MCZ33903CP5EK - SBC Gen2 with Hi-Speed CAN, 32-SOIC EP | NXP
料号： MCZ33903CP5EK ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.85 | $6.85 |
| 10 | $5.92 | $59.20 |
| 100 | $5.05 | $505.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $3.95 | $3,950.00 |
MCZ33903CP5EK 概述
A System Basis Chip (SBC) is a category of multi-functional automotive IC that combines power management with one or more communication transceivers (CAN, LIN, FlexRay) into a single package. SBCs sit hierarchically below the host microcontroller on the vehicle network, acting as the power-and-protocol gateway between the MCU, sensors, and the in-vehicle bus. By collapsing what used to require three or four discrete ICs into one part, SBCs reduce PCB area, quiescent current, and BOM cost in automotive ECUs.
Key features of the MCZ33903CP5EK include an integrated HS-CAN transceiver supporting 20 kbps bus speeds in Normal and Sleep modes, a 5V/3.3V LDO with the option of an external PNP transistor to extend current capability and share dissipation, voltage/current/temperature protection, and extremely low quiescent current in low-power modes for battery-friendly standby. The chip also exposes two 5V/400 mA protected supplies (V1 and V2) for sensors or peripherals, and full local/bus failure diagnostics for the CAN network.
Architecturally, the device pairs a fully-protected embedded 5V voltage regulator with an independent ISO 11898-compliant CAN physical layer. The exposed pad on the SOIC-32 WP package enables higher dissipation than the standard SOIC-32, which is critical because the device drives both itself and external loads. Built-in window watchdog and SPI diagnostics give the host MCU visibility into faults from the supply rail all the way to the bus pins, helping automotive platforms meet ISO 26262 functional-safety goals.
Typical applications include automotive body controllers, gateway ECUs, instrument clusters, infotainment head units with CAN connectivity, chassis modules, and HVAC control units. The wide 9V to 27V (and tolerant up to 40V) input range makes it drop-in ready for 12V and 24V vehicle battery rails, and the AEC-Q100 qualification (Automotive temperature grade) suits it for under-hood and cabin environments across passenger and commercial vehicles.
When designing with the MCZ33903CP5EK, always solder the exposed thermal pad to a properly sized copper pour; the chip drives two 400 mA rails so dissipation can be significant. Decouple VBAT, V1, V2, and VDD with the capacitor values recommended in the manufacturer datasheet, and provide a clean chassis ground for the CAN shield.
This page synthesizes NXP datasheet data, distributor stock signals, drop-in alternatives, and application-specific design notes not found on a single distributor product page.
直接替换替代料： MCZ33903CP5EK ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCZ33903CP5EK （相同外形与封装尺寸） ——差异在于 Product Type, CAN Interface, LIN Interface, Package.
快速对比工具——选择替代料号进行并排对比：
MCZ33904CP5EK
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33905CP5EK
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33903CP5EKR2
✅ 直接替换📋 参考替代料（不在目录中）
MCZ33903CP5EKR2G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCZ33903CP5EK 规格参数
| Product Type | System Basis Chip (SBC Gen2) |
| Integrated Function | 5V/3.3V LDO + High-Speed CAN transceiver + 2x 5V/400 mA protected supplies |
| CAN Standard | ISO 11898-2 and ISO 11898-5 |
| CAN Bus Speed (Normal/Sleep) | 20 kbps |
| Nominal Input Voltage | 9V / 12V / 15V / 18V / 24V (automotive battery rails) |
| MCU Supply Voltage | 5.0 V or 3.3 V selectable |
| Auxiliary Regulator Outputs (V1, V2) | 2 x 5.0 V / 400 mA |
| Embedded VDD Regulator | Fully-protected 5.0 V LDO (external PNP option for current extension) |
| Protection Features | Voltage, current, temperature; bus failure diagnostics |
| Low-Power Mode Quiescent Current | Extremely low (per datasheet low-power specs) |
| 接口 | SPI control / diagnostics |
| Operating Temperature Grade | Automotive (AEC-Q100) |
| 封装 | 32-pin SOIC Wide-Body with Exposed Pad (SOIC-32 EP) |
| 安装类型 | Surface Mount |
| Shipping Carrier | Tube (per Freescale/NXP original part marking) |
| Compliance | AEC-Q100 qualified, automotive grade |
MCZ33903CP5EK 32-pin soic wide-body with exposed pad (soic-32 ep) 引脚配置指南
MCZ33903CP5EK（32-pin soic wide-body with exposed pad (soic-32 ep) 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： MCZ33903CP5EK.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCZ33903CP5EK 适用于 6 应用s: Automotive Body Control Module (BCM), In-Vehicle Gateway ECU, Instrument Cluster, HVAC Control Module, Infotainment Head Unit (CAN side), Chassis Control Module (ABS / ESC adjacent).
