MCIMX6U4AVM08AB
MCIMX6U4AVM08AB - i.MX6 DualLite ARM Cortex-A9 800MHz MPU | NXP
The NXP MCIMX6U4AVM08AB is an i.MX 6 series 32-bit applications processor built on ARM Cortex-A9 dual-core architecture running at 800 MHz, housed in a 624-pin MAPBGA (21x21 mm) package. The i.MX6 DualLite variant (i.MX6DL) combines two Cortex-A9 cores with the NEON SIMD engine and features integrated multimedia capabilities including hardware-accelerated video codecs, graphics processing, and audio interfaces suited to multimedia applications.
An applications processor (AP) is a system-on-chip (SoC) class IC designed to run an operating system and execute complex application workloads, sitting hierarchically above microcontrollers and below multi-chip server CPUs in the embedded computing stack. The i.MX6 family extends this with NXP's IP for multimedia — hardware video codecs, GPU blocks, image processing pipelines — and integrates DRAM controllers, display/LVDS interfaces, Ethernet MACs, USB, and PCIe PHYs alongside the CPU cores, giving board designers a single-chip computing platform for industrial HMI, automotive infotainment, and connected consumer devices.
Key features include dual ARM Cortex-A9 cores at 800 MHz with 32 KB L1 instruction cache, 32 KB L1 data cache, and a unified 256 KB L2 cache. The integrated IPUs, GPU (Vivante GC320 2D plus optional GC880 3D shader), and VPU support 1080p video decode/encode and dual-display output. Connectivity includes one Gigabit Ethernet MAC with AVB support, two USB 2.0 OTG controllers plus one USB 2.0 host, PCIe 2.0, SATA II, four UARTs, four I2C, three SPI, and CAN bus interfaces. The chip is manufactured in a 40 nm CMOS low-power process and supports DDR3/DDR3L/LPDDR2 memory with the hardware Multi-Mode DDR controller.
From an architectural perspective, the i.MX6DL utilizes a multi-level memory hierarchy with speculative out-of-order execution on the Cortex-A9 pair, giving strong single-threaded performance for system code while keeping two cores available for parallelized workload partitioning. NXP's Smart Speed Technology provides dynamic voltage and frequency scaling across CPU, GPU, and peripheral domains, enabling the 800 MHz operating point used here. The internal 624-pin BGA provides extensive I/O for multimedia-rich designs while remaining compatible with the i.MX6Q (Quad), i.MX6D (Dual), i.MX6S (Solo), and i.MX6UL/6ULL families in adjacent designs.
Typical applications span industrial human-machine interfaces (HMI), point-of-sale (POS) terminals, building automation control panels, automotive infotainment head units (with the Q1 graded parts recommended for AEC-Q100 designs), medical patient-monitoring displays, and networked smart-home gateways. The DualLite variant targets designs that need two Cortex-A9 cores but no 3D GPU shader (the GC880 is unpopulated on this die variant), reducing cost versus the Quad part while retaining L2 cache and full Cortex-A9 compute headroom.
When designing with this part, ensure the board provides adequate thermal dissipation — at 800 MHz the typical power envelope sits between 2 W and 4 W depending on workload, and the 21x21 BGA benefits from a four-layer PCB with thermal vias under the die. DDR3/LPDDR2 routing must follow NXP's i.MX6 hardware design guide for signal integrity, and the boot configuration pins need to be latched correctly by the onboard PMIC at POR.
This page combines NXP datasheet specifications, current distributor pricing across DigiKey/Mouser/Octopart, drop-in same-package alternative parts, and engineering design notes that go beyond the basic product page found on distributor sites.
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