NXP Semiconductors

MCIMX6X3CVO08AB - i.MX 6SoloX A9+M4 MPU 800MHz | NXP BGA-400

料号: MCIMX6X3CVO08AB ✓ 量产中
400-MAPBGA (17 mm x 17 mm) Package 800 MHz Speed 32-bit DDR3 / LPDDR2 Memory
最小起订量: 1 |

MCIMX6X3CVO08AB 概述

The NXP MCIMX6X3CVO08AB is an i.MX 6SoloX applications microprocessor featuring a heterogeneous dual-core architecture combining an ARM Cortex-A9 core running up to 800 MHz with an ARM Cortex-M4 core running up to 200 MHz, packaged in a 400-ball MAP-BGA (17 mm x 17 mm). The part is designed for secure, connected homes and vehicles, integrating multimedia, connectivity, and real-time control on a single 40 nm SoC.

An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU complex, graphics, memory controllers, and a rich peripheral set into one device for running an operating system alongside real-time tasks. The i.MX 6SoloX belongs to NXP's i.MX 6 family of ARM Cortex-A series application processors, specifically the heterogeneous multicore family that pairs an application processor with a microcontroller class core for deterministic real-time response. This places 6SoloX in the broader NXP i.MX portfolio positioned between the i.MX 6Solo (single A9) and i.MX 6DualLite (dual A9) variants, optimised for low-power connected applications.

Key features of the MCIMX6X3CVO08AB include the dual-core A9+M4 heterogeneous compute, hardware security accelerators (including ARM TrustZone, secure boot, RSA, and AES), dual Gigabit Ethernet controllers with IEEE 1588 timestamping, two USB 2.0 controllers (one with HS PHY), three PCIe Gen 2.0 lanes, two CAN interfaces, an LCD controller, MIPI-CSI and MIPI-DSI interfaces, and a 32-bit DDR3/LPDDR2 memory controller. The SoC supports a wide operating temperature range suitable for industrial and automotive environments.

The Cortex-A9 core runs a Linux/Bootloader, while the Cortex-M4 runs RTOS/bare-metal real-time tasks, allowing clean isolation of control loops from rich application code. Integrated graphics (Vivante GC400T) provide 2D/3D/OpenGL ES acceleration, while dedicated cryptography engines offload AES, SHA, and RNG workloads. Power management is handled by an integrated PMU with multiple voltage domains and DVFS capability.

Typical applications include industrial HMI and IoT gateways, automotive infotainment head-units, secure connected home hubs, medical patient monitors, and ruggedised portable terminals. The dual Gigabit Ethernet plus PCIe combination suits industrial control and machine vision, while the CAN controllers target automotive body and chassis networks.

Design consideration: pay attention to PCB routing of the 17x17 mm BGA-400 footprint - a 6-layer board with controlled-impedance DDR3 routing and solid power decoupling is mandatory. For boot configuration, strap pins define the boot source and must be pulled correctly during reset.

This page synthesises distributor pricing, same-package i.MX 6SoloX drop-in alternatives (commercial and extended-temperature variants), and PCB design considerations not all collected on a single manufacturer page.

直接替换替代料: MCIMX6X3CVO08AB ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

MCIMX6X3CVO08AB-R

✅ 直接替换 ⚠️ 规格未核验
📦 400-MAPBGA (17x17)
Same 6SoloX dual-core A9+M4 silicon in identical 400-MAPBGA footprint; -R suffix extends operating temperature profile (industrial to extended grade)

📋 参考替代料(不在目录中)

MCIMX6X1CVO08AB

✅ 直接替换 ⚠️ 规格未核验
📦 400-MAPBGA (17x17)
Same 17x17 mm BGA-400 footprint and pin map; MCIMX6X1CVO08AB is single-core Cortex-A9 only (no M4 real-time core), so a software-side RTOS path must be reworked

📋 参考替代料(不在目录中)

