10AX090N3F40E2LG vs 10AX090N2F45E2LG 对比
详细并排对比 10AX090N3F40E2LG 出自 Intel 和 10AX090N2F45E2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX090N3F40E2LG | 10AX090N2F45E2LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,280.00 | $6,095.25 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory | 59,234,304 bits | — |
| DSP Blocks | 1,518 | [DATA_NEEDED: DSP block count] |
| User I/O Pins | 600 | 768 |
| Transceivers | Up to 24 full-duplex channels | [DATA_NEEDED: transceiver count and data rate] |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| 封装 | 1517-ball FCBGA, 40 mm | 1932-ball FCBGA (FBGA) |
| Process Technology | TSMC 20nm | 20 nm |
| 工作温度 | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | 0.9 V |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| RoHS 状态 | Compliant | — |
| Embedded Memory (bits) | — | 59,234,304 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Package Type | — | Flip-Chip BGA, surface mount |
| Operating Temperature Grade | — | Enhanced (E2) |
| Lead-Free / RoHS | — | Yes (per part suffix LG) |
| Configuration Memory | — | SRAM-based, volatile (external flash required) |
| 安装类型 | — | Surface Mount |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| 生命周期状态 | — | Active |