a high-density FLEX-10KS family Field Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic cells across 1,248 Logic Array Blocks (LABs), housed in a 484-ball FineLine BGA package. It operates from a 2.375V to 2.625V core supply, supports 369 user I/Os, and is built on a 0.22 µm SRAM-lookup-table process with embedded array blocks (EABs) for on-chip memory and product-term logic. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be reprogrammed to implement arbitrary digital logic. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors: more flexible than ASICs, faster and more deterministic than microcontrollers for parallel datapath workloads. The FLEX-10KS family is Intel/Altera's classic high-volume SRAM FPGA family that pioneered the embedded array block (EAB) concept - small dual-port RAM blocks distributed throughout the fabric to eliminate external memory in glue-logic and datapath applications. Key features of the EPF10K200SFC484-3 include 1,248 LABs organized into rows and columns, 200K equivalent system gates, embedded array blocks for distributed SRAM and ROM, multi-voltage I/O support (3.3V, 5.0V PCI-compliant interfaces), four low-skew global clock networks, and JTAG-compliant IEEE 1149.1 boundary-scan test. The part is rated for the commercial temperature range and is offered in a 484-ball FineLine BGA (1.0 mm pitch, 23 mm × 23 mm body) suitable for high-density PCB designs. Architecturally, the device uses a four-input look-up table per logic element, hierarchical interconnect with FastTrack continuous routing, and embedded array blocks providing up to 40,960 bits of on-chip RAM. The EABs can be configured as single-port RAM, dual-port RAM, ROM, or product-term logic, enabling efficient implementation of FIFOs, look-up tables, and arithmetic functions. The 0.22 µm process yields a maximum internal operating frequency of approximately 166.67 MHz, suitable for mid-speed glue logic, bridge, and bus-interface applications. Typical applications include telecom line-card glue logic, industrial bus-bridging (PCI, ISA, VME), legacy ASIC prototyping, custom I/O expansion, and embedded control systems that require a deterministic hardware datapath. The FLEX-10KS family is well documented in reference designs, simplifying migration to the APEX and later Cyclone families. When designing with this FPGA, note that the device requires a separate configuration PROM (EPC2 or compatible) for SRAM-based configuration storage, or can be configured via JTAG during development. Power sequencing must follow Altera's FLEX 10K reference design, and unused I/O pins should be configured as inputs with weak pull-ups to prevent oscillation. This page synthesizes distributor pricing, FLEX-10KS family cross-references, and practical design notes not found in the standalone manufacturer datasheet.

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EPF10K200SFC484-3N - 200K Gates FLEX 10KE FPGA 484-BGA | Altera
EPF10K200SFC484-3N

EPF10K200SFC484-3N - 200K Gates FLEX 10KE FPGA 484-BGA | Altera

The Altera (Intel) EPF10K200SFC484-3N is a high-density member of the FLEX 10KE family of SRAM-based FPGAs, delivering 200,000 typical gates, 9,984 logic elements (LEs), and 368 user I/O pins in a 484-ball FineLine BGA package. The device uses a 0.22 µm CMOS SRAM process with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling fast on-chip memory integration. It targets cost-sensitive designs that need high logic density and I/O count in a single chip. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all controlled by user-defined SRAM configuration bits. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> high-density FPGAs, and within power management and digital design they serve as the central processing and glue-logic element. FPGAs are widely used to implement parallel processing, custom peripherals, and high-speed interfaces that would otherwise require discrete ASICs or large clusters of TTL logic. Key features of the EPF10K200SFC484-3N include 4 Embedded Array Blocks (EABs) totaling up to 24 Kbits of dedicated RAM, a system clock that can be driven from a dedicated global clock network, IEEE 1149.1 JTAG boundary-scan support, and 3.3 V PCI compliance (speed grade -3) or 5.0 V PCI compliance (speed grade -1). The 484-ball FineLine BGA package supports pin migration across the FLEX 10KE family per Altera's SameFrame pin-compatibility scheme, so design teams can scale logic density without re-laying out the PCB. The FLEX 10KE architecture uses a continuous SRAM interconnect with fast, predictable routing delays, and the device operates from a 5.0 V core supply with multi-voltage I/O supporting 2.5 V, 3.3 V, and 5.0 V interfaces. Speed grade -3 indicates the fastest commercial speed bin, suitable for high-frequency glue logic and PCI applications. Industrial and commercial temperature grades are both available across the family. Typical applications include PCI/CompactPCI bridge designs, high-speed glue logic, telecom line-card controllers, industrial automation backplanes, and legacy system upgrades where the FLEX 10KE was the original design-in device. The 484-BGA package also enables dense, high-pin-count designs in compact form factors such as ATCA blades and custom peripheral boards. When designing with the EPF10K200SFC484-3N, ensure the 5.0 V VCCINT rail has sufficient decoupling (100 µF bulk + 0.1 µF ceramic per power pin), the JTAG chain is properly terminated, and the configuration memory (typically EPC2 or EPC16) is correctly selected for the device's 0.22 µm process. The SameFrame pin-out allows easy migration to EPF10K100 or EPF10K130 in the same 484-BGA footprint, providing design flexibility. This page synthesizes distributor pricing, SameFrame drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from search to working hardware than the bare PDF alone.

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EPF10K200SFC672-1 - FLEX 10KE FPGA 200K Gates 9984 Cells | Altera
EPF10K200SFC672-1

EPF10K200SFC672-1 - FLEX 10KE FPGA 200K Gates 9984 Cells | Altera

The Altera (now Intel) EPF10K200SFC672-1 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200K system gates and 9984 logic cells in a 672-ball FineLine BGA (FBGA) package with 470 user I/Os, manufactured on a 0.22 µm CMOS process and operating at 250 MHz core frequency with a 2.5 V supply. It is the commercial temperature grade (0 °C to 70 °C), speed grade -1 variant of the EPF10K200S family, providing designers with a deterministic, SRAM-based programmable logic fabric that combines look-up-table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory and DSP-like functions. What is a FLEX 10KE FPGA? The FLEX 10KE family belongs to the historical hierarchy of programmable logic devices (PLDs) - specifically the family of fine-grained, SRAM-based FPGAs introduced by Altera in the mid-1990s as a second-generation FLEX architecture. In the taxonomy hierarchy, an FPGA sits under Programmable Logic > PLD > CPLD/FPGA > SRAM-based FPGA > FLEX 10KE. Each logic element (LE) contains a 4-input LUT, a programmable register, and a carry chain, while groups of LEs form logic array blocks (LABs) that interconnect through a continuous FastTrack routing fabric. The 'KE' suffix denotes enhanced embedded array blocks for distributed RAM, ROM, and FIFO functions, expanding the device beyond pure glue logic into system-on-a-programmable-chip (SOPC) integration. Key features include 9984 logic elements organized into LABs, 12 embedded array blocks (EABs) providing up to 98,304 bits of RAM, 470 user I/Os for high-pin-count board designs, multi-volt I/O support (2.5 V/3.3 V/5.0 V PCI-compliant), and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device supports four input clock pins plus dedicated clock lock circuitry for clock-domain management. Architecturally, the EPF10K200SFC672-1 uses a continuous hierarchical interconnect (FastTrack) that spans rows and columns of LABs with predictable routing delays, simplifying static timing closure compared with segmented FPGA fabrics. The 0.22 µm SRAM process delivers low static power (typical Icc standby around 50 mA) and supports live reconfiguration, allowing the logic function to be updated in the field without powering down the board. Typical applications include telecommunications line cards, industrial control and factory automation backplanes, military and aerospace signal processing, prototyping for ASIC replacement, multi-channel DMA controllers, and bus-interface bridging (PCI, VME, ISA, I²C). The 672-ball FBGA package enables the high I/O count needed for memory-bus expansion and parallel data-path applications. When designing with the EPF10K200SFC672-1, plan for a multi-rail power design (2.5 V VCCINT plus a separate VCCIO bank supply), place decoupling capacitors within 5 mm of each power pin, and route JTAG signals with 4.7 kΩ pull-ups on TCK/TMS/TDI. Use Altera MAX+PLUS II or Quartus II (legacy) for synthesis, fitting, and timing analysis. The 672-BGA footprint requires careful PCB stack-up planning with microvia or via-in-pad technology for cost-effective assembly. This page synthesizes distributor pricing (DigiKey, Mouser, Arrow), real-time stock and lead-time signals, drop-in and same-package alternatives, and practical design notes that go beyond what the original Altera datasheet provides.