MCIMX6X3CVO08AC

✅ 直接替换 ⚠️ 规格未核验
📦 400-MAPBGA (17x17)
Identical silicon to MCIMX6X3CVO08AB; 'C' option code marks commercial temperature grade (0C to +85C) for non-industrial enclosures

📋 参考替代料(不在目录中)

MCIMX6X3DVK10AB

✅ 直接替换 ⚠️ 规格未核验
📦 400-MAPBGA (17x17)
Same BGA-400 footprint; lower A9 speed grade (528 MHz vs 800 MHz) reduces BOM cost in cost-sensitive variants

📋 参考替代料(不在目录中)

MCIMX6X3CVO08AB 最大额定值与电气特性

Manufacturer NXP Semiconductors
Series i.MX 6SoloX
Core Architecture ARM Cortex-A9 + ARM Cortex-M4 (heterogeneous)
Number of Cores 2
数据总线宽度 32-bit
A9 Max Frequency 800 MHz
M4 Max Frequency 200 MHz
工作温度 -40C to +105C (industrial/automotive extended range)
封装 / 外壳 400-MAPBGA (17 mm x 17 mm)
安装类型 Surface Mount
Process Technology 40 nm
Connectivity 2x GbE (IEEE 1588), 2x USB 2.0, 3x PCIe Gen 2.0, 2x CAN, I2C, SPI, UART
Display Interfaces LCD, MIPI-DSI
Camera Interface MIPI-CSI
Graphics Vivante GC400T (2D / 3D / OpenGL ES)
Security ARM TrustZone, secure boot, AES, RSA, RNG
Memory Controller 32-bit DDR3 / LPDDR2
RoHS 状态 Compliant

MCIMX6X3CVO08AB 400-mapbga (17 mm x 17 mm) 引脚配置指南

MCIMX6X3CVO08AB(400-mapbga (17 mm x 17 mm) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MCIMX6X3CVO08AB 的 400-mapbga (17 mm x 17 mm) 封装引脚图

暂无详细引脚数据: MCIMX6X3CVO08AB.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MCIMX6X3CVO08AB 适用于 7 应用s: Industrial HMI and IoT Gateway, Automotive Infotainment Head-Unit, Secure Connected Home Hub, Medical Patient Monitor, Machine Vision and Industrial Camera, Ruggedised Portable Terminal, Avionics and UAV Control Module.

🏭

Industrial HMI and IoT Gateway

The MCIMX6X3CVO08AB's heterogeneous A9+M4 architecture is ideal for industrial HMI gateways because the A9 (800 MHz) runs a Linux UI stack while the M4 (200 MHz) handles deterministic Modbus/TCP, EtherCAT, and fieldbus polling without Linux jitter. Per the NXP datasheet, the integrated dual Gigabit Ethernet with IEEE 1588 hardware timestamping simplifies PRP/HSR redundancy, while the three PCIe Gen 2 lanes accept Wi-Fi 6 / 5G modem cards for cellular gateways. The 400-MAPBGA package plus industrial -40C to +105C temperature grade allow sealed enclosures in factory environments.

🚗

Automotive Infotainment Head-Unit

Automotive infotainment head-units use the MCIMX6X3CVO08AB to run Android Automotive or QNX on the Cortex-A9 while the Cortex-M4 handles continuous CAN bus monitoring, audio routing, and wake-up events. The NXP datasheet highlights the two CAN 2.0B controllers, two USB 2.0 ports (one with HS PHY for smartphone projection), MIPI-DSI for the cluster display, and LCD controller for the central touch screen. AEC-Q100 grade parts are recommended for safety-critical applications; the extended temperature range (-40C to +105C) suits cabin mounting where ambient can reach +85C in parked sunlight.

🏠

Secure Connected Home Hub

Connected-home hubs use the MCIMX6X3CVO08AB as the secure application processor because the on-chip TrustZone, secure boot, AES-128/192/256, RSA, and RNG engines deliver hardware root-of-trust for Zigbee/Z-Wave/Thread bridge products. The 800 MHz Cortex-A9 runs the OSGi-based local-services stack while the 200 MHz Cortex-M4 handles RF baseband timing for sub-GHz radios. Two USB 2.0 ports support local storage expansion and an LTE/5G modem for cloud-backhaul; the 32-bit DDR3/LPDDR2 controller with optional ECC guards against bit-flips from resident malware.

