EPF10K20RC240-4 - FLEX 10K FPGA 20K Gates 240-BFQFP | Intel
料号： EPF10K20RC240-4 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $104.66 | $104.66 |
| 10 | $95.2 | $952.00 |
| 100 | $82.4 | $8,240.00 |
| 500 | $74.1 | $37,050.00 |
| 1,000 | $67.85 | $67,850.00 |
EPF10K20RC240-4 概述
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit hierarchically below ASICs and above standard logic in flexibility-vs-cost, and the FLEX 10K family specifically pioneered embedded array blocks (EABs) for on-chip SRAM/ROM, enabling system-on-chip integration of logic plus memory in one device.
Key features of the EPF10K20RC240-4 include 12,288 typical gates, 1,152 logic elements (cells), 144 LABs, 189 user I/Os, 5 V core operation, and a 240-pin BFQFP exposed-pad package for improved thermal dissipation. The -4 speed grade corresponds to a slower timing bin than -3 but offers cost advantages for designs that do not require maximum clock rates. The exposed-pad (EP) construction provides a low thermal-resistance path to PCB copper for reliable operation up to the rated junction temperature.
Typical applications include glue logic and bus interfacing in industrial control systems, legacy telecom infrastructure, prototyping platforms for ASICs, and educational hardware where the FLEX 10K family remains widely supported by the legacy Altera MAX+PLUS II / Quartus tool flow. The 189 I/O count is well matched to peripheral-rich embedded designs.
When designing with this device, ensure adequate decoupling on all VCCINT/VCCIO pins and follow Altera's BFQFP land-pattern recommendations to avoid solder-joint fatigue. The -4 speed grade is the slowest of the FLEX 10K20 family - verify timing closure before substituting -3 or unmarked parts.
This page synthesizes distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not aggregated in any single manufacturer datasheet.
直接替换替代料： EPF10K20RC240-4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K20RC240-4 （相同外形与封装尺寸） ——差异在于 Package, RoHS Status, Family, Mounting Type, Logic Array Blocks (LABs).
快速对比工具——选择替代料号进行并排对比：
EPF10K20RC240-3
✅ 直接替换✓ 有现货
$21.2 / 个
查看数据手册 →EPF10K20RC240-3N
✅ 直接替换✓ 有现货
$23.1 / 个
查看数据手册 →EPF10K20RC240-4N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF10K20RC208-4
✅ 直接替换✓ 有现货
$19.85 / 个
查看数据手册 →EPF10K20RC240-4 最大额定值与电气特性
| Family | FLEX 10K |
| Typical Gates | 20,000 |
| Logic Elements / Cells | 1,152 |
| Logic Array Blocks (LABs) | 144 |
| User I/Os | 189 |
| 封装 | 240-BFQFP Exposed Pad (RQFP) |
| 引脚数量 | 240 |
| 电源电压 | 5 V |
| Process Technology | 0.42 µm CMOS |
| 工作温度 | 0 °C to 70 °C |
| Speed Grade | -4 |
| Propagation Delay | 0.4 ns (per DigChip) |
| 安装类型 | Surface Mount |
| RoHS 状态 | non_compliant (legacy BFQFP, SnPb finish) |
| Embedded Memory | EAB (Embedded Array Block) SRAM/ROM |
EPF10K20RC240-4 240-bfqfp exposed pad (rqfp) 引脚配置指南
EPF10K20RC240-4（240-bfqfp exposed pad (rqfp) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K20RC240-4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K20RC240-4 适用于 6 应用s: Industrial Glue Logic and Bus Interfacing, Legacy Telecom Infrastructure, ASIC Prototyping Platform, Educational Hardware and FPGA Training, Test and Measurement Equipment Backplanes, Military and Aerospace Legacy Avionics.
Industrial Glue Logic and Bus Interfacing
The EPF10K20RC240-4 excels as glue logic between legacy microcontrollers, memory, and peripheral buses in industrial control systems. Its 189 user I/Os handle address/data multiplexing, chip-select decoding, and timing-protocol bridging in a single device, replacing dozens of 74-series logic gates. The 5 V tolerant I/Os and 0.70 C operating range align with factory-floor temperature profiles, while 1,152 logic elements provide ample headroom for state-machine-rich protocol converters (e.g., ISA-to-PCI, VME bridge logic).
推荐
Legacy Telecom Infrastructure
In telecom central-office equipment of the 1990s-2000s era, the EPF10K20RC240-4 implemented framing, line-card control, and backplane arbitration functions. Its embedded array blocks (EABs) provide on-chip dual-port SRAM for small FIFO buffers between TDM time slots, eliminating external RAM and reducing board area. The 240-BFQFP exposed-pad package is robust against the vibration and thermal cycling of telecom racks, and Altera's mature configuration bitstream toolchain (MAX+PLUS II) ensures bitstream reproducibility for decades-long field support.