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EPF10K200SFC672-1X - 200K Gates FLEX-10KS FPGA, 470 I/O | Intel
EPF10K200SFC672-1X

EPF10K200SFC672-1X - 200K Gates FLEX-10KS FPGA, 470 I/O | Intel

The Intel / Altera EPF10K200SFC672-1X is a high-density FLEX-10KS series Field Programmable Gate Array (FPGA) delivering up to 200,000 system gates, 9,984 logic elements (LEs), and 470 user I/O pins in a 672-ball FineLine BGA package. Built on a reconfigurable CMOS SRAM architecture, the device integrates an embedded array block (EAB) for efficient memory-intensive functions, with 24 EABs providing up to 98,304 RAM bits. The FLEX-10KS family is designed for system-on-a-programmable-chip (SOPC) integration, combining programmable logic with embedded memory in a single device. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. The FLEX-10KS family belongs to the older Altera FLEX 10K architecture lineage, which historically targeted high-density glue logic, bus interfacing, and DSP co-processing in telecom, networking, and industrial control. Within the broader taxonomy, FPGAs sit alongside CPLDs as programmable logic devices, distinguished from ASICs by their reprogrammability and from microcontrollers by their hardware-parallel execution model. Key features of the EPF10K200SFC672-1X include 1,248 Logic Array Blocks (LABs), a propagation delay of approximately 0.4 ns, and 4-input look-up table (LUT) based logic elements. The device supports in-system programmability via the IEEE Std. 1149.1 JTAG interface, which adds up to 31,250 gates of boundary-scan logic. Core supply voltage operates at 2.5 V (2.375 V to 2.625 V), and the device is rated for commercial temperature operation (0 °C to 70 °C). Architecturally, the FLEX-10KS combines a fine-grained logic array with coarse-grained embedded array blocks, allowing designers to implement wide data-path functions efficiently. The 27 × 27 mm FineLine BGA package with 1.0 mm ball pitch balances high I/O count with manageable PCB layout requirements compared to larger pitch alternatives. Each I/O pin supports JTAG boundary-scan testing, simplifying board-level validation. Typical applications include telecommunications backplane interfacing, ASIC prototyping, DSP co-processing, industrial control glue logic, and legacy system redesigns requiring drop-in FLEX-10K compatibility. The 470 user I/O count makes the device well-suited for memory-rich data buffering and bus-bridging functions in embedded systems. When designing with this FPGA, ensure the Quartus design tool supports the legacy FLEX 10K device family, since current Quartus versions have removed older device support. Use dedicated configuration devices (such as EPC2 or EPC8) or JTAG for bitstream loading, and account for the SRAM-based configuration requiring reconfiguration at every power-up. The 672-BGA package demands careful PCB layout with 1.0 mm pitch routing and thermal management for sustained operation. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy manufacturer datasheet.

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EPF10K200SFC672-2 - FLEX 10KE 200K Gates FPGA | Altera
EPF10K200SFC672-2

EPF10K200SFC672-2 - FLEX 10KE 200K Gates FPGA | Altera

The Intel (formerly Altera) EPF10K200SFC672-2 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200K system gates with 9,984 logic elements housed in a 672-pin FineLine BGA (FBGA) package. It features 470 user I/O pins, 1248 Logic Array Blocks (LABs), and an embedded array architecture built on a 0.22 µm CMOS process node operating at 2.5 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit within the programmable logic device (PLD) hierarchy, alongside CPLDs, and offer higher logic density and richer I/O. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) for on-chip memory, enabling system-on-a-programmable-chip (SOPC) integration combining logic, RAM, and ROM in a single device. Key features include 98,304 bits of embedded memory, a -2 speed grade with internal propagation delays of approximately 0.4 ns, MultiVolt I/O support for 2.5 V/3.3 V/5.0 V mixed-voltage environments, and JTAG-compliant IEEE 1149.1 boundary-scan testing. The device supports both SRAM-based configuration and in-system programmability via the passive parallel asynchronous configuration scheme. An on-chip Phase-Locked Loop (PLL) provides clock multiplication and skew management. Typical applications include telecommunications infrastructure (SONET/SDH framer circuits, ATM switches), high-speed data acquisition systems, digital signal processing front-ends, and legacy industrial control backplanes. The 470 user I/Os and 672-pin FBGA footprint make it suited for high-bandwidth parallel processing designs requiring dense connectivity. When designing with this part, note that the FLEX 10KE architecture requires 2.5 V core supply with separate VCCIO banks. Designers must allocate configuration memory and implement the ByteBlaster or MasterBlaster programming interface per Altera application notes. The device is now NRND/EOL; for new designs, consider Cyclone IV/V or MAX 10 families as modern equivalents. This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and LCSC, package-level drop-in alternatives, and practical design notes not found in the legacy FLEX 10KE datasheet alone.

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EPF10K200SFI672-2 - FLEX 10KE FPGA 200K Gates 672-BBGA | Intel
EPF10K200SFI672-2