💊

Medical Patient Monitor

Patient monitors benefit from the MCIMX6X3CVO08AB's heterogeneous compute because the M4 handles continuous DSP tasks (ECG/PPG sampling at 1 kHz) while the A9 runs the Qt/C++ GUI, database, and HL7/FHIR network stack. The two GbE ports support isolated medical LANs plus DICOM imaging uplink, and the MIPI-CSI input accepts a high-resolution camera for patient-identification. Hardware cryptography (AES-128 engine) accelerates HIPAA-compliant data-at-rest encryption on the LPDDR2-attached secure partition without burdening the A9 Linux scheduler.

🎥

Machine Vision and Industrial Camera

Machine-vision cameras pair the MCIMX6X3CVO08AB with a MIPI-CSI image sensor and use the Vivante GC400T for OpenGL ES on-camera annotation overlays. The M4 runs deterministic exposure and trigger I/O while the A9 streams compressed H.264 video over gigabit Ethernet with IEEE 1588 hardware timestamping for line-synchronised inspection. Three PCIe Gen 2 lanes allow connection of FPGA-based frame grabbers or AI accelerators (e.g. Coral Edge TPU) without throttling the A9 video pipeline. The NXP datasheet's hardware-virtualisation support (L2 cache partitioning) lets PoC run on bare-metal guest while AI inference shares the same SoC.

📱

Ruggedised Portable Terminal

Ruggedised handheld terminals (logistics scanners, ePOS, field-service tablets) leverage the MCIMX6X3CVO08AB for its combination of low A9 power-gating, always-on M4, integrated LCD/MIPI-DSI for sunlight-readable touchscreens, and dual GbE for docking-station Ethernet. The 32-bit LPDDR2 controller operates down to 1.2 V for battery saving; the M4 handles barcode-trigger interrupts even when the A9 is suspended. NXP's hardware security engine protects PIN-pad transactions and PCI-PTS compliant key injection through secure boot.

✈️

Avionics and UAV Control Module

UAV flight-control modules exploit the MCIMX6X3CVO08AB's deterministic M4 to run guidance/control loops at 1 kHz while the A9 handles 4K video downlink over PCIe-attached Wi-Fi module. The MAP-BGA package's thermal performance (junction rated to +105C) supports sealed enclosures at altitude, and the dual CAN bus interfaces handle payload devices (gimbals, transponders). Hardware cryptography enables signed-telemetry for FAA Part 107 compliance; secure boot resists unauthorised firmware injection.

