10AS066K3F35E2LG vs 10AS066K3F35I2LG 对比
详细并排对比 10AS066K3F35E2LG 出自 Intel 和 10AS066K3F35I2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AS066K3F35E2LG | 10AS066K3F35I2LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,310.00 | $3,712.06 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 660,000 |
| Process Technology | 20 nm | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | -E2 | K3 (mid-speed) |
| 封装 | 1152-ball FCBGA, 35 mm x 35 mm | 1152-ball FCBGA (F35), 35x35 mm |
| Package Code | F35 | — |
| User I/Os | 396 | — |
| Memory Cells (per snippet) | 660,000 cells (LE equivalent) | — |
| On-chip Memory | 256 KB (per FindIC snippet) | — |
| Configuration Scheme | FPP, AS supported | — |
| Temperature Grade | Industrial | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (FCBGA) |
| RoHS 状态 | Compliant (per FindIC listing) | Compliant |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| HPS Clock Speed | — | 1.5 GHz |
| Process Node | — | TSMC 20 nm |
| 工作温度 | — | -40C to +100C (Industrial) |
| Logic Voltage | — | 0.9 V core |
| Transceiver Data Rate (max) | — | 28.05 Gbps |
| Number of I/O Banks | — | [DATA_NEEDED: exact bank count for F35 variant] |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Embedded Memory | — | [DATA_NEEDED: M20K block memory count] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP block count] |
| PCIe Hard IP | — | PCIe Gen3 x8 hard IP |
| External Memory Support | — | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM III |