EPF10K200SFI672-2 - FLEX 10KE FPGA 200K Gates 672-BBGA | Intel

The Intel (formerly Altera) EPF10K200SFI672-2 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic elements in a 672-pin FineLine BGA (FBGA) package. The device is fabricated on a 0.22 µm (Arrow lists 0.42 µm process node per its parametric table) CMOS SRAM process, operates from a 2.5 V core supply, and supports PCI Local Bus Specification Revision 2.2 at 3.3 V / 33-66 MHz on -1 speed grade devices. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital logic, glue logic, or complete system-on-chip prototypes. The FLEX 10KE family extends the original FLEX 10K architecture by adding embedded array blocks (EABs) that double as synchronous SRAM, making it a hybrid logic-plus-memory fabric rather than a pure logic device. Key features of the EPF10K200SFI672-2 include 470 user I/Os, 1248 Logic Array Blocks (LABs), 24 Embedded Array Blocks (EABs) providing 96 Kbit of total embedded SRAM, and built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990. The device integrates 98,304 bits of distributed memory and supports in-system programmability via the Altera MAX+PLUS II or Quartus design tools through EDIF 2 0 0 / 3 0 0, LPM, VHDL, and Verilog HDL interfaces. The FLEX 10KE architecture combines a fine-grained logic fabric with row/column interconnects and column-based I/O structures that interface to off-chip signals at multiple I/O standards (LVTTL, LVCMOS, PCI, GTL). The -2 speed grade denotes a mid-tier performance bin within the FLEX 10KE family, trading off maximum toggle frequency versus cost. The 672-pin FBGA package uses the FineLine BGA pitch for high-density board mounting with controlled-impedance signal integrity. Typical applications include telecommunications line cards, industrial control glue logic, PCI bus interfaces, and legacy digital signal processing glue layers in telecom and instrumentation chassis. The embedded EABs simplify FIFO, dual-port RAM, and ROM substitution tasks. The wide I/O count also suits parallel bus bridging between microprocessors and ASICs. The legacy FLEX 10KE family has been an Altera workhorse for 32-bit PCI designs since the late 1990s. When designing with this part, verify that your Quartus / MAX+PLUS II toolchain still supports the FLEX 10KE device family because Intel has migrated its development tools to newer device families. Plan for end-of-life (EOL) risk because this part is reported as obsolete by major distributors. Confirm lead time and last-time-buy windows before committing to a new design. This page synthesizes distributor pricing, drop-in alternatives from the FLEX 10K/10KE family, and practical design notes for engineers maintaining legacy FLEX 10KE designs or planning last-time-buys.

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EPF10K200SFI672-2B - 200K Gates FLEX 10KE FPGA | Altera
EPF10K200SFI672-2B

EPF10K200SFI672-2B - 200K Gates FLEX 10KE FPGA | Altera

The Altera (Intel) EPF10K200SFI672-2B is a high-density FLEX 10KE family Field Programmable Gate Array (FPGA) with 200K system gates and 9,984 logic elements (LEs), housed in a 672-pin FineLine BGA (FBGA-672) package with 470 user I/Os. Built on a 0.22 µm SRAM-based CMOS process, it operates from a 2.5 V core supply and supports system performance up to 200 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can reconfigure post-manufacture to implement custom digital logic. FPGAs sit above standard logic ICs and microcontrollers in the programmable logic taxonomy (CPLD -> FPGA -> SoC FPGA) and belong to the broader category of programmable logic devices (PLDs) used for high-speed parallel processing, glue logic, prototyping ASICs, and DSP pipelines. The EPF10K200SFI672-2B features 98,304 bits of embedded SRAM, 24 Embedded System Blocks (EABs) totaling 96 Kbits of block RAM, and four phase-locked loops (PLLs) for clock management. Its FastTrack interconnect fabric delivers predictable timing across the device, while 5V-tolerant I/Os simplify interface to legacy peripherals. These characteristics make it suitable for telecom line cards, industrial control, and high-speed image processing applications. The 672-pin FineLine BGA package uses a 1.0 mm pitch on a 27 × 27 mm substrate, providing high signal density in a compact footprint. The FineLine BGA family is a sub-category of plastic BGA (PBGA) packaging designed for fine-pitch surface-mount assembly. The 'I' suffix in the part number indicates an industrial temperature grade (-40 °C to +85 °C), while 'S' denotes the 10KE family, 'F' indicates FineLine BGA package, and '672' identifies the pin count. Typical applications include telecommunications switching, high-speed serial protocol bridging (UTOPIA, POS-PHY), industrial machine vision, ASIC prototyping, and DSP co-processing. The device is well suited to high-I/O-count designs where 470 user pins and abundant block RAM simplify system partitioning. When designing with this part, verify PCB footprint compatibility with the FBGA-672 27 × 27 mm land pattern and ensure 6-layer or thicker stack-ups to maintain signal integrity for high-speed I/O. Plan JTAG access via the dedicated TEST pins for in-system programming, and check Quartus II / MAX+PLUS II support for bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EPF10K200SFI672-2N - 200K-Gate FLEX 10KE FPGA, 672-BGA | Intel
EPF10K200SFI672-2N

EPF10K200SFI672-2N - 200K-Gate FLEX 10KE FPGA, 672-BGA | Intel

The Intel (formerly Altera) EPF10K200SFI672-2N is a 200,000-gate member of the FLEX 10KE embedded programmable logic device family, integrating 9,984 logic elements (LEs), 98,304 bits of embedded memory, and 470 user I/Os into a single 672-ball FineLine BGA (FBGA) package. Speed grade -2 places the device in the mid-speed bin for the family, while the "I" suffix denotes the industrial temperature grade (-40C to +85C). The "N" suffix indicates a lead-free, RoHS-compliant package finish. FLEX 10KE devices belong to the FLEX (Flexible Logic Element matriX) family of SRAM-based FPGAs, with each LE containing a 4-input look-up table, a programmable register, and dedicated carry and cascade chains. FLEX 10KE extends the original FLEX 10K architecture by adding True-Look-Up-Table dual-port embedded array blocks (EABs) that double as 4 Kbit SRAM memories, and by adding FastTrack Interconnect routing that improves timing predictability and density utilization. They sit within the broader hierarchy of SRAM-based programmable logic devices (PLDs), which in turn form a major branch of digital semiconductor ICs. Key differentiating specifications include 9,984 logic elements, 12 EABs delivering 98,304 RAM bits, 470 user I/Os, a 0.22 um CMOS process, 2.5 V core supply (5.0 V tolerant I/O with PCI compliance), JTAG boundary-scan test per IEEE Std. 1149.1, and 200 MHz internal operation. The embedded JTAG circuitry adds up to 31,250 gates overhead without consuming user logic. Typical applications include telecommunications line cards, industrial control backplanes, military/aerospace signal processing, and PCI-based add-in card prototyping. The combination of 470 I/Os and ~200K gates supports wide datapath designs including 32-bit microcontrollers, multi-channel DMA engines, and protocol bridges. When designing with this device, note that it is SRAM-based and therefore requires a configuration ROM (such as an EPC2) on every board - the FLEX 10KE will not retain its configuration through power cycles without external boot storage. The 672-FBGA package has a 27 x 27 mm body with 1.0 mm ball pitch, so PCB layout must support fine-pitch BGA fanout with microvia or via-in-pad technology on most stackups. EOL warnings apply; check Intel/Altera PCN history before new designs. This page synthesizes datasheet specifications, distributor pricing, drop-in alternatives from the same FLEX 10KE family, and practical design notes that the bare datasheet PDF does not provide in one place.