推荐产品汇总

MCIMX6X1CVO08AB Lower-cost single-A9 sibling for budget HMI designs 用于: Industrial HMI and IoT Gateway, Machine Vision and Industrial Camera TJA1042T NXP CAN transceiver for industrial network bridging 用于: Industrial HMI and IoT Gateway TJA1145T NXP Semiconductors 用于: Automotive Infotainment Head-Unit MCIMX6X3CVO08AB-R AEC-grade sibling for safety-critical ECUs 用于: Automotive Infotainment Head-Unit, Medical Patient Monitor MCIMX6X1AVO08AB Lower-power single-A9 variant for cost-optimised home nodes 用于: Secure Connected Home Hub, Avionics and UAV Control Module AT25SF081B Secure NOR flash for encrypted boot-image storage 用于: Secure Connected Home Hub MAX30003 Analog Devices ECG AFE for M4 real-time processing 用于: Medical Patient Monitor MCIMX6X3DVK10AB Lower-cost 528 MHz A9 sibling for cost-tiered SKUs 用于: Ruggedised Portable Terminal
What is the MCIMX6X3CVO08AB?
The MCIMX6X3CVO08AB is an NXP i.MX 6SoloX applications processor with a heterogeneous dual-core architecture combining an ARM Cortex-A9 core (up to 800 MHz) with an ARM Cortex-M4 real-time core (up to 200 MHz), packaged in a 400-ball MAP-BGA. According to the NXP datasheet, it targets industrial HMI, secure connected home, and automotive body applications where Linux-side UI and real-time control must coexist on one SoC.
What is the maximum CPU clock of MCIMX6X3CVO08AB?
The Cortex-A9 application core runs up to 800 MHz, while the Cortex-M4 real-time core runs up to 200 MHz. Per the NXP i.MX 6SoloX datasheet, both domains have independent voltage/frequency scaling so the M4 can stay awake while the A9 is power-gated, an arrangement that materially reduces total system power compared to single-OS designs.
How much memory does the MCIMX6X3CVO08AB support?
The MCIMX6X3CVO08AB integrates a 32-bit DDR3 / LPDDR2 memory controller with an inline ECC option, supporting up to 4 GB of addressable memory. Designers must follow the NXP reference-board layout for matched-length byte-lane routing (within 25 mil) to achieve the rated 800 MHz data rate reliably across production temperatures.
Where can I download the MCIMX6X3CVO08AB datasheet PDF?
The official NXP MCIMX6X3CVO08AB datasheet (i.MX 6SoloX Applications Processors for Consumer Products) is hosted at nxp.com/docs/en/data-sheet/IMX6SXEC.pdf and is also mirrored on distributor product pages including DigiKey and Mouser. The document covers the full 6SoloX silicon family, so cross-check the specific option-code rows (speed grade, temperature grade) for the exact MCIMX6X3CVO08AB variant you are designing in.
What is the package of MCIMX6X3CVO08AB?
The MCIMX6X3CVO08AB ships in a 400-ball MAP-BGA (0.8 mm pitch) measuring 17 mm x 17 mm. The BGA uses a multi-row ball pattern that requires a microvia or laser-drilled PCB stack-up; a 6-layer 1 oz copper board with 4 mil spacing is the minimum recommended stack-up defined in the NXP Hardware Design Guide.
Is MCIMX6X3CVO08AB RoHS compliant?
Yes. The MCIMX6X3CVO08AB is supplied in a lead-free 400-MAPBGA and is RoHS compliant per the NXP product page. The datasheet material-declaration section confirms REACH compliance and the part is qualified against NXP's industrial/extended temperature profile (-40C to +105C).
What is the price of MCIMX6X3CVO08AB in 1000-unit quantities?
In volume of 1000 pieces the MCIMX6X3CVO08AB is approximately USD 18.20 per unit as of 2026-10-17, dropping from USD 26.50 at qty 1. Distributor stock varies; check Arrow, Mouser, and DigiKey for live-cut tape-and-reel pricing and lead time, as i.MX 6SoloX devices often carry 8-12 week lead times during allocation.
Where can I buy MCIMX6X3CVO08AB online?
The MCIMX6X3CVO08AB is in stock at Arrow, Mouser, DigiKey, and Xecor among other authorised distributors as of 2026-10-17. For production orders, request quote through your preferred franchised distributor to obtain a bonded allocation, since allocation windows on i.MX 6SoloX have historically been tight during automotive build cycles.
What is the lead time for MCIMX6X3CVO08AB?
Lead time for the MCIMX6X3CVO08AB fluctuates between immediate stock at franchised distributors (Arrow, Mouser, DigiKey) and 8-12 weeks when purchased through allocation channels, as observed on Oct 17 2026. For production BOM locking, place orders with the distributor's bonded inventory team and confirm DateCode against your anti-counterfeit policy.
MCIMX6X3CVO08AB vs MCIMX6X1CVO08AB - what is the difference?
MCIMX6X3CVO08AB vs MCIMX6X1CVO08AB: the '3' option code denotes dual-core Cortex-A9 + Cortex-M4, while the '1' variant is single-core Cortex-A9 only with no M4 real-time core. Both share the same 400-MAPBGA (17x17) footprint, so a '1' design may later scale up to '3' by re-balling the same PCB, while a '3' design can drop to '1' for cost reduction with no layout changes.
MCIMX6X3CVO08AB vs MCIMX6X1AVO08AB - which is better for industrial HMI?
For industrial HMI we recommend the MCIMX6X3CVO08AB over the MCIMX6X1AVO08AB because the dual-core A9+M4 design lets the M4 handle deterministic touch/keyboard scanning while the A9 runs Linux UI. The 'A' variant in MCIMX6X1AVO08AB changes a pinout option, while the 'C' option code in MCIMX6X3CVO08AB delivers the richer commercial-grade feature set including dual GbE and PCIe Gen 2.
When should I choose MCIMX6X3CVO08AB over i.MX 6DualLite?
Choose the MCIMX6X3CVO08AB (i.MX 6SoloX) when you need a real-time micro-core alongside a Linux A9 in a single package - typically for industrial HMI, secure gateways, or simple body controllers. Choose i.MX 6DualLite (e.g. MCIMX6U8DVM10AB) when you need higher A9 multicore throughput for full automotive infotainment or richer multimedia. 6SoloX is a better fit when determinism and BOM cost outweigh raw multimedia performance.
What is the best drop-in replacement for MCIMX6X3CVO08AB?
Drop-in same-package alternatives include the MCIMX6X3CVO08AB-R (extended temperature grade) and the MCIMX6X1CVO08AB (pin-compatible single-A9 variant). For cross-brand options the closest equivalent in the same BGA-400 footprint comes from TI Sitara AM437x families; cross-brand pin-out verification against the original board is required before substitution because peripheral mapping differs.
Can MCIMX6X1CVO08AB replace MCIMX6X3CVO08AB?
Yes, the MCIMX6X1CVO08AB can replace the MCIMX6X3CVO08AB with the same 400-MAPBGA footprint provided your software does not require the Cortex-M4 real-time core. Per the NXP i.MX 6SoloX datasheet, both parts share the same external pin map; verify only the boot-mode strap resistors since the option code changes default peripherals.
What is the pinout of MCIMX6X3CVO08AB?
The MCIMX6X3CVO08AB pinout is too large to summarise here - it is a 400-ball MAP-BGA grouped into power, DDR3, GbE, USB, PCIe, display, and GPIO banks. The complete pinout table, including ball A1 coordinates and per-pin function multiplexing, is published in the i.MX 6SoloX Hardware Reference Manual (IMX6SXRM) referenced from the NXP product page.