Automotive Body Control Module (BCM)
The MCZ33903CP5EK's integration of an MCU LDO and a high-speed CAN transceiver makes it a natural fit for body control modules that orchestrate lighting, wipers, and central locking. Designers route a 12V battery feed directly into VBAT and rely on the embedded 5V regulator to feed the host MCU plus sensors on the auxiliary 400 mA rails (V1 and V2). The integrated CAN physical layer replaces a discrete TJA1043 and shrinks the BOM to one IC plus a few passives, reducing PCB area in tightly packed door modules. SPI-driven diagnostics let the firmware detect bus faults, undervoltage, and overtemperature events, supporting ISO 26262 functional-safety architectures.
推荐
In-Vehicle Gateway ECU
A central gateway ECU bridges CAN, LIN, and Ethernet between vehicle domains, and the MCZ33903CP5EK supplies both the host MCU and the high-speed CAN side of the gateway in a single chip. The 5V/3.3V-selectable regulator accommodates newer low-power MCUs without an extra LDO, and the exposed-pad SOIC-32 package dissipates the heat from the auxiliary rails cleanly. SPI fault telemetry from the SBC lets the gateway forward bus diagnostics to the diagnostic over CAN (UDS) stack. Operating from a 9V to 27V automotive input, the part handles 12V and 24V battery systems without an external pre-regulator.
推荐
Instrument Cluster
Instrument clusters need a clean 5V rail for display drivers and a reliable CAN link to the powertrain bus, both of which the MCZ33903CP5EK provides in one chip. The 5V LDO feeds the cluster MCU and gauge drivers, while V1/V2 power pointer motors or backlight drivers at 400 mA each. Because the part is AEC-Q100 qualified, it tolerates the under-dash thermal environment and dashboard sun-load temperature swings. ISO 11898-2 / -5 compliance ensures inter-vendor interoperability with chassis and infotainment CAN nodes.
推荐
HVAC Control Module
HVAC modules drive relatively modest loads - blower controllers, stepper motors, and a CAN bus to the body controller - making them an ideal fit for the MCZ33903CP5EK's integrated approach. The 400 mA auxiliary rails (V1 and V2) cleanly power sensor and LED backlighting chains without needing a second LDO. Low quiescent current in Sleep mode keeps battery drain tolerable for a parked vehicle, a key constraint for always-powered HVAC modules with remote start. AEC-Q100 qualification gives OEMs confidence for cabin-mounted thermal cycles.
推荐
Infotainment Head Unit (CAN side)
Infotainment head units talk to the body network over high-speed CAN, and the MCZ33903CP5EK powers the MCU side of the CAN interface plus auxiliary rails that feed audio codec or Bluetooth modules. The exposed-pad SOIC-32 WP package keeps junction temperatures within limits when the head unit is mounted behind a sun-baked dashboard. Integrated voltage/current/temperature protection plus SPI diagnostics give the head-unit firmware early warning on bus faults and supply degradation, key for telematics-grade reliability.