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EPF10K200SRC240-1 - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel
EPF10K200SRC240-1

EPF10K200SRC240-1 - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel

The Intel EPF10K200SRC240-1 is a high-density FLEX-10KS series Field-Programmable Gate Array (FPGA) housed in a 240-pin RQFP (BFQFP with exposed pad) package, delivering up to 200,000 typical system gates and 9,984 logic elements backed by 98,304 bits of embedded SRAM. According to the Altera FLEX 10K Embedded Programmable Logic Family Data Sheet, the device provides 1,248 Logic Array Blocks (LABs), 182 user I/Os, and embedded array blocks that implement a wide range of memory and logic functions. The "SRC240-1" suffix indicates the standard 240-pin RQFP package and the -1 speed grade (fastest of the FLEX 10K family at 5.0 V). A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs are positioned above fixed-function ASICs in the silicon hierarchy: ASIC < FPGA < CPLD < programmable SoC < microprocessor. The FLEX 10K family pioneered embedded array blocks (EABs), which are RAM/ROM blocks that can be configured as wide SRAM, FIFO, ROM, or specialized logic, allowing each device to host both gates and megabytes of memory on one die. This makes FLEX 10K devices a bridge between simple glue-logic CPLDs and full-scale microprocessors. Key features of the EPF10K200SRC240-1 include the FLEX 10K SRAM-based architecture with in-system programmability via IEEE 1149.1 JTAG, multiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfaces, four dedicated clock input pins with on-chip PLL-style clock management, and built-in boundary-scan test. The device integrates 24 EABs totaling 40,960 bits, supports true dual-port RAM configurations, and provides configurable high-drive I/O for backplane driving. Embedded JTAG circuitry adds up to 31,250 gates beyond the listed gate count for boundary-scan and test logic. The 240-RQFP (32 x 32 mm BFQFP with exposed thermal pad) package exposes a metal pad on the underside for low thermal resistance and board-level grounding. Designers must use the standard FineLine BGA-pin-compatible migration strategy when planning a board that may move between FLEX 10K densities; Altera's datasheet recommends reserving only the I/O pins common to all candidate devices. Programming is performed through the JTAG port using Quartus II or MAX+PLUS II software. Typical applications include telecom line-card glue logic, industrial control state machines, PCI bridge interfaces, and legacy 5 V prototyping platforms. The exposed-pad package requires a thermal via array and copper pour directly under the part for heat spreading. When designing with this device, ensure all I/O banks share a common VCCIO if 5 V tolerance is required, since multiVolt I/O is per-bank. Designers migrating from FLEX 10K to FLEX 10KE should review the migration guide because EAB block RAM speeds and LAB interconnect changed between families. This page synthesizes distributor pricing, drop-in same-package alternatives from the same FLEX 10K family, and practical design notes not found in the manufacturer datasheet alone.

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EPF10K200SRC240-1N - 200K FLEX 10KE FPGA, 240-BFQFP | Intel
EPF10K200SRC240-1N

EPF10K200SRC240-1N - 200K FLEX 10KE FPGA, 240-BFQFP | Intel

The Intel (Altera) EPF10K200SRC240-1N is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs) featuring 9,984 logic elements and 200K equivalent gates, fabricated on a 0.22 µm CMOS process. It is housed in a 240-pin BQFP (Exposed Pad) package operating from a 2.5 V core supply. The device supports up to 182 user I/Os and includes 1,248 Logic Array Blocks (LABs), with embedded array blocks (EABs) that provide on-chip memory and arithmetic functions, making it well suited for high-density glue-logic, datapath, and interface bridging tasks. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can customize via a hardware description language (HDL). Within the broader hierarchy, an FPGA belongs to programmable logic devices -> digital logic ICs -> integrated circuits -> semiconductors. FPGAs fill the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic (low density, fixed function), enabling rapid prototyping, low-volume production, and field upgradability. Key features include 9,984 logic elements (cells), 1,248 LABs, 182 I/O pins, embedded array blocks for memory, and a maximum internal operating frequency of 250 MHz. The device is built on SRAM-based configuration cells, supporting in-system reprogrammability via the Altera/Intel Quartus or MAX+PLUS II design flows. It is rated for commercial operating temperature grades and uses the 240-pin BQFP exposed-pad package for improved thermal dissipation in surface-mount reflow processes. The FLEX 10KE architecture combines a fine-grained logic fabric with coarse-grained EABs, allowing efficient implementation of wide multiplexers, arithmetic functions, and small FIFOs without consuming general-purpose routing. Configuration data is stored in an SRAM cell, requiring a configuration device or microcontroller for in-system programming. The exposed pad on the BQFP package provides a low-thermal-resistance path to the PCB, important for the high toggle rates typical of 200K-gate designs. Typical applications include industrial control glue logic, legacy telecommunications interface cards, low-volume prototyping adapters, custom peripheral bridges, and educational digital-design platforms. The wide I/O count and embedded memory make it suitable for systems that require parallel datapath processing combined with control logic. Because the silicon is older and the family is in obsolescence transition, it is most commonly deployed as a long-life replacement for installed equipment rather than for green-field designs. When designing with this device, allocate sufficient PCB area for the exposed thermal pad and follow Intel/Altera application notes for JTAG chain configuration and in-system programming. Because the EPF10K200SRC240-1N is a mature part approaching end-of-life, designers should validate long-term supply and consider newer Cyclone or MAX families for new programs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and design engineers evaluate the EPF10K200SRC240-1N against modern substitutes.

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EPF10K200SRC240-1X - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel
EPF10K200SRC240-1X

EPF10K200SRC240-1X - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel

The Intel (formerly Altera) EPF10K200SRC240-1X is a 200,000-gate member of the FLEX 10KS family of SRAM-based FPGAs, delivering 9,984 logic elements, 182 user I/O pins, and 98,304 bits of embedded SRAM in a 240-pin RQFP (32x32 mm, 0.5 mm pitch) package. The '-1X' suffix denotes the commercial speed grade (fastest) with industrial temperature range support. It operates from a 2.375 V to 2.625 V core supply with separate V/CCINT and V/CCIO rails for I/O banking flexibility. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that an engineer can rewire after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) between traditional CPLDs (smaller, non-volatile, deterministic timing) and ASICs (custom-silicon performance at high NRE cost). The FLEX 10KS architecture introduced by Altera in the late 1990s was among the first commercial FPGAs to embed dedicated SRAM blocks (EABs/ESBs), making it suitable for data-path, DSP, and memory-intensive glue logic. Key features of the EPF10K200SRC240-1X include 9,984 logic elements, 1248 Logic Array Blocks (LABs), 98,304 embedded SRAM bits organized into Embedded Array Blocks (EABs), 182 maximum user I/O across 4 I/O banks, and multi-voltage I/O support (5.0 V, 3.3 V, 2.5 V). The device supports in-system configuration via serial or parallel EPROM/Flash, and is pin-compatible within the FLEX 10KS 240-pin RQFP family, enabling SameFrame migration to smaller or larger density parts without PCB rework. The FLEX 10KS architecture pairs a fine-grained logic fabric with row/column interconnect, an embedded array of SRAM blocks for wide-word memory or lookup-table expansion, and four I/O banks with independent V/CCIO rails for mixed-voltage interfacing. The '-1X' speed grade typically yields internal toggle rates around 250 MHz for simple counter paths, making the device adequate for legacy telecom, industrial control, and bus-bridging applications rather than high-speed SERDES work. Typical applications include legacy telecom line-card glue logic, industrial PLC backplanes, MIL-STD-1553 / ARINC 429 protocol bridges, parallel bus expansion (ISA, VME, PC/104), and pin-compatible upgrades for designs originally built on EPF10K100 / EPF10K130 / EPF10K200E FLEX 10K family members. The 240-RQFP package is also attractive for hand-solderable prototypes and field-repair scenarios where BGA rework equipment is unavailable. When designing with this part, verify that the chosen JTAG chain programmer supports the FLEX 10KS family (Quartus II 13.0 or MAX+PLUS II 10.2 are the last fully supported toolchains). For new designs, consider Cyclone IV or MAX II as modern pin-compatible migration targets; for drop-in replacement of an obsolete or EOL FLEX 10KS board, the part is currently available through authorized distributors and franchised brokers. This page consolidates distributor stock, drop-in same-package alternatives within the FLEX 10KS family, and practical sourcing notes that are not present in the legacy FLEX 10KS datasheet volume.

