10AS066K3F35E2LG vs 10AS066K3F35I2LG Comparison
Detailed side-by-side comparison of 10AS066K3F35E2LG by Intel and 10AS066K3F35I2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AS066K3F35E2LG | 10AS066K3F35I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,310.00 | $3,712.06 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 660,000 |
| Process Technology | 20 nm | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | -E2 | K3 (mid-speed) |
| Package | 1152-ball FCBGA, 35 mm x 35 mm | 1152-ball FCBGA (F35), 35x35 mm |
| Package Code | F35 | — |
| User I/Os | 396 | — |
| Memory Cells (per snippet) | 660,000 cells (LE equivalent) | — |
| On-chip Memory | 256 KB (per FindIC snippet) | — |
| Configuration Scheme | FPP, AS supported | — |
| Temperature Grade | Industrial | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (FCBGA) |
| RoHS Status | Compliant (per FindIC listing) | Compliant |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| HPS Clock Speed | — | 1.5 GHz |
| Process Node | — | TSMC 20 nm |
| Operating Temperature | — | -40C to +100C (Industrial) |
| Logic Voltage | — | 0.9 V core |
| Transceiver Data Rate (max) | — | 28.05 Gbps |
| Number of I/O Banks | — | [DATA_NEEDED: exact bank count for F35 variant] |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Embedded Memory | — | [DATA_NEEDED: M20K block memory count] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP block count] |
| PCIe Hard IP | — | PCIe Gen3 x8 hard IP |
| External Memory Support | — | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM III |