10M02DCU324A7G vs 10M04DCU324A7G 对比
详细并排对比 10M02DCU324A7G 出自 Intel 和 10M04DCU324A7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M02DCU324A7G | 10M04DCU324A7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.30 | $9.85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | 4,000 |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | Integrated (non-volatile configuration) |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | Yes (12-bit SAR, multiple channels) |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| 工作结温 | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| RoHS 状态 | Compliant | — |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Process Node | — | 55 nm |
| Embedded Memory (bits) | — | 193,536 |
| Maximum User I/O | — | 246 |
| 封装 | — | 324-pin UFBGA (U324) |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | 7 |
| 工作温度 | — | [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] |
| Configuration Memory | — | On-chip flash (instant-on, no external PROM) |
| AEC-Q100 Qualification | — | Yes (A-grade suffix) |
| Lead-Free / RoHS | — | Yes (G suffix) |
| PLL Count | — | [DATA_NEEDED: PLL count for 10M04] |
| Multipliers (18x18) | — | [DATA_NEEDED: multiplier count for 10M04] |