接口IC

MCZ33903CP5EK

MCZ33903CP5EK - SBC Gen2 with Hi-Speed CAN, 32-SOIC EP | NXP

The NXP MCZ33903CP5EK is a second-generation System Basis Chip (SBC Gen2) integrating a 5V/3.3V-selectable voltage regulator for the host MCU, a high-speed CAN transceiver compliant with ISO 11898-2 and ISO 11898-5, an SPI-controlled companion interface, and comprehensive system protection, all housed in a 32-pin SOIC wide-body package with an exposed thermal pad. A System Basis Chip (SBC) is a category of multi-functional automotive IC that combines power management with one or more communication transceivers (CAN, LIN, FlexRay) into a single package. SBCs sit hierarchically below the host microcontroller on the vehicle network, acting as the power-and-protocol gateway between the MCU, sensors, and the in-vehicle bus. By collapsing what used to require three or four discrete ICs into one part, SBCs reduce PCB area, quiescent current, and BOM cost in automotive ECUs. Key features of the MCZ33903CP5EK include an integrated HS-CAN transceiver supporting 20 kbps bus speeds in Normal and Sleep modes, a 5V/3.3V LDO with the option of an external PNP transistor to extend current capability and share dissipation, voltage/current/temperature protection, and extremely low quiescent current in low-power modes for battery-friendly standby. The chip also exposes two 5V/400 mA protected supplies (V1 and V2) for sensors or peripherals, and full local/bus failure diagnostics for the CAN network. Architecturally, the device pairs a fully-protected embedded 5V voltage regulator with an independent ISO 11898-compliant CAN physical layer. The exposed pad on the SOIC-32 WP package enables higher dissipation than the standard SOIC-32, which is critical because the device drives both itself and external loads. Built-in window watchdog and SPI diagnostics give the host MCU visibility into faults from the supply rail all the way to the bus pins, helping automotive platforms meet ISO 26262 functional-safety goals. Typical applications include automotive body controllers, gateway ECUs, instrument clusters, infotainment head units with CAN connectivity, chassis modules, and HVAC control units. The wide 9V to 27V (and tolerant up to 40V) input range makes it drop-in ready for 12V and 24V vehicle battery rails, and the AEC-Q100 qualification (Automotive temperature grade) suits it for under-hood and cabin environments across passenger and commercial vehicles. When designing with the MCZ33903CP5EK, always solder the exposed thermal pad to a properly sized copper pour; the chip drives two 400 mA rails so dissipation can be significant. Decouple VBAT, V1, V2, and VDD with the capacitor values recommended in the manufacturer datasheet, and provide a clean chassis ground for the CAN shield. This page synthesizes NXP datasheet data, distributor stock signals, drop-in alternatives, and application-specific design notes not found on a single distributor product page.