推荐
ASIC Prototyping Platform
Designers used the EPF10K20RC240-4 as an FPGA prototype before committing an ASIC to fab, validating RTL logic at near-ASIC clock rates thanks to the -3 and -4 speed grades. The 1,152 logic elements plus EAB SRAM map cleanly to standard-cell ASIC gate libraries, and Quartus II synthesis reports correlate well with ASIC synthesis timing. For digital-signal-processing or bus-protocol prototypes that will eventually migrate to a 0.18 µm ASIC, the 240-BFQFP exposed pad provides the thermal margin needed for sustained burn-in testing.
推荐
Educational Hardware and FPGA Training
University digital-design labs adopted the EPF10K20RC240-4 on Altera UP2 and similar education boards because the FLEX 10K family balances logic density, JTAG-friendly configuration, and student-friendly MAX+PLUS II GUI. The 189 I/Os expose students to buses, LEDs, seven-segment displays, and VGA/PS2 interfaces simultaneously, and the EAB SRAM teaches embedded-memory concepts. The device remains in active use at universities worldwide, and the legacy toolchain is freely downloadable for educational purposes.
推荐
Test and Measurement Equipment Backplanes
Instruments such as logic analyzers, protocol testers, and modular ATE systems used the EPF10K20RC240-4 as a backplane arbiter between instrument cards. Its 189 I/Os accommodate multi-drop test buses, trigger distribution, and high-speed pattern generation, while the embedded EABs implement deep pattern-capture FIFOs. The exposed-pad 240-BFQFP package ensures reliable operation across the 0 °C to 70 °C commercial-industrial range typical of laboratory environments.
推荐
Military and Aerospace Legacy Avionics
Avionics LRUs (line-replaceable units) from the late 1990s incorporate the EPF10K20RC240-4 for MIL-STD-1553 bus termination, ARINC 429 decoding, and discrete I/O aggregation. Although not formally MIL-PRF-38535 qualified, the plastic BFQFP package has demonstrated decades-long field reliability in commercial-derivative military systems. Because avionics programs demand 20+ year sustainment, the EPF10K20RC240-4 remains in active procurement through brokers and franchised inventory for these long-life platforms.
推荐
推荐产品汇总
工程参考数据： EPF10K20RC240-4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K20RC240-3 | EPF10K20RC240-3N | EPF10K20RC240-4N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same |
| Family | FLEX 10K | FLEX 10K - same | FLEX 10K - same | FLEX 10K - same |
| Logic Elements / Cells | 1,152 | 1,152 | 1,152 | 1,152 |
| Typical Gates | 20,000 | 20,000 | 20,000 | 20,000 |
| User I/Os | 189 | 189 | 189 | 189 |
| Speed Grade | -4 (slowest) | -3 (one bin faster) | -3 (one bin faster) | -4 (same speed grade) |
| RoHS / Pb-Free | SnPb finish (non-RoHS) | SnPb (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
关键差异点
- Original baseline FLEX 10K20 with -4 speed grade （对比 EPF10K20RC240-3)
- SnPb finish for legacy assembly lines （对比 EPF10K20RC240-4N)
- 189 user I/Os in a single 240-BFQFP package （对比 EPF10K20RC208-4)
设计说明
The 240-BFQFP exposed-pad package requires the central thermal pad to be soldered to a PCB copper pour of at least 1 square inch for rated operation. Estimated: at 5 V VCCINT and typical 200 mA active current, junction-to-ambient thermal resistance is roughly 25 C/W with a 1 in² 4-layer copper pour, supporting 0 °C to 70 °C operation at moderate toggle rates. Without the EP soldered, internal junction temperatures may exceed 100 °C during continuous operation.
Place 0.1 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair, plus bulk 10 µF tantalum capacitors at each supply rail entry point. The 240-BFQFP package has 1.27 mm pitch - route signals on inner layers to avoid crosstalk on long outer-layer traces. Follow Altera's recommended 4-layer stack-up with continuous ground plane beneath the device to control return-path impedance for the JTAG configuration signals (TCK, TMS, TDI, TDO).
Critical pitfalls when migrating between FLEX 10K20 speed grades: (1) verify that the -3 part's improved timing margin is genuine for your specific design paths, not just nominal; (2) the 'N' suffix denotes Pb-free finish and is electrically identical but may have different reflow-profile requirements (peak 260 °C vs 220 °C); (3) configuration bitstreams are speed-grade-dependent - do not use a -3 bitstream on a -4 device without resynthesis; (4) JTAG chain order matters when programming multiple devices via ByteBlaster.
合规信息
Original EPF10K20RC240-4 is non-RoHS (SnPb finish). The EPF10K20RC240-4N variant is Pb-free/RoHS-compliant. Not AEC-Q100 qualified; FLEX 10K is a commercial/industrial family not automotive-grade.