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EPF10K200SRC240-2 - FLEX 10KS FPGA, 9984 LEs, 240-RQFP | Intel
EPF10K200SRC240-2

EPF10K200SRC240-2 - FLEX 10KS FPGA, 9984 LEs, 240-RQFP | Intel

The Intel (formerly Altera) EPF10K200SRC240-2 is a member of the FLEX 10KS family of Field Programmable Gate Arrays (FPGAs) fabricated on a 0.42 micrometer CMOS SRAM process, delivering 9984 logic elements (LEs), 1248 Logic Array Blocks (LABs) and 98304 bits of embedded RAM in a 240-pin RQFP (32x32 mm) package with exposed thermal pad. The device supports 182 user I/O pins and operates from a 2.5 V core supply (2.375 V to 2.625 V). The “-2” suffix denotes a speed grade of approximately 80 MHz internal operation, suitable for medium-speed glue-logic, bridge and control applications. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect and embedded memory arrays into a single silicon die. Within the broader taxonomy, FPGAs sit under the Programmable Logic Device umbrella -> Integrated Circuit -> Semiconductor. The FLEX 10KS family was the industry’s first FPGA with embedded system blocks, allowing designers to integrate ASIC-like memory, bus controllers, and arithmetic units alongside conventional logic fabric. Key features include 9984 logic elements distributed across 1248 LABs, 98304 bits of distributed RAM, 182 user I/Os, and a commercial-grade 0C to 70C operating range. The 240-pin RQFP (also referred to as 240-BFQFP with exposed pad) supports surface-mount assembly on standard FR-4 PCB technology, with gull-wing leads on a 32x32 mm body. The device is in-system programmable via the IEEE 1149.1 JTAG interface or the legacy Altera EPC configuration EEPROM family. The architecture combines four-input look-up table (LUT) based logic elements with embedded array blocks (EABs) that can be configured as RAM, ROM or product-term logic. This hybrid fabric allows the implementation of both datapath pipelines and large memory arrays on a single device, eliminating external memory and reducing board area. The exposed thermal pad provides a low thermal-resistance path to the PCB copper pour, enabling higher sustained logic utilization. Typical applications include industrial control backplanes, telecommunications line-card glue logic, legacy PCI bridge designs, machine vision pre-processing, and test & measurement instrumentation. The 182 I/Os make the EPF10K200SRC240-2 well-suited for systems that need to consolidate multiple discrete logic devices, ASIC replacement, and rapid-prototyping of new bus architectures. When designing with this part, ensure that the Quartus II (or MAX+PLUS II for legacy flows) generated bitstream targets the FLEX 10KS device family and the -2 speed grade. Verify that the configuration EEPROM, clock buffers and decoupling network follow the FLEX 10KA/10KS handbook recommendations, and that the exposed pad is soldered to a sufficient ground copper pour for thermal dissipation. This page synthesizes distributor pricing, drop-in package alternatives within the FLEX 10KS family, and practical design notes not found in the original FLEX 10KS datasheet, enabling engineers to evaluate the EPF10K200SRC240-2 against modern and legacy FPGA alternatives.

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EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera
EPF10K200SRC240-2X

EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera

The Altera EPF10K200SRC240-2X is a high-density FLEX 10K-series Field Programmable Gate Array (FPGA) delivering 200,000 system gates, 9984 logic cells, and 1248 Logic Array Blocks (LABs), housed in a 240-pin PowerQuad Flat Package (RQFP/RQFP-240). It belongs to Intel/Altera's FLEX 10K family of embedded programmable logic devices (PLDs) that combine look-up table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory and DSP functions. The device supports up to 470 user I/Os in some packages and provides typical propagation delays of approximately 0.4 ns to 0.8 ns at room temperature. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits. Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad. Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin. Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode. This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.

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EPF10K200SRC240-3 - FLEX 10KE 200K-Gate FPGA, 240-RQFP | Intel
EPF10K200SRC240-3

EPF10K200SRC240-3 - FLEX 10KE 200K-Gate FPGA, 240-RQFP | Intel

The Intel (formerly Altera) EPF10K200SRC240-3 is a member of the FLEX 10KE family of SRAM-based FPGAs, integrating 200,000 system gates, 9,984 logic elements, and 98,304 bits of embedded memory in a 240-pin RQFP (Power Quad Flat Pack) package with exposed pad. Built on a 0.22 um CMOS process and operating from a 2.5 V core supply, this device provides 470 user I/Os at a 0.5 mm pitch and is rated for the commercial 0 C to 70 C temperature range. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) that combine programmable logic with on-chip dual-port RAM and ROM, enabling System-on-a-Programmable-Chip (SOPC) integration in a single device - a precursor to modern SoC FPGAs. FPGAs sit above ASICs and CPLDs in density while remaining reprogrammable. Key features of the EPF10K200SRC240-3 include 1,248 Logic Array Blocks / Configurable Logic Blocks (LABs/CLBs), four Delay-Locked Loops (DLLs) for clock skew management, 12 Embedded Array Blocks providing up to 98 Kbits of RAM, MultiVolt I/O supporting mixed-voltage interfacing, and an in-system programmability (ISP) interface via the passive serial or ByteBlaster configuration schemes. The device consumes approximately 0.4 ns propagation delay per logic element and runs at internal clock rates up to 166.67 MHz. Typical applications include telecommunications line cards, industrial control and factory automation, high-speed data acquisition front-ends, and legacy telecommunications and imaging systems designed during the late 1990s and early 2000s. The wide 470 I/O count makes it well suited for bus-intensive designs such as PCI bridges, memory controllers, and parallel DSP pipelines. When designing with this device, ensure the Quartus II or MAX+PLUS II toolchain is used for synthesis, place-and-route, and bitstream generation. The exposed pad of the RQFP-240 must be soldered to a copper pour to meet thermal specifications, and decoupling capacitors must be placed within 5 mm of every VCCINT and VCCIO pin pair.

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EPF10K200SRC240-3N - FLEX 10KE FPGA 200K Gates 9984 Cells | Intel
EPF10K200SRC240-3N