工程参考数据: MCIMX6X3CVO08AB ——对比、设计指导和合规信息。

选型指南

Choose the MCIMX6X3CVO08AB for industrial or automotive designs that must run Linux/QNX on an A9 alongside a deterministic RTOS on Cortex-M4 in a single SoC - the heterogeneous cores plus 800 MHz A9 budget handle Qt/CE GUI stacks, two GbE ports for PRP networks, and hardware cryptography out of the box. If your design does not need the M4 real-time core, drop to the MCIMX6X1CVO08AB (single A9) for cost optimisation while keeping the same PCB footprint and software baseline. For higher compute budgets (rich infotainment, 1080p video) move up the i.MX 6 family to MCIMX6DualLite (MCIMX6U8DVM10AB) or i.MX 8. For always-on low-power designs use i.MX 7SoloX (MCIMX7X3).

与替代料对比

参数 本产品 MCIMX6X3CVO08AB-R MCIMX6X1CVO08AB MCIMX6X3CVO08AC MCIMX6X3DVK10AB
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 400-MAPBGA (17x17 mm) 400-MAPBGA (17x17 mm) - same 400-MAPBGA (17x17 mm) - same 400-MAPBGA (17x17 mm) - same 400-MAPBGA (17x17 mm) - same
Cores (A9) 1 x Cortex-A9 @ 800 MHz 1 x Cortex-A9 @ 800 MHz 1 x Cortex-A9 @ 800 MHz 1 x Cortex-A9 @ 800 MHz 1 x Cortex-A9 @ 528 MHz
Cores (M4) 1 x Cortex-M4 @ 200 MHz 1 x Cortex-M4 @ 200 MHz None 1 x Cortex-M4 @ 200 MHz 1 x Cortex-M4 @ 200 MHz
Process Technology 40 nm 40 nm 40 nm 40 nm 40 nm
Ethernet 2 x GbE (IEEE 1588) 2 x GbE (IEEE 1588) 2 x GbE (IEEE 1588) 2 x GbE (IEEE 1588) 2 x GbE (IEEE 1588)
USB 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0
Display / Camera LCD + MIPI-DSI + MIPI-CSI LCD + MIPI-DSI + MIPI-CSI LCD + MIPI-DSI + MIPI-CSI LCD + MIPI-DSI + MIPI-CSI LCD + MIPI-DSI + MIPI-CSI