推荐
Chassis Control Module (ABS / ESC adjacent)
Chassis modules require deterministic, fail-operational communication and clean power, both of which the MCZ33903CP5EK's diagnostic-rich architecture addresses. The CAN transceiver supports ISO 11898-2 / -5 with local and bus failure diagnostics that the MCU can read over SPI in real time. Auxiliary rails supply 5V to chassis sensors at 400 mA each, enough for typical wheel-speed and steering-angle sensors. The part's automotive grade and automotive temperature rating make it viable for under-cabin and seat-mounted chassis ECU placements.
推荐
推荐产品汇总
工程参考数据： MCZ33903CP5EK ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCZ33904CP5EK | MCZ33905CP5EK | MCZ33903CP5EKR2 |
|---|---|---|---|---|
| Package | SOIC-32 EP (wide-body) | SOIC-32 EP (wide-body) | SOIC-32 EP (wide-body) | SOIC-32 EP (wide-body) |
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Integrated Transceiver | High-Speed CAN (ISO 11898-2/-5) | LIN | HS-CAN + LIN | HS-CAN (same die) |
| MCU Regulator Output | 5.0 V / 3.3 V selectable | 5.0 V / 3.3 V selectable | 5.0 V / 3.3 V selectable | 5.0 V / 3.3 V selectable |
| Auxiliary Rails (V1, V2) | 2 x 5.0 V / 400 mA | 2 x 5.0 V / 400 mA | 2 x 5.0 V / 400 mA | 2 x 5.0 V / 400 mA |
| Embedded 5V LDO with External PNP Option | Yes | Yes | Yes | Yes |
| Nominal Input Voltage Range | 9V - 24V (automotive 12V / 24V) | 9V - 24V | 9V - 24V | 9V - 24V |
| Shipping Carrier | Tube | Tube | Tube | Tape-and-reel 13-inch |
| Automotive Grade (AEC-Q100) | Yes | Yes | Yes | Yes |
关键差异点
- Highest integration density in the SBC Gen2 family with high-speed CAN （对比 MCZ33904CP5EK (LIN-only SBC Gen2))
- Single-package dual-protocol option in the family （对比 MCZ33905CP5EK (CAN + LIN combo))
- Reel-form availability for high-volume SMT production （对比 MCZ33903CP5EKR2 (tape-and-reel form))
- Compatibility with the original Freescale SBC Gen2 platform footprint （对比 Infineon TLE7259 / TLE7258 SBC family)
设计说明
Estimated: The MCZ33903CP5EK sources up to 400 mA on each of two 5V rails (V1, V2) plus the host MCU current. At a 12V battery feed worst case, dissipation can reach the multi-Watt range. Solder the exposed thermal pad to a copper pour of at least 1 square inch (per manufacturer recommended footprint) and use thermal vias to the inner plane to keep junction temperature below +150C. Derate based on board-level measurement, not datasheet worst-case.
Estimated: Place VBAT, VDD, V1, and V2 decoupling capacitors as close to the respective pins as possible (datasheet recommended values). Keep the CANH/CANL differential pair matched in length and impedance (per ISO 11898-2) and routed over a solid ground plane. The exposed pad must NOT share a single thermal via with the signal ground stitch - use multiple vias to the ground plane to avoid creating a high-current return-path choke at the CAN ground reference.
Estimated: With the part now End of Life per the NXP product page, do not start new designs on MCZ33903CP5EK without confirming last-time-buy opportunity and lifetime-buy coverage with NXP or authorised distributors. For new platforms, use the cross-reference results (MCZ33904/MCZ33905 within the same family, or step up to NXP FS65 family MC33FS65xx) and validate SPI register parity before committing. Reverse-battery protection must remain external because the part's absolute-maximum VBAT is below automotive reverse-polarity peaks.
合规信息
RoHS compliance inferred from NXP product page markers; AEC-Q100 qualified per manufacturer datasheet and product family documentation. REACH and halogen-free status not stated in the Verified Web Data and require confirmation from the manufacturer or distributor documentation.