EPF10K200SRC240-3N - FLEX 10KE FPGA 200K Gates 9984 Cells | Intel

The Intel (formerly Altera) EPF10K200SRC240-3N is a FLEX 10KE family Field Programmable Gate Array (FPGA) built on a 0.22 µm CMOS process, integrating 200,000 typical system gates and 9,984 logic elements (LEs) in a 240-pin RQFP (Power QFP) package with exposed pad. It features 470 user I/Os, 1248 Logic Array Blocks (LABs), and 24 Embedded Array Blocks (EABs) providing up to 98,304 bits of on-chip RAM, with a maximum internal operating frequency of 166.67 MHz and 0.22 µm SRAM-based configuration cells. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration density of an Application-Specific Integrated Circuit (ASIC) with the field-programmability of a Complex PLD (CPLD). Within the broader taxonomy, the FLEX 10KE belongs to the PLD -> CPLD/FPGA -> SRAM-based FPGA -> low-power FPGA hierarchy, intended for system-on-a-programmable-chip (SOPC) designs that require embedded memory, embedded logic, and substantial user I/O in a single device. Key differentiating features include a 2.5 V core supply, multi-volt I/O support for 2.5 V and 3.3 V interfaces, embedded IEEE Std 1149.1 JTAG boundary-scan test circuitry (contributing up to 31,250 gates of test logic), built-in phase-locked loops (PLLs) for clock management, and on-chip memory configured via Embedded Array Blocks (EABs). The -3N speed grade denotes a commercial-temperature device with a maximum propagation delay of 0.40 ns at the fastest logic path. The FLEX 10KE architecture combines a coarse-grained Logic Array Block fabric with fine-grained Logic Element cells and dedicated EAB SRAM blocks, allowing designers to implement both register-rich glue logic and moderately sized dual-port or ROM memories without external components. MultiVolt I/O pins enable seamless interfacing with 2.5 V, 3.3 V, and 5 V devices through configurable voltage-reference and PCI-compliant I/O standards. Typical applications include telecommunications line-card glue logic, industrial control and factory-automation backplanes, test-and-measurement instrumentation front-ends, PCI bridge prototyping, image and video pipeline prototyping, and low-volume ASIC replacement designs that benefit from embedded memory and the FLEX 10KE's high I/O count. Designers should remember that FLEX 10KE devices are SRAM-based, requiring a configuration ROM on the board for power-up loading, and the exposed thermal pad of the 240-pin RQFP must be soldered to a sufficiently large copper pour to meet the device's thermal dissipation envelope under continuous switching loads. This page synthesizes distributor pricing across 10 channels, drop-in FLEX 10KE alternatives in the same 240-pin RQFP footprint, and practical design notes that the manufacturer datasheet alone does not provide, including speed-grade trade-offs and configuration-ROM selection guidance.

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EPF10K20RC208-3 - FLEX 10K FPGA, 20K Gates, 147 I/O, RQFP-208 | Intel
EPF10K20RC208-3

EPF10K20RC208-3 - FLEX 10K FPGA, 20K Gates, 147 I/O, RQFP-208 | Intel

The Intel (formerly Altera) EPF10K20RC208-3 is a member of the FLEX 10K family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering 20,000 typical gates and 1,152 logic elements in a 208-pin RQFP (Power Quad Flat Pack) package with exposed thermal pad. Speed grade -3 indicates the device is specified for a propagation delay tier suitable for up to 125 MHz internal operation, fabricated on a 5V, 0.42 µm CMOS process with 4-input look-up tables (LUTs) and embedded array blocks (EABs) for on-chip memory. The device provides 147 user I/O pins and 12,288 bits of embedded SRAM for distributed buffering. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacture by the end user. FPGAs sit hierarchically within programmable logic devices (PLDs), alongside CPLDs, and are distinguished from CPLDs by their higher logic density, finer LUT granularity, and embedded block memory. The FLEX 10K family was Altera's first device family to integrate embedded array blocks (EABs) of SRAM memory alongside the logic array, creating a system-on-a-programmable-chip (SOPC) platform. Key features of the EPF10K20RC208-3 include 144 Logic Array Blocks (LABs) each containing 8 Logic Elements, configurable I/O standards supporting 5V TTL/CMOS interfaces, an in-system programmability (ISP) interface via the serial configuration EPROM, and built-in JTAG boundary-scan test (IEEE 1149.1 BST) support. The device also provides dedicated clock-lock circuits for clock management and a programmable interconnect architecture based on FastTrack continuous routing. Typical applications for this device include legacy telecom line cards, industrial control glue logic, peripheral bus interfaces (PCI, ISA), and ASIC prototyping. Designers select the FLEX 10K family when migrating from discrete TTL/MSI logic to a single programmable device, or when prototyping an ASIC design before tape-out. When designing with this part, ensure 5.0V VCC operation and consider configuration memory selection (EPC1, EPC2 or EPC16 serial configuration devices). Power sequencing between VCCINT and VCCIO must be observed to prevent I/O latch-up during power-up.

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EPF10K20RC208-3N - FLEX 10K FPGA 20K Gates 208-BFQFP | Intel
EPF10K20RC208-3N

EPF10K20RC208-3N - FLEX 10K FPGA 20K Gates 208-BFQFP | Intel

The Intel (Altera) EPF10K20RC208-3N is a FLEX-10K family Field-Programmable Gate Array (FPGA) fabricated on a 0.42 µm CMOS process, integrating 20,000 typical gates, 1,152 logic elements (LEs), 144 logic array blocks (LABs), and 12,288 bits of embedded RAM in a 208-pin BFQFP exposed-pad package. According to the verified distributor listings, this part provides 147 user I/O pins, a maximum internal operating frequency of 125 MHz, and supports a 5V core supply (4.75 V to 5.25 V). It belongs to the -3 speed grade and ships in lead-free, surface-mount 208-BFQFP. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits within the broader hierarchy of programmable logic: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. The FLEX 10K family in particular pioneered the embedded array block (EAB) concept, allowing blocks of on-chip SRAM to be used as RAM, ROM, or multiplier functions, which was revolutionary for the late-1990s era. Key differentiating specifications of the EPF10K20RC208-3N include 144 LABs organized across the FLEX 10K interconnect fabric, 12,288 total RAM bits distributed in EABs, and 147 I/O pins supporting multiple I/O standards of that generation. The 208-BFQFP package with exposed pad provides thermal dissipation suitable for industrial/commercial operating ranges. From an architectural standpoint, the FLEX 10K family employs a continuous routing fabric called the FastTrack Interconnect, with each LE containing a 4-input look-up table (LUT), a programmable flip-flop, and dedicated carry-chain logic. The EABs provide dual-port RAM capability and configurable widths from 256x8 to 2048x1, enabling efficient on-chip memory implementations. Typical applications for the EPF10K20RC208-3N include glue logic for telecommunications backplane designs, industrial control system prototyping, PCI bus interface bridges, and legacy embedded computing platforms that required mid-density programmable logic at 5V tolerance. The part is also commonly found in test equipment and data acquisition front-ends of that era. Designers should note that the EPF10K20RC208-3N is in production but is widely regarded as a legacy/legacy-supported part; new designs should consult the Altera/Intel product longevity statement. Configuration is performed via the classic Altera ByteBlaster or BitBlaster download cables, and the legacy MAX+PLUS II development toolchain supports this device natively. This page synthesizes distributor availability, drop-in compatible FLEX 10K variants in the same 208-RQFP footprint, and practical design notes not consolidated in any single manufacturer document.