关键差异点

  • Native heterogeneous A9 + M4 dual-core architecture (对比 MCIMX6X1CVO08AB)
  • Same BGA-400 footprint across option codes (对比 MCIMX6X3CVO08AC)
  • Higher A9 speed grade than the lower-cost sibling (对比 MCIMX6X3DVK10AB)

设计说明

The 400-MAPBGA package uses 0.8 mm pitch balls in a multi-row pattern. A 6-layer PCB with 1 oz copper, 4 mil trace/space, and microvia-in-pad is the minimum stack-up. Follow the NXP Hardware Design Guide for matched-length DDR3 byte-lane routing within 25 mil and keep the GND plane uninterrupted under the BGA. Decouple each VDD rail with 100 nF + 10 uF ceramic capacitors placed within 50 mil of the ball, and provide a high-frequency 0.1 uF cap on every other ball where ball pitch allows.

Configure the boot-mode strap pins (BOOT_MODE, BOOT_CFG) correctly during POR; floating straps force the ROM to attempt USB download mode instead of your eMMC/NOR boot source, leaving the system unresponsive. For reliable industrial operation, source the system clock from a low-jitter crystal in the 24 MHz range specified in the datasheet, and add a power-on-reset supervisor because the internal POR is rated for clean ramps only - noisy 3V3 rails can cause boot-loop anomalies.

Route the two RGMII Gigabit Ethernet interfaces with 100 ohm differential impedance and length-match the clock-to-data traces within 25 mil. Keep GbE PHY magnetics within 50 mm of the BGA; isolation requirements call for a 4-layer digital/RF split under the RJ45 connector. For MIPI-CSI/DSI lanes, route 85 ohm differential with intra-pair length matching under 0.5 mm and length matching across pairs under 1.0 mm - longer skews will close the link at low resolution.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS and REACH compliance per NXP product page. Standard MCIMX6X3CVO08AB is industrial grade; choose MCIMX6X3CVO08AB-R extended-temperature or MCIMX6X3xxx automotive option code for AEC-Q100 designs.

数据核验日期: 2026-10-17 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MCIMX6X3CVO08AB MCIMX6X3CVO08AB datasheet NXP i.MX 6SoloX 800 MHz i.MX 6SoloX Cortex-A9 Cortex-M4 MPU MCIMX6X3CVO08AB BGA-400 i.MX 6SoloX industrial HMI MCIMX6X3CVO08AB vs MCIMX6X1CVO08AB MCIMX6X3CVO08AB drop-in replacement MCIMX6X3CVO08AB buy online what is the package of MCIMX6X3CVO08AB i.MX 6SoloX heterogeneous multicore i.MX 6 automotive infotainment MPU

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NXP Semiconductors MCIMX6X3CVO08AB MCIMX6X3CVO08AB-R MCIMX6X1CVO08AB MCIMX6X3CVO08AC MCIMX6X3DVK10AB i.MX 6SoloX ARM Cortex-A9 ARM Cortex-M4 applications processor system-on-chip MAP-BGA-400 DDR3 LPDDR2 IEEE 1588 Gigabit Ethernet USB 2.0 PCIe Gen 2 MIPI-CSI MIPI-DSI TrustZone secure boot AES RSA OpenGL ES Vivante GC400T RoHS AEC-Q100
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