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EPF10K20RC208-4 - FLEX 10K FPGA, 20K Gates, 208-RQFP | Intel/Altera
EPF10K20RC208-4

EPF10K20RC208-4 - FLEX 10K FPGA, 20K Gates, 208-RQFP | Intel/Altera

The Intel (formerly Altera) EPF10K20RC208-4 is a member of the FLEX 10K family of embedded programmable logic devices, delivering 20,000 typical gates (10,000 logic gates) and 1,152 logic elements in a 208-pin RQFP package with exposed pad. It operates on a 5V supply at a maximum internal frequency of 125 MHz using 0.42 µm CMOS process technology, and provides 147 user I/O pins for system-level integration. What is a FLEX 10K FPGA? The FLEX 10K family is a hierarchical SRAM-based programmable logic family that combines a logic array with an embedded array block (EAB) for on-chip RAM and ROM. Within the broader taxonomy it is an FPGA (Field-Programmable Gate Array), a sub-class of programmable logic devices (PLD), which itself belongs to the semiconductor IC family of digital logic. FLEX 10K devices target high-density, system-on-a-programmable-chip (SOPC) integration in a single device, replacing multiple discrete logic and memory components with one configurable chip. Key features of the EPF10K20RC208-4 include a propagation delay of 0.4 ns, 12,288 typical RAM bits distributed across embedded array blocks, an operating temperature range of 0 °C to +70 °C (commercial grade), and PCI-compliant I/O buffers. The -4 speed grade is one of the faster bins offered within the FLEX 10K family for this die and package combination, giving designers extra timing margin for state-machine and datapath paths that do not require the higher-grade -3 or -2 bins. The 208-RQFP (also written 208-BFQFP) package places the device in the same socket as the rest of the EPF10K20 family, enabling reuse of existing PCB footprints. Typical applications include telecommunications line cards, industrial control and instrumentation, glue-logic replacement for ASIC prototyping, PCI interface bridging, and bus-interconnect multiplexing. The 5V I/O compatibility of the FLEX 10K family makes it attractive for legacy 5V system buses where newer 3.3V-only FPGAs cannot directly connect without level shifters. When designing with the EPF10K20RC208-4, allow at least one heat-spreading copper pour under the exposed pad of the 208-RQFP package, since the device can dissipate several hundred milliwatts at full toggle rate. Altera's MAX+PLUS II and Quartus development flows both support the EPF10K20 family, allowing reuse of legacy design files.

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EPF10K20RC208-4N - FLEX 10K FPGA, 20K Gates, 208-RQFP | Intel
EPF10K20RC208-4N

EPF10K20RC208-4N - FLEX 10K FPGA, 20K Gates, 208-RQFP | Intel

The Intel (formerly Altera) EPF10K20RC208-4N is a member of the FLEX 10K family of embedded programmable logic devices (EPLDs) packaged as a Field-Programmable Gate Array (FPGA) with 20,000 typical gates, 1,152 logic cells, 144 Logic Array Blocks (LABs), and 12,288 bits of embedded memory. It is housed in a 208-pin RQFP (Plastic Quad Flat Pack with exposed pad) package measuring 28 x 28 mm, providing 147 user I/O pins. Speed grade -4 indicates a propagation delay of approximately 0.6 ns per logic element. The device operates from a single 5 V nominal supply (4.75 V to 5.25 V) and is offered in a commercial 0 to 70 °C temperature range. A FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and are widely used for digital logic prototyping, glue logic, signal processing, and hardware acceleration. The FLEX 10K family specifically introduced Look-Up Table (LUT)-based logic combined with embedded array blocks (EABs) that implement RAM, ROM, and FIFO functions, bridging the gap between earlier PLDs and modern SRAM-based FPGAs. Key features include 147 user I/Os, 12 EABs for memory implementation, SRAM-based configuration cells, in-system programmability via the ByteBlaster or JTAG interfaces, and support for multi-volt I/O standards including 5.0 V, 3.3 V, and 2.5 V with proper configuration. The 'N' suffix indicates lead-free / Pb-free construction consistent with RoHS requirements. The exposed thermal pad on the 208-BFQFP package aids heat dissipation in moderate-power designs. From an architectural standpoint, the EPF10K20RC208-4N uses 0.42 µm CMOS process technology with four-input LUTs, dedicated carry chains for arithmetic, and a continuous interconnect fabric routed across LABs. Configuration data is stored in SRAM cells, allowing unlimited re-programmability, which is essential for design iteration and field upgrades. The 208-RQFP footprint is the largest QFP variant in this family, maximizing I/O access for parallel interfaces. Typical applications include telecommunications line cards, industrial control glue logic, data-acquisition pre-processing, PCI bridge prototypes, and legacy system emulation where large gate counts and abundant I/O are required. Newer Cyclone or MAX series parts generally supersede this device in new designs, but it remains valuable for maintenance of installed systems. When designing with this device, consider using the Quartus II (legacy) or MAX+PLUS II development environment for synthesis, place-and-route, and bitstream generation. The exposed pad must be soldered to a copper pour for thermal relief and to maintain the mechanical integrity of the fine-pitch RQFP package.

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EPF10K20RC240-3 - FLEX 10K FPGA, 20K Gates, 240-PQFP | Intel
EPF10K20RC240-3

EPF10K20RC240-3 - FLEX 10K FPGA, 20K Gates, 240-PQFP | Intel

The Intel EPF10K20RC240-3 is a member of the FLEX 10K family of SRAM-based FPGAs delivering 20,000 typical gates (12,288 logic elements / 1,152 LAB cells) in a 240-pin Power Quad Flat Pack (PQFP / RQFP / BFQFP) exposed-pad package. Operating from a 5V core supply, the -3 speed grade corresponds to a commercial-temperature device with maximum propagation delay around 0.4 ns and internal performance sufficient for 125 MHz state-machine designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses look-up tables (LUTs), configurable logic blocks (CLBs), and a programmable interconnect matrix to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs and one-time-programmable (OTP) arrays, and they occupy the high-density end of that hierarchy. The FLEX 10K family is Intel's (formerly Altera's) second-generation embedded-array family, combining logic fabric with embedded array blocks (EABs) intended for on-chip memory, ROM, or multiplier functions, enabling system-on-a-programmable-chip (SOPC) integration. Key features include 189 LABs, 12288 logic elements (LEs), 1152 dedicated flip-flops, 470 user I/O pins, in-system programmability through the IEEE 1149.1 JTAG interface, multi-voltage I/O support for interfacing to 5V, 3.3V, and 2.5V rails, and an embedded array block (EAB) architecture for efficient on-chip memory. The exposed thermal pad on the RQFP-240 package provides a low-thermal-resistance path for heat extraction in continuous-duty designs. The architecture is built on a 0.42 µm CMOS process with five layers of metal interconnect. The Look-up Table (LUT)-based combinational path feeds a programmable register that can be configured as D, T, JK, or SR, and carry-chain logic accelerates wide arithmetic operations. Embedded Array Blocks (EABs) provide 2 Kbits of dual-port RAM each and can be cascaded to implement FIFOs, ROMs, or small DSP kernels without consuming general-purpose logic. Typical applications include legacy telecom line cards, industrial control and factory-automation backplanes, military and avionics retrofits, ASIC prototyping, and glue-logic replacement on 5V-tolerant backplanes. The 240-pin PQFP footprint is compatible with many 1990s-era designs, simplifying field upgrades of installed equipment. When designing with the EPF10K20RC240-3, plan for an external configuration PROM (EPC2 or EPC8) on older boards or use the JTAG port for in-system configuration during prototyping. The 5V VCCINT requirement makes the FLEX 10K family incompatible with modern 1.8V/2.5V FPGA boards without level shifting. This page synthesizes distributor stock, parametric drop-in alternatives, and design notes not present in the manufacturer datasheet, giving procurement and design engineers a single source for evaluating this mature FLEX 10K device.

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EPF10K20RC240-3N - 20K-Gate FLEX 10K FPGA, 240-RQFP | Altera
EPF10K20RC240-3N

EPF10K20RC240-3N - 20K-Gate FLEX 10K FPGA, 240-RQFP | Altera

The Altera (Intel) EPF10K20RC240-3N is a FLEX 10K-series embedded programmable logic device (EPLD) delivering 20,000 usable gates, 1,152 logic cells, and 189 user I/Os in a 240-pin RQFP (RQFP-HFQFP) package with exposed pad. It is fabricated on a 0.42 µm CMOS process and operates from a 5 V supply with a 125 MHz internal performance rating and a -3 speed grade. FLEX 10K is the first family to combine embedded array blocks (EABs), which are dual-port RAM blocks usable as FIFOs, ROM, or RAM, with a fine-grained Look-Up Table (LUT) logic fabric. An EAB can implement up to 2,048 bits of memory plus optional registered outputs, while surrounding Logic Array Blocks (LABs) deliver combinatorial and sequential logic. The architecture is positioned between classic PLDs and modern SRAM FPGAs, providing a system-on-a-programmable-chip (SOPC) integration path that simplified glue-logic and bus-interface designs in the late 1990s and early 2000s. Key features include 144 LABs, 12,888 typical logic capacity, 189 programmable user I/O pins, multi-volt I/O support (5.0 V PCI-compliant, 5.0 V tolerant), JTAG-based in-system programmability via ByteBlaster/MasterBlaster/ByteBlasterMV cables, and built-in Joint Test Action Group (JTAG) boundary-scan. The -3 speed grade reflects AC performance at commercial temperature (0 °C to 70 °C). The device is targeted at glue logic, PCI bus interfaces, peripheral bridging, and embedded memory (FIFO/dual-port RAM) consolidation on a single chip. Typical applications include PCI controller/peripheral interfaces, asynchronous-transfer-mode (ATM) and telecom glue logic, peripheral bridging in embedded CPU boards, DSP co-processors, and pre-existing 5 V industrial platforms. Its 5 V tolerance simplifies integration with legacy 5 V logic without external level shifters. The 240-RQFP package offers a JEDEC-standard gull-wing footprint compatible with the FLEX 10K family, easing board layout for upgrades and form-factor-compatible variants. Designers should note that EAB blocks must be configured to match the chosen memory mode and width; unused EABs can be left disabled. Combined EAB + LAB usage reduces total logic available for general LUT-based design, so early floorplanning and Quartus (or MAX+PLUS II) resource estimation is recommended before commit.

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EPF10K20RC240-4 - FLEX 10K FPGA 20K Gates 240-BFQFP | Intel
EPF10K20RC240-4

EPF10K20RC240-4 - FLEX 10K FPGA 20K Gates 240-BFQFP | Intel

The Intel (formerly Altera) EPF10K20RC240-4 is a member of the FLEX 10K family of embedded programmable logic devices (PLDs), delivering approximately 20,000 usable gates in a 240-pin BFQFP (RQFP) exposed-pad package. The device integrates 1,152 logic elements across 144 LABs (logic array blocks) and offers 189 user I/O pins, providing system-on-a-programmable-chip (SOPC) integration in a single device. It is fabricated on a 0.42 µm CMOS process and operates from a 5 V supply with industrial 0 °C to 70 °C temperature support. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit hierarchically below ASICs and above standard logic in flexibility-vs-cost, and the FLEX 10K family specifically pioneered embedded array blocks (EABs) for on-chip SRAM/ROM, enabling system-on-chip integration of logic plus memory in one device. Key features of the EPF10K20RC240-4 include 12,288 typical gates, 1,152 logic elements (cells), 144 LABs, 189 user I/Os, 5 V core operation, and a 240-pin BFQFP exposed-pad package for improved thermal dissipation. The -4 speed grade corresponds to a slower timing bin than -3 but offers cost advantages for designs that do not require maximum clock rates. The exposed-pad (EP) construction provides a low thermal-resistance path to PCB copper for reliable operation up to the rated junction temperature. Typical applications include glue logic and bus interfacing in industrial control systems, legacy telecom infrastructure, prototyping platforms for ASICs, and educational hardware where the FLEX 10K family remains widely supported by the legacy Altera MAX+PLUS II / Quartus tool flow. The 189 I/O count is well matched to peripheral-rich embedded designs. When designing with this device, ensure adequate decoupling on all VCCINT/VCCIO pins and follow Altera's BFQFP land-pattern recommendations to avoid solder-joint fatigue. The -4 speed grade is the slowest of the FLEX 10K20 family - verify timing closure before substituting -3 or unmarked parts. This page synthesizes distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not aggregated in any single manufacturer datasheet.

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EPF10K20RI208-4 - FLEX 10K FPGA, 20K Gates, 208-Pin RQFP | Altera
EPF10K20RI208-4

EPF10K20RI208-4 - FLEX 10K FPGA, 20K Gates, 208-Pin RQFP | Altera

The Intel (formerly Altera) EPF10K20RI208-4 is a member of the FLEX 10K family of Field-Programmable Gate Arrays (FPGAs) integrating approximately 20,000 typical gates with 1,152 logic elements (LEs), 12,288 bits of embedded SRAM and 144 LABs in a 208-pin RQFP (Power Quad Flat Pack) exposed-pad package. According to the Altera FLEX 10K datasheet family, this member supports up to 147 user I/O pins and operates from a 5 V supply at up to 125 MHz internal performance using a 0.42 µm CMOS SRAM process. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect and I/O cells that the designer programs after manufacture. FPGAs sit hierarchically above Application-Specific Integrated Circuits (ASICs) and microcontrollers in the digital logic landscape: they provide ASIC-class performance and parallelism while retaining the ability to be re-programmed in the field. The FLEX 10K series was Altera's first embedded-memory SRAM-based FPGA family, pioneering the look-up-table (LUT) plus embedded-array-block (EAB) architecture that influenced later families such as APEX, Cyclone and the modern Intel Cyclone/Agilex lines. Key features of the EPF10K20RI208-4 include 1,152 logic elements distributed across 144 Logic Array Blocks, 12 Kbits of true dual-port SRAM realized as Embedded Array Blocks, 147 usable I/Os, low-power CMOS technology, FastTrack Interconnect for predictable timing closure, and 100% functional test coverage at the factory. The "-4" speed grade designates the slowest (most conservative timing) of the FLEX 10K grades, giving the best timing margin in return for lower Fmax. The "I" pin-suffix marks the industrial temperature range (–40 °C to +85 °C), and "R" denotes the RQFP package family. Architecturally, FLEX 10K devices combine a sea-of-LABs fabric with column-based EAB memory; each LAB contains 8 LEs and each LE a 4-input LUT plus a programmable register. The FastTrack continuous routing structure delivers fast, predictable interconnect delays that simplify static timing closure compared with segmented routing architectures of competitor families of the era. Typical applications for the EPF10K20RI208-4 include telecommunications glue logic, industrial control and factory automation controllers, prototyping for ASIC emulation, DSP pre/post-processing pipelines, PCI bus interface bridges, and embedded control subsystems where moderate logic density and on-chip SRAM suffice. The 208-pin RQFP footprint makes it suitable for through-hole and socketed legacy designs where BGAs would be impractical. When designing with this device, remember that the FLEX 10K family requires a 5 V supply and a separate configuration EPROM (typically EPC2) loaded via the serial or parallel passive-serial configuration scheme. JTAG boundary-scan testing is supported via the IEEE Std 1149.1 (JTAG) interface for in-system programming and board test. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical legacy-design notes not found in the original manufacturer datasheet.

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